iBet uBet web content aggregator. Adding the entire web to your favor.
iBet uBet web content aggregator. Adding the entire web to your favor.



Link to original content: https://www.scribd.com/document/53953594/Datasheet
Datasheet | PDF | Cpu Cache | Central Processing Unit

Datasheet

Download as pdf or txt
Download as pdf or txt
You are on page 1of 1524

REJ09B0033-0300

The revision list can be viewed directly by


clicking the title page.

The revision list summarizes the locations of


revisions and additions. Details should always
be checked by referring to the relevant text.

32 SH7720 Group, SH7721 Group


Hardware Manual

Renesas 32-Bit RISC Microcomputer


TM
SuperH RISC engine Family / SH7700 Series

SH7720 Group HD6417720


HD6417320

SH7721 Group R8A77210


R8A77211

Rev.3.00
Revision Date: Jan. 18, 2008
Rev. 3.00 Jan. 18, 2008 Page ii of lxii
Notes regarding these materials
1. This document is provided for reference purposes only so that Renesas customers may select the appropriate
Renesas products for their use. Renesas neither makes warranties or representations with respect to the
accuracy or completeness of the information contained in this document nor grants any license to any
intellectual property rights or any other rights of Renesas or any third party with respect to the information in
this document.
2. Renesas shall have no liability for damages or infringement of any intellectual property or other rights arising
out of the use of any information in this document, including, but not limited to, product data, diagrams, charts,
programs, algorithms, and application circuit examples.
3. You should not use the products or the technology described in this document for the purpose of military
applications such as the development of weapons of mass destruction or for the purpose of any other military
use. When exporting the products or technology described herein, you should follow the applicable export
control laws and regulations, and procedures required by such laws and regulations.
4. All information included in this document such as product data, diagrams, charts, programs, algorithms, and
application circuit examples, is current as of the date this document is issued. Such information, however, is
subject to change without any prior notice. Before purchasing or using any Renesas products listed in this
document, please confirm the latest product information with a Renesas sales office. Also, please pay regular
and careful attention to additional and different information to be disclosed by Renesas such as that disclosed
through our website. (http://www.renesas.com )
5. Renesas has used reasonable care in compiling the information included in this document, but Renesas
assumes no liability whatsoever for any damages incurred as a result of errors or omissions in the information
included in this document.
6. When using or otherwise relying on the information in this document, you should evaluate the information in
light of the total system before deciding about the applicability of such information to the intended application.
Renesas makes no representations, warranties or guaranties regarding the suitability of its products for any
particular application and specifically disclaims any liability arising out of the application and use of the
information in this document or Renesas products.
7. With the exception of products specified by Renesas as suitable for automobile applications, Renesas
products are not designed, manufactured or tested for applications or otherwise in systems the failure or
malfunction of which may cause a direct threat to human life or create a risk of human injury or which require
especially high quality and reliability such as safety systems, or equipment or systems for transportation and
traffic, healthcare, combustion control, aerospace and aeronautics, nuclear power, or undersea communication
transmission. If you are considering the use of our products for such purposes, please contact a Renesas
sales office beforehand. Renesas shall have no liability for damages arising out of the uses set forth above.
8. Notwithstanding the preceding paragraph, you should not use Renesas products for the purposes listed below:
(1) artificial life support devices or systems
(2) surgical implantations
(3) healthcare intervention (e.g., excision, administration of medication, etc.)
(4) any other purposes that pose a direct threat to human life
Renesas shall have no liability for damages arising out of the uses set forth in the above and purchasers who
elect to use Renesas products in any of the foregoing applications shall indemnify and hold harmless Renesas
Technology Corp., its affiliated companies and their officers, directors, and employees against any and all
damages arising out of such applications.
9. You should use the products described herein within the range specified by Renesas, especially with respect
to the maximum rating, operating supply voltage range, movement power voltage range, heat radiation
characteristics, installation and other product characteristics. Renesas shall have no liability for malfunctions or
damages arising out of the use of Renesas products beyond such specified ranges.
10. Although Renesas endeavors to improve the quality and reliability of its products, IC products have specific
characteristics such as the occurrence of failure at a certain rate and malfunctions under certain use
conditions. Please be sure to implement safety measures to guard against the possibility of physical injury, and
injury or damage caused by fire in the event of the failure of a Renesas product, such as safety design for
hardware and software including but not limited to redundancy, fire control and malfunction prevention,
appropriate treatment for aging degradation or any other applicable measures. Among others, since the
evaluation of microcomputer software alone is very difficult, please evaluate the safety of the final products or
system manufactured by you.
11. In case Renesas products listed in this document are detached from the products to which the Renesas
products are attached or affixed, the risk of accident such as swallowing by infants and small children is very
high. You should implement safety measures so that Renesas products may not be easily detached from your
products. Renesas shall have no liability for damages arising out of such detachment.
12. This document may not be reproduced or duplicated, in any form, in whole or in part, without prior written
approval from Renesas.
13. Please contact a Renesas sales office if you have any questions regarding the information contained in this
document, Renesas semiconductor products, or if you have any other inquiries.

Rev. 3.00 Jan. 18, 2008 Page iii of lxii


General Precautions on Handling of Product

1. Treatment of NC Pins
Note: Do not connect anything to the NC pins.
The NC (not connected) pins are either not connected to any of the internal circuitry or are
used as test pins or to reduce noise. If something is connected to the NC pins, the
operation of the LSI is not guaranteed.

2. Treatment of Unused Input Pins


Note: Fix all unused input pins to high or low level.
Generally, the input pins of CMOS products are high-impedance input pins. If unused pins
are in their open states, intermediate levels are induced by noise in the vicinity, a pass-
through current flows internally, and a malfunction may occur.

3. Processing before Initialization


Note: When power is first supplied, the product's state is undefined.
The states of internal circuits are undefined until full power is supplied throughout the
chip and a low level is input on the reset pin. During the period where the states are
undefined, the register settings and the output state of each pin are also undefined. Design
your system so that it does not malfunction because of processing while it is in this
undefined state. For those products which have a reset function, reset the LSI immediately
after the power supply has been turned on.

4. Prohibition of Access to Undefined or Reserved Addresses


Note: Access to undefined or reserved addresses is prohibited.
The undefined or reserved addresses may be used to expand functions, or test registers
may have been be allocated to these addresses. Do not access these registers; the system's
operation is not guaranteed if they are accessed.

Rev. 3.00 Jan. 18, 2008 Page iv of lxii


Configuration of This Manual
This manual comprises the following items:

1. General Precautions on Handling of Product


2. Configuration of This Manual
3. Preface
4. Contents
5. Overview
6. Description of Functional Modules
• CPU and System-Control Modules
• On-Chip Peripheral Modules
The configuration of the functional description of each module differs according to the
module. However, the generic style includes the following items:
i) Feature
ii) Input/Output Pin
iii) Register Description
iv) Operation
v) Usage Note
When designing an application system that includes this LSI, take notes into account. Each
section includes notes in relation to the descriptions given, and usage notes are given, as required,
as the final part of each section.

7. List of Registers
8. Electrical Characteristics
9. Appendix
10. Main Revisions and Additions in this Edition (only for revised versions)

The list of revisions is a summary of points that have been revised or added to earlier versions.
This does not include all of the revised contents. For details, see the actual locations in this
manual.

11. Index

Rev. 3.00 Jan. 18, 2008 Page v of lxii


Preface
The SH7720 or SH7721 Group RISC (Reduced Instruction Set Computer) microcomputer
includes a Renesas Technology original RISC CPU as its core, and the peripheral functions
required to configure a system.

Target Users: This manual was written for users who will be using this LSI in the design of
application systems. Users of this manual are expected to understand the
fundamentals of electrical circuits, logical circuits, and microcomputers.

Objective: This manual was written to explain the hardware functions and electrical
characteristics of this LSI to the above users.
Refer to the SH-3/SH-3E/SH3-DSP Software Manual for a detailed description of
the instruction set.

Notes on reading this manual:

• Product names
The following products are covered in this manual.

Product Classifications and Abbreviations


Basic Classification Product Code
SH7720 Group HD6417720, HD6417320
SH7721 Group R8A77210, R8A77211

• In order to understand the overall functions of the chip


Read the manual according to the contents. This manual can be roughly categorized into parts
on the CPU, system control functions, peripheral functions, and electrical characteristics.
• In order to understand the details of the CPU's functions
Read the SH-3/SH-3E/SH3-DSP Software Manual.

Rev. 3.00 Jan. 18, 2008 Page vi of lxii


Rules: Register name: The following notation is used for cases when the same or a
similar function, e.g. serial communication, is implemented
on more than one channel:
XXX_N (XXX is the register name and N is the channel
number)
Bit order: The MSB (most significant bit) is on the left and the LSB
(least significant bit) is on the right.
Number notation: Binary is B'xx, hexadecimal is H'xxxx, decimal is xxxx.
Signal notation: An overbar is added to a low-active signal: xxxx

Related Manuals: The latest versions of all related manuals are available from our web site.
Please ensure you have the latest versions of all documents you require.
http://www.renesas.com/

SH7720 or SH7721 Group manuals:

Document Title Document No.


SH7720/SH7721 Group Hardware Manual This manual
SH-3/SH-3E/SH3-DSP Software Manual REJ09B0317

Users manuals for development tools:

Document Title Document No.


TM
Super RISC engine C/C++ Compiler, Assembler, Optimizing Linkage Editor REJ10B0152
Compiler Package V.9.00 User's Manual
SuperHTM RISC engine High-performance Embedded Workshop 3 User's REJ10B0025
Manual
SuperHTM RISC engine High-performance Embedded Workshop 3 Tutorial REJ10B0023

Application note:

Document Title Document No.


TM
SuperH RISC engine C/C++ Compiler Package Application Note REJ05B0463

Rev. 3.00 Jan. 18, 2008 Page vii of lxii


Abbreviations

ADC Analog to Digital Converter


ALU Arithmetic Logic Unit
ASE Adaptive System Evaluator
ASID Address Space Identifier
AUD Advanced User Debugger
BCD Binary Coded Decimal
bps bit per second
BSC Bus State Controller
CCN Cache memory Controller
CMT Compare Match Timer
CPG Clock Pulse Generator
CPU Central Processing Unit
DES Data Encryption Standard
DMAC Direct Memory Access Controller
etu Elementary Time Unit
FIFO First-In First-Out
Hi-Z High Impedance
H-UDI User Debugging Interface
INTC Interrupt Controller
IrDA Infrared Data Association
JTAG Joint Test Action Group
LQFP Low Profile QFP
LRU Least Recently Used
LSB Least Significant Bit
MMU Memory Management Unit
MPX Multiplex
MSB Most Significant Bit
PC Program Counter
PFC Pin Function Controller
PLL Phase Locked Loop
PWM Pulse Width Modulation
RAM Random Access Memory
RISC Reduced Instruction Set Computer

Rev. 3.00 Jan. 18, 2008 Page viii of lxii


ROM Read Only Memory
RSA Rivest Shamir Adleman
RTC Real Time Clock
SCIF Serial Communication Interface with FIFO
SDHI SD Host Interface
SDRAM Synchronous DRAM
SSL Secure Socket Layer
TAP Test Access Port
T.B.D To Be Determined
TLB Translation Lookaside Buffer
TMU Timer Unit
TPU Timer Pulse Unit
UART Universal Asynchronous Receiver/Transmitter
UBC User Break Controller
USB Universal Serial Bus
WDT Watchdog Timer

All trademarks and registered trademarks are the property of their respective owners.

Rev. 3.00 Jan. 18, 2008 Page ix of lxii


Rev. 3.00 Jan. 18, 2008 Page x of lxii
Contents

Section 1 Overview..................................................................................................1
1.1 Features.................................................................................................................................. 1
1.2 Block Diagram ..................................................................................................................... 10
1.3 Pin Assignments................................................................................................................... 10
1.3.1 Pin Assignments ..................................................................................................... 10
1.3.2 Pin Functions .......................................................................................................... 25

Section 2 CPU........................................................................................................37
2.1 Processing States and Processing Modes ............................................................................. 37
2.1.1 Processing States..................................................................................................... 37
2.1.2 Processing Modes ................................................................................................... 38
2.2 Memory Map ....................................................................................................................... 39
2.2.1 Virtual Address Space............................................................................................. 39
2.2.2 External Memory Space.......................................................................................... 40
2.3 Register Descriptions ........................................................................................................... 42
2.3.1 General Registers.................................................................................................... 45
2.3.2 System Registers..................................................................................................... 46
2.3.3 Program Counter..................................................................................................... 47
2.3.4 Control Registers .................................................................................................... 48
2.4 Data Formats........................................................................................................................ 51
2.4.1 Register Data Format .............................................................................................. 51
2.4.2 Memory Data Formats ............................................................................................ 52
2.5 Features of CPU Core Instructions ...................................................................................... 54
2.5.1 Instruction Execution Method................................................................................. 54
2.5.2 CPU Instruction Addressing Modes ....................................................................... 56
2.5.3 Instruction Formats ................................................................................................. 60
2.6 Instruction Set ...................................................................................................................... 63
2.6.1 Instruction Set Based on Functions......................................................................... 63
2.6.2 Operation Code Map............................................................................................... 77

Section 3 DSP Operating Unit ...............................................................................81


3.1 DSP Extended Functions ..................................................................................................... 81
3.2 DSP Mode Resources .......................................................................................................... 83
3.2.1 Processing Modes ................................................................................................... 83
3.2.2 DSP Mode Memory Map........................................................................................ 83
3.2.3 CPU Register Sets................................................................................................... 84

Rev. 3.00 Jan. 18, 2008 Page xi of lxii


3.2.4 DSP Registers ......................................................................................................... 88
3.3 CPU Extended Instructions.................................................................................................. 89
3.3.1 DSP Repeat Control................................................................................................ 89
3.4 DSP Data Transfer Instructions ......................................................................................... 100
3.4.1 General Registers.................................................................................................. 104
3.4.2 DSP Data Addressing ........................................................................................... 106
3.4.3 Modulo Addressing .............................................................................................. 108
3.4.4 Memory Data Formats .......................................................................................... 110
3.4.5 Instruction Formats of Double and Single Transfer Instructions .......................... 111
3.5 DSP Data Operation Instructions....................................................................................... 113
3.5.1 DSP Registers ....................................................................................................... 113
3.5.2 DSP Operation Instruction Set.............................................................................. 118
3.5.3 DSP-Type Data Formats....................................................................................... 123
3.5.4 ALU Fixed-Point Arithmetic Operations.............................................................. 125
3.5.5 ALU Integer Operations ....................................................................................... 131
3.5.6 ALU Logical Operations ...................................................................................... 133
3.5.7 Fixed-Point Multiply Operation............................................................................ 135
3.5.8 Shift Operations .................................................................................................... 137
3.5.9 Most Significant Bit Detection Operation ............................................................ 141
3.5.10 Rounding Operation.............................................................................................. 144
3.5.11 Overflow Protection.............................................................................................. 146
3.5.12 Local Data Move Instruction ................................................................................ 147
3.5.13 Operand Conflict .................................................................................................. 148
3.6 DSP Extended Function Instruction Set............................................................................. 149
3.6.1 CPU Extended Instructions................................................................................... 149
3.6.2 Double-Data Transfer Instructions ....................................................................... 151
3.6.3 Single-Data Transfer Instructions ......................................................................... 152
3.6.4 DSP Operation Instructions .................................................................................. 154
3.6.5 Operation Code Map in DSP Mode ...................................................................... 160

Section 4 Memory Management Unit (MMU).................................................... 165


4.1 Role of MMU .................................................................................................................... 165
4.1.1 MMU of This LSI................................................................................................. 168
4.2 Register Descriptions......................................................................................................... 174
4.2.1 Page Table Entry Register High (PTEH).............................................................. 174
4.2.2 Page Table Entry Register Low (PTEL) ............................................................... 175
4.2.3 Translation Table Base Register (TTB) ................................................................ 175
4.2.4 MMU Control Register (MMUCR) ...................................................................... 175
4.3 TLB Functions ................................................................................................................... 177
4.3.1 Configuration of the TLB ..................................................................................... 177

Rev. 3.00 Jan. 18, 2008 Page xii of lxii


4.3.2 TLB Indexing........................................................................................................ 179
4.3.3 TLB Address Comparison .................................................................................... 180
4.3.4 Page Management Information............................................................................. 182
4.4 MMU Functions................................................................................................................. 183
4.4.1 MMU Hardware Management .............................................................................. 183
4.4.2 MMU Software Management ............................................................................... 184
4.4.3 MMU Instruction (LDTLB).................................................................................. 184
4.4.4 Avoiding Synonym Problems ............................................................................... 186
4.5 MMU Exceptions............................................................................................................... 188
4.5.1 TLB Miss Exception............................................................................................. 188
4.5.2 TLB Protection Violation Exception .................................................................... 189
4.5.3 TLB Invalid Exception ......................................................................................... 190
4.5.4 Initial Page Write Exception................................................................................. 191
4.5.5 MMU Exception in Repeat Loop.......................................................................... 192
4.6 Memory-Mapped TLB....................................................................................................... 194
4.6.1 Address Array ....................................................................................................... 194
4.6.2 Data Array ............................................................................................................ 194
4.6.3 Usage Examples.................................................................................................... 196
4.7 Usage Note......................................................................................................................... 196

Section 5 Cache ...................................................................................................197


5.1 Features.............................................................................................................................. 197
5.1.1 Cache Structure..................................................................................................... 197
5.2 Register Descriptions ......................................................................................................... 199
5.2.1 Cache Control Register 1 (CCR1) ........................................................................ 200
5.2.2 Cache Control Register 2 (CCR2) ........................................................................ 201
5.2.3 Cache Control Register 3 (CCR3) ........................................................................ 204
5.3 Operation ........................................................................................................................... 205
5.3.1 Searching the Cache.............................................................................................. 205
5.3.2 Read Access.......................................................................................................... 207
5.3.3 Prefetch Operation ................................................................................................ 207
5.3.4 Write Access ......................................................................................................... 207
5.3.5 Write-Back Buffer ................................................................................................ 208
5.3.6 Coherency of Cache and External Memory .......................................................... 208
5.4 Memory-Mapped Cache .................................................................................................... 209
5.4.1 Address Array ....................................................................................................... 209
5.4.2 Data Array ............................................................................................................ 210
5.4.3 Usage Examples.................................................................................................... 212

Rev. 3.00 Jan. 18, 2008 Page xiii of lxii


Section 6 X/Y Memory ....................................................................................... 213
6.1 Features.............................................................................................................................. 213
6.2 Operation ........................................................................................................................... 214
6.2.1 Access from CPU ................................................................................................. 214
6.2.2 Access from DSP.................................................................................................. 214
6.2.3 Access from Bus Master Module.......................................................................... 215
6.3 Usage Notes ....................................................................................................................... 215
6.3.1 Page Conflict ........................................................................................................ 215
6.3.2 Bus Conflict .......................................................................................................... 215
6.3.3 MMU and Cache Settings..................................................................................... 216
6.3.4 Sleep Mode ........................................................................................................... 216

Section 7 Exception Handling ............................................................................. 217


7.1 Register Descriptions......................................................................................................... 217
7.1.1 TRAPA Exception Register (TRA) ...................................................................... 218
7.1.2 Exception Event Register (EXPEVT)................................................................... 219
7.1.3 Interrupt Event Register (INTEVT)...................................................................... 219
7.1.4 Interrupt Event Register 2 (INTEVT2)................................................................. 220
7.1.5 Exception Address Register (TEA) ...................................................................... 220
7.2 Exception Handling Function ............................................................................................ 221
7.2.1 Exception Handling Flow ..................................................................................... 221
7.2.2 Exception Vector Addresses................................................................................. 222
7.2.3 Exception Codes ................................................................................................... 222
7.2.4 Exception Request and BL Bit (Multiple Exception Prevention) ......................... 222
7.2.5 Exception Source Acceptance Timing and Priority .............................................. 223
7.3 Individual Exception Operations ....................................................................................... 227
7.3.1 Resets.................................................................................................................... 227
7.3.2 General Exceptions............................................................................................... 227
7.3.3 General Exceptions (MMU Exceptions)............................................................... 231
7.4 Exception Processing While DSP Extension Function is Valid......................................... 234
7.4.1 Illegal Instruction Exception and Illegal Slot Instruction Exception .................... 234
7.4.2 CPU Address Error ............................................................................................... 234
7.4.3 Exception in Repeat Control Period ..................................................................... 234
7.5 Usage Notes ....................................................................................................................... 241

Section 8 Interrupt Controller (INTC)................................................................. 243


8.1 Features.............................................................................................................................. 243
8.2 Input/Output Pins............................................................................................................... 245
8.3 Register Descriptions......................................................................................................... 246

Rev. 3.00 Jan. 18, 2008 Page xiv of lxii


8.3.1 Interrupt Priority Registers A to J (IPRA to IPRJ)................................................ 247
8.3.2 Interrupt Control Register 0 (ICR0)...................................................................... 249
8.3.3 Interrupt Control Register 1 (ICR1)...................................................................... 250
8.3.4 Interrupt Request Register 0 (IRR0) ..................................................................... 252
8.3.5 Interrupt Request Register 1 (IRR1) ..................................................................... 253
8.3.6 Interrupt Request Register 2 (IRR2) ..................................................................... 254
8.3.7 Interrupt Request Register 3 (IRR3) ..................................................................... 255
8.3.8 Interrupt Request Register 4 (IRR4) ..................................................................... 256
8.3.9 Interrupt Request Register 5 (IRR5) ..................................................................... 257
8.3.10 Interrupt Request Register 6 (IRR6) ..................................................................... 259
8.3.11 Interrupt Request Register 7 (IRR7) ..................................................................... 260
8.3.12 Interrupt Request Register 8 (IRR8) ..................................................................... 261
8.3.13 Interrupt Request Register 9 (IRR9) ..................................................................... 262
8.3.14 PINT Interrupt Enable Register (PINTER)........................................................... 264
8.3.15 Interrupt Control Register 2 (ICR2)...................................................................... 265
8.4 Interrupt Sources................................................................................................................ 266
8.4.1 NMI Interrupt........................................................................................................ 266
8.4.2 IRQ Interrupts ....................................................................................................... 266
8.4.3 IRL interrupts........................................................................................................ 267
8.4.4 PINT Interrupts ..................................................................................................... 268
8.4.5 On-Chip Peripheral Module Interrupts ................................................................. 268
8.4.6 Interrupt Exception Handling and Priority............................................................ 269
8.5 Operation ........................................................................................................................... 276
8.5.1 Interrupt Sequence ................................................................................................ 276
8.5.2 Multiple Interrupts ................................................................................................ 278

Section 9 Bus State Controller (BSC)..................................................................279


9.1 Features.............................................................................................................................. 279
9.2 Input/Output Pins ............................................................................................................... 283
9.3 Area Overview ................................................................................................................... 285
9.3.1 Area Division........................................................................................................ 285
9.3.2 Shadow Area......................................................................................................... 285
9.3.3 Address Map ......................................................................................................... 287
9.3.4 Area 0 Memory Type and Memory Bus Width .................................................... 289
9.3.5 Data Alignment..................................................................................................... 289
9.4 Register Descriptions ......................................................................................................... 290
9.4.1 Common Control Register (CMNCR) .................................................................. 291
9.4.2 CSn Space Bus Control Register (CSnBCR) ........................................................ 294
9.4.3 CSn Space Wait Control Register (CSnWCR) ..................................................... 299
9.4.4 SDRAM Control Register (SDCR)....................................................................... 325

Rev. 3.00 Jan. 18, 2008 Page xv of lxii


9.4.5 Refresh Timer Control/Status Register (RTCSR)................................................. 328
9.4.6 Refresh Timer Counter (RTCNT)......................................................................... 329
9.4.7 Refresh Time Constant Register (RTCOR) .......................................................... 330
9.4.8 SDRAM Mode Registers 2, 3 (SDMR2 and SRMR3) ......................................... 330
9.5 Operation ........................................................................................................................... 331
9.5.1 Endian/Access Size and Data Alignment.............................................................. 331
9.5.2 Normal Space Interface ........................................................................................ 337
9.5.3 Access Wait Control ............................................................................................. 343
9.5.4 CSn Assert Period Expansion ............................................................................... 345
9.5.5 SDRAM Interface ................................................................................................. 346
9.5.6 Burst ROM (Clock Asynchronous) Interface ....................................................... 385
9.5.7 Byte-Selection SRAM Interface ........................................................................... 387
9.5.8 PCMCIA Interface................................................................................................ 392
9.5.9 Burst ROM (Clock Synchronous) Interface.......................................................... 400
9.5.10 Wait between Access Cycles ................................................................................ 401
9.5.11 Bus Arbitration ..................................................................................................... 401
9.6 Usage Notes ....................................................................................................................... 404

Section 10 Direct Memory Access Controller (DMAC)..................................... 407


10.1 Features.............................................................................................................................. 407
10.2 Input/Output Pins............................................................................................................... 409
10.3 Register Descriptions......................................................................................................... 410
10.3.1 DMA Source Address Registers (SAR_0 to SAR_5) ........................................... 411
10.3.2 DMA Destination Address Registers (DAR_0 to DAR_5) .................................. 412
10.3.3 DMA Transfer Count Registers (DMATCR_0 to DMATCR_5) ......................... 412
10.3.4 DMA Channel Control Registers (CHCR_0 to CHCR_5) ................................... 413
10.3.5 DMA Operation Register (DMAOR) ................................................................... 418
10.3.6 DMA Extended Resource Selectors 0 to 2 (DMARS0 to DMARS2)................... 420
10.4 Operation ........................................................................................................................... 424
10.4.1 DMA Transfer Flow ............................................................................................. 424
10.4.2 DMA Transfer Requests ....................................................................................... 426
10.4.3 Channel Priority.................................................................................................... 431
10.4.4 DMA Transfer Types............................................................................................ 434
10.4.5 Number of Bus Cycle States and DREQ Pin Sampling Timing ........................... 444
10.5 Usage Notes ....................................................................................................................... 448
10.5.1 Notes on DACK Pin Output ................................................................................. 448
10.5.2 Notes on the Cases When DACK is Divided........................................................ 448
10.5.3 Other Notes........................................................................................................... 452

Rev. 3.00 Jan. 18, 2008 Page xvi of lxii


Section 11 Clock Pulse Generator (CPG)............................................................453
11.1 Features.............................................................................................................................. 453
11.2 Input/Output Pins ............................................................................................................... 457
11.3 Clock Operating Modes ..................................................................................................... 458
11.4 Register Descriptions ......................................................................................................... 461
11.4.1 Frequency Control Register (FRQCR) ................................................................. 461
11.4.2 USBH/USBF Clock Control Register (UCLKCR) ............................................... 464
11.5 Changing Frequency .......................................................................................................... 465
11.5.1 Changing Multiplication Rate............................................................................... 465
11.5.2 Changing Division Ratio....................................................................................... 465
11.6 Usage Notes ....................................................................................................................... 466
11.7 Notes on Board Design ...................................................................................................... 466

Section 12 Watchdog Timer (WDT)....................................................................469


12.1 Features.............................................................................................................................. 469
12.2 Register Descriptions for WDT ......................................................................................... 471
12.2.1 Watchdog Timer Counter (WTCNT).................................................................... 471
12.2.2 Watchdog Timer Control/Status Register (WTCSR)............................................ 471
12.2.3 Notes on Register Access...................................................................................... 473
12.3 WDT Operation ................................................................................................................. 474
12.3.1 Canceling Software Standbys ............................................................................... 474
12.3.2 Changing Frequency ............................................................................................. 475
12.3.3 Using Watchdog Timer Mode .............................................................................. 475
12.3.4 Using Interval Timer Mode .................................................................................. 476

Section 13 Power-Down Modes ..........................................................................477


13.1 Features.............................................................................................................................. 477
13.1.1 Power-Down Modes ............................................................................................. 477
13.1.2 Reset ..................................................................................................................... 478
13.2 Input/Output Pins ............................................................................................................... 479
13.3 Register Descriptions ......................................................................................................... 480
13.3.1 Standby Control Register (STBCR)...................................................................... 480
13.3.2 Standby Control Register 2 (STBCR2)................................................................. 481
13.3.3 Standby Control Register 3 (STBCR3)................................................................. 483
13.3.4 Standby Control Register 4 (STBCR4)................................................................. 484
13.3.5 Standby Control Register 5 (STBCR5)................................................................. 486
13.4 Sleep Mode ........................................................................................................................ 488
13.4.1 Transition to Sleep Mode...................................................................................... 488
13.4.2 Canceling Sleep Mode .......................................................................................... 488

Rev. 3.00 Jan. 18, 2008 Page xvii of lxii


13.5 Software Standby Mode..................................................................................................... 489
13.5.1 Transition to Software Standby Mode .................................................................. 489
13.5.2 Canceling Software Standby Mode ...................................................................... 489
13.6 Module Standby Function.................................................................................................. 491
13.6.1 Transition to Module Standby Function ............................................................... 491
13.6.2 Canceling Module Standby Function.................................................................... 491
13.7 STATUS Pin Change Timing ............................................................................................ 492
13.7.1 Reset ..................................................................................................................... 492
13.7.2 Software Standby Mode........................................................................................ 493
13.7.3 Sleep Mode ........................................................................................................... 494
13.8 Hardware Standby Mode ................................................................................................... 496
13.8.1 Transition to Hardware Standby Mode................................................................. 496
13.8.2 Canceling the Hardware Standby Mode ............................................................... 496
13.8.3 Hardware Standby Mode Timing.......................................................................... 497

Section 14 Timer Unit (TMU)............................................................................. 499


14.1 Features.............................................................................................................................. 499
14.2 Register Descriptions......................................................................................................... 501
14.2.1 Timer Start Register (TSTR) ................................................................................ 502
14.2.2 Timer Control Registers (TCR) ............................................................................ 503
14.2.3 Timer Constant Registers (TCOR) ....................................................................... 504
14.2.4 Timer Counters (TCNT) ....................................................................................... 504
14.3 Operation ........................................................................................................................... 505
14.3.1 Counter Operation ................................................................................................ 505
14.4 Interrupts............................................................................................................................ 508
14.4.1 Status Flag Set Timing.......................................................................................... 508
14.4.2 Status Flag Clear Timing ...................................................................................... 508
14.4.3 Interrupt Sources and Priorities ............................................................................ 509
14.5 Usage Notes ....................................................................................................................... 510
14.5.1 Writing to Registers .............................................................................................. 510
14.5.2 Reading Registers ................................................................................................. 510

Section 15 16-Bit Timer Pulse Unit (TPU) ......................................................... 511


15.1 Features.............................................................................................................................. 511
15.2 Input/Output Pins............................................................................................................... 514
15.3 Register Descriptions......................................................................................................... 515
15.3.1 Timer Control Registers (TCR) ............................................................................ 516
15.3.2 Timer Mode Registers (TMDR) ........................................................................... 520
15.3.3 Timer I/O Control Registers (TIOR) .................................................................... 521
15.3.4 Timer Interrupt Enable Registers (TIER) ............................................................. 523

Rev. 3.00 Jan. 18, 2008 Page xviii of lxii


15.3.5 Timer Status Registers (TSR) ............................................................................... 524
15.3.6 Timer Counters (TCNT) ....................................................................................... 526
15.3.7 Timer General Registers (TGR)............................................................................ 526
15.3.8 Timer Start Register (TSTR) ................................................................................ 527
15.4 Operation ........................................................................................................................... 528
15.4.1 Overview............................................................................................................... 528
15.4.2 Basic Functions..................................................................................................... 529
15.4.3 Buffer Operation ................................................................................................... 534
15.4.4 PWM Modes ......................................................................................................... 536
15.4.5 Phase Counting Mode........................................................................................... 539
15.5 Usage Notes ....................................................................................................................... 545

Section 16 Compare Match Timer (CMT) ..........................................................547


16.1 Features.............................................................................................................................. 547
16.2 Register Descriptions ......................................................................................................... 549
16.2.1 Compare Match Timer Start Register (CMSTR) .................................................. 550
16.2.2 Compare Match Timer Control/Status Register (CMCSR) .................................. 551
16.2.3 Compare Match Timer Counter (CMCNT) .......................................................... 553
16.2.4 Compare Match Timer Constant Register (CMCOR)........................................... 553
16.3 Operation ........................................................................................................................... 554
16.3.1 Counter Operation................................................................................................. 554
16.3.2 Counter Size.......................................................................................................... 555
16.3.3 Timing for Counting by CMCNT ......................................................................... 556
16.3.4 DMA Transfer Requests and Internal Interrupt Requests to CPU ........................ 556
16.3.5 Compare Match Flag Set Timing (All Channels) ................................................. 557

Section 17 Realtime Clock (RTC) .......................................................................559


17.1 Features.............................................................................................................................. 559
17.2 Input/Output Pin................................................................................................................. 561
17.3 Register Descriptions ......................................................................................................... 562
17.3.1 64-Hz Counter (R64CNT) .................................................................................... 563
17.3.2 Second Counter (RSECCNT) ............................................................................... 564
17.3.3 Minute Counter (RMINCNT) ............................................................................... 565
17.3.4 Hour Counter (RHRCNT)..................................................................................... 566
17.3.5 Day of Week Counter (RWKCNT) ...................................................................... 567
17.3.6 Date Counter (RDAYCNT) .................................................................................. 568
17.3.7 Month Counter (RMONCNT) .............................................................................. 569
17.3.8 Year Counter (RYRCNT) ..................................................................................... 569
17.3.9 Second Alarm Register (RSECAR) ...................................................................... 570
17.3.10 Minute Alarm Register (RMINAR)...................................................................... 570

Rev. 3.00 Jan. 18, 2008 Page xix of lxii


17.3.11 Hour Alarm Register (RHRAR) ........................................................................... 571
17.3.12 Day of Week Alarm Register (RWKAR) ............................................................. 572
17.3.13 Date Alarm Register (RDAYAR)......................................................................... 573
17.3.14 Month Alarm Register (RMONAR) ..................................................................... 574
17.3.15 Year Alarm Register (RYRAR)............................................................................ 574
17.3.16 RTC Control Register 1 (RCR1)........................................................................... 575
17.3.17 RTC Control Register 2 (RCR2)........................................................................... 577
17.3.18 RTC Control Register 3 (RCR3)........................................................................... 579
17.4 Operation ........................................................................................................................... 580
17.4.1 Initial Settings of Registers after Power-On ......................................................... 580
17.4.2 Setting Time ......................................................................................................... 580
17.4.3 Reading Time........................................................................................................ 581
17.4.4 Alarm Function..................................................................................................... 582
17.5 Usage Notes ....................................................................................................................... 583
17.5.1 Register Writing during RTC Count..................................................................... 583
17.5.2 Use of Realtime Clock (RTC) Periodic Interrupts................................................ 583
17.5.3 Transition to Standby Mode after Setting Register............................................... 583
17.5.4 Crystal Oscillator Circuit ...................................................................................... 584

Section 18 Serial Communication Interface with FIFO (SCIF).......................... 585


18.1 Features.............................................................................................................................. 585
18.2 Input/Output Pins............................................................................................................... 588
18.3 Register Descriptions......................................................................................................... 589
18.3.1 Receive Shift Register (SCRSR) .......................................................................... 590
18.3.2 Receive FIFO Data Register (SCFRDR) .............................................................. 590
18.3.3 Transmit Shift Register (SCTSR) ......................................................................... 590
18.3.4 Transmit FIFO Data Register (SCFTDR)............................................................. 590
18.3.5 Serial Mode Register (SCSMR)............................................................................ 591
18.3.6 Serial Control Register (SCSCR).......................................................................... 595
18.3.7 FIFO Error Count Register (SCFER) ................................................................... 599
18.3.8 Serial Status Register (SCSSR) ............................................................................ 600
18.3.9 Bit Rate Register (SCBRR) .................................................................................. 607
18.3.10 FIFO Control Register (SCFCR) .......................................................................... 609
18.3.11 FIFO Data Count Register (SCFDR).................................................................... 612
18.3.12 Transmit Data Stop Register (SCTDSR) .............................................................. 613
18.4 Operation ........................................................................................................................... 613
18.4.1 Asynchronous Mode ............................................................................................. 613
18.4.2 Serial Operation .................................................................................................... 614
18.4.3 Synchronous Mode ............................................................................................... 624
18.4.4 Serial Operation in Synchronous Mode ................................................................ 625

Rev. 3.00 Jan. 18, 2008 Page xx of lxii


18.5 Interrupt Sources and DMAC ............................................................................................ 635
18.6 Usage Notes ....................................................................................................................... 637

Section 19 Infrared Data Association Module (IrDA).........................................639


19.1 Features.............................................................................................................................. 639
19.2 Input/Output Pins ............................................................................................................... 640
19.3 Register Description........................................................................................................... 640
19.3.1 IrDA Mode Register (SCIMR) ............................................................................. 640
19.4 Operation ........................................................................................................................... 642
19.4.1 Transmitting.......................................................................................................... 642
19.4.2 Receiving .............................................................................................................. 642
19.4.3 Data Format Specification .................................................................................... 643

Section 20 I2C Bus Interface (IIC) .......................................................................645


20.1 Features.............................................................................................................................. 645
20.2 Input/Output Pins ............................................................................................................... 648
20.3 Register Descriptions ......................................................................................................... 648
20.3.1 I2C Bus Control Register 1 (ICCR1)..................................................................... 649
20.3.2 I2C Bus Control Register 2 (ICCR2)..................................................................... 650
20.3.3 I2C Bus Mode Register (ICMR)............................................................................ 651
20.3.4 I2C Bus Interrupt Enable Register (ICIER) ........................................................... 653
20.3.5 I2C Bus Status Register (ICSR)............................................................................. 655
20.3.6 Slave Address Register (SAR).............................................................................. 657
20.3.7 I2C Bus Transmit Data Register (ICDRT)............................................................. 658
20.3.8 I2C Bus Receive Data Register (ICDRR).............................................................. 658
20.3.9 I2C Bus Shift Register (ICDRS)............................................................................ 658
20.3.10 I2C Bus Master Transfer Clock Select Register (ICCKS)..................................... 658
20.4 Operation ........................................................................................................................... 660
20.4.1 I2C Bus Format...................................................................................................... 660
20.4.2 Master Transmit Operation ................................................................................... 661
20.4.3 Master Receive Operation..................................................................................... 663
20.4.4 Slave Transmit Operation ..................................................................................... 665
20.4.5 Slave Receive Operation....................................................................................... 667
20.4.6 Noise Canceller..................................................................................................... 670
20.4.7 Example of Use..................................................................................................... 670
20.5 Interrupt Request................................................................................................................ 675
20.6 Bit Synchronous Circuit..................................................................................................... 676
20.7 Usage Notes ....................................................................................................................... 677

Rev. 3.00 Jan. 18, 2008 Page xxi of lxii


Section 21 Serial I/O with FIFO (SIOF) ............................................................. 679
21.1 Features.............................................................................................................................. 679
21.2 Input/Output Pins............................................................................................................... 681
21.3 Register Descriptions......................................................................................................... 682
21.3.1 Mode Register (SIMDR) ...................................................................................... 683
21.3.2 Control Register (SICTR)..................................................................................... 686
21.3.3 Transmit Data Register (SITDR) .......................................................................... 689
21.3.4 Receive Data Register (SIRDR) ........................................................................... 690
21.3.5 Transmit Control Data Register (SITCR) ............................................................. 691
21.3.6 Receive Control Data Register (SIRCR) .............................................................. 692
21.3.7 Status Register (SISTR)........................................................................................ 693
21.3.8 Interrupt Enable Register (SIIER) ........................................................................ 699
21.3.9 FIFO Control Register (SIFCTR) ......................................................................... 701
21.3.10 Clock Select Register (SISCR) ............................................................................. 703
21.3.11 Transmit Data Assign Register (SITDAR) ........................................................... 704
21.3.12 Receive Data Assign Register (SIRDAR) ............................................................ 706
21.3.13 Control Data Assign Register (SICDAR) ............................................................. 707
21.4 Operation ........................................................................................................................... 709
21.4.1 Serial Clocks......................................................................................................... 709
21.4.2 Serial Timing ........................................................................................................ 711
21.4.3 Transfer Data Format............................................................................................ 713
21.4.4 Register Allocation of Transfer Data .................................................................... 715
21.4.5 Control Data Interface .......................................................................................... 717
21.4.6 FIFO...................................................................................................................... 719
21.4.7 Transmit and Receive Procedures......................................................................... 721
21.4.8 Interrupts............................................................................................................... 727
21.4.9 Transmit and Receive Timing............................................................................... 729
21.5 Usage Notes ....................................................................................................................... 734
21.5.1 Regarding SYNC Signal High Width when Restarting Transmission
in Master Mode 2.................................................................................................. 734

Section 22 Analog Front End Interface (AFEIF) ................................................ 735


22.1 Features.............................................................................................................................. 735
22.2 Input/Output Pins............................................................................................................... 736
22.3 Register Configuration....................................................................................................... 736
22.3.1 AFEIF Control Register 1 and 2 (ACTR1, ACTR2) ............................................ 737
22.3.2 Make Ratio Count Register (MRCR) ................................................................... 740
22.3.3 Minimum Pause Count Register (MPCR) ............................................................ 740
22.3.4 AFEIF Status Register 1 and 2 (ASTR1, ASTR2)................................................ 740

Rev. 3.00 Jan. 18, 2008 Page xxii of lxii


22.3.5 Dial Pulse Number Queue (DPNQ) ...................................................................... 745
22.3.6 Ringing Pulse Counter (RCNT)............................................................................ 746
22.3.7 AFE Control Data Register (ACDR) .................................................................... 746
22.3.8 AFE Status Data Register (ASDR) ....................................................................... 746
22.3.9 Transmit Data FIFO Port (TDFP)......................................................................... 747
22.3.10 Receive Data FIFO Port (RDFP) .......................................................................... 747
22.4 Operation ........................................................................................................................... 748
22.4.1 Interrupt Timing.................................................................................................... 748
22.4.2 AFE Interface........................................................................................................ 750
22.4.3 DAA Interface....................................................................................................... 752
22.4.4 Wake up Ringing Interrupt ................................................................................... 754

Section 23 USB Pin Multiplex Controller ...........................................................755


23.1 Features.............................................................................................................................. 755
23.2 Input/Output Pins ............................................................................................................... 756
23.3 Register Descriptions ......................................................................................................... 758
23.3.1 USB Transceiver Control Register (UTRCTL) .................................................... 758
23.4 Examples of External Circuit............................................................................................. 759
23.4.1 Example of the Connection between USB Function Controller and Transceiver. 759
23.4.2 Example of the Connection between USB Host Controller and Transceiver........ 761
23.5 Usage Notes ....................................................................................................................... 763
23.5.1 About the USB Transceiver .................................................................................. 763
23.5.2 About the Examples of External Circuit ............................................................... 763

Section 24 USB Host Controller (USBH) ...........................................................765


24.1 Features.............................................................................................................................. 765
24.2 Input/Output Pins ............................................................................................................... 766
24.3 Register Descriptions ......................................................................................................... 767
24.3.1 Hc Revision Register (USBHR) ........................................................................... 768
24.3.2 Hc Control Register (USBHC) ............................................................................. 768
24.3.3 Hc Command Status Register (USBHCS) ............................................................ 771
24.3.4 Hc Interrupt Status Register (USBHIS) ................................................................ 774
24.3.5 Hc Interrupt Enable Register (USBHIE) .............................................................. 776
24.3.6 Hc Interrupt Disable Register (USBHID) ............................................................. 777
24.3.7 HCCA Register (USBHHCCA)............................................................................ 779
24.3.8 Hc Period Current ED Register (USBHPCED) .................................................... 779
24.3.9 Hc Control Head ED Register (USBHCHED)...................................................... 780
24.3.10 Hc Control Current ED Register (USBHCCED) .................................................. 780
24.3.11 Hc Bulk Head ED Register (USBHBHED) .......................................................... 780
24.3.12 Hc Bulk Current ED Register (USBHBCED) ...................................................... 781

Rev. 3.00 Jan. 18, 2008 Page xxiii of lxii


24.3.13 Hc Done Head ED Register (USBHDHED)......................................................... 781
24.3.14 Hc Fm Interval Register (USBHFI)...................................................................... 781
24.3.15 Hc Frame Remaining Register (USBHFR)........................................................... 783
24.3.16 Hc Fm Number b Register (USBHFN)................................................................. 784
24.3.17 Hc Periodic Start Register (USBHPS) .................................................................. 785
24.3.18 Hc LS Threshold Register (USBHLST) ............................................................... 786
24.3.19 Hc Rh Descriptor A Register (USBHRDA) ......................................................... 787
24.3.20 Hc Rh Descriptor B Register (USBHRDB).......................................................... 789
24.3.21 Hc Rh Status Register (USBHRS)........................................................................ 790
24.3.22 Hc Rh Port Status 1 and Hc Rh Port Status 2 Registers
(USBHRPS1, USBHRPS2) .................................................................................. 792
24.4 Data Storage Format which Required by USB Host Controller ........................................ 798
24.4.1 Storage Format of the Transferred Data ............................................................... 798
24.4.2 Storage Format of the Descriptor.......................................................................... 799
24.5 Data Alignment Restriction of USB Host Controller......................................................... 799
24.5.1 Restriction on the Line Boundary of the Synchronous DRAM ............................ 799
24.5.2 Restriction on the Memory Access Address ......................................................... 800
24.6 Accessing External Address from the USB Host............................................................... 800
24.7 Usage Notes ....................................................................................................................... 801

Section 25 USB Function Controller (USBF) ..................................................... 803


25.1 Features.............................................................................................................................. 803
25.2 Input/Output Pins............................................................................................................... 805
25.3 Register Descriptions......................................................................................................... 806
25.3.1 Interrupt Flag Register 0 (IFR0) ........................................................................... 808
25.3.2 Interrupt Flag Register 1 (IFR1) ........................................................................... 810
25.3.3 Interrupt Flag Register 2 (IFR2) ........................................................................... 811
25.3.4 Interrupt Flag Register 3 (IFR3) ........................................................................... 813
25.3.5 Interrupt Flag Register 4 (IFR4) ........................................................................... 815
25.3.6 Interrupt Select Register 0 (ISR0)......................................................................... 816
25.3.7 Interrupt Select Register 1 (ISR1)......................................................................... 816
25.3.8 Interrupt Select Register 2 (ISR2)......................................................................... 817
25.3.9 Interrupt Select Register 3 (ISR3)......................................................................... 817
25.3.10 Interrupt Select Register 4 (ISR4)......................................................................... 818
25.3.11 Interrupt Enable Register 0 (IER0) ....................................................................... 818
25.3.12 Interrupt Enable Register 1 (IER1) ....................................................................... 819
25.3.13 Interrupt Enable Register 2 (IER2) ....................................................................... 819
25.3.14 Interrupt Enable Register 3 (IER3) ....................................................................... 820
25.3.15 Interrupt Enable Register 4 (IER4) ....................................................................... 820
25.3.16 EP0i Data Register (EPDR0i)............................................................................... 821

Rev. 3.00 Jan. 18, 2008 Page xxiv of lxii


25.3.17 EP0o Data Register (EPDR0o) ............................................................................. 821
25.3.18 EP0s Data Register (EPDR0s) .............................................................................. 821
25.3.19 EP1 Data Register (EPDR1) ................................................................................. 822
25.3.20 EP2 Data Register (EPDR2) ................................................................................. 822
25.3.21 EP3 Data Register (EPDR3) ................................................................................. 822
25.3.22 EP4 Data Register (EPDR4) ................................................................................. 823
25.3.23 EP5 Data Register (EPDR5) ................................................................................. 823
25.3.24 EP0o Receive Data Size Register (EPSZ0o) ........................................................ 823
25.3.25 EP1 Receive Data Size Register (EPSZ1) ............................................................ 824
25.3.26 EP4 Receive Data Size Register (EPSZ4) ............................................................ 824
25.3.27 Trigger Register (TRG)......................................................................................... 824
25.3.28 Data Status Register (DASTS).............................................................................. 825
25.3.29 FIFO Clear Register 0 (FCLR0) ........................................................................... 825
25.3.30 FIFO Clear Register 1 (FCLR1) ........................................................................... 826
25.3.31 DMA Transfer Setting Register (DMA) ............................................................... 826
25.3.32 Endpoint Stall Register 0 (EPSTL0)..................................................................... 827
25.3.33 Endpoint Stall Register 1 (EPSTL1)..................................................................... 828
25.3.34 Configuration Value Register (CVR) ................................................................... 828
25.3.35 Time Stamp Register (TSRH/TSRL).................................................................... 829
25.3.36 Control Register 0 (CTLR0) ................................................................................. 830
25.3.37 Control Register 1 (CTLR1) ................................................................................. 831
25.3.38 Endpoint Information Register (EPIR) ................................................................. 831
25.3.39 Timer Register (TMRH/TMRL) ........................................................................... 836
25.3.40 Set Time Out Register (STOH/STOL).................................................................. 836
25.4 Operation ........................................................................................................................... 837
25.4.1 Cable Connection.................................................................................................. 837
25.4.2 Cable Disconnection ............................................................................................. 838
25.4.3 Control Transfer.................................................................................................... 839
25.4.4 EP1 Bulk-Out Transfer (Dual FIFOs)................................................................... 845
25.4.5 EP2 Bulk-In Transfer (Dual FIFOs) ..................................................................... 846
25.4.6 EP3 Interrupt-In Transfer...................................................................................... 848
25.5 EP4 Isochronous-Out Transfer........................................................................................... 849
25.6 EP5 Isochronous-In Transfer ............................................................................................. 852
25.7 Processing of USB Standard Commands and Class/Vendor Commands........................... 855
25.7.1 Processing of Commands Transmitted by Control Transfer ................................. 855
25.8 Stall Operations.................................................................................................................. 856
25.8.1 Overview............................................................................................................... 856
25.8.2 Forcible Stall by Application ................................................................................ 856
25.8.3 Automatic Stall by USB Function Controller ....................................................... 858

Rev. 3.00 Jan. 18, 2008 Page xxv of lxii


25.9 Usage Notes ....................................................................................................................... 859
25.9.1 Setup Data Reception ........................................................................................... 859
25.9.2 FIFO Clear............................................................................................................ 859
25.9.3 Overreading/Overwriting of Data Register........................................................... 859
25.9.4 Assigning EP0 Interrupt Sources .......................................................................... 860
25.9.5 FIFO Clear when DMA Transfer is Set ................................................................ 860
25.9.6 Note on Using TR Interrupt .................................................................................. 860
25.9.7 Note on Clock Frequency ..................................................................................... 861

Section 26 LCD Controller (LCDC) ................................................................... 863


26.1 Features.............................................................................................................................. 863
26.2 Input/Output Pins............................................................................................................... 865
26.3 Register Configuration....................................................................................................... 866
26.3.1 LCDC Input Clock Register (LDICKR) ............................................................... 867
26.3.2 LCDC Module Type Register (LDMTR) ............................................................. 868
26.3.3 LCDC Data Format Register (LDDFR)................................................................ 871
26.3.4 LCDC Scan Mode Register (LDSMR) ................................................................. 873
26.3.5 LCDC Start Address Register for Upper Display Data Fetch (LDSARU) ........... 875
26.3.6 LCDC Start Address Register for Lower Display Data Fetch (LDSARL) ........... 876
26.3.7 LCDC Line Address Offset Register for Display Data Fetch (LDLAOR) ........... 877
26.3.8 LCDC Palette Control Register (LDPALCR)....................................................... 878
26.3.9 Palette Data Registers 00 to FF (LDPR00 to LDPRFF) ....................................... 879
26.3.10 LCDC Horizontal Character Number Register (LDHCNR) ................................. 880
26.3.11 LCDC Horizontal Sync Signal Register (LDHSYNR)......................................... 881
26.3.12 LCDC Vertical Display Line Number Register (LDVDLNR) ............................. 882
26.3.13 LCDC Vertical Total Line Number Register (LDVTLNR).................................. 883
26.3.14 LCDC Vertical Sync Signal Register (LDVSYNR) ............................................. 884
26.3.15 LCDC AC Modulation Signal Toggle Line Number Register (LDACLNR) ....... 885
26.3.16 LCDC Interrupt Control Register (LDINTR) ....................................................... 886
26.3.17 LCDC Power Management Mode Register (LDPMMR) ..................................... 889
26.3.18 LCDC Power-Supply Sequence Period Register (LDPSPR)................................ 891
26.3.19 LCDC Control Register (LDCNTR)..................................................................... 892
26.3.20 LCDC User Specified Interrupt Control Register (LDUINTR)............................ 893
26.3.21 LCDC User Specified Interrupt Line Number Register (LDUINTLNR) ............. 895
26.3.22 LCDC Memory Access Interval Number Register (LDLIRNR) .......................... 896
26.4 Operation ........................................................................................................................... 897
26.4.1 LCD Module Sizes which can be Displayed in this LCDC .................................. 897
26.4.2 Limits on the Resolution of Rotated Displays, Burst Length,
and Connected Memory (SDRAM) ...................................................................... 898
26.4.3 Color Palette Specification ................................................................................... 905

Rev. 3.00 Jan. 18, 2008 Page xxvi of lxii


26.4.4 Data Format .......................................................................................................... 907
26.4.5 Setting the Display Resolution.............................................................................. 910
26.4.6 Power Management Registers............................................................................... 910
26.4.7 Operation for Hardware Rotation ......................................................................... 915
26.5 Clock and LCD Data Signal Examples.............................................................................. 918
26.6 Usage Notes ....................................................................................................................... 928
26.6.1 Procedure for Halting Access to Display Data Storage VRAM
(Synchronous DRAM in Area 3) .......................................................................... 928

Section 27 A/D Converter....................................................................................929


27.1 Features.............................................................................................................................. 929
27.2 Input Pins ........................................................................................................................... 931
27.3 Register Descriptions ......................................................................................................... 932
27.3.1 A/D Data Registers A to D (ADDRA to ADDRD) .............................................. 932
27.3.2 A/D Control/Status Registers (ADCSR)............................................................... 933
27.4 Operation ........................................................................................................................... 936
27.4.1 Single Mode.......................................................................................................... 936
27.4.2 Multi Mode ........................................................................................................... 938
27.4.3 Scan Mode ............................................................................................................ 940
27.4.4 Input Sampling and A/D Conversion Time .......................................................... 942
27.4.5 External Trigger Input Timing.............................................................................. 943
27.5 Interrupts............................................................................................................................ 944
27.6 Definitions of A/D Conversion Accuracy.......................................................................... 944
27.7 Usage Notes ....................................................................................................................... 946
27.7.1 Notes on A/D Conversion..................................................................................... 946
27.7.2 Notes on A/D Conversion-End Interrupt and DMA Transfer............................... 948
27.7.3 Allowable Signal-Source Impedance.................................................................... 948
27.7.4 Influence to Absolute Accuracy............................................................................ 949
27.7.5 Setting Analog Input Voltage ............................................................................... 949
27.7.6 Notes on Board Design ......................................................................................... 949
27.7.7 Notes on Countermeasures to Noise ..................................................................... 950

Section 28 D/A Converter (DAC)........................................................................953


28.1 Features.............................................................................................................................. 953
28.2 Input/Output Pins ............................................................................................................... 954
28.3 Register Descriptions ......................................................................................................... 954
28.3.1 D/A Data Registers 0 and 1 (DADR0, DADR1) .................................................. 954
28.3.2 D/A Control Register (DACR) ............................................................................. 955
28.4 Operation ........................................................................................................................... 956

Rev. 3.00 Jan. 18, 2008 Page xxvii of lxii


Section 29 PC Card Controller (PCC)................................................................. 957
29.1 Features.............................................................................................................................. 957
29.1.1 PCMCIA Support ................................................................................................. 959
29.2 Input/Output Pins............................................................................................................... 962
29.3 Register Descriptions......................................................................................................... 963
29.3.1 Area 6 Interface Status Register (PCC0ISR) ........................................................ 963
29.3.2 Area 6 General Control Register (PCC0GCR) ..................................................... 966
29.3.3 Area 6 Card Status Change Register (PCC0CSCR) ............................................. 969
29.3.4 Area 6 Card Status Change Interrupt Enable Register (PCC0CSCIER)............... 972
29.4 Operation ........................................................................................................................... 976
29.4.1 PC card Connection Specification (Interface Diagram, Pin Correspondence)...... 976
29.4.2 PC Card Interface Timing..................................................................................... 980
29.5 Usage Notes ....................................................................................................................... 985

Section 30 SIM Card Module (SIM) ................................................................... 987


30.1 Features.............................................................................................................................. 987
30.2 Input/Output Pins............................................................................................................... 989
30.3 Register Descriptions......................................................................................................... 989
30.3.1 Serial Mode Register (SCSMR)............................................................................ 990
30.3.2 Bit Rate Register (SCBRR) .................................................................................. 991
30.3.3 Serial Control Register (SCSCR).......................................................................... 992
30.3.4 Transmit Shift Register (SCTSR) ......................................................................... 994
30.3.5 Transmit Data Register (SCTDR)......................................................................... 994
30.3.6 Serial Status Register (SCSSR) ............................................................................ 995
30.3.7 Receive Shift Register (SCRSR) ........................................................................ 1001
30.3.8 Receive Data Register (SCRDR) ........................................................................ 1001
30.3.9 Smart Card Mode Register (SCSCMR) .............................................................. 1002
30.3.10 Serial Control 2 Register (SCSC2R)................................................................... 1003
30.3.11 Guard Extension Register (SCGRD) .................................................................. 1004
30.3.12 Wait Time Register (SCWAIT) .......................................................................... 1004
30.3.13 Sampling Register (SCSMPL)............................................................................ 1005
30.4 Operation ......................................................................................................................... 1006
30.4.1 Overview ............................................................................................................ 1006
30.4.2 Data Format ........................................................................................................ 1007
30.4.3 Register Settings ................................................................................................. 1008
30.4.4 Clocks ................................................................................................................. 1011
30.4.5 Data Transmit/Receive Operation....................................................................... 1012
30.5 Usage Notes ..................................................................................................................... 1020

Rev. 3.00 Jan. 18, 2008 Page xxviii of lxii


Section 31 MultiMediaCard Interface (MMCIF) ..............................................1027
31.1 Features............................................................................................................................ 1027
31.2 Input/Output Pins ............................................................................................................. 1029
31.3 Register Descriptions ....................................................................................................... 1030
31.3.1 Mode Register (MODER)................................................................................... 1031
31.3.2 Command Type Register (CMDTYR)................................................................ 1031
31.3.3 Response Type Register (RSPTYR) ................................................................... 1033
31.3.4 Transfer Byte Number Count Register (TBCR) ................................................. 1036
31.3.5 Transfer Block Number Counter (TBNCR)........................................................ 1037
31.3.6 Command Registers 0 to 5 (CMDR0 to CMDR5).............................................. 1037
31.3.7 Response Registers 0 to 16 and D (RSPR0 to RSPR16 and RSPRD) ................ 1038
31.3.8 Command Start Register (CMDSTRT)............................................................... 1040
31.3.9 Operation Control Register (OPCR) ................................................................... 1041
31.3.10 Command Timeout Control Register (CTOCR) ................................................. 1043
31.3.11 Data Timeout Register (DTOUTR) .................................................................... 1044
31.3.12 Card Status Register (CSTR) .............................................................................. 1045
31.3.13 Interrupt Control Registers 0 and 1 (INTCR0 and INTCR1).............................. 1047
31.3.14 Interrupt Status Registers 0 and 1 (INTSTR0 and INTSTR1) ............................ 1049
31.3.15 Transfer Clock Control Register (CLKON)........................................................ 1053
31.3.16 VDD/Open-Drain Control Register (VDCNT)................................................... 1054
31.3.17 Data Register (DR) ............................................................................................. 1054
31.3.18 FIFO Pointer Clear Register (FIFOCLR) ........................................................... 1055
31.3.19 DMA Control Register (DMACR) ..................................................................... 1055
31.3.20 Interrupt Control Register 2 (INTCR2)............................................................... 1056
31.3.21 Interrupt Status Register 2 (INTSTR2)............................................................... 1057
31.4 Operation ......................................................................................................................... 1058
31.4.1 Operations in MMC Mode.................................................................................. 1058
31.5 Operations Using DMAC................................................................................................. 1088
31.5.1 Operation of Read Sequence............................................................................... 1088
31.5.2 Operation of Write Sequence.............................................................................. 1098
31.6 MMCIF Interrupt Sources................................................................................................ 1108

Section 32 SSL Accelerator (SSL) ....................................................................1109

Section 33 User Break Controller (UBC) ..........................................................1111


33.1 Features............................................................................................................................ 1111
33.2 Register Descriptions ....................................................................................................... 1113
33.2.1 Break Address Register A (BARA) .................................................................... 1113
33.2.2 Break Address Mask Register A (BAMRA)....................................................... 1114

Rev. 3.00 Jan. 18, 2008 Page xxix of lxii


33.2.3 Break Bus Cycle Register A (BBRA)................................................................. 1114
33.2.4 Break Address Register B (BARB) .................................................................... 1116
33.2.5 Break Address Mask Register B (BAMRB) ....................................................... 1117
33.2.6 Break Data Register B (BDRB).......................................................................... 1117
33.2.7 Break Data Mask Register B (BDMRB)............................................................. 1118
33.2.8 Break Bus Cycle Register B (BBRB) ................................................................. 1119
33.2.9 Break Control Register (BRCR) ......................................................................... 1120
33.2.10 Execution Times Break Register (BETR)........................................................... 1124
33.2.11 Branch Source Register (BRSR)......................................................................... 1124
33.2.12 Branch Destination Register (BRDR)................................................................. 1125
33.2.13 Break ASID Register A (BASRA) ..................................................................... 1125
33.2.14 Break ASID Register B (BASRB)...................................................................... 1126
33.3 Operation ......................................................................................................................... 1127
33.3.1 Flow of the User Break Operation ...................................................................... 1127
33.3.2 Break on Instruction Fetch Cycle ....................................................................... 1128
33.3.3 Break on Data Access Cycle............................................................................... 1129
33.3.4 Break on X/Y-Memory Bus Cycle ..................................................................... 1130
33.3.5 Sequential Break................................................................................................. 1131
33.3.6 Value of Saved Program Counter ....................................................................... 1131
33.3.7 PC Trace ............................................................................................................. 1132
33.3.8 Usage Examples.................................................................................................. 1133
33.4 Usage Notes ..................................................................................................................... 1138

Section 34 Pin Function Controller (PFC) ........................................................ 1141


34.1 Register Descriptions....................................................................................................... 1146
34.1.1 Port A Control Register (PACR) ........................................................................ 1147
34.1.2 Port B Control Register (PBCR)......................................................................... 1148
34.1.3 Port C Control Register (PCCR)......................................................................... 1150
34.1.4 Port D Control Register (PDCR) ........................................................................ 1151
34.1.5 Port E Control Register (PECR) ......................................................................... 1153
34.1.6 Port F Control Register (PFCR).......................................................................... 1154
34.1.7 Port G Control Register (PGCR) ........................................................................ 1156
34.1.8 Port H Control Register (PHCR) ........................................................................ 1157
34.1.9 Port J Control Register (PJCR) ........................................................................... 1159
34.1.10 Port K Control Register (PKCR) ........................................................................ 1160
34.1.11 Port L Control Register (PLCR) ......................................................................... 1161
34.1.12 Port M Control Register (PMCR) ....................................................................... 1162
34.1.13 Port P Control Register (PPCR).......................................................................... 1164
34.1.14 Port R Control Register (PRCR)......................................................................... 1165
34.1.15 Port S Control Register (PSCR).......................................................................... 1167

Rev. 3.00 Jan. 18, 2008 Page xxx of lxii


34.1.16 Port T Control Register (PTCR) ......................................................................... 1168
34.1.17 Port U Control Register (PUCR) ........................................................................ 1169
34.1.18 Port V Control Register (PVCR) ........................................................................ 1170
34.1.19 Pin Select Register A (PSELA) .......................................................................... 1171
34.1.20 Pin Select Register B (PSELB)........................................................................... 1173
34.1.21 Pin Select Register C (PSELC)........................................................................... 1174
34.1.22 Pin Select Register D (PSELD) .......................................................................... 1176
34.1.23 USB Transceiver Control Register (UTRCTL) .................................................. 1178

Section 35 I/O Ports ...........................................................................................1179


35.1 Port A............................................................................................................................... 1179
35.1.1 Register Description ........................................................................................... 1179
35.1.2 Port A Data Register (PADR)............................................................................. 1180
35.2 Port B ............................................................................................................................... 1181
35.2.1 Register Description ........................................................................................... 1181
35.2.2 Port B Data Register (PBDR) ............................................................................. 1182
35.3 Port C ............................................................................................................................... 1183
35.3.1 Register Description ........................................................................................... 1183
35.3.2 Port C Data Register (PCDR) ............................................................................. 1184
35.4 Port D............................................................................................................................... 1185
35.4.1 Register Description ........................................................................................... 1185
35.4.2 Port D Data Register (PDDR)............................................................................. 1186
35.5 Port E ............................................................................................................................... 1187
35.5.1 Register Description ........................................................................................... 1187
35.5.2 Port E Data Register (PEDR).............................................................................. 1188
35.6 Port F ............................................................................................................................... 1190
35.6.1 Register Description ........................................................................................... 1190
35.6.2 Port F Data Register (PFDR) .............................................................................. 1191
35.7 Port G............................................................................................................................... 1193
35.7.1 Register Description ........................................................................................... 1193
35.7.2 Port G Data Register (PGDR)............................................................................. 1194
35.8 Port H............................................................................................................................... 1195
35.8.1 Register Description ........................................................................................... 1195
35.8.2 Port H Data Register (PHDR)............................................................................. 1196
35.9 Port J ................................................................................................................................ 1197
35.9.1 Register Description ........................................................................................... 1197
35.9.2 Port J Data Register (PJDR) ............................................................................... 1198
35.10 Port K............................................................................................................................... 1199
35.10.1 Register Description ........................................................................................... 1199
35.10.2 Port K Data Register (PKDR)............................................................................. 1200

Rev. 3.00 Jan. 18, 2008 Page xxxi of lxii


35.11 Port L ............................................................................................................................... 1201
35.11.1 Register Description ........................................................................................... 1201
35.11.2 Port L Data Register (PLDR).............................................................................. 1202
35.12 Port M .............................................................................................................................. 1203
35.12.1 Register Description ........................................................................................... 1203
35.12.2 Port M Data Register (PMDR) ........................................................................... 1204
35.13 Port P ............................................................................................................................... 1205
35.13.1 Register Description ........................................................................................... 1205
35.13.2 Port P Data Register (PPDR) .............................................................................. 1206
35.14 Port R ............................................................................................................................... 1207
35.14.1 Register Description ........................................................................................... 1207
35.14.2 Port R Data Register (PRDR) ............................................................................. 1208
35.15 Port S ............................................................................................................................... 1209
35.15.1 Register Description ........................................................................................... 1209
35.15.2 Port S Data Register (PSDR) .............................................................................. 1210
35.16 Port T ............................................................................................................................... 1211
35.16.1 Register Description ........................................................................................... 1211
35.16.2 Port T Data Register (PTDR).............................................................................. 1212
35.17 Port U............................................................................................................................... 1213
35.17.1 Register Description ........................................................................................... 1213
35.17.2 Port U Data Register (PUDR)............................................................................. 1214
35.18 Port V............................................................................................................................... 1215
35.18.1 Register Description ........................................................................................... 1215
35.18.2 Port V Data Register (PVDR)............................................................................. 1216

Section 36 User Debugging Interface (H-UDI)................................................. 1217


36.1 Features............................................................................................................................ 1217
36.2 Input/Output Pins............................................................................................................. 1218
36.3 Register Descriptions....................................................................................................... 1220
36.3.1 Bypass Register (SDBPR) .................................................................................. 1220
36.3.2 Instruction Register (SDIR) ................................................................................ 1220
36.3.3 Shift Register ...................................................................................................... 1221
36.3.4 Boundary Scan Register (SDBSR) ..................................................................... 1221
36.3.5 ID Register (SDID)............................................................................................. 1230
36.4 Operation ......................................................................................................................... 1231
36.4.1 TAP Controller ................................................................................................... 1231
36.4.2 Reset Configuration ............................................................................................ 1232
36.4.3 TDO Output Timing ........................................................................................... 1232
36.4.4 H-UDI Reset ....................................................................................................... 1233
36.4.5 H-UDI Interrupt .................................................................................................. 1233

Rev. 3.00 Jan. 18, 2008 Page xxxii of lxii


36.5 Boundary Scan ................................................................................................................. 1234
36.5.1 Supported Instructions ........................................................................................ 1234
36.5.2 Points for Attention............................................................................................. 1235
36.6 Usage Notes ..................................................................................................................... 1236
36.7 Advanced User Debugger (AUD).................................................................................... 1236

Section 37 List of Registers ...............................................................................1237


37.1 Register Addresses........................................................................................................... 1238
37.2 Register Bits..................................................................................................................... 1255
37.3 Register States in Each Operating Mode ......................................................................... 1289

Section 38 Electrical Characteristics .................................................................1305


38.1 Absolute Maximum Ratings ............................................................................................ 1305
38.2 Power-On and Power-Off Order ...................................................................................... 1306
38.3 DC Characteristics ........................................................................................................... 1309
38.4 AC Characteristics ........................................................................................................... 1314
38.4.1 Clock Timing ...................................................................................................... 1315
38.4.2 Control Signal Timing ........................................................................................ 1319
38.4.3 AC Bus Timing................................................................................................... 1322
38.4.4 Basic Timing....................................................................................................... 1324
38.4.5 Burst ROM Timing............................................................................................. 1331
38.4.6 SDRAM Timing ................................................................................................. 1332
38.4.7 PCMCIA Timing ................................................................................................ 1351
38.4.8 Peripheral Module Signal Timing....................................................................... 1355
38.4.9 16-Bit Timer Pulse Unit (TPU)........................................................................... 1356
38.4.10 RTC Signal Timing............................................................................................. 1357
38.4.11 SCIF Module Signal Timing............................................................................... 1358
38.4.12 I2C Bus Interface Timing .................................................................................... 1360
38.4.13 SIOF Module Signal Timing .............................................................................. 1362
38.4.14 AFEIF Module Signal Timing ............................................................................ 1365
38.4.15 USB Module Signal Timing ............................................................................... 1366
38.4.16 LCDC Module Signal Timing ............................................................................ 1368
38.4.17 SIM Module Signal Timing ................................................................................ 1369
38.4.18 MMCIF Module Signal Timing.......................................................................... 1370
38.4.19 H-UDI Related Pin Timing................................................................................. 1372
38.5 A/D Converter Characteristics ......................................................................................... 1374
38.6 D/A Converter Characteristics ......................................................................................... 1374
38.7 AC Characteristic Test Conditions................................................................................... 1375

Rev. 3.00 Jan. 18, 2008 Page xxxiii of lxii


Appendix ....................................................................................................... 1377
A. Pin States ......................................................................................................................... 1377
B. Product Lineup................................................................................................................. 1390
C. Package Dimensions ........................................................................................................ 1392

Main Revisions and Additions in this Edition................................................... 1395

Index ....................................................................................................... 1451

Rev. 3.00 Jan. 18, 2008 Page xxxiv of lxii


Figures
Section 1 Overview
Figure 1.1 Block Diagram ............................................................................................................ 10
Figure 1.2 Pin Assignments (PLBG0256GA-A (BP-256H/HV))................................................. 11
Figure 1.3 Pin Assignments (PLBG0256KA-A (BP-256C/CV)) ................................................. 12
Section 2 CPU
Figure 2.1 Processing State Transitions........................................................................................ 38
Figure 2.2 Virtual Address to External Memory Space Mapping................................................. 41
Figure 2.3 Register Configuration in Each Processing Mode....................................................... 44
Figure 2.4 General Registers ........................................................................................................ 46
Figure 2.5 System Registers and Program Counter ...................................................................... 47
Figure 2.6 Control Register Configuration ................................................................................... 51
Figure 2.7 Data Format on Memory (Big Endian Mode) ............................................................. 52
Figure 2.8 Data Format on Memory (Little Endian Mode) .......................................................... 53
Section 3 DSP Operating Unit
Figure 3.1 DSP Instruction Format............................................................................................... 82
Figure 3.2 CPU Registers in DSP Mode....................................................................................... 84
Figure 3.3 DSP Register Configuration ........................................................................................ 88
Figure 3.4 DSP Registers and Bus Connections ......................................................................... 101
Figure 3.5 General Registers (DSP Mode) ................................................................................. 104
Figure 3.6 Sample Parallel Instruction Program......................................................................... 119
Figure 3.7 Examples of Conditional Operations and Data Transfer Instructions ....................... 121
Figure 3.8 Data Formats ............................................................................................................. 124
Figure 3.9 ALU Fixed-Point Arithmetic Operation Flow........................................................... 125
Figure 3.10 Operation Sequence Example.................................................................................. 127
Figure 3.11 DC Bit Generation Examples in Carry or Borrow Mode ........................................ 128
Figure 3.12 DC Bit Generation Examples in Negative Value Mode .......................................... 129
Figure 3.13 DC Bit Generation Examples in Overflow Mode.................................................... 129
Figure 3.14 ALU Integer Arithmetic Operation Flow ................................................................ 131
Figure 3.15 ALU Logical Operation Flow ................................................................................. 133
Figure 3.16 Fixed-Point Multiply Operation Flow ..................................................................... 135
Figure 3.17 Arithmetic Shift Operation Flow............................................................................. 137
Figure 3.18 Logical Shift Operation Flow.................................................................................. 139
Figure 3.19 PDMSB Operation Flow ......................................................................................... 141
Figure 3.20 Rounding Operation Flow ....................................................................................... 145
Figure 3.21 Definition of Rounding Operation........................................................................... 145

Rev. 3.00 Jan. 18, 2008 Page xxxv of lxii


Figure 3.22 Local Data Move Instruction Flow.......................................................................... 147
Section 4 Memory Management Unit (MMU)
Figure 4.1 MMU Functions ........................................................................................................ 167
Figure 4.2 Virtual Address Space (MMUCR.AT = 1)................................................................ 169
Figure 4.3 Virtual Address Space (MMUCR.AT = 0)................................................................ 170
Figure 4.4 P4 Area...................................................................................................................... 171
Figure 4.5 Physical Address Space............................................................................................. 172
Figure 4.6 Overall Configuration of the TLB............................................................................. 177
Figure 4.7 Virtual address and TLB Structure............................................................................ 178
Figure 4.8 TLB Indexing (IX = 1) .............................................................................................. 179
Figure 4.9 TLB Indexing (IX = 0) .............................................................................................. 180
Figure 4.10 Objects of Address Comparison.............................................................................. 181
Figure 4.11 Operation of LDTLB Instruction............................................................................. 185
Figure 4.12 Synonym Problem (32-kbyte Cache) ...................................................................... 187
Figure 4.13 MMU Exception Generation Flowchart .................................................................. 193
Figure 4.14 Specifying Address and Data for Memory-Mapped TLB Access ........................... 195
Section 5 Cache
Figure 5.1 Cache Structure ......................................................................................................... 198
Figure 5.2 Cache Search Scheme ............................................................................................... 206
Figure 5.3 Write-Back Buffer Configuration.............................................................................. 208
Figure 5.4 Specifying Address and Data for Memory-Mapped Cache Access
(16-kbyte mode) ........................................................................................................ 211
Section 7 Exception Handling
Figure 7.1 Register Bit Configuration ........................................................................................ 218
Section 8 Interrupt Controller (INTC)
Figure 8.1 Block Diagram of INTC............................................................................................ 244
Figure 8.2 Example of IRL Interrupt Connection....................................................................... 267
Figure 8.3 Interrupt Operation Flowchart................................................................................... 277
Section 9 Bus State Controller (BSC)
Figure 9.1 Block Diagram of BSC ............................................................................................. 282
Figure 9.2 Address Space ........................................................................................................... 286
Figure 9.3 Normal Space Basic Access Timing (Access Wait 0)............................................... 337
Figure 9.4 Continuous Access for Normal Space 1, Bus Width = 16 bits, Longword Access,
CSnWCR.WM Bit = 0 (Access Wait = 0, Cycle Wait = 0) ...................................... 339

Rev. 3.00 Jan. 18, 2008 Page xxxvi of lxii


Figure 9.5 Continuous Access for Normal Space 2, Bus Width = 16 bits, Longword Access,
CSnWCR.WM Bit = 1 (Access Wait = 0, Cycle Wait = 0) ...................................... 340
Figure 9.6 Example of 32-Bit Data-Width SRAM Connection .................................................. 341
Figure 9.7 Example of 16-Bit Data-Width SRAM Connection .................................................. 342
Figure 9.8 Example of 8-Bit Data-Width SRAM Connection.................................................... 342
Figure 9.9 Wait Timing for Normal Space Access (Software Wait Only) ................................. 343
Figure 9.10 Wait State Timing for Normal Space Access
(Wait State Insertion using WAIT Signal) .............................................................. 344
Figure 9.11 CSn Assert Period Expansion.................................................................................. 345
Figure 9.12 Example of 32-Bit Data-Width SDRAM Connection ............................................. 347
Figure 9.13 Example of 16-Bit Data-Width SDRAM Connection ............................................. 348
Figure 9.14 Burst Read Basic Timing (Auto-Precharge)............................................................ 361
Figure 9.15 Burst Read Wait Specification Timing (Auto-Precharge)....................................... 362
Figure 9.16 Basic Timing for Single Read (Auto-Precharge)..................................................... 363
Figure 9.17 Basic Timing for Burst Write (Auto-Precharge) ..................................................... 365
Figure 9.18 Basic Timing for Single Write (Auto-Precharge).................................................... 366
Figure 9.19 Burst Read Timing (No Auto-Precharge)................................................................ 368
Figure 9.20 Burst Read Timing (Bank Active, Same Row Address) ......................................... 369
Figure 9.21 Burst Read Timing (Bank Active, Different Row Addresses) ................................ 370
Figure 9.22 Single Write Timing (No Auto-Precharge) ............................................................. 371
Figure 9.23 Single Write Timing (Bank Active, Same Row Address) ....................................... 372
Figure 9.24 Single Write Timing (Bank Active, Different Row Addresses) .............................. 373
Figure 9.25 Auto-Refresh Timing .............................................................................................. 375
Figure 9.26 Self-Refresh Timing ................................................................................................ 376
Figure 9.27 Access Timing in Power-Down Mode .................................................................... 378
Figure 9.28 Write Timing for SDRAM Mode Register (Based on JEDEC)............................... 381
Figure 9.29 EMRS Command Issue Timing............................................................................... 384
Figure 9.30 Transition Timing in Deep Power-Down Mode...................................................... 385
Figure 9.31 Burst ROM (Clock Asynchronous) Access
(Bus Width = 32 Bits, 16-byte Transfer (Number of Bursts = 4),
Access Wait for First Time = 2, Access Wait for 2nd Time and after = 1) ............. 387
Figure 9.32 Basic Access Timing for Byte-Selection SRAM (BAS = 0) ................................... 388
Figure 9.33 Basic Access Timing for Byte-Selection SRAM (BAS = 1) ................................... 389
Figure 9.34 Wait Timing for Byte-Selection SRAM (BAS = 1) (Software Wait Only)............. 390
Figure 9.35 Example of Connection with 32-Bit Data-Width Byte-Selection SRAM ............... 391
Figure 9.36 Example of Connection with 16-Bit Data-Width Byte-Selection SRAM ............... 391
Figure 9.37 Example of PCMCIA Interface Connection............................................................ 393
Figure 9.38 Basic Access Timing for PCMCIA Memory Card Interface................................... 394

Rev. 3.00 Jan. 18, 2008 Page xxxvii of lxii


Figure 9.39 Wait Timing for PCMCIA Memory Card Interface
(TED[3:0] = B'0010, TEH[3:0] = B'0001, Software Wait = 1,
Hardware Wait = 1)................................................................................................. 395
Figure 9.40 Example of PCMCIA Space Assignment
(CS5BWCR.SA[1:0] = B'10, CS6BWCR.SA[1:0] = B'10) .................................... 396
Figure 9.41 Basic Timing for PCMCIA I/O Card Interface ....................................................... 398
Figure 9.42 Wait Timing for PCMCIA I/O Card Interface
(TED[3:0] = B'0010, TEH[3:0] = B'0001, Software Wait = 1,
Hardware Wait = 1)................................................................................................. 399
Figure 9.43 Timing for Dynamic Bus Sizing of PCMCIA I/O Card Interface
(TED[3:0] = B'0010, TEH[3:0] = B'0001, Software Waits = 3) ............................. 399
Figure 9.44 Burst ROM (Clock Synchronous) Access Timing
(Burst Length = 8, Wait Cycles inserted in First Access = 2,
Wait Cycles inserted in Second and Subsequent Accesses = 1).............................. 400
Figure 9.45 Bus Arbitration Timing ........................................................................................... 403
Section 10 Direct Memory Access Controller (DMAC)
Figure 10.1 Block Diagram of DMAC ....................................................................................... 408
Figure 10.2 DMA Transfer Flowchart........................................................................................ 425
Figure 10.3 Round-Robin Mode................................................................................................. 432
Figure 10.4 Changes in Channel Priority in Round-Robin Mode............................................... 433
Figure 10.5 Data Flow of Dual Address Mode........................................................................... 435
Figure 10.6 Example of DMA Transfer Timing in Dual Mode
(Source: Ordinary Memory, Destination: Ordinary Memory)................................. 436
Figure 10.7 Data Flow in Single Address Mode......................................................................... 437
Figure 10.8 Example of DMA Transfer Timing in Single Address Mode ................................. 438
Figure 10.9 DMA Transfer Example in Cycle-Steal Normal Mode
(Dual Address, DREQ Low Level Detection)......................................................... 439
Figure 10.10 Example of DMA Transfer in Cycle Steal Intermittent Mode
(Dual Address, DREQ Low Level Detection)....................................................... 440
Figure 10.11 DMA Transfer Example in Burst Mode
(Dual Address, DREQ Low Level Detection)....................................................... 440
Figure 10.12 Bus State when Multiple Channels are Operating................................................. 443
Figure 10.13 Example of DREQ Input Detection in Cycle Steal Mode Edge Detection............ 444
Figure 10.14 Example of DREQ Input Detection in Cycle Steal Mode Level Detection........... 445
Figure 10.15 Example of DREQ Input Detection in Burst Mode Edge Detection ..................... 445
Figure 10.16 Example of DREQ Input Detection in Burst Mode Level Detection .................... 446
Figure 10.17 Example of DMA Transfer End in Cycle Steal Mode Level Detection ................ 446
Figure 10.18 Example of BSC Ordinary Memory Access
(No Wait, Idle Cycle 1, Longword Access to 16-Bit Device) ............................... 447

Rev. 3.00 Jan. 18, 2008 Page xxxviii of lxii


Figure 10.19 Timing of DREQ Input Detection by Edge Detection in Cycle Stealing Mode
(DACK is Divided into Four due to Idle Cycle Insertion between Access Cycles
and So DREQ Sampling is Accepted One Extra Time) ........................................ 450
Figure 10.20 Timing of DREQ Input Detection by Edge Detection in Cycle Stealing Mode
(DACK is Not Divided By Idle Cycle Insertion between Access Cycles
and So DREQ Sampling is Accepted Normally)................................................... 450
Figure 10.21 Timing of DREQ Input Detection by Level Detection in Cycle Stealing Mode
(DACK is Divided into Four due to Idle Cycle Insertion between Access Cycles
and So DREQ Sampling is Accepted One Extra Time) ........................................ 451
Figure 10.22 Timing of DREQ Input Detection by Edge Detection in Cycle Stealing Mode
(DACK is Not Divided By Idle Cycle Insertion between Access Cycles
and So DREQ Sampling is Accepted Normally)................................................... 452
Section 11 Clock Pulse Generator (CPG)
Figure 11.1 Block Diagram of CPG ........................................................................................... 454
Figure 11.2 Points for Attention when Using Crystal Resonator................................................ 467
Figure 11.3 Points for Attention when Using PLL Oscillator Circuit ........................................ 468
Section 12 Watchdog Timer (WDT)
Figure 12.1 Block Diagram of WDT .......................................................................................... 470
Figure 12.2 Writing to WTCNT and WTCSR............................................................................ 474
Section 13 Power-Down Modes
Figure 13.1 Canceling Standby Mode with STBY Bit in STBCR.............................................. 490
Figure 13.2 STATUS Output at Power-on Reset........................................................................ 492
Figure 13.3 STATUS Output at Manual Reset ........................................................................... 492
Figure 13.4 STATUS Output when Software Standby Mode is Canceled by an Interrupt......... 493
Figure 13.5 STATUS Output When Software Standby Mode is Canceled
by a Power-on Reset................................................................................................ 493
Figure 13.6 STATUS Output When Software Standby Mode is Canceled
by a Manual Reset ................................................................................................... 494
Figure 13.7 STATUS Output when Sleep Mode is Canceled by an Interrupt ............................ 494
Figure 13.8 STATUS Output When Sleep Mode is Canceled by a Power-on Reset.................. 495
Figure 13.9 STATUS Output When Sleep Mode is Canceled by a Manual Reset ..................... 495
Figure 13.10 Hardware Standby Mode Timing (CA is pulled low in normal operation) ........... 497
Figure 13.11 Hardware Standby Mode Timing
(CA is pulled low while WDT operates after the standby mode is canceled) ....... 498
Figure 13.12 Timing When Power of Pins other than VCC_RTC and VCCQ_RTC is Off........... 498

Rev. 3.00 Jan. 18, 2008 Page xxxix of lxii


Section 14 Timer Unit (TMU)
Figure 14.1 Block Diagram of TMU .......................................................................................... 500
Figure 14.2 Setting Count Operation.......................................................................................... 505
Figure 14.3 Auto-Reload Count Operation................................................................................. 506
Figure 14.4 Count Timing when Internal Clock is Operating .................................................... 507
Figure 14.5 Count Timing when RTC Clock is Operating ......................................................... 507
Figure 14.6 UNF Set Timing ...................................................................................................... 508
Figure 14.7 Status Flag Clear Timing......................................................................................... 508
Section 15 16-Bit Timer Pulse Unit (TPU)
Figure 15.1 Block Diagram of TPU............................................................................................ 513
Figure 15.2 Example of Counter Operation Setting Procedure .................................................. 529
Figure 15.3 Free-Running Counter Operation ............................................................................ 530
Figure 15.4 Periodic Counter Operation..................................................................................... 531
Figure 15.5 Example of Setting Procedure for Waveform Output by Compare Match.............. 532
Figure 15.6 Example of 0 Output/1 Output Operation ............................................................... 533
Figure 15.7 Example of Toggle Output Operation ..................................................................... 533
Figure 15.8 Compare Match Buffer Operation........................................................................... 534
Figure 15.9 Example of Buffer Operation Setting Procedure..................................................... 535
Figure 15.10 Example of Buffer Operation ................................................................................ 536
Figure 15.11 Example of PWM Mode Setting Procedure .......................................................... 537
Figure 15.12 Example of PWM Mode Operation (1) ................................................................. 538
Figure 15.13 Examples of PWM Mode Operation (2)................................................................ 538
Figure 15.14 Example of Phase Counting Mode Setting Procedure........................................... 540
Figure 15.15 Example of Phase Counting Mode 1 Operation .................................................... 541
Figure 15.16 Example of Phase Counting Mode 2 Operation .................................................... 542
Figure 15.17 Example of Phase Counting Mode 3 Operation .................................................... 543
Figure 15.18 Example of Phase Counting Mode 4 Operation .................................................... 544
Figure 15.19 Phase Difference, Overlap, and Pulse Width in Phase Counting Mode ................ 545
Section 16 Compare Match Timer (CMT)
Figure 16.1 Block Diagram of CMT .......................................................................................... 548
Figure 16.2 Counter Operation (One-Shot Operation) ............................................................... 554
Figure 16.3 Counter Operation (Free-Running Operation) ........................................................ 555
Figure 16.4 CMF Set Timing...................................................................................................... 557
Section 17 Realtime Clock (RTC)
Figure 17.1 RTC Block Diagram................................................................................................ 560
Figure 17.2 Setting Time ............................................................................................................ 580
Figure 17.3 Reading Time .......................................................................................................... 581

Rev. 3.00 Jan. 18, 2008 Page xl of lxii


Figure 17.4 Using Alarm Function ............................................................................................. 582
Figure 17.5 Using Periodic Interrupt Function ........................................................................... 583
Figure 17.6 Example of Crystal Oscillator Circuit Connection .................................................. 584
Section 18 Serial Communication Interface with FIFO (SCIF)
Figure 18.1 Block Diagram of SCIF........................................................................................... 587
Figure 18.2 Sample SCIF Initialization Flowchart ..................................................................... 616
Figure 18.3 Sample Serial Transmission Flowchart ................................................................... 617
Figure 18.4 Example of Transmit Operation
(Example with 8-Bit Data, Parity, One Stop Bit) .................................................... 619
Figure 18.5 Example of Transmit Data Stop Function ............................................................... 619
Figure 18.6 Transmit Data Stop Function Flowchart ................................................................. 620
Figure 18.7 Sample Serial Reception Flowchart (1)................................................................... 621
Figure 18.8 Sample Serial Reception Flowchart (2)................................................................... 622
Figure 18.9 Example of SCIF Receive Operation
(Example with 8-Bit Data, Parity, One Stop Bit) .................................................... 623
Figure 18.10 Example of CTS Control Operation ...................................................................... 624
Figure 18.11 Example of RTS Control Operation ...................................................................... 624
Figure 18.12 Data Format in Synchronous Communication ...................................................... 625
Figure 18.13 Sample SCIF Initialization Flowchart (1) (Transmission) .................................... 626
Figure 18.13 Sample SCIF Initialization Flowchart (2) (Reception).......................................... 627
Figure 18.13 Sample SCIF Initialization Flowchart (3)
(Simultaneous Transmission and Reception) ........................................................ 628
Figure 18.14 Sample Serial Transmission Flowchart (1)
(First Transmission after Initialization) ................................................................. 629
Figure 18.14 Sample Serial Transmission Flowchart (2)
(Second and Subsequent Transmission) ................................................................ 630
Figure 18.15 Sample Serial Reception Flowchart (1) (First Reception after Initialization) ....... 631
Figure 18.15 Sample Serial Reception Flowchart (2) (Second and Subsequent Reception) ...... 632
Figure 18.16 Sample Simultaneous Serial Transmission and Reception Flowchart (1)
(First Transfer after Initialization) ......................................................................... 633
Figure 18.16 Sample Simultaneous Serial Transmission and Reception Flowchart (2)
(Second and Subsequent Transfer) ........................................................................ 634
Figure 18.17 Receive Data Sampling Timing in Asynchronous Mode ...................................... 638
Section 19 Infrared Data Association Module (IrDA)
Figure 19.1 Block Diagram of IrDA........................................................................................... 639
Figure 19.2 Transmit/Receive Operation.................................................................................... 643

Rev. 3.00 Jan. 18, 2008 Page xli of lxii


Section 20 I2C Bus Interface (IIC)
Figure 20.1 Block Diagram of I2C Bus Interface ....................................................................... 646
Figure 20.2 External Circuit Connections of I/O Pins ................................................................ 647
Figure 20.3 I2C Bus Formats ...................................................................................................... 660
Figure 20.4 I2C Bus Timing........................................................................................................ 661
Figure 20.5 Master Transmit Mode Operation Timing (1)......................................................... 662
Figure 20.6 Master Transmit Mode Operation Timing (2)......................................................... 663
Figure 20.7 Master Receive Mode Operation Timing (1) .......................................................... 664
Figure 20.8 Master Receive Mode Operation Timing (2) .......................................................... 665
Figure 20.9 Slave Transmit Mode Operation Timing (1) ........................................................... 666
Figure 20.10 Slave Transmit Mode Operation Timing (2) ......................................................... 667
Figure 20.11 Slave Receive Mode Operation Timing (1)........................................................... 668
Figure 20.12 Slave Receive Mode Operation Timing (2)........................................................... 669
Figure 20.13 Block Diagram of Noise Conceller ....................................................................... 670
Figure 20.14 Sample Flowchart for Master Transmit Mode ...................................................... 671
Figure 20.15 Sample Flowchart for Master Receive Mode ........................................................ 672
Figure 20.16 Sample Flowchart for Slave Transmit Mode......................................................... 673
Figure 20.17 Sample Flowchart for Slave Receive Mode .......................................................... 674
Figure 20.18 The Timing of the Bit Synchronous Circuit .......................................................... 676
Section 21 Serial I/O with FIFO (SIOF)
Figure 21.1 Block Diagram of SIOF .......................................................................................... 680
Figure 21.2 Serial Clock Supply................................................................................................. 709
Figure 21.3 Serial Data Synchronization Timing ....................................................................... 711
Figure 21.4 SIOF Transmit/Receive Timing .............................................................................. 712
Figure 21.5 Transmit/Receive Data Bit Alignment .................................................................... 715
Figure 21.6 Control Data Bit Alignment .................................................................................... 716
Figure 21.7 Control Data Interface (Slot Position)..................................................................... 717
Figure 21.8 Control Data Interface (Secondary FS) ................................................................... 718
Figure 21.9 Example of Transmit Operation in Master Mode.................................................... 721
Figure 21.10 Example of Receive Operation in Master Mode ................................................... 722
Figure 21.11 Example of Transmit Operation in Slave Mode .................................................... 723
Figure 21.12 Example of Receive Operation in Slave Mode ..................................................... 724
Figure 21.13 Transmit and Receive Timing (8-Bit Monaural Data (1))..................................... 729
Figure 21.14 Transmit and Receive Timing (8-Bit Monaural Data (2))..................................... 730
Figure 21.15 Transmit and Receive Timing (16-Bit Monaural Data (1))................................... 730
Figure 21.16 Transmit and Receive Timing (16-Bit Stereo Data (1)) ........................................ 731
Figure 21.17 Transmit and Receive Timing (16-Bit Stereo Data (2)) ........................................ 731
Figure 21.18 Transmit and Receive Timing (16-Bit Stereo Data (3)) ........................................ 732
Figure 21.19 Transmit and Receive Timing (16-Bit Stereo Data (4)) ........................................ 732

Rev. 3.00 Jan. 18, 2008 Page xlii of lxii


Figure 21.20 Transmit and Receive Timing (16-Bit Stereo Data).............................................. 733
Figure 21.21 Frame Length (32-Bit)........................................................................................... 734
Section 22 Analog Front End Interface (AFEIF)
Figure 22.1 Block Diagram of AFE Interface............................................................................. 735
Figure 22.2 FIFO Interrupt Timing............................................................................................. 748
Figure 22.3 Ringing Interrupt Occurrence Timing ..................................................................... 749
Figure 22.4 Interrupt Generator .................................................................................................. 749
Figure 22.5 AFE Serial Interface................................................................................................ 750
Figure 22.6 AFE Control Sequence............................................................................................ 751
Figure 22.7 DAA Block Diagram............................................................................................... 752
Figure 22.8 Ringing Detect Sequence ........................................................................................ 753
Section 23 USB Pin Multiplex Controller
Figure 23.1 Block Diagram of USB PIN Multiplexer ................................................................ 755
Figure 23.2 Example 1 of Transceiver Connection for USB Function Controller
(On-Chip Transceiver is Used)................................................................................ 759
Figure 23.3 Example 2 of Transceiver Connection for USB function Controller
(On-Chip Transceiver is not Used).......................................................................... 760
Figure 23.4 Example 1 of Transceiver Connection for USB Host Controller
(On-Chip Transceiver is Used)................................................................................ 762
Figure 23.5 Example 2 of Transceiver Connection for USB Host Controller
(On-Chip Transceiver is not Used).......................................................................... 763
Section 25 USB Function Controller (USBF)
Figure 25.1 Block Diagram of USBF ......................................................................................... 804
Figure 25.2 Example of Endpoint Configuration........................................................................ 835
Figure 25.3 Cable Connection Operation ................................................................................... 837
Figure 25.4 Cable Disconnection Operation............................................................................... 838
Figure 25.5 Transfer Stages in Control Transfer ........................................................................ 839
Figure 25.6 Setup Stage Operation ............................................................................................. 840
Figure 25.7 Data Stage (Control-In) Operation .......................................................................... 841
Figure 25.8 Data Stage (Control-Out) Operation........................................................................ 842
Figure 25.9 Status Stage (Control-In) Operation ........................................................................ 843
Figure 25.10 Status Stage (Control-Out) Operation ................................................................... 844
Figure 25.11 EP1 Bulk-Out Transfer Operation......................................................................... 845
Figure 25.12 EP2 Bulk-In Transfer Operation............................................................................ 846
Figure 25.13 EP3 Interrupt-In Transfer Operation ..................................................................... 848
Figure 25.14 EP4 Isochronous-Out Transfer Operation (SOF is Normal).................................. 849
Figure 25.15 EP4 Isochronous-Out Transfer Operation (SOF is Broken) .................................. 850

Rev. 3.00 Jan. 18, 2008 Page xliii of lxii


Figure 25.16 EP5 Isochronous-In Transfer Operation (SOF is Normal) .................................... 852
Figure 25.17 EP5 Isochronous-In Transfer Operation (SOF in Broken) .................................... 853
Figure 25.18 Forcible Stall by Application ................................................................................ 857
Figure 25.19 Automatic Stall by USB Function Controller........................................................ 858
Figure 25.20 Set Timing of TR Interrupt Flag............................................................................ 861
Section 26 LCD Controller (LCDC)
Figure 26.1 LCDC Block Diagram............................................................................................. 864
Figure 26.2 Valid Display and the Retrace Period ..................................................................... 898
Figure 26.3 Color-Palette Data Format....................................................................................... 905
Figure 26.4 Power-Supply Control Sequence and States of the LCD Module ........................... 911
Figure 26.5 Power-Supply Control Sequence and States of the LCD Module ........................... 911
Figure 26.6 Power-Supply Control Sequence and States of the LCD Module ........................... 912
Figure 26.7 Power-Supply Control Sequence and States of the LCD Module ........................... 912
Figure 26.8 Operation for Hardware Rotation (Normal Mode).................................................. 916
Figure 26.9 Operation for Hardware Rotation (Rotation Mode) ................................................ 917
Figure 26.10 Clock and LCD Data Signal Example................................................................... 918
Figure 26.11 Clock and LCD Data Signal Example
(STN Monochrome 8-Bit Data Bus Module) ........................................................ 918
Figure 26.12 Clock and LCD Data Signal Example (STN Color 4-Bit Data Bus Module)........ 919
Figure 26.13 Clock and LCD Data Signal Example (STN Color 8-Bit Data Bus Module)........ 919
Figure 26.14 Clock and LCD Data Signal Example (STN Color 12-Bit Data Bus Module)...... 920
Figure 26.15 Clock and LCD Data Signal Example (STN Color 16-Bit Data Bus Module)...... 921
Figure 26.16 Clock and LCD Data Signal Example
(DSTN Monochrome 8-Bit Data Bus Module) ..................................................... 922
Figure 26.17 Clock and LCD Data Signal Example
(DSTN Monochrome 16-Bit Data Bus Module) ................................................... 922
Figure 26.18 Clock and LCD Data Signal Example (DSTN Color 8-Bit Data Bus Module)..... 923
Figure 26.19 Clock and LCD Data Signal Example (DSTN Color 12-Bit Data Bus Module)... 923
Figure 26.20 Clock and LCD Data Signal Example (DSTN Color 16-Bit Data Bus Module)... 924
Figure 26.21 Clock and LCD Data Signal Example (TFT Color 16-Bit Data Bus Module) ...... 925
Figure 26.22 Clock and LCD Data Signal Example (8-Bit Interface Color 640 × 480)............. 926
Figure 26.23 Clock and LCD Data Signal Example (16-Bit Interface Color 640 × 480)........... 927
Section 27 A/D Converter
Figure 27.1 Block Diagram of A/D Converter ........................................................................... 930
Figure 27.2 Example of A/D Converter Operation (Single Mode, Channel 1 Selected) ............ 937
Figure 27.3 Example of A/D Converter Operation
(Multi Mode, Channels AN0 to AN2 Selected) ...................................................... 939

Rev. 3.00 Jan. 18, 2008 Page xliv of lxii


Figure 27.4 Example of A/D Converter Operation
(Scan Mode, Channels AN0 to AN2 Selected)........................................................ 941
Figure 27.5 A/D Conversion Timing .......................................................................................... 942
Figure 27.6 External Trigger Input Timing ................................................................................ 943
Figure 27.7 Definitions of A/D Conversion Accuracy ............................................................... 945
Figure 27.8 Analog Input Circuit Example................................................................................. 949
Figure 27.9 Example of Analog Input Protection Circuit ........................................................... 950
Figure 27.10 Analog Input Pin Equivalent Circuit ..................................................................... 951
Section 28 D/A Converter (DAC)
Figure 28.1 Block Diagram of D/A Converter ........................................................................... 953
Figure 28.2 D/A Converter Operation Example ......................................................................... 956
Section 29 PC Card Controller (PCC)
Figure 29.1 PC Card Controller Block Diagram......................................................................... 958
Figure 29.2 Continuous 32-Mbyte Area Mode........................................................................... 960
Figure 29.3 Continuous 16-Mbyte Area Mode (Area 6)............................................................. 961
Figure 29.4 Interface................................................................................................................... 976
Figure 29.5 PCMCIA Memory Card Interface Basic Timing..................................................... 980
Figure 29.6 PCMCIA Memory Card Interface Wait Timing...................................................... 981
Figure 29.7 PCMCIA I/O Card Interface Basic Timing ............................................................. 982
Figure 29.8 PCMCIA I/O Card Interface Wait Timing .............................................................. 983
Figure 29.9 Dynamic Bus Sizing Timing for PCMCIA I/O Card Interface ............................... 984
Section 30 SIM Card Module (SIM)
Figure 30.1 Smart Card Interface ............................................................................................... 988
Figure 30.2 Data Format Used by Smart Card Interface .......................................................... 1007
Figure 30.3 Examples of Start Character Waveforms .............................................................. 1010
Figure 30.4 Example of Initialization Flow .............................................................................. 1013
Figure 30.5 Example of Transmit Processing........................................................................... 1015
Figure 30.6 Example of Receive Processing ............................................................................ 1017
Figure 30.7 Receive Data Sampling Timing in Smart Card Mode ........................................... 1020
Figure 30.8 Retransmission when Smart Card Interface is in Receive Mode........................... 1022
Figure 30.9 Retransmit Standby Mode (Clock Stopped)
when Smart Card Interface is in Transmit Mode................................................... 1023
Figure 30.10 Procedure for Stopping Clock and Restarting ..................................................... 1024
Figure 30.11 Example of Pin Connections in Smart Card Interface......................................... 1025
Figure 30.12 TEIE Set Timing ................................................................................................. 1026

Rev. 3.00 Jan. 18, 2008 Page xlv of lxii


Section 31 MultiMediaCard Interface (MMCIF)
Figure 31.1 Block Diagram of MMCIF.................................................................................... 1028
Figure 31.2 Example of Command Sequence for Commands
that do not Require Command Response............................................................... 1060
Figure 31.3 Operational Flow for Commands that do not Require Command Response......... 1061
Figure 31.4 Example of Command Sequence for Commands without Data Transfer
(No Data Busy State)............................................................................................. 1063
Figure 31.5 Example of Command Sequence for Commands without Data Transfer
(with Data Busy State)........................................................................................... 1064
Figure 31.6 Operational Flowchart for Commands without Data Transfer .............................. 1065
Figure 31.7 Example of Command Sequence for Commands with Read Data
(Block Size ≤ FIFO Size) ...................................................................................... 1067
Figure 31.8 Example of Command Sequence for Commands with Read Data
(Block Size > FIFO Size) ...................................................................................... 1068
Figure 31.9 Example of Command Sequence for Commands with Read Data
(Multiblock Transfer) ............................................................................................ 1069
Figure 31.10 Example of Command Sequence for Commands with Read Data
(Stream Transfer) ................................................................................................ 1070
Figure 31.11 Operational Flowchart for Commands with Read Data
(Single Block Transfer) ....................................................................................... 1071
Figure 31.12 Operational Flowchart for Commands with Read Data
(Open-ended Multiblock Transfer) (1) ................................................................ 1072
Figure 31.12 Operational Flowchart for Commands with Read Data
(Open-ended Multiblock Transfer) (2) ................................................................ 1073
Figure 31.13 Operational Flowchart for Commands with Read Data
(Pre-defined Multiblock Transfer) (1) ................................................................. 1074
Figure 31.13 Operational Flowchart for Commands with Read Data
(Pre-defined Multiblock Transfer) (2) ................................................................. 1075
Figure 31.14 Operational Flowchart for Commands with Read Data (Stream Transfer) ......... 1076
Figure 31.15 Example of Command Sequence for Commands with Write Data
(Block Size ≤ FIFO Size) .................................................................................... 1078
Figure 31.16 Example of Command Sequence for Commands with Write Data
(Block Size > FIFO Size) .................................................................................... 1079
Figure 31.17 Example of Command Sequence for Commands with Write Data
(Multiblock Transfer) .......................................................................................... 1080
Figure 31.18 Example of Command Sequence for Commands with Write Data
(Stream Transfer) ................................................................................................ 1081
Figure 31.19 Operational Flowchart for Commands with Write Data
(Single Block Transfer) ....................................................................................... 1082

Rev. 3.00 Jan. 18, 2008 Page xlvi of lxii


Figure 31.20 Operational Flowchart for Commands with Write Data
(Open-ended Multiblock Transfer) (1) ................................................................ 1083
Figure 31.20 Operational Flowchart for Commands with Write Data
(Open-ended Multiblock Transfer) (2) ................................................................ 1084
Figure 31.21 Operational Flowchart for Commands with Write Data
(Pre-defined Multiblock Transfer) (1) ................................................................. 1085
Figure 31.21 Operational Flowchart for Commands with Write Data
(Pre-defined Multiblock Transfer) (2) ................................................................. 1086
Figure 31.22 Operational Flowchart for Commands with Write Data (Stream Transfer) ....... 1087
Figure 31.23 Operational Flowchart for Read Sequence (Single Block Transfer) ................... 1090
Figure 31.24 Operational Flowchart for Read Sequence
(Open-ended Multiblock Transfer) (1) ................................................................ 1091
Figure 31.24 Operational Flowchart for Read Sequence
(Open-ended Multiblock Transfer) (2) ................................................................ 1092
Figure 31.25 Operational Flowchart for Read Sequence
(Pre-defined Multiblock Transfer) (1) ................................................................. 1093
Figure 31.25 Operational Flowchart for Read Sequence
(Pre-defined Multiblock Transfer) (2) ................................................................. 1094
Figure 31.26 Operational Flowchart for Rear Sequence (Stream Read Transfer) .................... 1095
Figure 31.27 Operational Flowchart for Pre-defined Multiblock Read Transfer
in Auto Mode (1) ................................................................................................. 1096
Figure 31.27 Operational Flowchart for Pre-defined Multiblock Read Transfer
in Auto Mode (2) ................................................................................................. 1097
Figure 31.28 Operational Flowchart for Write Sequence (Single Block Transfer) .................. 1100
Figure 31.29 Operational Flowchart for Write Sequence
(Open-ended Multiblock Transfer) (1) ................................................................ 1101
Figure 31.29 Operational Flowchart for Write Sequence
(Open-ended Multiblock Transfer) (2) ................................................................ 1102
Figure 31.30 Operational Flowchart for Write Sequence
(Pre-defined Multiblock Transfer) (1) ................................................................. 1103
Figure 31.30 Operational Flowchart for Write Sequence
(Pre-defined Multiblock Transfer) (2) ................................................................. 1104
Figure 31.31 Operational Flowchart for Write Sequence (Stream Write Transfer).................. 1105
Figure 31.32 Operational Flowchart for Pre-defied Multiblock Write Transfer
in Auto Mode (1) ................................................................................................. 1106
Figure 31.32 Operational Flowchart for Pre-defied Multiblock Write Transfer
in Auto Mode (2) ................................................................................................. 1107
Section 33 User Break Controller (UBC)
Figure 33.1 Block Diagram of UBC......................................................................................... 1112

Rev. 3.00 Jan. 18, 2008 Page xlvii of lxii


Section 35 I/O Ports
Figure 35.1 Port A .................................................................................................................... 1179
Figure 35.2 Port B .................................................................................................................... 1181
Figure 35.3 Port C .................................................................................................................... 1183
Figure 35.4 Port D .................................................................................................................... 1185
Figure 35.5 Port E..................................................................................................................... 1187
Figure 35.6 Port F..................................................................................................................... 1190
Figure 35.7 Port G .................................................................................................................... 1193
Figure 35.8 Port H .................................................................................................................... 1195
Figure 35.9 Port J ..................................................................................................................... 1197
Figure 35.10 Port K .................................................................................................................. 1199
Figure 35.11 Port L................................................................................................................... 1201
Figure 35.12 Port M.................................................................................................................. 1203
Figure 35.13 Port P................................................................................................................... 1205
Figure 35.14 Port R .................................................................................................................. 1207
Figure 35.15 Port S................................................................................................................... 1209
Figure 35.16 Port T................................................................................................................... 1211
Figure 35.17 Port U .................................................................................................................. 1213
Figure 35.18 Port V .................................................................................................................. 1215
Section 36 User Debugging Interface (H-UDI)
Figure 36.1 Block Diagram of H-UDI...................................................................................... 1218
Figure 36.2 TAP Controller State Transitions .......................................................................... 1231
Figure 36.3 H-UDI Data Transfer Timing................................................................................ 1233
Figure 36.4 H-UDI Reset.......................................................................................................... 1233
Section 38 Electrical Characteristics
Figure 38.1 EXTAL Clock Input Timing ................................................................................. 1316
Figure 38.2 CKIO Clock Output Timing.................................................................................. 1316
Figure 38.3 CKIO Clock Input Timing .................................................................................... 1316
Figure 38.4 Power-On Oscillation Settling Time ..................................................................... 1317
Figure 38.5 Oscillation Settling Time on Return from Standby (Return by Reset).................. 1317
Figure 38.6 Oscillation Settling Time on Return from Standby (Return by NMI or IRQ)....... 1317
Figure 38.7 PLL Synchronization Settling Time by Reset, NMI or IRQ Interrupts................. 1318
Figure 38.8 Reset Input Timing................................................................................................ 1320
Figure 38.9 Interrupt Signal Input Timing................................................................................ 1320
Figure 38.10 Bus Release Timing ............................................................................................ 1321
Figure 38.11 Pin Drive Timing at Standby............................................................................... 1321
Figure 38.12 Basic Bus Cycle in Normal Space (No Wait)...................................................... 1324
Figure 38.13 Basic Bus Cycle in Normal Space (Software Wait 1) ......................................... 1325

Rev. 3.00 Jan. 18, 2008 Page xlviii of lxii


Figure 38.14 Basic Bus Cycle in Normal Space (External Wait 1 Input)................................. 1326
Figure 38.15 Basic Bus Cycle in Normal Space
(Software Wait 1, External Wait Valid (WM Bit = 0), No Idle Cycle) ............... 1327
Figure 38.16 CS Extended Bus Cycle in Normal Space
(SW = 1 Cycle, HW = 1 Cycle, External Wait 1 Input) ...................................... 1328
Figure 38.17 Bus Cycle of SRAM with Byte Selection
(SW = 1 Cycle, HW = 1 Cycle, External Wait 1 Input,
BAS = 0 (UB and LB in Write Cycle Controlled)) ............................................. 1329
Figure 38.18 Bus Cycle of SRAM with Byte Selection
(SW = 1 Cycle, HW = 1 Cycle, External Wait 1 Input,
BAS = 1 (WE in Write Cycle Controlled)) ......................................................... 1330
Figure 38.19 Read Bus Cycle of Burst ROM
(Software Wait 1, External Wait 1 Input, Burst Wait 1, Number of Burst 2)...... 1331
Figure 38.20 Single Read Bus Cycle of SDRAM
(Auto Precharge Mode, CAS Latency 2, TRCD = 1 Cycle, TRP = 1 Cycle) ...... 1332
Figure 38.21 Single Read Bus Cycle of SDRAM
(Auto Precharge Mode, CAS Latency 2, TRCD = 2 Cycles, TRP = 2 Cycles)... 1333
Figure 38.22 Burst Read Bus Cycle of SDRAM (Single Read × 8)
(Auto Precharge Mode, CAS Latency 2, TRCD = 1 Cycle, TRP = 2 Cycles) .... 1334
Figure 38.23 Burst Read Bus Cycle of SDRAM (Single Read × 8)
(Auto Precharge Mode, CAS Latency 2, TRCD = 2 Cycles, TRP = 1 Cycle) .... 1335
Figure 38.24 Single Write Bus Cycle of SDRAM
(Auto Precharge Mode, TRWL = 1 Cycle).......................................................... 1336
Figure 38.25 Single Write Bus Cycle of SDRAM
(Auto Precharge Mode, TRCD = 3 Cycles, TRWL = 1 Cycle) ........................... 1337
Figure 38.26 Burst Write Bus Cycle of SDRAM (Single Write × 8) (Auto Precharge Mode,
TRCD = 1 Cycle, TRWL = 1 Cycle)................................................................... 1338
Figure 38.27 Burst Write Bus Cycle of SDRAM (Single Write × 8)
(Auto Precharge Mode, TRCD = 2 Cycles, TRWL = 1 Cycle) ........................... 1339
Figure 38.28 Burst Read Bus Cycle of SDRAM (Single Read × 8)
(Bank Active Mode: ACTV + READ Command, CAS Latency 2,
TRCD = 1 Cycle)................................................................................................. 1340
Figure 38.29 Burst Read Bus Cycle of SDRAM (Single Read × 8)
(Bank Active Mode: READ Command, Same Row Address,
CAS Latency 2, TRCD = 1 Cycle) ...................................................................... 1341
Figure 38.30 Burst Read Bus Cycle of SDRAM (Single Read × 8)
(Bank Active Mode: PRE + ACTV + READ Command,
Different Row Address, CAS Latency 2, TRCD = 1 Cycle) ............................... 1342
Figure 38.31 Burst Write Bus Cycle of SDRAM (Single Write × 8)
(Bank Active Mode: ACTV + WRIT Command, TRCD = 1 Cycle) .................. 1343

Rev. 3.00 Jan. 18, 2008 Page xlix of lxii


Figure 38.32 Burst Write Bus Cycle of SDRAM (Single Write × 8)
(Bank Active Mode: ACTV + WRIT Command, TRCD = 1 Cycle) .................. 1344
Figure 38.33 Burst Write Bus Cycle of SDRAM (Single Write × 8)
(Bank Active Mode: PRE + ACTV + WRIT Command, TRCD = 1 Cycle)....... 1345
Figure 38.34 Auto Refresh Timing of SDRAM (TRP = 2 Cycles) .......................................... 1346
Figure 38.35 Self Refresh Timing of SDRAM (TRP = 2 Cycles) ............................................ 1347
Figure 38.36 Power-On Sequence of SDRAM (Mode Write Timing, TRP = 2 Cycles).......... 1348
Figure 38.37 Write to Read Bus Cycle in Power-Down Mode of SDRAM
(Auto Precharge Mode, TRCD = 1 Cycle, TRP = 1 Cycle, TRWL = 1 Cycle)... 1349
Figure 38.38 Read to Write Bus Cycle in Power-Down Mode of SDRAM
(Auto Precharge Mode, TRCD = 1 Cycle, TRP = 1 Cycle, TRWL = 1 Cycle)... 1350
Figure 38.39 PCMCIA Memory Card Interface Bus Timing ................................................... 1351
Figure 38.40 PCMCIA Memory Card Interface Bus Timing
(TED[3:0] = B'0010, TEH[3:0] = B'0001, Software Wait 1,
Hardware Wait 1) ................................................................................................ 1352
Figure 38.41 PCMCIA I/O Card Interface Bus Timing............................................................ 1353
Figure 38.42 PCMCIA I/O Card Interface Bus Timing
(TED[3:0] = B'0010, TEH[3:0] = B'0001, Software Wait 1,
Hardware Wait 1) ................................................................................................ 1354
Figure 38.43 REFOUT, IRQOUT Delay Time ........................................................................ 1354
Figure 38.44 I/O Port Timing ................................................................................................... 1355
Figure 38.45 DREQ Input Timing (DREQ Low Level is Detected) ........................................ 1355
Figure 38.46 DACK Output Timing......................................................................................... 1355
Figure 38.47 TPU Output Timing ............................................................................................. 1356
Figure 38.48 TPU Clock Input Timing..................................................................................... 1356
Figure 38.49 Oscillation Settling Time when RTC Crystal Oscillator is Turned On ............... 1357
Figure 38.50 SCK Input Clock Timing .................................................................................... 1358
Figure 38.51 SCIF Input/Output Timing in Synchronous Mode .............................................. 1359
Figure 38.52 I2C Bus Interface Input/Output Timing ............................................................... 1361
Figure 38.53 SIOF_MCLK Input Timing................................................................................. 1362
Figure 38.54 SIOF Transmission/Reception Timing (Master Mode 1, Fall Sampling)............ 1363
Figure 38.55 SIOF Transmission/Reception Timing (Master Mode 1, Rise Sampling)........... 1363
Figure 38.56 SIOF Transmission/Reception Timing (Master Mode 2, Fall Sampling)............ 1364
Figure 38.57 SIOF Transmission/Reception Timing (Master Mode 2, Rise Sampling)........... 1364
Figure 38.58 SIOF Transmission/Reception Timing (Slave Mode 1, Slave Mode 2) .............. 1365
Figure 38.59 AFEIF Module AC Timing ................................................................................. 1366
Figure 38.60 USB Clock Timing.............................................................................................. 1367
Figure 38.61 LCDC Module Signal Timing ............................................................................. 1369
Figure 38.62 SIM Module Signal Timing ................................................................................ 1370
Figure 38.63 MMCIF Transmit Timing ................................................................................... 1371

Rev. 3.00 Jan. 18, 2008 Page l of lxii


Figure 38.64 MMCIF Receive Timing (Rise Sampling) .......................................................... 1371
Figure 38.65 TCK Input Timing............................................................................................... 1372
Figure 38.66 TRST Input Timing (Reset Hold)........................................................................ 1373
Figure 38.67 H-UDI Data Transfer Timing .............................................................................. 1373
Figure 38.68 ASEMD0 Input Timing....................................................................................... 1373
Figure 38.69 Output Load Circuit............................................................................................. 1375
Appendix
Figure C.1 Package Dimensions (PLBG0256GA-A (BP-256H/HV))...................................... 1392
Figure C.2 Package Dimensions (PLBG0256KA-A (BP-256C/CV)) ...................................... 1393

Rev. 3.00 Jan. 18, 2008 Page li of lxii


Rev. 3.00 Jan. 18, 2008 Page lii of lxii
Tables

Section 1 Overview
Table 1.1 SH7720/SH7721 Features......................................................................................... 2
Table 1.2 Product Lineup (SH7720 Group).............................................................................. 8
Table 1.3 Product Lineup (SH7721 Group).............................................................................. 9
Table 1.4 List of Pin Assignments .......................................................................................... 13
Table 1.5 SH7720/SH7721 Pin Functions .............................................................................. 25
Section 2 CPU
Table 2.1 Virtual Address Space............................................................................................. 40
Table 2.2 Register Initial Values............................................................................................. 43
Table 2.3 Addressing Modes and Effective Addresses for CPU Instructions......................... 56
Table 2.4 CPU Instruction Formats ........................................................................................ 60
Table 2.5 CPU Instruction Types............................................................................................ 63
Table 2.6 Data Transfer Instructions....................................................................................... 67
Table 2.7 Arithmetic Operation Instructions .......................................................................... 69
Table 2.8 Logic Operation Instructions .................................................................................. 71
Table 2.9 Shift Instructions..................................................................................................... 72
Table 2.10 Branch Instructions ................................................................................................. 73
Table 2.11 System Control Instructions.................................................................................... 74
Table 2.12 Operation Code Map............................................................................................... 77
Section 3 DSP Operating Unit
Table 3.1 CPU Processing Modes .......................................................................................... 83
Table 3.2 Virtual Address Space............................................................................................. 84
Table 3.3 Operation of SR Bits in Each Processing Mode ..................................................... 87
Table 3.4 RS and RE Setting Rule.......................................................................................... 93
Table 3.5 Repeat Control Instructions .................................................................................... 93
Table 3.6 Repeat Control Macros ........................................................................................... 94
Table 3.7 DSP Mode Extended System Control Instructions ................................................. 96
Table 3.8 PC Value during Repeat Control (When RC[11:0] ≥ 2) ......................................... 99
Table 3.9 Extended System Control Instructions in DSP Mode ........................................... 103
Table 3.10 Overview of Data Transfer Instructions................................................................ 106
Table 3.11 Modulo Addressing Control Instructions.............................................................. 108
Table 3.12 Double Data Transfer Instruction Formats ........................................................... 111
Table 3.13 Single Data Transfer Instruction Formats ............................................................. 112
Table 3.14 Destination Register in DSP Instructions.............................................................. 114
Table 3.15 Source Register in DSP Operations ...................................................................... 115

Rev. 3.00 Jan. 18, 2008 Page liii of lxii


Table 3.16 DSR Register Bits................................................................................................. 116
Table 3.17 DSP Operation Instruction Formats...................................................................... 118
Table 3.18 Correspondence between DSP Instruction Operands and Registers ..................... 119
Table 3.19 DC Bit Update Definitions ................................................................................... 120
Table 3.20 Examples of NOPX and NOPY Instruction Codes............................................... 122
Table 3.21 Variation of ALU Fixed-Point Operations............................................................ 126
Table 3.22 Correspondence between Operands and Registers ............................................... 126
Table 3.23 Variation of ALU Integer Operations ................................................................... 131
Table 3.24 Variation of ALU Logical Operations .................................................................. 133
Table 3.25 Variation of Fixed-Point Multiply Operation ....................................................... 135
Table 3.26 Correspondence between Operands and Registers ............................................... 136
Table 3.27 Variation of Shift Operations................................................................................ 137
Table 3.28 Operation Definition of PDMSB .......................................................................... 143
Table 3.29 Variation of PDMSB Operation............................................................................ 144
Table 3.30 Variation of Rounding Operation ......................................................................... 145
Table 3.31 Definition of Overflow Protection for Fixed-Point Arithmetic Operations .......... 146
Table 3.32 Definition of Overflow Protection for Integer Arithmetic Operations.................. 146
Table 3.33 Variation of Local Data Move Operations............................................................ 147
Table 3.34 Correspondence between Operands and Registers ............................................... 148
Table 3.35 DSP Mode Extended System Control Instructions ............................................... 149
Table 3.36 Double Data Transfer Instruction ......................................................................... 151
Table 3.37 Single Data Transfer Instructions ......................................................................... 152
Table 3.38 Correspondence between DSP Data Transfer Operands and Registers ................ 153
Table 3.39 DSP Operation Instructions .................................................................................. 154
Table 3.40 Operation Code Map............................................................................................. 160
Section 4 Memory Management Unit (MMU)
Table 4.1 Access States Designated by D, C, and PR Bits ................................................... 183
Section 5 Cache
Table 5.1 Number of Entries and Size/Way in Each Cache Size.......................................... 197
Table 5.2 LRU and Way Replacement (when Cache Locking Mechanism is Disabled)...... 199
Table 5.3 Way Replacement when a PREF Instruction Misses the Cache ........................... 203
Table 5.4 Way Replacement when Instructions other than the PREF Instruction
Miss the Cache...................................................................................................... 203
Table 5.5 LRU and Way Replacement (when W2LOCK = 1 and W3LOCK =0)................ 203
Table 5.6 LRU and Way Replacement (when W2LOCK = 0 and W3LOCK =1)................ 204
Table 5.7 LRU and Way Replacement (when W2LOCK = 1 and W3LOCK =1)................ 204
Table 5.8 Address Format Based on the Size of Cache to be Assigned to Memory............. 211

Rev. 3.00 Jan. 18, 2008 Page liv of lxii


Section 6 X/Y Memory
Table 6.1 X/Y Memory Virtual Addresses ........................................................................... 213
Table 6.2 MMU and Cache Settings..................................................................................... 216
Section 7 Exception Handling
Table 7.1 Exception Event Vectors....................................................................................... 225
Table 7.2 Instruction Positions and Restriction Types.......................................................... 235
Table 7.3 SPC Value When a Re-Execution Type Exception Occurs in Repeat Control
(SR.RC[11:0]≥2)................................................................................................... 237
Table 7.4 Exception Acceptance in the Repeat Loop ........................................................... 239
Table 7.5 Instruction Where a Specific Exception Occurs
When a Memory Access Exception Occurs in Repeat Control
(SR.RC[11:0]≥1)................................................................................................... 240
Section 8 Interrupt Controller (INTC)
Table 8.1 Pin Configuration.................................................................................................. 245
Table 8.2 Interrupt Sources and IPRA to IPRJ ..................................................................... 248
Table 8.3 Interrupt Exception Handling Sources and Priority (IRQ Mode) ......................... 270
Table 8.4 Interrupt Exception Handling Sources and Priority (IRL Mode).......................... 272
Table 8.5 Interrupt Level and INTEVT Code....................................................................... 275
Section 9 Bus State Controller (BSC)
Table 9.1 Pin Configuration.................................................................................................. 283
Table 9.2 Address Space Map 1 (CMNCR.MAP = 0).......................................................... 287
Table 9.3 Address Space Map 2 (CMNCR.MAP = 1).......................................................... 288
Table 9.4 Correspondence between External Pins (MD3 and MD4),
Memory Type of CS0, and Memory Bus Width................................................... 289
Table 9.5 Correspondence between External Pin (MD5) and Endians ................................. 289
Table 9.6 32-Bit External Device/Big Endian Access and Data Alignment ......................... 331
Table 9.7 16-Bit External Device/Big Endian Access and Data Alignment ......................... 332
Table 9.8 8-Bit External Device/Big Endian Access and Data Alignment........................... 333
Table 9.9 32-Bit External Device/Little Endian Access and Data Alignment ...................... 334
Table 9.10 16-Bit External Device/Little Endian Access and Data Alignment ...................... 335
Table 9.11 8-Bit External Device/Little Endian Access and Data Alignment ........................ 336
Table 9.12 Relationship between A2/3BSZ[1:0], A2/3ROW[1:0], A2/3COL[1:0],
and Address Multiplex Output (1)-1..................................................................... 349
Table 9.12 Relationship between A2/3BSZ[1:0], A2/3ROW[1:0], A2/3COL[1:0],
and Address Multiplex Output (1)-2..................................................................... 350
Table 9.13 Relationship between A2/3BSZ[1:0], A2/3ROW[1:0], A2/3COL[1:0],
and Address Multiplex Output (2)-1..................................................................... 351

Rev. 3.00 Jan. 18, 2008 Page lv of lxii


Table 9.13 Relationship between A2/3BSZ[1:0], A2/3ROW[1:0], A2/3COL[1:0],
and Address Multiplex Output (2)-2..................................................................... 352
Table 9.14 Relationship between A2/3BSZ[1:0], A2/3ROW[1:0], A2/3COL[1:0],
and Address Multiplex Output (3) ........................................................................ 353
Table 9.15 Relationship between A2/3BSZ[1:0], A2/3ROW[1:0], A2/3COL[1:0],
and Address Multiplex Output (4)-1..................................................................... 354
Table 9.15 Relationship between A2/3BSZ[1:0], A2/3ROW[1:0], A2/3COL[1:0],
and Address Multiplex Output (4)-2..................................................................... 355
Table 9.16 Relationship between A2/3BSZ[1:0], A2/3ROW[1:0], A2/3COL[1:0],
and Address Multiplex Output (5)-1..................................................................... 356
Table 9.16 Relationship between A2/3BSZ[1:0], A2/3ROW[1:0], A2/3COL[1:0],
and Address Multiplex Output (5)-2..................................................................... 357
Table 9.17 Relationship between A2/3BSZ[1:0], A2/3ROW[1:0], A2/3COL[1:0],
and Address Multiplex Output (6)-1..................................................................... 358
Table 9.17 Relationship between A2/3BSZ[1:0], A2/3ROW[1:0], A2/3COL[1:0],
and Address Multiplex Output (6)-2..................................................................... 359
Table 9.18 Relationship between Access Size and Number of Bursts.................................... 360
Table 9.19 Access Address in SDRAM Mode Register Write ............................................... 380
Table 9.20 Output Addresses when EMRS Command is Issued ............................................ 383
Table 9.21 Relationship between Bus Width, Access Size, and Number of Bursts................ 386
Section 10 Direct Memory Access Controller (DMAC)
Table 10.1 Pin Configuration.................................................................................................. 409
Table 10.2 Transfer Request Sources ..................................................................................... 423
Table 10.3 Selecting External Request Modes with RS Bits .................................................. 426
Table 10.4 Selecting External Request Detection with DL, DS Bits ...................................... 427
Table 10.5 Selecting External Request Detection with DO Bit .............................................. 427
Table 10.6 Selecting On-Chip Peripheral Module Request Modes with RS3 to RS0 Bits ..... 429
Table 10.7 Supported DMA Transfers.................................................................................... 434
Table 10.8 Relationship between Request Modes and Bus Modes
by DMA Transfer Category.................................................................................. 441
Section 11 Clock Pulse Generator (CPG)
Table 11.1 Pin Configuration.................................................................................................. 457
Table 11.2 Clock Operating Modes ........................................................................................ 458
Table 11.3 Possible Combination of Clock Mode and FRQCR Values ................................. 459
Section 13 Power-Down Modes
Table 13.1 States of Power-Down Modes .............................................................................. 478
Table 13.2 Pin Configuration.................................................................................................. 479

Rev. 3.00 Jan. 18, 2008 Page lvi of lxii


Section 14 Timer Unit (TMU)
Table 14.1 TMU Interrupt Sources ......................................................................................... 509
Section 15 16-Bit Timer Pulse Unit (TPU)
Table 15.1 TPU Functions ...................................................................................................... 512
Table 15.2 TPU Pin Configurations........................................................................................ 514
Table 15.3 TPU Clock Sources............................................................................................... 518
Table 15.4 TPSC2 to TPSC0 (1)............................................................................................. 518
Table 15.4 TPSC2 to TPSC0 (2)............................................................................................. 518
Table 15.4 TPSC2 to TPSC0 (3)............................................................................................. 519
Table 15.4 TPSC2 to TPSC0 (4)............................................................................................. 519
Table 15.5 IOA2 to IOA0 ....................................................................................................... 522
Table 15.6 Register Combinations in Buffer Operation ......................................................... 534
Table 15.7 Phase Counting Mode Clock Input Pins ............................................................... 539
Table 15.8 Up/Down-Count Conditions in Phase Counting Mode 1...................................... 541
Table 15.9 Up/Down-Count Conditions in Phase Counting Mode 2...................................... 542
Table 15.10 Up/Down-Count Conditions in Phase Counting Mode 3...................................... 543
Table 15.11 Up/Down-Count Conditions in Phase Counting Mode 4...................................... 544
Section 17 Realtime Clock (RTC)
Table 17.1 Pin Configuration.................................................................................................. 561
Table 17.2 Recommended Oscillator Circuit Constants (Recommended Values).................. 584
Section 18 Serial Communication Interface with FIFO (SCIF)
Table 18.1 Pin configuration................................................................................................... 588
Table 18.2 SCSMR Settings and SCIF Transmit/Receive ...................................................... 614
Table 18.3 Serial Transmit/Receive Formats.......................................................................... 615
Table 18.4 SCIF Interrupt Sources ......................................................................................... 636
Section 19 Infrared Data Association Module (IrDA)
Table 19.1 Pin Configuration.................................................................................................. 640
Section 20 I2C Bus Interface (IIC)
Table 20.1 I2C Bus Interface Pins........................................................................................... 648
Table 20.2 Transfer Rate ........................................................................................................ 659
Table 20.3 Interrupt Requests ................................................................................................. 675
Table 20.4 Time for Monitoring SCL..................................................................................... 676
Section 21 Serial I/O with FIFO (SIOF)
Table 21.1 Pin Configuration.................................................................................................. 681

Rev. 3.00 Jan. 18, 2008 Page lvii of lxii


Table 21.2 Operation in Each Transfer Mode......................................................................... 685
Table 21.3 SIOF Serial Clock Frequency ............................................................................... 710
Table 21.4 Serial Transfer Modes........................................................................................... 713
Table 21.5 Frame Length........................................................................................................ 714
Table 21.6 Audio Mode Specification for Transmit Data....................................................... 716
Table 21.7 Audio Mode Specification for Receive Data ........................................................ 716
Table 21.8 Setting Number of Channels in Control Data ....................................................... 717
Table 21.9 Conditions to Issue Transmit Request .................................................................. 719
Table 21.10 Conditions to Issue Receive Request .................................................................... 720
Table 21.11 Transmit and Receive Reset.................................................................................. 725
Table 21.12 SIOF Interrupt Sources ......................................................................................... 727
Section 22 Analog Front End Interface (AFEIF)
Table 22.1 Pin Configuration.................................................................................................. 736
Table 22.2 FIFO Interrupt Size............................................................................................... 738
Table 22.3 Telephone Number and Data ................................................................................ 745
Section 23 USB Pin Multiplex Controller
Table 23.1 Pin Configuration (Digital Transceiver Signal) .................................................... 756
Table 23.2 Pin Configuration (Analog Transceiver Signal) ................................................... 756
Table 23.3 Pin Configuration (Power Control Signal)............................................................ 757
Table 23.4 Pin Configuration (Clock Signal) ......................................................................... 757
Section 24 USB Host Controller (USBH)
Table 24.1 Pin Configuration.................................................................................................. 766
Section 25 USB Function Controller (USBF)
Table 25.1 Pin Configuration and Functions .......................................................................... 805
Table 25.2 Restrictions of Settable Values ............................................................................. 834
Table 25.3 Example of Endpoint Configuration..................................................................... 834
Table 25.4 Example of Setting of Endpoint Configuration Information ................................ 835
Table 25.5 Command Decoding on Application Side ............................................................ 855
Section 26 LCD Controller (LCDC)
Table 26.1 Pin Configuration.................................................................................................. 865
Table 26.2 I/O Clock Frequency and Clock Division Ratio ................................................... 868
Table 26.3 Limits on the Resolution of Rotated Displays, Burst Length,
and Connected Memory (32-bit SDRAM)............................................................ 899
Table 26.4 Limits on the Resolution of Rotated Displays, Burst Length,
and Connected Memory (16-bit SDRAM)............................................................ 902

Rev. 3.00 Jan. 18, 2008 Page lviii of lxii


Table 26.5 Available Power-Supply Control-Sequence Periods at Typical Frame Rates....... 913
Table 26.6 LCDC Operating Modes ....................................................................................... 914
Table 26.7 LCD Module Power-Supply States....................................................................... 914
Section 27 A/D Converter
Table 27.1 Pin Configuration.................................................................................................. 931
Table 27.2 Analog Input Channels and A/D Data Registers................................................... 932
Table 27.3 A/D Conversion Time (Single Mode)................................................................... 943
Table 27.4 Conditions for the Method of Transferring Results of A/D Conversion
and Inclusion of Superfluous DMA ...................................................................... 947
Table 27.5 Analog Input Pin Ratings...................................................................................... 950
Section 28 D/A Converter (DAC)
Table 28.1 Pin Configuration.................................................................................................. 954
Section 29 PC Card Controller (PCC)
Table 29.1 Features of the PCMCIA Interface ....................................................................... 959
Table 29.2 PCC Pin Configuration ......................................................................................... 962
Table 29.3 PCMCIA Support Interface .................................................................................. 977
Section 30 SIM Card Module (SIM)
Table 30.1 Pin Configuration.................................................................................................. 989
Table 30.2 Register Settings for Smart Card Interface ......................................................... 1009
Table 30.3 Example of Bit Rates (bits/s) for SCBRR Settings
(Pφ = 19.8 MHz, SCSMPL = 371)...................................................................... 1011
Table 30.4 Interrupt Sources of Smart Card Interface .......................................................... 1018
Section 31 MultiMediaCard Interface (MMCIF)
Table 31.1 Pin Configuration................................................................................................ 1029
Table 31.2 Correspondence between Commands and Settings of CMDTYR
and RSPTYR ...................................................................................................... 1034
Table 31.3 CMDR Configuration ......................................................................................... 1037
Table 31.4 Correspondence between Command Response Byte Number and RSPR........... 1039
Table 31.5 MMCIF Interrupt Sources................................................................................... 1108
Section 33 User Break Controller (UBC)
Table 33.1 Specifying Break Address Register .................................................................... 1116
Table 33.2 Specifying Break Data Register.......................................................................... 1118
Table 33.3 Data Access Cycle Addresses and Operand Size Comparison Conditions ......... 1129

Rev. 3.00 Jan. 18, 2008 Page lix of lxii


Section 34 Pin Function Controller (PFC)
Table 34.1 Multiplexed Pins................................................................................................. 1141
Section 35 I/O Ports
Table 35.1 Port A Data Register (PADR) Read/Write Operations ....................................... 1180
Table 35.2 Port B Data Register (PBDR) Read/Write Operations ....................................... 1182
Table 35.3 Port C Data Register (PCDR) Read/Write Operations ....................................... 1184
Table 35.4 Port D Data Register (PDDR) Read/Write Operations ....................................... 1186
Table 35.5 Port E Data Register (PEDR) Read/Write Operations........................................ 1188
Table 35.6 Port F Data Register (PFDR) Read/Write Operations ........................................ 1191
Table 35.7 Port G Data Register (PGDR) Read/Write Operations ....................................... 1194
Table 35.8 Port H Data Register (PHDR) Read/Write Operations ....................................... 1196
Table 35.9 Port J Data Register (PJDR) Read/Write Operations.......................................... 1198
Table 35.10 Port K Data Register (PKDR) Read/Write Operations ....................................... 1200
Table 35.11 Port L Data Register (PLDR) Read/Write Operations ........................................ 1202
Table 35.12 Port M Data Register (PMDR) Read/Write Operations...................................... 1204
Table 35.13 Port P Data Register (PPDR) Read/Write Operations ........................................ 1206
Table 35.14 Port R Data Register (PRDR) Read/Write Operations........................................ 1208
Table 35.15 Port S Data Register (PSDR) Read/Write Operations ........................................ 1210
Table 35.16 Port T Data Register (PTDR) Read/Write Operations ........................................ 1212
Table 35.17 Port U Data Register (PUDR) Read/Write Operations ....................................... 1214
Table 35.18 Port V Data Register (PVDR) Read/Write Operations ....................................... 1216
Section 36 User Debugging Interface (H-UDI)
Table 36.1 Pin Configuration................................................................................................ 1219
Table 36.2 H-UDI Commands.............................................................................................. 1221
Table 36.3 Pins and Boundary Scan Register Bits................................................................ 1222
Table 36.4 Reset Configuration ............................................................................................ 1232
Section 38 Electrical Characteristics
Table 38.1 Absolute Maximum Ratings ............................................................................... 1305
Table 38.2 Recommended Timing in Power-On .................................................................. 1307
Table 38.3 Recommended Timing in Power-Off.................................................................. 1308
Table 38.4 DC Characteristics (1) [Common] ...................................................................... 1309
Table 38.4 DC Characteristics (2-a) [Except USB Transceiver, I2C, ADC,
DAC Analog Related Pins]................................................................................. 1311
Table 38.4 DC Characteristics (2-b) [I2C Related Pins] ....................................................... 1312
Table 38.4 DC Characteristics (2-c) [USB Transceiver Related Pins] ................................. 1313
Table 38.5 Permissible Output Current Values .................................................................... 1313
Table 38.6 Maximum Operating Frequencies....................................................................... 1314

Rev. 3.00 Jan. 18, 2008 Page lx of lxii


Table 38.7 Clock Timing ...................................................................................................... 1315
Table 38.8 Control Signal Timing ........................................................................................ 1319
Table 38.9 Bus Timing ......................................................................................................... 1322
Table 38.10 Peripheral Module Signal Timing....................................................................... 1355
Table 38.11 16-Bit Timer Pulse Unit...................................................................................... 1356
Table 38.12 RTC Signal Timing............................................................................................. 1357
Table 38.13 SCIF Module Signal Timing............................................................................... 1358
Table 38.14 I2C Bus Interface Timing .................................................................................... 1360
Table 38.15 SIOF Module Signal Timing............................................................................... 1362
Table 38.16 AFEIF Module Signal Timing ............................................................................ 1365
Table 38.17 USB Module Clock Timing ................................................................................ 1366
Table 38.18 USB Electrical Characteristics (Full-Speed)....................................................... 1367
Table 38.19 USB Electrical Characteristics (Low-Speed)...................................................... 1367
Table 38.20 LCDC Module Signal Timing............................................................................. 1368
Table 38.21 SIM Module Signal Timing ................................................................................ 1369
Table 38.22 MMCIF Module Signal Timing.......................................................................... 1370
Table 38.23 H-UDI Related Pin Timing ................................................................................. 1372
Table 38.24 A/D Converter Characteristics ............................................................................ 1374
Table 38.25 D/A Converter Characteristics ............................................................................ 1374
Appendix
Table A.1 Pin States ............................................................................................................ 1377

Rev. 3.00 Jan. 18, 2008 Page lxi of lxii


Rev. 3.00 Jan. 18, 2008 Page lxii of lxii
Section 1 Overview

Section 1 Overview

1.1 Features
This LSI is a single-chip RISC microprocessor that integrates a 32-bit RISC-type Super H
architecture CPU with a digital signal processing (DSP) extension as its core, together with a
large-capacity 32-kbyte cache memory, a 16-kbyte X/Y memory, and an interrupt controller.

High-speed data transfers can be performed by an on-chip direct memory access controller
(DMAC), and an external memory access support function enables direct connection to different
kinds of memory. This LSI also supports a stereo audio recording and playback function, a USB
host controller, a function controller, an LCD controller, a PCMCIA interface, an A/D converter,
and a D/A converter.

The USB host controller and LCD controller have bus master functions, so that data supplied from
an external memory (area 3) can be freely processed. Since the USB host controller, in particular,
conforms to Open HCI standards, it is extremely easy to transfer data from the PC of a device
driver or other devices. Also, low-power operation suitable for battery operation is possible
because the LCD controller continues to display even in sleep mode.

A powerful built-in power management function keeps power consumption low, even during high-
speed operation. This LSI is ideal for electronics devices, which require both high speed and low
power consumption.

The SH7720 group integrates an SSL (Secure Socket Layer) accelerator that performs RSA
(Rivest-Shamir-Adleman) operations and DES (Data Encryption Standard) and Triple-DES
encryption/decryption, while the SH7721 group does not have the SSL accelerator. Each group
consists of several models which includes or does not include an SD host interface (SDHI) to be
suited to a variety of applications. See table 1.2 and 1.3, Product Lineup, for the models including
(or not including) the SDHI.

Note: For the detailed specifications of the SDHI and SSL, contact the Renesas representatives
in your region.

Table 1.1 shows the features of this LSI.

Rev. 3.00 Jan. 18, 2008 Page 1 of 1458


REJ09B0033-0300
Section 1 Overview

Table 1.1 SH7720/SH7721 Features

Item Features
CPU • Renesas Technology Original SuperH architecture
• Upper compatibility with SH-1, SH-2, and SH3-DSP at object code level
• 32-bit internal data bus
• General-register
 Sixteen 32-bit general registers (eight 32-bit shadow registers)
 Five 32-bit control registers
 Four 32-bit system registers
• RISC type instruction set
 Instruction length: 16-bit fixed length for improved code efficiency
 Load/store architecture
 Delayed branch instruction
 Instruction set based on C language
• Instruction execution time: One instruction/cycle for basic instructions
• Logical address space: 4 Gbytes
• Space identifier ASID: 8 bits, 256 logical address spaces
• Five-stage pipeline
DSP operating • Mixture of 16-bit and 32-bit instructions
unit • 32-/40-bit internal data bus
• Multiplier, ALU, barrel shifter, and DSP register
• 16-bit x 16-bit → 32-bit one cycle multiplier
• Large-capacity DSP data register file
 Six 32-bit data registers
 Two 40-bit data registers
• Extended Harvard architecture for DSP data buses
 Two data buses
 One instruction bus
• Up to four parallel operations: ALU, multiply, two loads, and store
• Two address units to generating addresses for two memory access
• DSP data addressing modes: Increment, index register addition (with or
without modulo addressing)
• Zero-overhead repeat loop control
• Conditional execution instructions
• User DSP mode and privileged DSP mode

Rev. 3.00 Jan. 18, 2008 Page 2 of 1458


REJ09B0033-0300
Section 1 Overview

Item Features
Memory • 4-Gbyte address space, 256 address spaces (8-bit ASID)
management unit • Page unit sharing
(MMU) • Supports multiple page sizes: 1 kbyte or 4 kbytes
• 128-entry, 4-way set associative TLB
• Specifies replacement way by software and supports random replacement
algorithm
• Address assignment allows direct access to TLB contents
Cache memory • 32-kbyte cache mixing instructions and data
• 512-entry, 4-way set associative, 16-byte block length
• Write-back, write-through, least recent used (LRU) replacement algorithm
• Single-stage write-back buffer
X/Y memory • User-selectable mapping mechanism
 Fixed mapping for mission-critical realtime applications
 Automatic mapping through TLB for easy to use
• Three independent read/write ports
 8-/16-/32-bit access from CPU
 Up to two 16-bit accesses from DSP
 8-/16-/32-bit access from DMAC
• 8-kbyte RAM for X and Y memory individual (4 kbytes × 4)
Interrupt • Seven external interrupt pins (NMI, IRQ5 to IRQ0)
controller (INTC)  NMI: Fall/rise selectable
 IRQ: Fall/rise/high level/low level selectable
• On-chip peripheral interrupt: Sets priority for each module
Bus state • Physical address space is provided to support areas of up to 64 Mbytes and
controller (BSC) 32 Mbytes.
• Each area allows independent setting of the following functions:
 Bus size (8, 16, or 32 bits). An access wait cycle count with a different
size to be supported is provided for each area.
 Number of access wait cycles. Some areas can be inserted wait cycles
independently in read access and write access.
 Sets of idle wait cycle (for the same or different area)
 Supports SRAM, page mode ROM, SDRAM, and pseudo SRAM (ready
for page mode) by specifying memory to be connected to each area.
 Outputs chip select signals to corresponding areas, such as CS0, CS2 to
CS4, CS5A/CS5B, and CS6A/CS6B

Rev. 3.00 Jan. 18, 2008 Page 3 of 1458


REJ09B0033-0300
Section 1 Overview

Item Features
Direct memory • Number of channels: Six channels (two channels support external requests)
access controller
• Address space: 4 Gbytes on architecture
(DMAC)
• Data transfer length: Bytes, words (2 bytes), longwords (4 bytes), 16 bytes
(longword × 4)
• Maximum number of transfer times: 16,777,216 times
• Address mode: Single address mode or dual address mode selectable
• Transfer request: Selectable from external request, on-chip peripheral
module request, and auto request
• Bus mode: Selectable from cycle steal mode (normal mode and intermittent
mode) and burst mode
• Priority: Selectable from channel priority fixed mode and round robin mode
• Interrupt request: Supports interrupt request to CPU at the end of data
transfer
• External request detection: Selectable from DREQ input low/high level
detection and rising/falling detection
• Transfer request acceptance signal: DACK and TEND can be set an active
level
Clock pulse • Clock mode: Input clock selectable from external clock (EXTAL or CKIO)
generator (CPG) and crystal resonator
• Generates three types of clocks
 CPU clock: Maximum 133.34 MHz
 Bus clock: Maximum 66.67 MHz
 Peripheral clock: Maximum 33.34 MHz
• Supports power-down mode
 Sleep mode
 Standby mode
 Module standby mode (X/Y memory standby enabled)
• One-channel watchdog timer
Watchdog timer • One-channel watchdog timer (WDT)
(WDT)
• Interrupt request: WDT only
Timer unit (TMU) • Internal three-channel 32-bit timer
• Auto-reload type 32-bit down counter
• Internal prescaler for Pφ
• Interrupt request

Rev. 3.00 Jan. 18, 2008 Page 4 of 1458


REJ09B0033-0300
Section 1 Overview

Item Features
16-bit timer pulse • Four-channel 16-bit timer
unit (TPU)
• PWM mode
• Four types of counter input clocks
• Phase counting mode (two channels)
Compare match • Internal six-channel 32-bit counter (16-/32-bit switchable)
timer (CMT)
• Selectable prescaling for Pφ
• Internal full-channel compare match function
• With interrupt request and DMAC request
Realtime clock • Built-in clock, calendar functions, and alarm functions
(RTC)
• On-chip 32-kHz crystal oscillator circuit with a maximum resolution (cycle
interrupt) of 1/256 second
Serial • Includes a 64-byte FIFO for transmission and another for reception
communication
• Supports high-speed UART for Bluetooth
interface with
FIFO • Internal prescaler for Pφ
(SCIF0, SCIF1) • With interrupt request and DMAC request
Infrared data • Conforms to the IrDA 1.0 system
association
• Asynchronous serial communication
module (IrDA)
• On-chip 64-stage FIFO buffers for transmission and reception
I C bus interface •
2
Supports multi master transmission/reception
(IIC)
Serial I/O with • Includes a 64-byte FIFO for transmission and another for reception
FIFO
• Supports 8-/16-/16-bit stereo sound input/output
(SIOF0, SIOF1)
• Sampling rate clock input selectable from Pφ and external pin
• Includes a prescaler for Pφ
• Interrupt requests and DMAC requests
Analog front end • STLC7550 can directly be connected
interface (AFEIF)
• Data access arrangement function
• 128-word transmit FIFO
• 128-word receive FIFO

Rev. 3.00 Jan. 18, 2008 Page 5 of 1458


REJ09B0033-0300
Section 1 Overview

Item Features
USB host • Conforms to OHCI Rev. 1.0
controller (USBH)
• USB Rev. 1.1 compatible
• 127 endpoints
• Support interrupt/bulk/control/isochronous mode
• Bus master controller (can access area 3 and synchronous DRAM)
• Two ports with analog transceiver (one is common with USB function
controller)
• External clock input function
USB function • Conforms to OHCI Rev. 1.0
controller (USBF)
• Six endpoints
• Support interrupt/bulk/control/isochronous mode
• One port with analog transceiver (common with USB function controller),
12 Mbps only
• External clock input function
LCD controller • From 16 × 1 to 1024 × 1024 pixels can be supported
(LCDC)
• 4/8/15/16 bpp (bit per pixel) color pallet
• 1/2/4/6 bpp (bit per pixel) gray scale
• 8-bit frame rate controller
• TFT/DSTN/STN panels
• Signal polarity setting function
• Hardware panel rotation
• Power control function
• Selectable clock source (LCLK, Bclk, or Pclk)
A/D converter • 10 bits ± 4 LSB, four channels
(ADC)
• Conversion time: 15 µs
• Input range: 0 to AVCC (max. 3.6 V)
D/A converter • 8 bits ± 4 LSB, two channels
(DAC)
• Conversion time: 10 µs
• Output range: 0 to AVCC (max. 3.6 V)
PC card • Complies with the PCMCIA Rev.2.1/JEIDA Version 4.2
controller (PCC)
• Supports the IC memory card interface and I/O card interface

Rev. 3.00 Jan. 18, 2008 Page 6 of 1458


REJ09B0033-0300
Section 1 Overview

Item Features
SIM card • Single channel ready for ISO7816-3 data protocol (T = 0, T = 1)
interface (SIM)
• Asynchronous half-duplex character transmission protocol
• Data length of 8 bits
• Generates and checks a parity bit
• Number of output clocks per 1 etu selectable
• Direct convention/inverse convention selectable
• Internal prescaler for Pφ
• Clock polarity changeable at idle time (low or high)
• With interrupt request and DMAC request
MultiMedia Card • Complies with The MultiMedia Card System Specification Version 3.1
interface
• Supports MMC mode
(MMCIF)
• 16.5-Mbps bit rate (max) for the card interface (Pφ = 33 MHz)
• Incorporates sixty-four 16-bit data-transfer FIFOs
• Interrupt and DMA request
• Module standby function
SD host interface • Supports SDHC (SD High Capacity) and SDIO
(SDHI)
 Supports Part 1 Physical Layer Ver.1.01 to 2.0 of SD Specification, but
Note: Only for not supported for High-Speed
models with the
SDHI  Supports Part E1 SDIO Ver. 1.00 to 2.00 of SD Specification
• SD memory/IO card interface (1 bit/4 bits SD bus)
• SD clock frequency ≤ 1/2 peripheral clock frequency
• Error check function: CRC7 (command/response), CRC16 (data)
• MMC (MultiMedia Card) access
• Interrupt request and DAMC transfer request (SD_BUF read/write)
• Card detection function
• Write protect
SSL accelerator • RSA encryption
(SSL)
• Supported operations: addition, subtraction, multiplication, power operation
Note: SH7720
• DES and Triple-DES encryption/decryption
group only

Rev. 3.00 Jan. 18, 2008 Page 7 of 1458


REJ09B0033-0300
Section 1 Overview

Item Features
User break • Two break channels
controller (UBC)
• All of address, data value, access type, and data size can be set as break
conditions.
• Supports sequential break function
User debugging • Supports E10A emulator
interface (H-UDI)
• Realtime branch trace
• 1-kbyte on-chip memory for executing high-speed emulation program

Table 1.2 Product Lineup (SH7720 Group)

Power Supply
Voltage
Operating
Model I/O Internal Frequency Product Code Package SSL SDHI

SH7720 3.3 V 1.5 V 133.34 HD6417720BP133C 256-pin 17mm x 17mm CSP O 


±0.3V ±0.1V MHz (PLBG0256GA-A)

HD6417720BP133CV 256-pin 17mm x 17mm CSP O 


(PLBG0256GA-A)

HD6417720BL133C 256-pin 11mm x 11mm CSP O 


(PLBG0256KA-A)

HD6417720BL133CV 256-pin 11mm x 11mm CSP O 


(PLBG0256KA-A)

SH7320 HD6417320BP133C 256-pin 17mm x 17mm CSP O O


(PLBG0256GA-A)

HD6417320BP133CV 256-pin 17mm x 17mm CSP O O


(PLBG0256GA-A)

HD6417320BL133C 256-pin 11mm x 11mm CSP O O


(PLBG0256KA-A)

HD6417320BL133CV 256-pin 11mm x 11mm CSP O O


(PLBG0256KA-A)

[Legend] O: Provided; : Not provided

Rev. 3.00 Jan. 18, 2008 Page 8 of 1458


REJ09B0033-0300
Section 1 Overview

Table 1.3 Product Lineup (SH7721 Group)

Power Supply
Voltage
Operating
Model I/O Internal Frequency Product Code Package SSL SDHI

SH7721 3.3 V 1.5 V 133.34 R8A77210C133BG 256-pin 17mm x 17mm CSP  


±0.3V ±0.1V MHz (PLBG0256GA-A)

R8A77210C133BGV 256-pin 17mm x 17mm CSP  


(PLBG0256GA-A)

R8A77210C133BA 256-pin 11mm x 11mm CSP  


(PLBG0256KA-A)

R8A77210C133BAV 256-pin 11mm x 11mm CSP  


(PLBG0256KA-A)

R8A77211C133BG 256-pin 17mm x 17mm CSP  O


(PLBG0256GA-A)

R8A77211C133BGV 256-pin 17mm x 17mm CSP  O


(PLBG0256GA-A)

R8A77211C133BA 256-pin 11mm x 11mm CSP  O


(PLBG0256KA-A)

R8A77211C133BAV 256-pin 11mm x 11mm CSP  O


(PLBG0256KA-A)

[Legend] O: Provided; : Not provided

Rev. 3.00 Jan. 18, 2008 Page 9 of 1458


REJ09B0033-0300
Section 1 Overview

1.2 Block Diagram

Super H User break


DSP core controller (UBC)
CPU core

CPU bus

X bus
Y bus
Cache Memory
X/Y memory Cache access
memory management
Instruction/data for controller (CCN)
(32 kbytes) unit (MMU)
CPU/DSP (16 kbytes)
Internal bus Internal bus

Bus state Direct memory SSL USB host LDC


External bus Peripheral
controller access controller accelerator controller 512-byte controller 2.56-kbyte
bus controller (DMAC) line buffer
(BSC) (SSL) (USBH) RAM (LCDC)
Peripheral bus

Interrupt Realtime Clock pulse


User debugging Timer unit
controller clock generator
interface (H-UDI) (TMU)
(INTC) (RTC) (CPG)
Peripheral bus

Serial communication Serial communication Analog front end Compare 16-bit A/D D/A
576-byte USB function controller
interface 0 with FIFO interface 1 with FIFO I2C match timer pulse converter converter
128-byte FIFO SRAM interface (AFEIF) 1-kbyte FIFO (USBF)
128-byte FIFO (SCIF1) timer (CMT) unit (TPU) (ADC) (DAC)
(SCIF0/IrDA)

SD host Serial I/O Serial I/O SIM card PC card


128-byte MultiMediaCard 256-byte 256-byte
interface with FIFO with FIFO interface controller
RAM interface (MMCIF) SRAM SRAM
(SDHI) (SIOF0) (SIOF1) (SIM) (PCC)

Figure 1.1 Block Diagram

1.3 Pin Assignments

1.3.1 Pin Assignments

Rev. 3.00 Jan. 18, 2008 Page 10 of 1458


REJ09B0033-0300
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
USB1_pwr_en/
STATUS1/ LCD_DATA13/ LCD_DATA5/ LCD_DATA1/ LCD_CL2/
VssQ VccQ VssQ VccQ VssQ VccQ LCD_CLK VssQ VccQ USBF_UPLUP/ AVss AN0/PTF1 AVcc_USB AVss_USB VssQ
A PTH3 PINT13/PTD5 PTC5 PTC1 PTE2 PTH0

LCD_DATA15/ LCD_DATA11/ LCD_DATA7/ LCD_DATA3/ LCD_FLM/ LCD_M_DISP/ SIOF0_MCLK/ USB2_pwr_en/ AN2/PTF3 USB2_M USB1_P USB1_M AVcc_USB VccQ
Vcc_PLL2 MD2 XTAL RESETM MD4 DA1/PTF6
B PINT15/PTD7 PTD3 PTC7 PTC3 PTE0 PTE4 PTS3 PTH1

USB1d_TXDPLS/
Vcc_PLL1 MD1 MD5 EXTAL MD3 LCD_DATA12/ LCD_DATA9/ LCD_DATA6/ LCD_DATA2/ LCD_DON/ SIOF0_SYNC/ SIOF0_TxD/ SIOF0_SCK/ AFE_SCLK/IOIS16/ USB1_ovr_current/ EXTAL_USB
ADTRG/PTF0 AN3/PTF4 USB2_P AVcc PCC_IOIS16/
C PINT12/PTD4 PTD1 PTC6 PTC2 PTE1 PTS4 PTS2 PTS0 USBF_VBUS
PTG4
USB1d_DMNS/ USB1d_SUSPEND/ USB1d_TXENL/
STATUS0/ LCD_DATA14/ LCD_DATA10/ LCD_DATA8/ LCD_DATA4/ LCD_DATA0/ LCD_CL1/ SIOF0_RxD/ PINT11/
VssQ1 MD0 D31/PTB7 Vss Vcc USB2_ovr_current DA0/PTF5 AN1/PTF2 AFE_RLYCNT/ REFOUT/ XTAL_USB PINT8/
D PTH2 PINT14/PTD6 PTD2 PTD0 PTC4 PTC0 PTE3 PTS1
PCC_BVD2/PTG3 IRQOUT/PTP4 PCC_CD1/PTG0

Figure 1.2
USB1d_RCV/ USB1d_TXSE0/
USB1d_SPEED/
IRQ5/AFE_FS/ IRQ4/
E VccQ1 Vss_PLL2 Vss_PLL1 D30/PTB6 PINT9/PCC_CD2/ AFE_TXOUT/ VssQ
PCC_REG/ PCC_DRV/
PTG1
PTG6 PTG5
MMC_VDDON/ AFE_RDET/ USB1d_DPLS/
D24/PTB0 D29/PTB5 D28/PTB4 D27/PTB3 SCIF1_CTS/ PINT10/
F LCD_VEPWC/ IIC_SDA/ AFE_HC1/ VccQ
INDEX TPU_TO3/PTV4 PTE5 PCC_BVD1/PTG2
MMC_ODMOD/ AFE_RXIN/ SIM_CLK/
VssQ1 D26/PTB2 D25/PTB1 Vcc Vss SCIF1_RTS/ SCIF1_SCK/
G LCD_VCPWC/ IIC_SCL/
TPU_TO2/PTV3 PTE6 SD_DAT3/PTV0

SIM_RST/ SIM_D/ MMC_DAT/


VccQ1 D23/PTA7 D22/PTA6 Vss Vcc SD_WP/ SCIF1_TxD/ SIOF1_TxD/
H SD_DAT0/
SCIF1_RxD/PTV1 SD_CD/PTV2 TPU_TI3A/PTU2
MMC_CMD/ SIOF1_MCLK/ SIOF1_SYNC/ SCIF0_RTS/
VssQ1 D20/PTA4 D21/PTA5 D19/PTA3 SIOF1_RxD/
J SD_CMD/ SD_DAT1/ SD_DAT2/ TPU_TO0/
TPU_TI2B/PTU1 TPU_TI3B/PTU3 PTU4 PTT3
SH7330 SCIF0_CTS/ MMC_CLK/
SIOF1_SCK/
VccQ1 D17/PTA1 D18/PTA2 D16/PTA0 SCIF0_TxD/ TPU_TO1/
VssQ
K IrTX/PTT2 SD_CLK/
PLBG0256GA-A PTT4 TPU_TI2A/PTU0
WE2/ WE3/
CKIO DQMUL/ DQMUU/ RD/WR
(BP-256H/HV) SCIF0_RxD/ IRQ3/IRL3/ SCIF0_SCK/
L VccQ
ICIORD ICIOWR IrRx/PTT1 PTP3 PTT0
(Top view)
CAS/PTH5 WE1/
WE0/DQMLL CKE/PTH4 IRQ1/IRL1/ IRQ0/IRL0/ IRQ2/IRL2/
M DQMLU/WE NMI
PTP1 PTP0 PTP2

RAS/PTH6 CS3 CS2 Vcc AUDATA2/ AUDATA1/ AUDATA3/


Vss
N PTJ3 PTJ2 PTJ4

VssQ1 A14 A17 Vss Vcc AUDATA0/


P AUDCK/PTJ6 VssQ
PTJ1

Rev. 3.00
VccQ1 A11 A13 A15 AUDSYNC/
R ASEMD0 TRST/PTL7 VccQ
PTJ0

PINT7/
ASEBRKAK/
A16 A6 A5 A12 TMS/PTL6 TCK/PTL3 PCC_RESET/
T PTJ5
PTK3
PINT6/
VssQ1 A9 A4 A10 D11 D8 D4 D1 Vcc Vss BACK BS A19/PTR1 A22/PTR4 A24/PTR6 DACK0/ DREQ1/PTM7 TDI/PTL4 PCC_RDY/ TDO/PTL5
U PINT1/PTM4 PTK2

Jan. 18, 2008


CS5B/CE1A/ PINT5/
WAIT/ XTAL_RTC VssQ
D6 D2 D0 A20/PTR2 A23/PTR5 DREQ0/

Pin Assignments (PLBG0256GA-A (BP-256H/HV))


VccQ1 A3 A7 D12 D14 D9 PTM1 BREQ EXTAL_RTC RESETP PCC_VS2/
V PCC_WAIT PINT0/PTM6 PTK1

PINT4/
Section 1

CS6B/ TEND0/ TEND1/


A8 A2 A1 A0/PTR0 D15 D10 D7 D3 CS5A/CE2A CS4 A18 A21/PTR3 A25/PTR7 VccQ_RTC Vss_RTC PCC_VS1/ VccQ
CE1B/PTM0 PINT2/PTM2 PINT3/PTM3
W PTK0

VssQ1 VccQ1 D13 VssQ1 VccQ1 D5 VssQ1 VccQ1 CS6A/CE2B VssQ1 VssQ1 CS0 RD VssQ1 VccQ1 VssQ1 VccQ1 DACK1/PTM5 CA Vcc_RTC
Y
Overview

REJ09B0033-0300
Page 11 of 1458
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21
Section 1

USB1d_DMNS/

Rev. 3.00
LCD_DATA14/ LCD_DATA10/ LCD_DATA8/ LCD_DATA4/ LCD_DATA0/ SIOF0_SYNC/ SIOF0_TxD/ SIOF0_SCK/ PINT11/
MD1 VssQ EXTAL MD4 RESETM VssQ AVss AN0/PTF1 USB2_M USB1_P AVcc_USB USB1_M
A PINT14/PTD6 PTD2 PTD0 PTC4 PTC0 PTS4 PTS2 PTS0 AFE_RLYCNT/
PCC_BVD2/PTG3

LCD_DATA11/ STATUS0/ LCD_DATA12/ LCD_DATA9/ LCD_DATA6/ LCD_DATA2/ LCD_DON/ USB1_ovr_current/


MD2 XTAL MD3 MD5 Vss Vcc SIOF0_RxD/ USB2_ovr_current DA1/PTF6 AN2/PTF3 AVcc_USB AVcc VssQ
B PTD3 PTH2 PINT12/PTD4 PTD1 PTC6 PTC2 PTE1 PTS1 USBF_VBUS

REJ09B0033-0300
AFE_RDET/ USB1d_SUSPEND/
LCD_DATA15/ REFOUT/IRQOUT/
C D31/PTB7 IIC_SDA/
PINT15/PTD7 PTP4
PTE5
Overview

USB1_pwr_en/ USB1d_RCV/ USB1d_TXSE0/


STATUS1/ LCD_DATA13/ LCD_DATA3/ LCD_CL2/ LCD_M_DISP/ IRQ5/AFE_FS/ IRQ4/AFE_TXOUT/
D MD0 Vcc_PLL1 D28/PTB4 VccQ VccQ VssQ USBF_UPLUP DA0/PTF5 AN1/PTF2 USB2_P AVss_USB AN3/PTF4

Jan. 18, 2008


PTH3 PINT13/PTD5 PTC3 PTE2 PTE4 PCC_REG/ PCC_DRV/PTG5
PTH0 PTG6
USB1d_TXDPLS/

Figure 1.3
LCD_DATA7/ LCD_DATA5/ LCD_DATA1/ LCD_FLM/ LCD_CL1/ SIOF0_MCLK/ USB2_pwr_en/ ADTRG/
E Vss_PLL2 D29/PTB5 Vcc_PLL2 D25/PTB1 VssQ VccQ LCD_CLK VccQ AFE_SCLK/IOIS16/ VccQ EXTAL_USB
PTC7 PTC5 PTC1 PTE0 PTE3 PTS3 PTH1 PTF0
PCC_IOIS16/PTG4
MMC_VDDON/ USB1d_DPLS/ USB1d_TXENL/
SCIF1_CTS/ PINT10/AFE_HC1/ PINT8/
F VssQ1 D26/PTB2 Vss_PLL1 D22/PTA6 LCD_VEPWC/ XTAL_USB PCC_BVD1/PTG2 PCC_CD1/
TPU_TO3/PTV4 /PTG0
USB1d_SPEED/ AFE_RXIN/
G VccQ1 D24/PTB0 D30/PTB6 Vss Vss PINT9/ IIC_SCL/ VssQ
INDEX PCC_CD2/PTG1 PTE6
SIM_RST/ MMC_ODMOD/ SIM_D/
SD_WP/ SCIF1_RTS/ VccQ SCIF1_TxD/
D23/PTA7 VssQ1 D27/PTB3 D19/PTA3 LCD_VCPWC/

Page 12 of 1458
H SCIF1_RxD/PTV1 SD_CD/PTV2
TPU_TO2/PTV3
SIOF1_MCLK/ SIM_CLK/ SIOF1_SYNC/
SCIF1_SCK/
J VccQ1 D20/PTA4 Vcc D18/PTA2 SD_DAT1/ Vcc SD_DAT3/ SD_DAT2/
TPU_TI3B/PTU3 PTV0 PTU4
MMC_CMD/ SCIF0_CTS/ MMC_DAT/ MMC_CLK/
SIOF1_RxD/ SIOF1_TxD/ SIOF1_SCK/
K VssQ1 D17/PTA1 D21/PTA5 CKIO SH7330 SD_CMD/ TPU_TO1/ SD_DAT0/ SD_CLK/
TPU_TI2B/PTU1 PTT4 TPU_TI3A/PTU2 TPU_TI2A/PTU0
PLBG0256KA-A SCIF0_RTS/ SCIF0_TxD/ SCIF0_RxD/
VccQ1 CAS/PTH5 D16/PTA0 RD/WR TPU_TO0/ VccQ
L (BP-256C/CV) IrTX/PTT2 IrRX/PTT1
PTT3
WE2/ WE3/
(Top view) IRQ0/IRL0/ IRQ3/IRL3/ IRQ1/IRL1/
DQMUL/ RAS/PTH6 DQMUU/ CKE/PTH4 VssQ
M PTP0 PTP3 PTP1
ICIORD ICIOWR
WE1/
WE0/ VssQ1 Vcc SCIF0_SCK/ AUDATA1/ NMI
N DQMLU/ Vss
DQMLL PTT0 PTJ2
WE

IRQ2/IRL2/ AUDCK/ AUDATA2/


P CS3 A17 VccQ1 CS2 Vcc
PTP2 PTJ6 PTJ3

AUDATA3/ AUDATA0/
R A15 A13 VssQ1 Vss PTJ4
TRST/PTL7 ASEMD0
PTJ1

A12 A11 A9 A16 VssQ TCK/PTL3 AUDSYNC/ TDI/PTL4


T PTJ0

PINT7/
WAIT/
U VccQ1 A8 A7 D15 VssQ1 VccQ1 CS6A/CE2B CS5A/CE2A VccQ1 BACK BS A20/PTR2 A22/PTR4 A24/PTR6 VccQ VccQ TMS/PTL6 PCC_RESET/
PCC_WAIT
PTK3
DACK0/ PINT6/
CS6B/CE1B/ A19/PTR1 TEND1/PINT3/ ASEBRKAK/
A6 A5 VccQ1 VccQ1 D13 D10 D7 D3 Vss BREQ A23/PTR5 PINT1/ RESETP VssQ PCC_RDY/
V PTM0 PTM3 PTJ5
PTM4 PTK2

Pin Assignments (PLBG0256KA-A (BP-256C/CV))


A4 A14 TDO/PTL5 DREQ1/
W PTM7

DREQ0/ PINT4/
CS5B/CE1A/ TEND0/PINT2/ PINT0/
VssQ1 A3 VssQ1 D14 D11 D8 D6 D2 D0 CS0 RD VssQ1 VccQ1 A25/PTR7 CA EXTAL_RTC Vss_RTC PCC_VS1/
Y PTM1 PTM2 PTM6 PTK0
PINT5/
DACK1/
AA A1 A2 A10 A0/PTR0 D15 D12 D9 D4 D1 Vcc VssQ1 CS4 A18 A21/PTR3 VssQ1 VccQ1 VccQ_RTC XTAL_RTC Vcc_RTC PCC_VS2/
PTM5
PTK1
Section 1 Overview

Table 1.4 List of Pin Assignments

Pin No. Pin No. I/O


(PLBG (PLBG Buffer
0256 0256 Power
GA-A) KA-A) Pin Name Function I/O Supply
A1 A2 VssQ I/O power supply (0V) 
A2 D5 VccQ I/O power supply (3.3 V) 
A3 D6 STATUS1/PTH3 Status output/general-purpose O/IO VccQ
port
A4 D7 LCD_DATA13/PINT13/ LCD data/port interrupt/ O/I/IO VccQ
PTD5 general-purpose port
A5 E6 VssQ I/O power supply (0V) 
A6 D8 VccQ I/O power supply (3.3 V) 
A7 E8 LCD_DATA5/PTC5 LCD data/general-purpose port O/IO VccQ
A8 E9 LCD_DATA1/PTC1 LCD data/general-purpose port O/IO VccQ
A9 D10 LCD_CL2/PTE2 LCD shift clock 2/general-purpose O/IO VccQ
port
A10 A11 VssQ I/O power supply (0V) 
A11 E12 VccQ I/O power supply (3.3 V) 
A12 E13 LCD_CLK LCD clock source I VccQ
A13 D12 VssQ I/O power supply (0V) 
A14 E15 VccQ I/O power supply (3.3 V) 
A15 D13 USB1_pwr_en/ USB1 power-enable/pull-up O/O/IO VccQ
USBF_UPLUP/PTH0 control/general-purpose port
A16 A15 AVss Analog power supply (0V) 
A17 A16 AN0/PTF1 ADC analog input/general-purpose I/I AVcc
port
A18 B18 AVcc_USB USB power supply (3.3 V) 
A19 D17 AVss_USB USB power supply (0 V) 
A20 B21 VssQ I/O power supply (0V) 
B1 E4 Vcc_PLL2 PLL2 power supply (1.5 V) 
B2 B1 MD2 Clock mode setting I VccQ
B3 B2 XTAL Crystal O VccQ
B4 A5 RESETM Manual reset I VccQ
B5 A4 MD4 Bus width setting I VccQ

Rev. 3.00 Jan. 18, 2008 Page 13 of 1458


REJ09B0033-0300
Section 1 Overview

Pin No. Pin No. I/O


(PLBG (PLBG Buffer
0256 0256 Power
GA-A) KA-A) Pin Name Function I/O Supply
B6 C1 LCD_DATA15/PINT15/ LCD data/port interrupt/ O/I/IO VccQ
PTD7 general-purpose port
B7 B3 LCD_DATA11/PTD3 LCD data/general-purpose port O/IO VccQ
B8 E7 LCD_DATA7/PTC7 LCD data/general-purpose port O/IO VccQ
B9 D9 LCD_DATA3/PTC3 LCD data/general-purpose port O/IO VccQ
B10 E10 LCD_FLM/PTE0 LCD line marker/general-purpose O/IO VccQ
port
B11 D11 LCD_M_DISP/PTE4 LCD current-alternating signal/ O/IO VccQ
general-purpose port
B12 E14 SIOF0_MCLK/PTS3 SIOF master clock/general- I/IO VccQ
purpose port
B13 E16 USB2_pwr_en/PTH1 USB2 power-enable/ O/IO VccQ
general-purpose port
B14 B16 DA1/PTF6 DAC analog output/general- O/I VccQ
purpose port
B15 B17 AN2/PTF3 ADC analog input/general-purpose I/I AVcc
port
B16 A17 USB2_M USB D− port 2 IO AVcc_
USB
B17 A18 USB1_P USB D+ port 1 IO AVcc_
USB
B18 A21 USB1_M USB D− port 1 IO AVcc_
USB
B19 A20 AVcc_USB USB power supply (3.3 V) 
B20 E20 VccQ I/O power supply (3.3 V) 
C1 D2 Vcc_PLL1 PLL1 power supply (1.5 V) 
C2 A1 MD1 Clock mode setting I VccQ
C3 B5 MD5 Endian setting I VccQ
C4 A3 EXTAL External clock I VccQ
C5 B4 MD3 Bus width setting I VccQ
C6 B7 LCD_DATA12/PINT12/ LCD data/port interrupt/ O/I/IO VccQ
PTD4 general-purpose port
C7 B8 LCD_DATA9/PTD1 LCD data/general-purpose port O/IO VccQ

Rev. 3.00 Jan. 18, 2008 Page 14 of 1458


REJ09B0033-0300
Section 1 Overview

Pin No. Pin No. I/O


(PLBG (PLBG Buffer
0256 0256 Power
GA-A) KA-A) Pin Name Function I/O Supply
C8 B9 LCD_DATA6/PTC6 LCD data/general-purpose port O/IO VccQ
C9 B10 LCD_DATA2/PTC2 LCD data/general-purpose port O/IO VccQ
C10 B11 LCD_DON/PTE1 LCD display on signal/ O/IO VccQ
general-purpose port
C11 A12 SIOF0_SYNC/PTS4 SIOF frame sync/general-purpose IO/IO VccQ
port
C12 A13 SIOF0_TxD/PTS2 SIOF transmit data/general- O/IO VccQ
purpose port
C13 A14 SIOF0_SCK/PTS0 SIOF serial clock/general-purpose IO/IO VccQ
port
C14 E17 ADTRG/PTF0 ADC external trigger/general- I/I VccQ
purpose port
C15 D18 AN3/PTF4 ADC analog input/general-purpose I/I AVcc
port
C16 D16 USB2_P USB D+ port 2 IO AVcc_
USB
C17 B19 AVcc Analog power supply (3.3 V) 
C18 E18 USB1d_TXDPLS/ D+ transmit output/AFE shift O/I/I/I/ VccQ
AFE_SCLK/IOIS16/ clock/16-bit IO/PCCI 6-bit IO
PCC_IOIS16/PTG4 IO/general-purpose port
C19 B20 USB1_ovr_current/ USB1 overcurrent/monitor I/I VccQ
USBF_VBUS
C20 E21 EXTAL_USB USB external clock I VccQ
D1 F1 VssQ1 I/O power supply (0 V) 
D2 D1 MD0 Clock mode setting I VccQ
D3 C2 D31/PTB7 Data bus/general-purpose port IO/IO VccQ1
D4 B6 STATUS0/PTH2 Status output/general-purpose O/IO VccQ
port
D5 A6 LCD_DATA14/PINT14/ LCD data/port interrupt/ O/I/IO VccQ
PTD6 general-purpose port
D6 A7 LCD_DATA10/PTD2 LCD data/general-purpose port O/IO VccQ
D7 A8 LCD_DATA8/PTD0 LCD data/general-purpose port O/IO VccQ
D8 A9 LCD_DATA4/PTC4 LCD data/general-purpose port O/IO VccQ

Rev. 3.00 Jan. 18, 2008 Page 15 of 1458


REJ09B0033-0300
Section 1 Overview

Pin No. Pin No. I/O


(PLBG (PLBG Buffer
0256 0256 Power
GA-A) KA-A) Pin Name Function I/O Supply
D9 A10 LCD_DATA0/PTC0 LCD data/general-purpose port O/IO VccQ
D10 E11 LCD_CL1/PTE3 LCD shift clock 1/general-purpose O/IO VccQ
port
D11 B12 Vss Internal power supply (0 V) 
D12 B13 Vcc Internal power supply (1.5 V) 
D13 B14 SIOF0_RxD/PTS1 SIOF receive data/general- I/IO VccQ
purpose port
D14 B15 USB2_ovr_current USB2 port overcurrent I VccQ
D15 D14 DA0/PTF5 DAC analog output/general- O/I VccQ
purpose port
D16 D15 AN1/PTF2 ADC analog input/general-purpose I/I AVcc
port
D17 A19 USB1d_DMNS/PINT11/ D- signal input/port interrupt/ I/I/O/I/ VccQ
AFE_RLYCNT/ AFE on-hook control/PCC buttery IO
PCC_BVD2/PTG3 detection 2/general-purpose port
D18 C21 USB1d_SUSPEND/ Suspend state/bus request O/O/O/ VccQ
REFOUT/IRQOUT/ (refresh)/ bus request (interrupt)/ IO
PTP4 general-purpose port
D19 F18 XTAL_USB USB crystal O VccQ
D20 F21 USB1d_TXENL/PINT8/ Driver output enable/port interrupt/ O/I/I/IO VccQ
PCC_CD1/PTG0 PCC card detection 1/
general-purpose port
E1 G1 VccQ1 I/O power supply (1.8/3.3 V) 
E2 E1 Vss_PLL2 PLL2 power supply (0 V) 
E3 F4 Vss_PLL1 PLL1 power supply (0 V) 
E4 G4 D30/PTB6 Data bus/general-purpose port IO/IO VccQ1
E17 G18 USB1d_SPEED/PINT9/ Speed control/port interrupt/ O/I/I/IO VccQ
PCC_CD2/PTG1 PCC card detection 2/
general-purpose port
E18 D20 USB1d_RCV/IRQ5/ Receive data/interrupt/ I/I/I/O/ VccQ
AFE_FS/PCC_REG/ area indicate signal/ IO
PTG6 AFE frame synchronization/
PCC space indication/
general-purpose port

Rev. 3.00 Jan. 18, 2008 Page 16 of 1458


REJ09B0033-0300
Section 1 Overview

Pin No. Pin No. I/O


(PLBG (PLBG Buffer
0256 0256 Power
GA-A) KA-A) Pin Name Function I/O Supply
E19 D21 USB1d_TXSE0/IRQ4/ SE0 state/interrupt/ O/I/O/ VccQ
AFE_TXOUT/ AFE serial transmission/ O/IO
PCC_DRV/PTG5 PCC buffer control/
general-purpose port
E20 G21 VssQ I/O power supply (0V) 
F1 G2 D24/PTB0 Data bus/general-purpose port IO/IO VccQ1
F2 E2 D29/PTB5 Data bus/general-purpose port IO/IO VccQ1
F3 D4 D28/PTB4 Data bus/general-purpose port IO/IO VccQ1
F4 H4 D27/PTB3 Data bus/general-purpose port IO/IO VccQ1
F17 F17 MMC_VDDON/ MMC card power supply control/ O/I/O/ VccQ
SCIF1_CTS/ SCIF transmit enable/LCD power O/IO
LCD_VEPWC/ supply control/ TPU compare-
TPU_TO3/PTV4 match output/general-purpose port
F18 C20 AFE_RDET/IIC_SDA/ AFE ringing/IIC data I/O I/IO/I VccQ
PTE5 /general-purpose port
F19 F20 USB1d_DPLS/PINT10/ D+ transmit input/port interrupt/ I/I/O/I/ VccQ
AFE_HC1/PCC_BVD1/ AFE hardware control/ IO
PTG2 PCC battery detection 1/
general-purpose port
F20 H20 VccQ I/O power supply (3.3 V) 
G1 H2 VssQ1 I/O power supply (0V) 
G2 F2 D26/PTB2 Data bus/general-purpose port IO/IO VccQ1
G3 E5 D25/PTB1 Data bus/general-purpose port IO/IO VccQ1
G4 J4 Vcc Internal power supply (1.5 V) 
G17 G17 Vss Internal power supply (0 V) 
G18 H18 MMC_ODMOD/ MMC open drain control/ O/O/O/ VccQ
SCIF1_RTS/ SCIF transmit request/LCD power O/IO
LCD_VCPWC/TPU_TO2/ supply control/TPU compare-
PTV3 match output/general-purpose port
G19 G20 AFE_RXIN/IIC_SCL/ AFE serial receive/ I/IO/I VccQ
PTE6 IIC clock/general-purpose port
G20 J20 SIM_CLK/ SCIF1_SCK/ SIM clock/SCIF serial clock/ O/IO/ VccQ
SD_DAT3/PTV0 SD data/general-purpose port IO/IO

Rev. 3.00 Jan. 18, 2008 Page 17 of 1458


REJ09B0033-0300
Section 1 Overview

Pin No. Pin No. I/O


(PLBG (PLBG Buffer
0256 0256 Power
GA-A) KA-A) Pin Name Function I/O Supply
H1 J1 VccQ1 I/O power supply (1.8/3.3 V) 
H2 H1 D23/PTA7 Data bus/general-purpose port IO/IO VccQ1
H3 F5 D22/PTA6 Data bus/general-purpose port IO/IO VccQ1
H4 G5 Vss Power-supply (0 V) 

H17 J18 Vcc Power-supply (1.5 V) 


H18 H17 SIM_RST/SCIF1_RxD/ SIM reset/SCIF receive data/ O/I/I/IO VccQ
SD_WP/PTV1 SD write protect/
general-purpose port
H19 H21 SIM_D/SCIF1_TxD/ SIM data/SCIF transmit data/ IO/O/I/ VccQ
SD_CD/PTV2 SD card detection/ IO
general-purpose port
H20 K20 MMC_DAT/SIOF1_TxD/ MMC data/SIOF transmit data/ IO/O/ VccQ
SD_DAT0/TPU_TI3A/ SD data/TPU clock input/ IO/I/IO
PTU2 general-purpose port
J1 K1 VssQ1 I/O power supply (0V) 
J2 J2 D20/PTA4 Data bus/general-purpose port IO/IO VccQ1
J3 K4 D21/PTA5 Data bus/general-purpose port IO/IO VccQ1
J4 H5 D19/PTA3 Data bus/general-purpose port IO/IO VccQ1
J17 K17 MMC_CMD/ MMC command/SIOF receive IO/I/IO/ VccQ
SIOF1_RxD/SD_CMD/ data/SD command/TPU clock I/IO
TPU_TI2B/PTU1 input/general-purpose port
J18 J17 SIOF1_MCLK/SD_DAT1/ SIOF master clock/SD data/ I/IO/I/IO VccQ
TPU_TI3B/PTU3 TPU clock input/general-purpose
port
J19 J21 SIOF1_SYNC/SD_DAT2/ SIOF frame sync/ IO/IO/IO VccQ
PTU4 SD data/general-purpose port
J20 L17 SCIF0_RTS/TPU_TO0/ SCIF transmit request/TPU O/O/IO VccQ
PTT3 compare-match output/
general-purpose port
K1 L1 VccQ1 I/O power supply (1.8/3.3 V) 
K2 K2 D17/PTA1 Data bus/general-purpose port IO/IO VccQ1

Rev. 3.00 Jan. 18, 2008 Page 18 of 1458


REJ09B0033-0300
Section 1 Overview

Pin No. Pin No. I/O


(PLBG (PLBG Buffer
0256 0256 Power
GA-A) KA-A) Pin Name Function I/O Supply
K3 J5 D18/PTA2 Data bus/general-purpose port IO/IO VccQ1
K4 L4 D16/PTA0 Data bus/general-purpose port IO/IO VccQ1
K17 L20 SCIF0_TxD/IrTx/PTT2 SCIF transmit data/ IrDA transmit O/O/IO VccQ
data/general-purpose port
K18 K18 SCIF0_CTS/TPU_TO1/ SCIF transmit enable/TPU I/O/IO VccQ
PTT4 compare-match output/
general-purpose port
K19 K21 MMC_CLK/SIOF1_SCK/ MMC clock/SIOF serial clock/ O/IO/O/ VccQ
SD_CLK/TPU_TI2A/ SD clock/TPU clock input/general- I/IO
PTU0 purpose port
K20 M17 VssQ I/O power supply (0V) 
L1 K5 CKIO System clock IO VccQ1
L2 M1 WE2/DQMUL/ICIORD Second-highest-byte write/ O/O/O VccQ1
DQ mask UL/IO read
L3 M4 WE3/DQMUU/ICIOWR Highest-byte write/ O/O/O VccQ1
DQ mask UU/IO write
L4 L5 RD/WR Read/write signal O VccQ1
L17 L21 SCIF0_RxD/IrRx/PTT1 SCIF receive data/IrDA receive I/I/IO VccQ
data/general-purpose port
L18 M20 IRQ3/IRL3/PTP3 Interrupt/interrupt/general-purpose I/I/IO VccQ
port
L19 N17 SCIF0_SCK/PTT0 SCIF serial clock/general-purpose IO/IO VccQ
port
L20 L18 VccQ I/O power supply (3.3 V) 
M1 L2 CAS/PTH5 Column address/general-purpose O/IO VccQ1
port
M2 N1 WE0/DQMLL Lowest-byte write/DQ mask LL O/O VccQ1
M3 N5 WE1/DQMLU/WE Second-lowest-byte write/ O/O/O VccQ1
DQ mask LU/write enable
M4 M5 CKE/PTH4 Clock enable/general-purpose port O/IO VccQ1
M17 M21 IRQ1/IRL1/PTP1 Interrupt/interrupt/ I/I/IO VccQ
general-purpose port
M18 N20 NMI NMI interrupt I VccQ

Rev. 3.00 Jan. 18, 2008 Page 19 of 1458


REJ09B0033-0300
Section 1 Overview

Pin No. Pin No. I/O


(PLBG (PLBG Buffer
0256 0256 Power
GA-A) KA-A) Pin Name Function I/O Supply
M19 M18 IRQ0/IRL0/PTP0 Interrupt/interrupt/ I/I/IO VccQ
general-purpose port
M20 P17 IRQ2/IRL2/PTP2 Interrupt/interrupt/ I/I/IO VccQ
general-purpose port
N1 M2 RAS/PTH6 Row address/general-purpose port O/IO VccQ1
N2 P1 CS3 Chip select O VccQ1
N3 P5 CS2 Chip select O VccQ1
N4 N4 Vcc Power-supply (1.5 V) 
N17 N21 Vss Power-supply (0 V) 
N18 P20 AUDATA2/PTJ3 AUD data/general-purpose port O/IO VccQ
N19 N18 AUDATA1/PTJ2 AUD data/general-purpose port O/IO VccQ
N20 R17 AUDATA3/PTJ4 AUD data/general-purpose port O/IO VccQ
P1 N2 VssQ1 I/O power supply (0V) 
P2 W2 A14 Address bus O VccQ1
P3 P2 A17 Address bus O VccQ1
P4 R5 Vss Internal power supply (0 V) 
P17 P21 Vcc Internal power supply (1.5 V)  
P18 R20 AUDATA0/PTJ1 AUD data/general-purpose port O/IO VccQ
P19 P18 AUDCK/PTJ6 AUD clock/general-purpose port O/IO VccQ
P20 T17 VssQ I/O power supply (0V) 
R1 P4 VccQ1 I/O power supply (1.8/3.3 V) 
R2 T2 A11 Address bus O VccQ1
R3 R2 A13 Address bus O VccQ1
R4 R1 A15 Address bus O VccQ1
R17 T20 AUDSYNC/PTJ0 AUD synchronous signal/ O/IO VccQ
general-purpose port
R18 R21 ASEMD0 ASE mode I VccQ
R19 R18 TRST/PTL7 Test reset/general-purpose port I/IO VccQ
R20 U17 VccQ I/O power supply (3.3 V) 
T1 T5 A16 Address bus O VccQ1

Rev. 3.00 Jan. 18, 2008 Page 20 of 1458


REJ09B0033-0300
Section 1 Overview

Pin No. Pin No. I/O


(PLBG (PLBG Buffer
0256 0256 Power
GA-A) KA-A) Pin Name Function I/O Supply
T2 V1 A6 Address bus O VccQ1
T3 V2 A5 Address bus O VccQ1
T4 T1 A12 Address bus O VccQ1
T17 U20 TMS/PTL6 Test mode select/general-purpose I/IO VccQ
port
T18 T18 TCK/PTL3 Test clock/general-purpose port I/IO VccQ
T19 U21 PINT7/PCC_RESET/ Port interrupt/PCC reset/general- I/O/IO VccQ
PTK3 purpose port
T20 V18 ASEBRKAK/PTJ5 ASE break mode acknowledge/ O/IO VccQ
general-purpose port
U1 R4 VssQ1 I/O power supply (0 V) 
U2 T4 A9 Address bus O VccQ1
U3 W1 A4 Address bus O VccQ1
U4 AA3 A10 Address bus O VccQ1
U5 Y5 D11 Data bus IO VccQ1
U6 Y6 D8 Data bus IO VccQ1
U7 AA8 D4 Data bus IO VccQ1
U8 AA9 D1 Data bus IO VccQ1
U9 AA10 Vcc Internal power supply (1.5 V) 
U10 V11 Vss Internal power supply (0 V) 
U11 U11 BACK Bus request acknowledge O VccQ1
U12 U12 BS Bus start O VccQ1
U13 V13 A19/PTR1 Address bus/general-purpose port O/IO VccQ1
U14 U15 A22/PTR4 Address bus/general-purpose port O/IO VccQ1
U15 U16 A24/PTR6 Address bus/general-purpose port O/IO VccQ1
U16 V15 DACK0/PINT1/PTM4 DMA transfer request reception/ O/I/IO VccQ1
port interrupt/
general-purpose port
U17 W21 DREQ1/PTM7 DMA transfer request/ I/IO VccQ1
general-purpose port
U18 T21 TDI/PTL4 Test data input/general-purpose I/IO VccQ
port

Rev. 3.00 Jan. 18, 2008 Page 21 of 1458


REJ09B0033-0300
Section 1 Overview

Pin No. Pin No. I/O


(PLBG (PLBG Buffer
0256 0256 Power
GA-A) KA-A) Pin Name Function I/O Supply
U19 V21 PINT6/PCC_RDY/PTK2 Port interrupt/PCC ready/general- I/I/IO VccQ
purpose port
U20 W20 TDO/PTL5 Test data output/general-purpose O/IO VccQ
port
V1 U1 VccQ1 I/O power supply (1.8/3.3 V) 
V2 Y2 A3 Address bus O VccQ1
V3 U4 A7 Address bus O VccQ1
V4 AA6 D12 Data bus IO VccQ1
V5 Y4 D14 Data bus IO VccQ1
V6 AA7 D9 Data bus IO VccQ1
V7 Y7 D6 Data bus IO VccQ1
V8 Y8 D2 Data bus IO VccQ1
V9 Y9 D0 Data bus IO VccQ1
V10 Y10 CS5B/CE1A/PTM1 Chip select/chip select/ O/O/IO VccQ1
general-purpose port
V11 V12 BREQ Bus request I VccQ1
V12 U13 WAIT/PCC_WAIT Wait/PCC wait I/I VccQ1
V13 U14 A20/PTR2 Address bus/general-purpose port O/IO VccQ1
V14 V14 A23/PTR5 Address bus/general-purpose port O/IO VccQ1
V15 Y19 DREQ0/PINT0/PTM6 DMA transfer request/ I/I/IO VccQ1
port interrupt/general-purpose port
V16 Y18 EXTAL_RTC RTC external clock I VccQ_
RTC
V17 AA19 XTAL_RTC RTC crystal O VccQ_
RTC
V18 V17 RESETP Power-on reset I VccQ_
RTC
V19 AA21 PINT5/PCC_VS2/PTK1 Port interrupt/ I/I/IO VccQ
PCC voltage detection 2/
general-purpose port
V20 V20 VssQ I/O power supply (0 V) 

Rev. 3.00 Jan. 18, 2008 Page 22 of 1458


REJ09B0033-0300
Section 1 Overview

Pin No. Pin No. I/O


(PLBG (PLBG Buffer
0256 0256 Power
GA-A) KA-A) Pin Name Function I/O Supply
W1 U2 A8 Address bus O VccQ1
W2 AA2 A2 Address bus O VccQ1
W3 AA1 A1 Address bus O VccQ1
W4 AA4 A0/PTR0 Address bus/general-purpose port O/IO VccQ1
W5 AA5 D15 Data bus IO VccQ1
W6 V7 D10 Data bus IO VccQ1
W7 V8 D7 Data bus IO VccQ1
W8 V9 D3 Data bus IO VccQ1
W9 V10 CS6B/CE1B/PTM0 Chip select/chip select/general- O/O/IO VccQ1
purpose port
W10 U9 CS5A/CE2A Chip select/chip select O/O VccQ1
W11 AA12 CS4 Chip select O VccQ1
W12 AA13 A18 Address bus O VccQ1
W13 AA14 A21/PTR3 Address bus/general-purpose port O/IO VccQ1
W14 Y15 A25/PTR7 Address bus/general-purpose port O/IO VccQ1
W15 Y16 TEND0/PINT2/PTM2 DMA transfer end/port interrupt/ O/I/IO VccQ1
general-purpose port
W16 AA18 VccQ_RTC RTC power supply (3.3 V) 
W17 V16 TEND1/PINT3/PTM3 DMA transfer end/port interrupt/ O/I/IO VccQ1
general-purpose port
W18 Y20 Vss_RTC RTC power supply (0 V) 
W19 Y21 PINT4/PCC_VS1/PTK0 Port interrupt/PCC voltage I/I/IO VccQ
detection 1/general-purpose port
W20 U18 VccQ I/O power supply (3.3 V) 
Y1 Y1 VssQ1 I/O power supply (0 V) 
Y2 V5 VccQ1 I/O power supply (1.8/3.3 V) 
Y3 V6 D13 Data bus IO VccQ1
Y4 Y3 VssQ1 I/O power supply (0 V) 
Y5 V4 VccQ1 I/O power supply (1.8/3.3 V) 
Y6 U5 D5 Data bus IO VccQ1

Rev. 3.00 Jan. 18, 2008 Page 23 of 1458


REJ09B0033-0300
Section 1 Overview

Pin No. Pin No. I/O


(PLBG (PLBG Buffer
0256 0256 Power
GA-A) KA-A) Pin Name Function I/O Supply
Y7 U6 VssQ1 I/O power supply (0 V) 
Y8 U7 VccQ1 I/O power supply (1.8/3.3 V) 
Y9 U8 CS6A/CE2B Chip select/chip select O/O VccQ1
Y10 AA11 VssQ1 I/O power supply (0 V) 
Y11 U10 VccQ1 I/O power supply (1.8/3.3 V) 
Y12 Y11 CS0 Chip select O VccQ1
Y13 Y12 RD Read strobe O VccQ1
Y14 Y13 VssQ1 I/O power supply (0 V) VccQ1
Y15 Y14 VccQ1 I/O power supply (1.8/3.3 V) 
Y16 AA15 VssQ1 I/O power supply (0 V) 
Y17 AA16 VccQ1 I/O power supply (1.8/3.3 V) 
Y18 AA17 DACK1/PTM5 DMA transfer request reception/ O/IO VccQ1
general-purpose port
Y19 Y17 CA Chip active I VccQ_
RTC
Y20 AA20 Vcc_RTC RTC power supply (1.5 V) 

Rev. 3.00 Jan. 18, 2008 Page 24 of 1458


REJ09B0033-0300
Section 1 Overview

1.3.2 Pin Functions

Table 1.5 lists the pin functions.

Table 1.5 SH7720/SH7721 Pin Functions

Classification Symbol I/O Name Function


Power supply Vcc  Power supply Power supply for the internal
modules and ports for the system.
Connect all Vcc pins to the system
power supply. There will be no
operation if any pins are open.
Vss  Ground Ground pin. Connect all Vss pins
to the system power supply (0 V).
There will be no operation if any
pins are open.
VccQ  Power supply Power supply for I/O pins. Connect
all VccQ pins to the system power
supply. There will be no operation
if any pins are open.
VssQ  Ground Ground pin. Connect all VssQ pins
to the system power supply (0 V).
There will be no operation if any
pins are open.
VccQ1  Power supply Input/output power supply
(1.8/3.3 V) pin.
VssQ1  Ground Input/output power supply (0 V)
pin.
Clock Vcc_PLL1  PLL1 power Power supply for the on-chip PLL1
supply oscillator. (1.5 V)
Vss_PLL1  PLL1 ground Ground pin for the on-chip PLL1
oscillator.
Vcc_PLL2  PLL2 power Power supply for the on-chip PLL2
supply oscillator. (1.5 V)
Vss_PLL2  PLL2 ground Ground pin for the on-chip PLL2
oscillator.
EXTAL I External clock For connection to a crystal
resonator. An external clock signal
may also be input.

Rev. 3.00 Jan. 18, 2008 Page 25 of 1458


REJ09B0033-0300
Section 1 Overview

Classification Symbol I/O Name Function


Clock XTAL O Crystal For connection to a crystal
resonator.
CKIO I/O System clock Used as a pin to input external
clock or output clock.
Operating mode MD5 to MD0 I Mode set Sets the operating mode. Do not
control change values on these pins
during operation.
MD2 to MD0 set the clock mode,
MD3 and MD4 set the bus width of
area 0 and MD5 sets the endian.
System control RESETP I Power-on reset When low, the system enters the
power-on reset state.
RESETM I Manual reset When low, the system enters the
manual reset state.
STATUS1, O Status output Indicates the operating state.
STATUS0
BREQ I Bus request Low when an external device
requests the release of the bus
mastership.
BACK O Bus request Indicates that the bus mastership
acknowledge has been released to an external
device. Reception of the BACK
signal informs the device which
has output the BREQ signal that it
has acquired the bus.
CA I Chip active High in normal operation, and low
in hardware standby mode.
Interrupts NMI I Non-maskable Non-maskable interrupt request
interrupt pin. Fix to high level when not in
use.
IRQ5 to IRQ0 I Interrupt Maskable interrupt request pins.
requests 5 to 0 Selectable as level input or edge
input. The rising edge or falling
edge is selectable as the detection
edge. The low level or high level is
selectable as the detection level.
IRL3 to IRL0 I Interrupt Maskable interrupt request pin.
requests 3 to 0 Input a coded interrupt level.

Rev. 3.00 Jan. 18, 2008 Page 26 of 1458


REJ09B0033-0300
Section 1 Overview

Classification Symbol I/O Name Function


Interrupts PINT15 to I Port interrupt Port interrupt request pins
PINT0 requests 15 to 0
REFOUT O Bus request Bus request signal for refreshing
IRQOUT O Bus request Bus request signal for interrupt
Address bus A25 to A0 O Address bus Outputs addresses.
Data bus D31 to D0 I/O Data bus 32-bit bidirectional data bus
Bus control CS4 to CS2, O Chip select Chip-select signal for external
CS0 memory or devices.
CS6A, CS6B,
CS5A, CS5B,
CE2A, CE2B,
CE1A, CE1B
RD O Read strobe Indicates reading of data from
external devices.
RD/WR O Read/write Read/write signal
signal
BS O Bus start Bus-cycle start signal pin
BACK O Bus request Indicates that the bus mastership
acknowledge has been released to an external
device.
BREQ I Bus request Low when an external device
requests the release of the bus
mastership.
WE O Write enable Write enable pin for PCMCIA
WE3 (BE3) O Highest-byte Indicates that bits 31 to 24 of the
write data in the external memory or
device are being written.
WE2 (BE2) O Second-highest- Indicates that bits 23 to 16 of the
byte write data in the external memory or
device are being written.
WE1 (BE1) O Second-lowest- Indicates that bits 15 to 8 of the
byte write data in the external memory or
device are being written.
WE0 (BE0) O Lowest-byte Indicates that bits 7 to 0 of the data
write in the external memory or device
are being written.
CKE O Clock enable Clock enable (SDRAM)

Rev. 3.00 Jan. 18, 2008 Page 27 of 1458


REJ09B0033-0300
Section 1 Overview

Classification Symbol I/O Name Function


Bus control CAS O Column address Connect to the CAS pin when the
SDRAM is connected.
DQMUU O DQ mask UU Selects D31 to D24. (SDRAM)
DQMUL O DQ mask UL Selects D23 to D16. (SDRAM)
DQMLU O DQ mask LU Selects D15 to D8. (SDRAM)
DQMLL O DQ mask LL Selects D7 to D0. (SDRAM)
RAS O Row address Connect to the RAS pin when the
SDRAM is connected.
WAIT I Wait input Inserts a wait cycle into the bus
cycles during access to the
external space.
IOIS16 I 16-bit IO Indicates 16-bit I/O when PCMCIA
is in use.
ICIORD O IO read Indicates I/O read when PCMCIA
is in use.
ICIOWR O IO write Indicates I/O write when PCMCIA
is in use.
Direct memory DREQ0, I DMA-transfer Input pins for external requests for
access controller DREQ1 request DMA transfer
(DMAC)
DACK0, O DMA transfer Indicates the acceptance of DMA
DACK1 request transfer requests to external
reception devices.
TEND0, O DMA-transfer Transfer end output pins for DMAC
TEND1 end
16-bit timer pulse TPU_TO3 to O TPU compare- TPU compare-match output pins
unit (TPU) TPU_TO0 match output
TPU_TI3A to I TPU clock input TPU clock input pins
TPU_TI2A
TPU_TI2B to I TPU clock input TPU clock input pins
TPU_TI3B
Analog front end AFE_RLYCNT O AFE on-hook On-hook control pin
interface (AFEIF) control
AFE_FS I AFE frame AFE frame synchronization signal
synchronization pin
AFE_SCLK I AFE shift clock AFE shift clock input pin

Rev. 3.00 Jan. 18, 2008 Page 28 of 1458


REJ09B0033-0300
Section 1 Overview

Classification Symbol I/O Name Function


Analog front end AFE_TXOUT O AFE serial AFE serial transmit data output pin
interface (AFEIF) transmission
AFE_RDET I AFE ringing AFE ringing signal input pin
signal
AFE_HC1 O AFE hardware AFE hardware control signal
control
AFE_RXIN I AFE serial AFE serial receive data
reception
Serial SCIF0_TxD, O SCIF transmit Transmit data pins
communication SCIF1_TxD data
interface with
SCIF0_RxD, I SCIF receive Receive data pins
FIFO SCIF1_RxD data
(SCIF)
SCIF0_SCK, I/O SCIF serial Clock input/output pins
SCIF1_SCK clock
SCIF0_RTS, O SCIF transmit Transmit request output pins
SCIF1_RTS request
SCIF0_CTS, I SCIF transmit Modem control pins
SCIF1_CTS enable
IrDA IrTX O IrDA transmit IrDA transmit data output pin
data
IrRX I IrDA receive IrDA receive data input pin
data
Serial I/O with SIOF0_SYNC, I/O SIOF frame SIOF frame synchronization
FIFO (SIOF) SIOF1_SYNC sync signals
SIOF0_TxD, O SIOF transmit SIOF transmit data pin
SIOF1_TxD data
SIOF0_RxD, I SIOF receive SIOF receive data pin
SIOF1_RxD data
SIOF0_SCK, I/O SIOF serial SIOF serial clock pins
SIOF1_SCK clock
SIOF0_MCLK, I SIOF master SIOF master clock input pins
SIOF1_MCLK clock
I2C bus interface IIC_SCL I/O IIC clock I2C serial clock pin
(IIC) 2
IIC_SDA I/O IIC data I C data input/output pin
Realtime clock VccQ_RTC  RTC power Power supply pin for the RTC
(RTC) supply (3.3 V)

Rev. 3.00 Jan. 18, 2008 Page 29 of 1458


REJ09B0033-0300
Section 1 Overview

Classification Symbol I/O Name Function


Realtime clock Vcc_RTC  RTC power Power supply pin for the RTC
(RTC) supply (1.5 V)
Vss_RTC  RTC ground Ground pin for the RTC.
EXTAL_RTC I RTC external Connects crystal resonator for the
clock RTC. Also used to input external
clock for the RTC.
XTAL_RTC O RTC crystal Connects crystal resonator for the
RTC.
LCD controller LCD_DATA15 O LCD data Data output pin for LCD panel
(LCDC) to LCD_DATA0
LCD_CL1 O LCD shift clock LCD shift clock 1/ horizontal sync
1 signal pin
LCD_CL2 O LCD shift clock LCD shift clock 2/dot clock pin
2
LCD_CLK I LCD clock LCD clock source input pin
source
LCD_FLM O LCD line marker First line marker/vertical sync
signal pin
LCD_DON O LCD display on LCD display on signal pin
LCD_VCPWC O LCD power LCD module power control (VCC)
control (VCC) pin
LCD_VEPWC O LCD power LCD module power control (VEE)
control (VEE) pin
LCD_M_DISP O LCD current LCD current alternating signal pin
alternating
signal
PC card PCC_BVD1 I PCC battery Pin for buttery voltage detect 1/
controller (PCC) detection 1 card status change signal from PC
card
PCC_BVD2 I PCC battery Pin for buttery voltage detect 2/
detection 2 digital sound signal pin from PC
card
PCC_RDY I PCC ready Pin for ready signal/interrupt
request signal form PC card
PCC_REG O PCC space Area indicate signal pin for PC
indication card
PCC_RESET O PCC reset Reset signal pin for PC card
PCC_CD1 I PCC card Pin for card detect 1 signal from
detection 1 PC card

Rev. 3.00 Jan. 18, 2008 Page 30 of 1458


REJ09B0033-0300
Section 1 Overview

Classification Symbol I/O Name Function


PC card PCC_CD2 I PCC card Pin for card detect 2 signal from
controller (PCC) detection 2 PC card
PCC_WAIT I PCC wait PCC hardware wait request signal
request pin
PCC_DRV O PCC buffer PCC buffer control signal pin
control
PCC_VS1 I PCC voltage Pin for voltage sense 1 signal from
detection 1 PC card
PCC_VS2 I PCC voltage Pin for voltage sense 2 signal from
detection 2 PC card
PCC_IOIS16 I PCC16-bit IO Pin for write protection signal/16-
bit I/O signal from PC card
MultiMedia Card MMC_ODMOD O MMC open Open drain mode control pin
interface drain control
(MMCIF) MMC_VDDON O MMC card MMC power control pin
power control
MMC_CLK O MMC clock Clock output pin
MMC_DAT I/O MMC data Data input/output pin in MMC
mode
Response/data input pin in SPI
mode
This pin is connected to the Data
out pin on the MMC side.
MMC_CMD I/O MMC command Command output/response input
pin in MMC mode
Command/data output pin in SPI
mode
This pin is connected to the Data
in pin on the MMC side.
SD host interface SD_CLK O SD clock Clock output pin
(SDHI) SD_CMD I/O SD command Command output/response input
pin
SD_DAT0 I/O SD data 0 Data input/output pin
SD_DAT1 I/O SD data 1 Data input/output pin
SD_DAT2 I/O SD data 2 Data input/output pin
SD_DAT3 I/O SD data 3 Data input/output pin

Rev. 3.00 Jan. 18, 2008 Page 31 of 1458


REJ09B0033-0300
Section 1 Overview

Classification Symbol I/O Name Function


SD host interface SD_CD I SD card Card detection pin
(SDHI) detection
SD_WP I SD write protect Write protect pin
SIM card module SIM_RST O SIM reset Smart card reset output pin
(SIM)
SIM_CLK O SIM clock Smart card clock output pin
SIM_D I/O SIM data Transmit/receive data input/output
pin
A/D converter AN3 to AN0 I ADC analog Analog input pin
(ADC) input
AVcc  Analog power Power supply pin for the A/D or
supply D/A converter. When the A/D or
D/A converter is not in use,
connect this pin to input/output
power supply (VccQ).
AVss  Analog ground Ground pin for the A/D or D/A
converter. Connect this pin to
input/output power supply (VssQ).
ADTRG I ADC external External trigger signal for starting
trigger A/D conversion
D/A converter DA0 O DAC analog Channel 0 analog output pin
(DAC) output
DA1 O DAC analog Channel 1 analog output pin
output
USB AVcc_USB  USB power Power supply pin for USB
supply
AVss_USB  USB ground Ground pin for USB
EXTAL_USB I USB external Connects crystal resonator for
clock USB. Also used to input external
clock for USB (48 MHz)
XTAL_USB O USB crystal Connects a crystal resonator for
USB
USB1_ovr_ I USB1 over- USB port 1 over-current detection/
current/ current/ USB cable connection monitor pin
USBF_VBUS monitor
USB2_ovr_ I USB2 over- USB port 2 over-current detection
current current pin

Rev. 3.00 Jan. 18, 2008 Page 32 of 1458


REJ09B0033-0300
Section 1 Overview

Classification Symbol I/O Name Function


USB USB1_pwr_en/ O USB1 power USB port 1 power enable control/
USBF_UPLUP enable/pull-up pull- up control output pin
control
SUB2_pwer_en O USB2 power USB port 2 power enable control
enable pin
USB1_P I/O USB D+ port 1 D+ port 1 transceiver pin for USB
USB1_M I/O USB D− port 1 D− port 1 transceiver pin for USB
USB2_P I/O USB D+ port 2 D+ port 2 transceiver pin for USB
USB2_M I/O USB D− port 2 D− port 2 transceiver pin for USB
USB1d_DMNS I D− signal input Input pin to driver for D− signal
from receiver
USB1d_ O Suspend state Transceiver suspend state output
SUSPEND pin
USB1d_RCV I Receive data Input pin for receive data from
differential receiver
USB1d_TXENL O Driver output Driver output enable pin
enable
USB1d_SPEED O Speed control Transceiver speed control pin
USB1d_TXSE0 O SE0 state SE0 state output pin
USB1d_ O D+ transmit D+ transmit output pin to driver
TXDPLS output
USB1d_DPLS I D+ transmit D+ transmit input pin to driver
input
I/O port PTA7 to PTA0 I/O General 8-bit general-purpose port pins
purpose port
PTB7 to PTB0 I/O General 8-bit general-purpose port pins
purpose port
PTC7 to PTC0 I/O General 8-bit general-purpose port pins
purpose port
PTD7 to PTD0 I/O General 8-bit general-purpose port pins
purpose port
PTE6, PTE5 I General 7-bit general-purpose port pins
purpose port
PTE4 to PTE0 I/O General
purpose port
PTF6 to PTF0 I General 7-bit general-purpose port pins
purpose port

Rev. 3.00 Jan. 18, 2008 Page 33 of 1458


REJ09B0033-0300
Section 1 Overview

Classification Symbol I/O Name Function


I/O port PTG6 to PTG0 I/O General 7-bit general-purpose port pins
purpose port
PTH6 to PTH0 I/O General 7-bit general-purpose port pins
purpose port
PTJ6 to PTJ0 I/O General 7-bit general-purpose port pins
purpose port
PTK3 to PTK0 I/O General 4-bit general-purpose port pins
purpose port
PTL7 to PTL3 I/O General 5-bit general-purpose port pins
purpose port
PTM7 to PTM0 I/O General 8-bit general-purpose port pins
purpose port
PTP4 to PTP0 I/O General 5-bit general-purpose port pins
purpose port
PTR7 to PTR0 I/O General 8-bit general-purpose port pins
purpose port
PTS4 to PTS0 I/O General 5-bit general-purpose port pins
purpose port
PTT4 to PTT0 I/O General 5-bit general-purpose port pins
purpose port
PTU4 to PTU0 I/O General 5-bit general-purpose port pins
purpose port
PTV4 to PTV0 I/O General 5-bit general-purpose port pins
purpose port
User debugging TCK I Test clock Test-clock input pin
interface TMS I Test mode Test-mode select signal input pin
(H-UDI)
select
TDI I Test data input Serial input pin for instructions and
data
TDO O Test data Serial output pin for instructions
output and data
TRST I Test reset Initial-signal input pin

Rev. 3.00 Jan. 18, 2008 Page 34 of 1458


REJ09B0033-0300
Section 1 Overview

Classification Symbol I/O Name Function


Advanced user AUDATA3 to O AUD data Destination-address output pin in
debugger AUDATA0 branch-trace mode
(AUD) AUDCK O AUD clock Synchronous clock output pin in
branch-trace mode
AUDSYNC O AUD Data start-position acknowledge-
synchronous signal output pin in branch-trace
signal mode
E10A interface ASEBRKAK O ASE break Indicates that the E10A emulator
mode has entered its break mode.
acknowledge
ASEMD0 I ASE mode Sets ASE mode.
Notes: 1. All Vcc/Vss/VccQ/VssQ/VccQ1/VssQ1/AVcc/AVss/AVcc_USB/AVss_USB/VccQ_RTC/
Vcc_RTC/Vss_RTC/Vcc_PLL1/Vss_PLL1/Vcc_PLL2/Vss_PLL2 should be connected to
the system power supply (so that power is supplied at all times.) In hardware standby
mode, the power supply to other than Vcc_RTC and VccQ_RTC can be turned off
(section 13.8).
2. Always supply power to the Vcc_RTC and VccQ_RTC, even if the RTC is not being
used.
3. Always supply power to the Vcc_PLL1 and Vcc_PLL2, even if the PLL is not being
used.
4. Drive ASEMD0 high when using the user system alone, and not using an emulator or
the H-UDI. When this pin is low or open, RESETP may be masked.
5. Drivability can be switched by the register settings of the pin function controller (PFC).
When 3.3 V is applied to VccQ1, set the drivability low. When 1.8 V is applied to
VccQ1, set the drivability high.
6. SDHI associated pins support only for the models including the SDHI.

Rev. 3.00 Jan. 18, 2008 Page 35 of 1458


REJ09B0033-0300
Section 1 Overview

Rev. 3.00 Jan. 18, 2008 Page 36 of 1458


REJ09B0033-0300
Section 2 CPU

Section 2 CPU

2.1 Processing States and Processing Modes

2.1.1 Processing States

This LSI supports four types of processing states: a reset state, an exception handling state, a
program execution state, and a low-power consumption state, according to the CPU processing
states.

(1) Reset State

In the reset state, the CPU is reset. The LSI supports two types of resets: power-on reset and
manual reset. For details on resets, refer to section 7, Exception Handling.

In power-on reset, the registers and internal statuses of all LSI on-chip modules are initialized. In
manual reset, the register contents of a part of the LSI on-chip modules are retained. For details,
refer to section 37, List of Registers. The CPU internal statuses and registers are initialized both in
power-on reset and manual reset. After initialization, the program branches to address
H'A0000000 to pass control to the reset processing program to be executed.

(2) Exception Handling State

In the exception handling state, the CPU processing flow is changed temporarily by a general
exception or interrupt exception processing. The program counter (PC) and status register (SR) are
saved in the save program counter (SPC) and save status register (SSR), respectively. The program
branches to an address obtained by adding a vector offset to the vector base register (VBR) and
passes control to the exception processing program defined by the user to be executed. For details
on reset, refer to section 7, Exception Handling.

(3) Program Execution State

The CPU executes programs sequentially.

(4) Low-Power Consumption State

The CPU stops operation to reduce power consumption. The power-down mode can be entered by
executing the SLEEP instruction. For details on the power-down mode, refer to section 13, Power-
Down Modes.

Figure 2.1 shows a status transition diagram.

CPUS3D0S_000020020300 Rev. 3.00 Jan. 18, 2008 Page 37 of 1458


REJ09B0033-0300
Section 2 CPU

2.1.2 Processing Modes

This LSI supports two processing modes: user mode and privileged mode. These processing
modes can be determined by the processing mode bit (MD) in the status register (SR). If the MD
bit is cleared to 0, the user mode is selected. If the MD bit is set to 1, the privileged mode is
selected. The CPU enters the privileged mode by a transition to reset state or exception handling
state. In the privileged mode, any registers and resources in address spaces can be accessed.

Clearing the MD bit in the SR to 0 puts the CPU in the user mode. In the user mode, some of the
registers, including SR, and some of the address spaces cannot be accessed by the user program
and system control instructions cannot be executed. This function effectively protects the system
resources from the user program. To change the processing mode from user to privileged mode, a
transition to exception handling state is required.

Note: To call a service routine used in privileged mode from user mode, the LSI supports an
unconditional trap instruction (TRAPA). When a transition from user mode to privileged
mode occurs, the contents of the SR and PC are saved. A program execution in user mode
can be resumed by restoring the contents of the SR and PC. To return from an exception
processing program, the LSI supports an RTE instruction.

(From any states)


Power-on reset
Manual reset
Reset processing
routine starts
Reset state Program execution state

Exception
handling
Multiple routine starts SLEEP instruction
exceptions An exception
is accepted

Low-power
Exception handling state
An exception consumption state
is accepted

Figure 2.1 Processing State Transitions

Rev. 3.00 Jan. 18, 2008 Page 38 of 1458


REJ09B0033-0300
Section 2 CPU

2.2 Memory Map

2.2.1 Virtual Address Space

The LSI supports 32-bit virtual addresses and accesses system resources using the 4-Gbytes of
virtual address space. User programs and data are accessed from the virtual address space. The
virtual address space is divided into several areas as shown in table 2.1.

(1) P0/U0 Area

This area is called the P0 area when the CPU is in privileged mode and the U0 area when in user
mode. For the P0 and U0 areas, access using the cache is enabled. The P0 and U0 areas are
handled as address translatable areas.

If the cache is enabled, access to the P0 or U0 area is cached. If a P0 or U0 address is specified


while the address translation unit is enabled, the P0 or U0 address is translated into a physical
address based on translation information defined by the user.

If the CPU is in user mode, only the U0 area can be accessed. If P1, P2, P3, or P4 is accessed in
user mode, a transition to an address error exception occurs.

(2) P1 Area

The P1 area is defined as a cacheable but non-address translatable area. Normally, programs
executed at high speed in privileged mode, such as exception processing handlers, which are at the
core of the operating system (OS), are assigned to the P1 area.

(3) P2 Area

The P2 area is defined as a non-cacheable but non-address translatable area. A reset processing
program to be called from the reset state is described at the start address (H'A0000000) of the P2
area. Normally, programs such as system initialization routines and OS initiation programs are
assigned to the P2 area. To access a part of an on-chip I/O, its corresponding program should be
assigned to the P2 area.

(4) P3 Area

The P3 area is defined as a cacheable and address translatable area. This area is used if an address
translation is required for a privileged program.

Rev. 3.00 Jan. 18, 2008 Page 39 of 1458


REJ09B0033-0300
Section 2 CPU

(5) P4 Area

The P4 area is defined as a control area which is non-cacheable and non-address translatable. This
area can be accessed only in privileged mode. A part of the LSI’s on-chip I/O is assigned to this
area.

Table 2.1 Virtual Address Space

Address Range Name Mode Description


H'00000000 to P0/U0 Privileged/user mode 2-Gbyte physical space, cacheable, address
H'7FFFFFFF translatable
In user mode, only this address space can be
accessed.
H'80000000 to P1 Privileged mode 0.5-Gbyte physical space, cacheable
H'9FFFFFFF
H'A0000000 to P2 Privileged mode 0.5-Gbyte physical space, non-cacheable
H'BFFFFFFF
H'C0000000 to P3 Privileged mode 0.5-Gbyte physical space, cacheable,
H'DFFFFFFF address translatable
H'E0000000 to P4 Privileged mode 0.5-Gbyte control space, non-cacheable
H'FFFFFFFF

2.2.2 External Memory Space

This LSI uses 29 bits of the 32-bit virtual address to access external memory. In this case, 0.5-
Gbyte of external memory space can be accessed. The external memory space is managed in area
units. Different types of memory can be connected to each area, as shown in figure 2.2. For
details, please refer to section 9, Bus State Controller (BSC).

In addition, area 1 in the external memory space is used as an on-chip I/O space where most of this
LSI’s on-chip I/Os are mapped.

Normally, the upper three bits of the 32-bit virtual address are masked and the lower 29 bits are
used for external memory addresses.*2 For example, address H'00000100 in the P0 area, address
H'80000100 in the P1 area, address H'A0000100 in the P2 area, and address H'C0000100 in the P3
area of the virtual address space are mapped into address H'00000100 of area 0 in the external
memory space. The P4 area in the virtual address space is not mapped into the external memory
address. If an address in the P4 area is accessed, an external memory cannot be accessed.

Rev. 3.00 Jan. 18, 2008 Page 40 of 1458


REJ09B0033-0300
Section 2 CPU

Notes: 1. To access an on-chip I/O mapped into area 1 in the external memory space, access the
address from the P2 area which is not cached in the virtual address space.
2. If the address translation unit is enabled, arbitrary mapping in page units can be
specified. For details, refer to section 4, Memory Management Unit (MMU).

External memory space


H'0000 0000 H'0000 0000
Area 0
Area 1
Area 2
Area 3
Area 4
P0 area Area 5 U0 area
Area 6
Area 7

H'8000 0000 H'8000 0000

P1 area
H'A000 0000

P2 area
H'C000 0000 Address error

P3 area
H'E000 0000

P4 area
H'FFFF FFFF H'FFFF FFFF
Privileged mode User mode

Figure 2.2 Virtual Address to External Memory Space Mapping

Rev. 3.00 Jan. 18, 2008 Page 41 of 1458


REJ09B0033-0300
Section 2 CPU

2.3 Register Descriptions


This LSI provides thirty-three 32-bit registers: 24 general registers, five control registers, three
system registers, and one program counter.

(1) General Registers

This LSI incorporates 24 general registers: R0_BANK0 to R7_BANK0, R0_BANK1 to


R7_BANK1 and R8 to R15. R0 to R7 are banked. The process mode and the register bank (RB)
bit in the status register (SR) define which set of banked registers (R0_BANK0 to R7_BANK0 or
R0_BANK1 to R7_BANK1) are accessed as general registers.

(2) System Registers

This LSI incorporates the multiply and accumulate registers (MACH/MACL) and procedure
register (PR) as system registers. These registers can be accessed regardless of the processing
mode.

(3) Program Counter

The program counter stores the value obtained by adding 4 to the current instruction address.

(4) Control Registers

This LSI incorporates the status register (SR), global base register (GBR), save status register
(SSR), save program counter (SPC), and vector base register as control register. Only the GBR can
be accessed in user mode. Control registers other than the GBR can be accessed only in privileged
mode.

Rev. 3.00 Jan. 18, 2008 Page 42 of 1458


REJ09B0033-0300
Section 2 CPU

Table 2.2 shows the register values after reset. Figure 2.3 shows the register configurations in each
process mode.

Table 2.2 Register Initial Values

Register Type Registers Initial Values*


General registers R0_BANK0 to R7_BANK0, Undefined
R0_BANK1 to R7_BANK1,
R8 to R15
System registers MACH, MACL, PR Undefined
Program counter PC H'A0000000
Control registers SR MD bit = 1, RB bit = 1, BL bit = 1, I3 to I0 bits
= H'F (1111), reserved bits = all 0, other bits =
undefined
GBR, SSR, SPC Undefined
VBR H'00000000
Note: * Initialized by a power-on or manual reset.

Rev. 3.00 Jan. 18, 2008 Page 43 of 1458


REJ09B0033-0300
Section 2 CPU

31 0 31 0 31 0
R0_BANK0*1,*2 R0_BANK1*1,*3 R0_BANK0*1,*4
R1_BANK0*2 R1_BANK1*3 R1_BANK0*4
R2_BANK0*2 R2_BANK1*3 R2_BANK0*4
R3_BANK0*2 R3_BANK1*3 R3_BANK0*4
R4_BANK0*2 R4_BANK1*3 R4_BANK0*4
R5_BANK0*2 R5_BANK1*3 R5_BANK0*4
R6_BANK0*2 R6_BANK1*3 R6_BANK0*4
R7_BANK0*2 R7_BANK1*3 R7_BANK0*4
R8 R8 R8
R9 R9 R9
R10 R10 R10
R11 R11 R11
R12 R12 R12
R13 R13 R13
R14 R14 R14
R15 R15 R15

SR SR SR
SSR SSR

GBR GBR GBR


MACH MACH MACH
MACL MACL MACL
PR PR PR
VBR VBR

PC PC PC
SPC SPC

R0_BANK0*1,*4 R0_BANK1*1,*3
R1_BANK0*4 R1_BANK1*3
R2_BANK0*4 R2_BANK1*3
R3_BANK0*4 R3_BANK1*3
R4_BANK0*4 R4_BANK1*3
R5_BANK0*4 R5_BANK1*3
R6_BANK0*4 R6_BANK1*3
R7_BANK0*4 R7_BANK1*3

(a) User mode register (b) Privileged mode register (c) Privileged mode register
configuration configuration (RB = 1) configuration (RB = 0)

Notes: 1. The R0 register is used as an index register in indexed register indirect addressing mode
and indexed GBR indirect addressing mode.
2. Bank register
3. Bank register
Accessed as a general register when the RB bit is set to 1 in the SR register.
Accessed only by LDC/STC instructions when the RB bit is cleared to 0.
4. Bank register
Accessed as a general register when the RB bit is cleared to 0 in the SR register.
Accessed only by LDC/STC instructions when the RB bit is set to 1.

Figure 2.3 Register Configuration in Each Processing Mode

Rev. 3.00 Jan. 18, 2008 Page 44 of 1458


REJ09B0033-0300
Section 2 CPU

2.3.1 General Registers

There are twenty-four 32-bit general registers: R0_BANK0 to R7_BANK0, R0_BANK1 to


R7_BANK1, and R8 to R15. R0 to R7 are banked. The process mode and the register bank (RB)
bit in the status register (SR) define which set of banked registers (R0_BANK0 to R7_BANK0 or
R0_BANK1 to R7_BANK1) are accessed as general registers. R0 to R7 registers in the selected
bank are accessed as R0 to R7. R0 to R7 in the non-selected bank is accessed as R0_BANK to
R7_BANK by the control register load instruction (LDC) and control register store instruction
(STC).

In user mode, bank 0 is selected regardless of the RB bit value. Sixteen registers: R0_BANK0 to
R7_BANK0 and R8 to R15 are accessed as general registers R0 to R15. The R0_BANK1 to
R7_BANK1 registers in bank 1 cannot be accessed.

In privileged mode that is entered by a transition to exception handling state, the RB bit is set to 1
to select bank 1. In privileged mode, sixteen registers: R0_BANK1 to R7_BANK1 and R8 to R15
are accessed as general registers R0 to R15. A bank is switched automatically when an exception
handling state is entered, registers R0 to R7 need not be saved by the exception handling routine.
The R0_BANK0 to R7_BANK0 registers in bank 0 can be accessed as R0_BANK to R7_BANK
by the LDC and STC instructions.

In privileged mode, bank 0 can also be used as general registers by clearing the RB bit to 0. In this
case, sixteen registers: R0_BANK0 to R7_BANK0 and R8 to R15 are accessed as general
registers R0 to R15. The R0_BANK1 to R7_BANK1 registers in bank 1 can be accessed as
R0_BANK to R7_BANK by the LDC and STC instructions.

The general registers R0 to R15 are used as equivalent registers for almost all instructions. In
some instructions, the R0 register is automatically used or only the R0 register can be used as
source or destination registers.

Rev. 3.00 Jan. 18, 2008 Page 45 of 1458


REJ09B0033-0300
Section 2 CPU

31 0
R0*1,*2 General Registers: Undefined after reset
R1*2
R2*2 Notes: 1. R0 functions as an index register in the indexed
register-indirect addressing mode and indexed
R3*2
GBR-indirect addressing mode. In some
R4*2
instructions, only R0 can be used as the source
R5*2 or destination register.
R6*2 2. R0 to R7 are banked registers. In privileged
R7*2 mode, either R0_BANK0 to R7_BANK0 or
R8 R0_BANK1 to R7_BANK1 is selected by the
RB bit in the SR register.
R9
R10
R11
R12
R13
R14
R15

Figure 2.4 General Registers

2.3.2 System Registers

The system registers: multiply and accumulate registers (MACH/MACL) and procedure register
(PR) as system registers can be accessed by the LDS and STS instructions.

(1) Multiply and Accumulate Registers (MACH/MACL)

The multiply and accumulate registers (MACH/MACL) store the results of multiplication and
accumulation instructions or multiplication instructions. The MACH/MACL registers also store
addition values for the multiplication and accumulations. After reset, these registers are undefined.
The MACH and MACL registers store upper 32 bits and lower 32 bits, respectively.

(2) Procedure Register (PR)

The procedure register (PR) stores the return address for a subroutine call using the BSR, BSRF,
or JSR instruction. The return address stored in the PR register is restored to the program counter
(PC) by the RTS (return from the subroutine) instruction. After reset, this register is undefined.

Rev. 3.00 Jan. 18, 2008 Page 46 of 1458


REJ09B0033-0300
Section 2 CPU

2.3.3 Program Counter

The program counter (PC) stores the value obtained by adding 4 to the current instruction address.
There is no instruction to read the PC directly. Before an exception handling state is entered, the
PC is saved in the save program counter (SPC). Before a subroutine call is executed, the PC is
saved in the procedure register (PR). In addition, the PC can be used for PC relative addressing
mode.

Figure 2.5 shows the system register and program counter configurations.

Multiply and accumulate high and low registers (MACH/MACL)

31 0

MACH

MACL

Procedure register (PR)


31 0

PR

Program counter (PC)


31 0

PC

Figure 2.5 System Registers and Program Counter

Rev. 3.00 Jan. 18, 2008 Page 47 of 1458


REJ09B0033-0300
Section 2 CPU

2.3.4 Control Registers

The control registers (SR, SSR, SPC, GBR, and VBR) can be accessed by the LDC or STC
instruction in privileged mode. The GBR register can be accessed in the user mode.

The control registers are described below.

(1) Status Register (SR)

The status register (SR) indicates the system status as shown below. The SR register can be
accessed only in privileged mode.

Initial
Bit Bit Name Value R/W Description
31  0 R Reserved
This bit is always read as 0. The write value should
always be 0.
30 MD 1 R/W Processing Mode
Indicates the CPU processing mode.
0: User mode
1: Privileged mode
The MD bit is set to 1 in reset or exception handling
state.
29 RB 1 R/W Register Bank
The general registers R0 to R7 are banked registers.
0: In this case, R0_BANK0 to R7_BANK0 and R8 to
R15 are used as general registers.
R0_BANK1 to R7_BANK1 can be accessed by the
LDC or STR instruction.
1: In this case, R0_BANK1 to R7_BANK1 and R8 to
R15 are used as general registers.
R0_BANK0 to R7_BANK0 can be accessed by the
LDC or STR instruction.
The RB bit is set to 1 in reset or exception handling
state.

Rev. 3.00 Jan. 18, 2008 Page 48 of 1458


REJ09B0033-0300
Section 2 CPU

Initial
Bit Bit Name Value R/W Description
28 BL 1 R/W Block
Specifies whether an exception, interrupt, or user
break is enabled or not.
0: Enables an exception, interrupt, or user break.
1: Disables an exception, interrupt, or user break.
The BL bit is set to 1 in reset or exception handling
state.
27 to 10  All 0 R Reserved
These bits are always read as 0. The write value
should always be 0.
9 M  R/W M Bit
8 Q  R/W Q Bit
These bits are used by the DIV0S, DIV0U, and DIV1
instructions. These bits can be changed even in user
mode by using the DIV0S, DIV0U, and DIV1
instructions. These bits are undefined at reset. These
bits do not change in an exception handling state.
7 to 4 I3 to I0 All 1 R/W Interrupt Mask
Indicates the interrupt mask level. These bits do not
change even if an interrupt occurs. At reset, these bits
are initialized to B'1111. These bits are not affected in
an exception handling state.
3, 2  All 0 R Reserved
These bits are always read as 0. The write value
should always be 0.
1 S  R/W Saturation Mode
Specifies the saturation mode for multiply instructions
or multiply and accumulate instructions. This bit can be
specified by the SETS and CLRS instructions in user
mode.
At reset, this bit is undefined. This bit is not affected in
an exception handling state.

Rev. 3.00 Jan. 18, 2008 Page 49 of 1458


REJ09B0033-0300
Section 2 CPU

Initial
Bit Bit Name Value R/W Description
0 T  R/W T Bit
Indicates true or false for compare instructions or carry
or borrow occurrence for an operation instruction with
carry or borrow. This bit can be specified by the SETT
and CLRT instructions in user mode.
At reset, this bit is undefined. This bit is not affected in
an exception handling state.
Note: The M, Q, S, and T bits can be set/cleared by the user mode specific instructions. Other bits
can be read or written in privileged mode.

(2) Save Status Register (SSR)

The save status register (SSR) can be accessed only in privileged mode. Before entering the
exception, the contents of the SR register is stored in the SSR register. At reset, the SSR initial
value is undefined.

(3) Save Program Counter (SPC)

The save program counter (SPC) can be accessed only in privileged mode. Before entering the
exception, the contents of the PC is stored in the SPC. At reset, the SPC initial value is undefined.

(4) Global Base Register (GBR)

The global base register (GBR) is referenced as a base register in GBR indirect addressing mode.
At reset, the GBR initial value is undefined.

(5) Vector Base Register (VBR)

The vector base register (VBR) can be accessed only in privileged mode. If a transition from reset
state to exception handling state occurs, this register is referenced as a base address. For details,
refer to section 7, Exception Handling. At reset, the VBR is initialized as H'00000000.

Rev. 3.00 Jan. 18, 2008 Page 50 of 1458


REJ09B0033-0300
Section 2 CPU

Figure 2.6 shows the control register configuration.

Save status register (SSR)


31 0
SSR

Save program counter (SPC)


31 0
SPC

Global base register (GBR)


31 0
GBR

Vector base register (VBR)


31 0
VBR

Status register (SR)


31 0
0 MD RB BL 0 0 M Q I3 I2 I1 I0 0 0 S T

Figure 2.6 Control Register Configuration

2.4 Data Formats

2.4.1 Register Data Format

Register operands are always longwords (32 bits). When the memory operand is only a byte (8
bits) or a word (16 bits), it is sign-extended into a longword when loaded into a register.

31 0
Longword

Rev. 3.00 Jan. 18, 2008 Page 51 of 1458


REJ09B0033-0300
Section 2 CPU

2.4.2 Memory Data Formats

Memory data formats are classified into byte, word, and longword. Memory can be accessed in
byte, word, and longword. When the memory operand is only a byte (8 bits) or a word (16 bits), it
is sign-extended into a longword when loaded into a register.

An address error will occur if word data starting from an address other than 2n or longword data
starting from an address other than 4n is accessed. In such cases, the data accessed cannot be
guaranteed.

When a word or longword operand is accessed, the byte positions on the memory corresponding to
the word or longword data on the register is determined to the specified endian mode (big endian
or little endian).

Figure 2.7 shows a byte correspondence in big endian mode. In big endian mode, the MSB byte in
the register corresponds to the lowest address in the memory, and the LSB the in the register
corresponds to the highest address. For example, if the contents of the general register R0 is stored
at an address indicated by the general register R1 in longword, the MSB byte of the R0 is stored at
the address indicated by the R1 and the LSB byte of the R1 register is stored at the address
indicated by the (R1 +3).

The on-chip device registers assigned to memory are accessed in big endian mode. Note that the
available access size (byte, word, or long word) differs in each register.

Note: The CPU instruction codes of this LSI must be stored in word units. In big endian mode,
the instruction code must be stored from upper byte to lower byte in this order from the
word boundary of the memory.

31 23 15 7 0
Byte position
in R0 [7:0] [15:8] [7:0] [31:24] [23:16] [15:8] [7:0]

Byte position
[7:0] [15:8] [7:0] [31:24] [23:16] [15:8] [7:0]
in memory
@(R1+0) @(R1+1) @(R1+2) @(R1+3) @(R1+0) @(R1+1) @(R1+2) @(R1+3) @(R1+0) @(R1+1) @(R1+2) @(R1+3)

(a) Byte access (b) Word access (c) Longword access


Example: MOV.B R0, @R1 Example: MOV.W R0, @R1 Example: MOV.L R0, @R1
(R1 = Address 4n) (R1 = Address 4n) (R1 = Address 4n)

Figure 2.7 Data Format on Memory (Big Endian Mode)

Rev. 3.00 Jan. 18, 2008 Page 52 of 1458


REJ09B0033-0300
Section 2 CPU

The little endian mode can also be specified as data format. Either big-endian or little-endian mode
can be selected according to the MD5 pin at reset. When MD5 is low at reset, the processor
operates in big-endian mode. When MD5 is high at reset, the processor operates in little-endian
mode. The endian mode cannot be modified dynamically.

In little endian mode, the MSB byte in the register corresponds to the highest address in the
memory, and the LSB the in the register corresponds to the lowest address (figure 2.8). For
example, if the contents of the general register R0 is stored at an address indicated by the general
register R1 in longword, the MSB byte of the R0 is stored at the address indicated by the (R1+3)
and the LSB byte of the R1 register is stored at the address indicated by the R1.

If the little endian mode is selected, the on-chip memory are accessed in little endian mode.
However, the on-chip device registers assigned to memory are accessed in big endian mode. Note
that the available access size (byte, word, or long word) differs in each register.

Note: The CPU instruction codes of this LSI must be stored in word units. In little endian mode,
the instruction code must be stored from lower byte to upper byte in this order from the
word boundary of the memory.

31 23 15 7 0
Byte position
in R0 [7:0] [15:8] [7:0] [31:24] [23:16] [15:8] [7:0]

Byte position
[7:0] [15:8] [7:0] [31:24] [23:16] [15:8] [7:0]
in memory
@(R1+3) @(R1+2) @(R1+1) @(R1+0) @(R1+3) @(R1+2) @(R1+1) @(R1+0) @(R1+3) @(R1+2) @(R1+1) @(R1+0)

(a) Byte access (b) Word access (c) Longword access


Example: MOV.B R0, @R1 Example: MOV.W R0, @R1 Example: MOV.L R0, @R1
(R1 = Address 4n) (R1 = Address 4n) (R1 = Address 4n)

Figure 2.8 Data Format on Memory (Little Endian Mode)

Rev. 3.00 Jan. 18, 2008 Page 53 of 1458


REJ09B0033-0300
Section 2 CPU

2.5 Features of CPU Core Instructions

2.5.1 Instruction Execution Method

(1) Instruction Length

All instructions have a fixed length of 16 bits and are executed in the sequential pipeline. In the
sequential pipeline, almost all instructions can be executed in one cycle. All data items are handles
in longword (32 bits). Memory can be accessed in byte, word, or longword. In this case, Memory
byte or word data is sign-extended and operated on as longword data. Immediate data is sign-
extended to longword size for arithmetic operations (MOV, ADD, and CMP/EQ instructions) or
zero-extended to longword size for logical operations (TST, AND, OR, and XOR instructions).

(2) Load/Store Architecture

Basic operations are executed between registers. In operations involving memory, data is first
loaded into a register (load/store architecture). However, bit manipulation instructions such as
AND are executed directly on memory.

(3) Delayed Branching

Unconditional branch instructions are executed as delayed branches. With a delayed branch
instruction, the branch is made after execution of the instruction (called the slot instruction)
immediately following the delayed branch instruction. This minimizes disruption of the pipeline
when a branch is made.

This LSI supports two types of conditional branch instructions: delayed branch instruction or
normal branch instruction.

Example: BRA TARGET


ADD R1, R0 ; ADD is executed before branching to
the TARGET

Rev. 3.00 Jan. 18, 2008 Page 54 of 1458


REJ09B0033-0300
Section 2 CPU

(4) T Bit

The result of a comparison is indicated by the T bit in the status register (SR), and a conditional
branch is performed according to whether the result is True or False. Processing speed has been
improved by keeping the number of instructions that modify the T bit to a minimum.

Example: ADD #1, R0 ; The T bit cannot be modified by the


ADD instruction
CMP/EQ #0, R0 ; The T bit is set to 1 if R0 is 0.
BT TARGET ; Branch to TARGET if the T bit is set
to 1 (R0=0).

(5) Literal Constant

Byte literal constant is placed inside the instruction code as immediate data. Since the instruction
length is fixed to 16 bits, word and longword literal constant is not placed inside the instruction
code, but in a table in memory. The table in memory is referenced with a MOV instruction using
PC-relative addressing mode with displacement.

Example: MOV.W @(disp, PC), R0

(6) Absolute Addresses

When data is referenced by absolute address, the absolute address value is placed in a table in
memory beforehand as well as word or longword literal constant. Using the method whereby
immediate data is loaded when an instruction is executed, this value is transferred to a register and
the data is referenced using register indirect addressing mode.

(7) 16-Bit/32-Bit Displacement

When data is referenced with a 16- or 32-bit displacement, the displacement value is placed in a
table in memory beforehand. Using the method whereby word or longword immediate data is
loaded when an instruction is executed, this value is transferred to a register and the data is
referenced using indexed register indirect addressing mode.

Rev. 3.00 Jan. 18, 2008 Page 55 of 1458


REJ09B0033-0300
Section 2 CPU

2.5.2 CPU Instruction Addressing Modes

The following table shows addressing modes and effective address calculation methods for
instructions executed by the CPU core.

Table 2.3 Addressing Modes and Effective Addresses for CPU Instructions

Addressing Instruction
Mode Format Effective Address Calculation Method Calculation Formula

Register Rn Effective address is register Rn. 


direct
(Operand is register Rn contents.)
Register @Rn Effective address is register Rn contents. Rn
indirect
Rn Rn

Register @Rn+ Effective address is register Rn contents. A Rn


indirect with constant is added to Rn after instruction
After instruction execution
post-increment execution: 1 for a byte operand, 2 for a word
operand, 4 for a longword operand. Byte: Rn + 1 → Rn

Rn Rn Word: Rn + 2 → Rn
Rn + 1/2/4
+
Longword: Rn + 4 → Rn

1/2/4

Register @–Rn Effective address is register Rn contents, Byte: Rn – 1 → Rn


indirect with decremented by a constant beforehand: 1 for a
Word: Rn – 2 → Rn
pre-decrement byte operand, 2 for a word operand, 4 for a
longword operand. Longword: Rn – 4 → Rn

Rn (Instruction executed with


Rn - 1/2/4 Rn after calculation)
- Rn - 1/2/4

1/2/4

Rev. 3.00 Jan. 18, 2008 Page 56 of 1458


REJ09B0033-0300
Section 2 CPU

Addressing Instruction
Mode Format Effective Address Calculation Method Calculation Formula

Register @(disp:4, Effective address is register Rn contents with 4-bit Byte: Rn + disp
indirect with Rn) displacement disp added. After disp is zero-
Word: Rn + disp × 2
displacement extended, it is multiplied by 1 (byte), 2 (word), or 4
(longword), according to the operand size. Longword: Rn + disp × 4

Rn

Rn
disp +
+ disp × 1/2/4
(zero-extended)
×

1/2/4

Indexed @(R0, Rn) Effective address is sum of register Rn Rn + R0


register indirect and R0 contents.
Rn

+ Rn + R0

R0

GBR indirect with @(disp:8, Effective address is register GBR contents with 8- Byte: GBR + disp
displacement GBR) bit displacement disp added. After disp is zero- Word: GBR + disp × 2
extended, it is multiplied by 1 (byte), 2 (word), or 4
(longword), according to the Longword:
operand size. GBR + disp × 4

GBR

disp GBR
+
(Zero-extended) + disp × 1/2/4
×

1/2/4

Indexed GBR @(R0, GBR) Effective address is sum of register GBR and R0 GBR + R0
indirect contents.
GBR

+ GBR + R0

R0

Rev. 3.00 Jan. 18, 2008 Page 57 of 1458


REJ09B0033-0300
Section 2 CPU

Addressing Instruction
Mode Format Effective Address Calculation Method Calculation Formula

PC-relative with @(disp:8, Effective address is PC with 8-bit displacement disp Word: PC + disp × 2
displacement PC) added. After disp is zero-extended, it is multiplied
Longword:
by 2 (word) or 4 (longword), according to the PC&H'FFFFFFFC
operand size. With a longword operand, the lower 2
+ disp × 4
bits of PC are masked.
PC

*
&

PC + disp × 2
H'FFFFFFFC or
+ PC &
disp H'FFFFFFFC
(zero-extended) + disp × 4
×

2/4 *: With longword operand

PC-relative disp:8 Effective address is PC with 8-bit displacement disp PC + disp × 2


added after being sign-extended and multiplied by
2.
PC

disp + PC + disp × 2
(sign-extended)

disp:12 Effective address is PC with 12-bit displacement PC + disp × 2


disp added after being sign-extended and multiplied
by 2
PC

disp + PC + disp × 2
(sign-extended)

Rn Effective address is sum of PC and Rn. PC + Rn


PC

+ PC + Rn

Rn

Rev. 3.00 Jan. 18, 2008 Page 58 of 1458


REJ09B0033-0300
Section 2 CPU

Addressing Instruction
Mode Format Effective Address Calculation Method Calculation Formula

Immediate #imm:8 8-bit immediate data imm of TST, AND, OR, or 


XOR instruction is zero-extended.
#imm:8 8-bit immediate data imm of MOV, ADD, or 
CMP/EQ instruction is sign-extended.
#imm:8 8-bit immediate data imm of TRAPA instruction is 
zero-extended and multiplied by 4.
Note: For addressing modes with displacement (disp) as shown below, the assembler description
in this manual indicates the value before it is scaled (x1, x2, or x4) according to the operand
size to clarify the LSI operation. For details on assembler description, refer to the
description rules in each assembler.
@ (disp:4, Rn) ; Register indirect with displacement
@ (disp:8, GBR) ; GBR indirect with displacement
@ (disp:8, PC) ; PC relative with displacement
disp:8, disp:12 ; PC relative

Rev. 3.00 Jan. 18, 2008 Page 59 of 1458


REJ09B0033-0300
Section 2 CPU

2.5.3 Instruction Formats

Table 2.4 shows the instruction formats, and the meaning of the source and destination operands,
for instructions executed by the CPU core. The meaning of the operands depends on the
instruction code. The following symbols are used in the table.

xxxx: Instruction code

mmmm: Source register

nnnn: Destination register

iiii: Immediate data

dddd: Displacement

Table 2.4 CPU Instruction Formats

Destination
Instruction Format Source Operand Operand Sample Instruction
0 type   NOP
15 0
xxxx xxxx xxxx xxxx

n type  nnnn: register MOVT Rn


15 0 direct
xxxx nnnn xxxx xxxx

Control register or nnnn: register STS MACH,Rn


system register direct
Control register or nnnn: pre- STC.L SR,@-Rn
system register decrement register
indirect
m type mmmm: register Control register or LDC Rm,SR
15 0 direct system register
xxxx mmmm xxxx xxxx

mmmm: post- Control register or LDC.L @Rm+,SR


increment register system register
indirect
mmmm: register  JMP @Rm
indirect
PC-relative using  BRAF Rm
Rm

Rev. 3.00 Jan. 18, 2008 Page 60 of 1458


REJ09B0033-0300
Section 2 CPU

Destination
Instruction Format Source Operand Operand Sample Instruction
nm type mmmm: register nnnn: register ADD Rm,Rn
15 0 direct direct
xxxx nnnn mmmm xxxx

mmmm: register nnnn: register MOV.L Rm,@Rn


indirect indirect
mmmm: post- MACH, MACL MAC.W @Rm+,@Rn+
increment register
indirect (multiply-
and-accumulate
operation)
nnnn: * post-
increment register
indirect (multiply-
and-accumulate
operation)
mmmm: post- nnnn: register MOV.L @Rm+,Rn
increment register direct
indirect
mmmm: register nnnn: pre- MOV.L Rm,@-Rn
direct decrement register
indirect
mmmm: register nnnn: indexed MOV.L Rm,@(R0,Rn)
direct register indirect
md type mmmmdddd: R0 (register direct) MOV.B @(disp,Rm),R0
15 0 register indirect
xxxx xxxx mmmm dddd with displacement
nd4 type R0 (register direct) nnnndddd: MOV.B R0,@(disp,Rn)
15 0 register indirect
xxxx xxxx nnnn dddd with displacement
nmd type mmmm: register nnnndddd: MOV.L Rm,@(disp,Rn)
15 0 direct register indirect
xxxx nnnn mmmm dddd with displacement
mmmmdddd: nnnn: register MOV.L @(disp,Rm),Rn
register indirect direct
with displacement

Rev. 3.00 Jan. 18, 2008 Page 61 of 1458


REJ09B0033-0300
Section 2 CPU

Destination
Instruction Format Source Operand Operand Sample Instruction
d type dddddddd: GBR R0 (register direct) MOV.L @(disp,GBR),R0
15 0 indirect with
xxxx xxxx dddd dddd displacement
R0 (register direct) dddddddd: GBR MOV.L R0,@(disp,GBR)
indirect with
displacement
dddddddd: R0 (register direct) MOVA @(disp,PC),R0
PC-relative with
displacement
dddddddd:  BF label
PC-relative
d12 type dddddddddddd:  BRA label
15 0 PC-relative (label=disp+PC)
xxxx dddd dddd dddd

nd8 type dddddddd: PC- nnnn: register MOV.L @(disp,PC),Rn


15 0 relative with direct
xxxx nnnn dddd dddd displacement
i type iiiiiiii: immediate Indexed GBR AND.B #imm,@(R0,GBR)
15 0 indirect
xxxx xxxx iiii iiii

iiiiiiii: immediate R0 (register direct) AND #imm,R0


iiiiiiii: immediate  TRAPA #imm
ni type iiiiiiii: immediate nnnn: register ADD #imm,Rn
15 0 direct
xxxx nnnn i i i i iiii

Note: * In multiply-and-accumulate instructions, nnnn is the source register.

Rev. 3.00 Jan. 18, 2008 Page 62 of 1458


REJ09B0033-0300
Section 2 CPU

2.6 Instruction Set

2.6.1 Instruction Set Based on Functions

Table 2.5 shows the instructions classified by function.

Table 2.5 CPU Instruction Types

Kinds of Number of
Type Instruction Op Code Function Instructions
Data transfer 5 MOV Data transfer 39
instructions MOVA Effective address transfer
MOVT T bit transfer
SWAP Upper/lower swap
XTRCT Extraction of middle of linked registers
Arithmetic 21 ADD Binary addition 33
operation ADDC Binary addition with carry
instructions
ADDV Binary addition with overflow check
CMP/cond Comparison
DIV1 Division
DIV0S Signed division initialization
DIV0U Unsigned division initialization
DMULS Signed double-precision multiplication
DMULU Unsigned double-precision multiplication
DT Decrement and test
EXTS Sign extension
EXTU Zero extension
MAC Multiply-and-accumulate, double-
precision multiply-and-accumulate
MUL Double-precision multiplication
(32 × 32 bits)

Rev. 3.00 Jan. 18, 2008 Page 63 of 1458


REJ09B0033-0300
Section 2 CPU

Kinds of Number of
Type Instruction Op Code Function Instructions
Arithmetic 21 MULS Signed multiplication (16 × 16 bits) 33
operation MULU Unsigned multiplication (16 × 16 bits)
instructions
NEG Sign inversion
NEGC Sign inversion with borrow
SUB Binary subtraction
SUBC Binary subtraction with borrow
SUBV Binary subtraction with underflow
Logic 6 AND Logical AND 14
operation NOT Bit inversion
instructions
OR Logical OR
TAS Memory test and bit setting
TST Logical AND and T bit setting
XOR Exclusive logical OR
Shift 12 ROTCL 1-bit left shift with T bit 16
instructions ROTCR 1-bit right shift with T bit
ROTL 1-bit left shift
ROTR 1-bit right shift
SHAD Arithmetic dynamic shift
SHAL Arithmetic 1-bit left shift
SHAR Arithmetic 1-bit right shift
SHLD Logical dynamic shift
SHLL Logical 1-bit left shift
SHLLn Logical n-bit left shift
SHLR Logical 1-bit right shift
SHLRn Logical n-bit right shift

Rev. 3.00 Jan. 18, 2008 Page 64 of 1458


REJ09B0033-0300
Section 2 CPU

Kinds of Number of
Type Instruction Op Code Function Instructions
Branch 9 BF Conditional branch, delayed conditional 11
instructions branch (T = 0)
BT Conditional branch, delayed conditional
branch (T = 1)
BRA Unconditional branch
BRAF Unconditional branch
BSR Branch to subroutine procedure
BSRF Branch to subroutine procedure
JMP Unconditional branch
JSR Branch to subroutine procedure
RTS Return from subroutine procedure
System 15 CLRMAC MAC register clear 75
control
CLRS S bit clear
instructions
CLRT T bit clear
LDC Load into control register
LDS Load into system register
LDTLB PTEH/PTEL load into TLB
NOP No operation
PREF Data prefetch to cache
RTE Return from exception handling
SETS S bit setting
SETT T bit setting
SLEEP Transition to power-down mode
STC Store from control register
STS Store from system register
TRAPA Trap exception handling
Total: 68 188

The instruction code, operation, and number of execution states of the CPU instructions are shown
in the following tables, classified by instruction type, using the format shown below.

Rev. 3.00 Jan. 18, 2008 Page 65 of 1458


REJ09B0033-0300
Section 2 CPU

Execution
Instruction Instruction Code Operation Privilege States T Bit
Indicated by mnemonic. Indicated in MSB ↔ Indicates summary of Indicates a Value Value of T
LSB order. operation. privileged when no bit after
instruction. wait states instruction
are is executed
inserted*1
Explanation of Symbols Explanation of Symbols Explanation of Symbols Explanation
of Symbols
OP.Sz SRC, DEST mmmm: Source register →, ←: Transfer direction
OP: Operation code : No
nnnn: Destination register (xx): Memory operand
Sz: Size change
0000: R0
SRC: Source M/Q/T: Flag bits in SR
0001: R1
DEST: Destination .........
&: Logical AND of each bit
Rm: Source register 1111: R15
|: Logical OR of each bit
Rn: Destination register iiii: Immediate data
^: Exclusive logical OR of
imm: Immediate data dddd: Displacement*2 each bit
disp: Displacement ~: Logical NOT of each bit
<<n: n-bit left shift
>>n: n-bit right shift

Notes: 1. The table shows the minimum number of execution states. In practice, the number of
instruction execution states will be increased in cases such as the following:
a. When there is a conflict between an instruction fetch and a data access
b. When the destination register of a load instruction (memory → register) is also
used by the following instruction
2. Scaled (x1, x2, or x4) according to the instruction operand size, etc.

Rev. 3.00 Jan. 18, 2008 Page 66 of 1458


REJ09B0033-0300
Section 2 CPU

Table 2.6 Data Transfer Instructions

Privileged
Instruction Instruction Code Operation Mode Cycles T Bit

MOV #imm,Rn 1110nnnniiiiiiii imm → Sign extension → Rn – 1 –


MOV.W @(disp,PC),Rn 1001nnnndddddddd (disp x 2+PC)→Sign – 1 –
extension → Rn
MOV.L @(disp,PC),Rn 1101nnnndddddddd (disp x 4+PC)→Rn – 1 –
MOV Rm,Rn 0110nnnnmmmm0011 Rm→Rn – 1 –
MOV.B Rm,@Rn 0010nnnnmmmm0000 Rm→(Rn) – 1 –
MOV.W Rm,@Rn 0010nnnnmmmm0001 Rm→(Rn) – 1 –
MOV.L Rm,@Rn 0010nnnnmmmm0010 Rm→(Rn) – 1 –
MOV.B @Rm,Rn 0110nnnnmmmm0000 (Rm)→Sign extension→Rn – 1 –
MOV.W @Rm,Rn 0110nnnnmmmm0001 (Rm)→Sign extension→Rn – 1 –
MOV.L @Rm,Rn 0110nnnnmmmm0010 (Rm)→Rn – 1 –
MOV.B Rm,@–Rn 0010nnnnmmmm0100 Rn–1→Rn, Rm→(Rn) – 1 –
MOV.W Rm,@–Rn 0010nnnnmmmm0101 Rn–2→Rn, Rm→(Rn) – 1 –
MOV.L Rm,@–Rn 0010nnnnmmmm0110 Rn–4→Rn, Rm→(Rn) – 1 –
MOV.B @Rm+,Rn 0110nnnnmmmm0100 (Rm)→Sign extension→Rn, – 1 –
Rm+1→Rm
MOV.W @Rm+,Rn 0110nnnnmmmm0101 (Rm)→Sign extension→Rn, – 1 –
Rm+2→Rm
MOV.L @Rm+,Rn 0110nnnnmmmm0110 (Rm)→Rn, Rm+4→Rm – 1 –
MOV.B R0,@(disp,Rn) 10000000nnnndddd R0→(disp+Rn) – 1 –
MOV.W R0,@(disp,Rn) 10000001nnnndddd R0→(disp x 2+Rn) – 1 –
MOV.L Rm,@(disp,Rn) 0001nnnnmmmmdddd Rm→(disp x 4+Rn) – 1 –
MOV.B @(disp,Rm),R0 10000100mmmmdddd (disp+Rm)→Sign – 1 –
extension→R0
MOV.W @(disp,Rm),R0 10000101mmmmdddd (disp x 2+Rm)→Sign – 1 –
extension→R0
MOV.L @(disp,Rm),Rn 0101nnnnmmmmdddd (disp x 4+Rm)→Rn – 1 –
MOV.B Rm,@(R0,Rn) 0000nnnnmmmm0100 Rm→(R0+Rn) – 1 –
MOV.W Rm,@(R0,Rn) 0000nnnnmmmm0101 Rm→(R0+Rn) – 1 –
MOV.L Rm,@(R0,Rn) 0000nnnnmmmm0110 Rm→(R0+Rn) – 1 –

Rev. 3.00 Jan. 18, 2008 Page 67 of 1458


REJ09B0033-0300
Section 2 CPU

Privileged
Instruction Instruction Code Operation Mode Cycles T Bit

MOV.B @(R0,Rm),Rn 0000nnnnmmmm1100 (R0+Rm)→Sign – 1 –


extension→Rn
MOV.W @(R0,Rm),Rn 0000nnnnmmmm1101 (R0+Rm)→Sign – 1 –
extension→Rn
MOV.L @(R0,Rm),Rn 0000nnnnmmmm1110 (R0+Rm)→Rn – 1 –
MOV.B R0,@(disp,GBR) 11000000dddddddd R0→(disp+GBR) – 1 –
MOV.W R0,@(disp,GBR) 11000001dddddddd R0→(disp x 2+GBR) – 1 –
MOV.L R0,@(disp,GBR) 11000010dddddddd R0→(disp x 4+GBR) – 1 –
MOV.B @(disp,GBR),R0 11000100dddddddd (disp+GBR)→Sign – 1 –
extension→R0
MOV.W @(disp,GBR),R0 11000101dddddddd (disp x 2+GBR)→Sign – 1 –
extension→R0
MOV.L @(disp,GBR),R0 11000110dddddddd (disp x 4+GBR)→R0 – 1 –
MOVA @(disp,PC),R0 11000111dddddddd disp x 4+PC→R0 – 1 –
MOVT Rn 0000nnnn00101001 T→Rn – 1 –
SWAP.B Rm,Rn 0110nnnnmmmm1000 Rm→Swap lowest two – 1 –
bytes→Rn
SWAP.W Rm,Rn 0110nnnnmmmm1001 Rm→Swap two – 1 –
consecutive words→Rn
XTRCT Rm,Rn 0010nnnnmmmm1101 Rm: Middle 32 bits of Rn – 1 –
→Rn

Rev. 3.00 Jan. 18, 2008 Page 68 of 1458


REJ09B0033-0300
Section 2 CPU

Table 2.7 Arithmetic Operation Instructions

Privileged
Instruction Instruction Code Operation Mode Cycles T Bit

ADD Rm,Rn 0011nnnnmmmm1100 Rn+Rm→Rn – 1 –


ADD #imm,Rn 0111nnnniiiiiiii Rn+imm→Rn – 1 –
ADDC Rm,Rn 0011nnnnmmmm1110 Rn+Rm+T→Rn, Carry→T – 1 Carry
ADDV Rm,Rn 0011nnnnmmmm1111 Rn+Rm→Rn, Overflow→T – 1 Overflow
CMP/EQ #imm,R0 10001000iiiiiiii If R0 = imm, 1 → T – 1 Comparison
result

CMP/EQ Rm,Rn 0011nnnnmmmm0000 If Rn = Rm, 1 → T – 1 Comparison


result

CMP/HS Rm,Rn 0011nnnnmmmm0010 If Rn ≥ Rm with unsigned data, – 1 Comparison


1→T result

CMP/GE Rm,Rn 0011nnnnmmmm0011 If Rn ≥ Rm with signed data, – 1 Comparison


1→T result

CMP/HI Rm,Rn 0011nnnnmmmm0110 If Rn > Rm with unsigned data, – 1 Comparison


1→T result

CMP/GT Rm,Rn 0011nnnnmmmm0111 If Rn > Rm with signed data, – 1 Comparison


1→T result

CMP/PL Rn 0100nnnn00010101 If Rn ≥ 0, 1 → T – 1 Comparison


result

CMP/PZ Rn 0100nnnn00010001 If Rn > 0, 1 → T – 1 Comparison


result

CMP/STR Rm,Rn 0010nnnnmmmm1100 If Rn and Rm have an – 1 Comparison


equivalent byte, 1 → T result

DIV1 Rm,Rn 0011nnnnmmmm0100 Single-step division (Rn/Rm) – 1 Calculatio


n result
DIV0S Rm,Rn 0010nnnnmmmm0111 MSB of Rn → Q, – 1 Calculatio
MSB of Rm → M, M ^ Q → T n result
DIV0U 0000000000011001 0 → M/Q/T – 1 0
DMULS.L Rm,Rn 0011nnnnmmmm1101 Signed operation of Rn × Rm – 2 (to –
→ MACH, 5)*
MACL 32 × 32 → 64 bits
DMULU.L Rm,Rn 0011nnnnmmmm0101 Unsigned operation of Rn × – 2 (to –
Rm → MACH, 5)*
MACL 32 × 32 → 64 bits
DT Rn 0100nnnn00010000 Rn – 1 → Rn, – 1 Comparison
if Rn = 0, 1 → T, else 0 → T result

Rev. 3.00 Jan. 18, 2008 Page 69 of 1458


REJ09B0033-0300
Section 2 CPU

Privileged
Instruction Instruction Code Operation Mode Cycles T Bit

EXTS.B Rm,Rn 0110nnnnmmmm1110 A byte in Rm is sign-extended – 1 –


→ Rn
EXTS.W Rm,Rn 0110nnnnmmmm1111 A word in Rm is sign-extended – 1 –
→ Rn
EXTU.B Rm,Rn 0110nnnnmmmm1100 A byte in Rm is zero-extended – 1 –
→ Rn
EXTU.W Rm,Rn 0110nnnnmmmm1101 A word in Rm is zero- – 1 –
extended → Rn
MAC.L @Rm+, 0000nnnnmmmm1111 Signed operation of (Rn) × – 2 (to 5)* –
@Rn+ (Rm) + MAC → MAC,
Rn + 4 → Rn, Rm + 4 → Rm
32 × 32 + 64 → 64 bits
MAC.W @Rm+, 0100nnnnmmmm1111 Signed operation of (Rn) × – 2 (to 5)* –
@Rn+ (Rm) + MAC → MAC,
Rn + 2 → Rn, Rm + 2 → Rm
16 × 16 + 64 → 64 bits
MUL.L Rm,Rn 0000nnnnmmmm0111 Rn × Rm → MACL – 2 (to 5) * –
32 × 32 → 32 bits
MULS.W Rm,Rn 0010nnnnmmmm1111 Signed operation of Rn × Rm – 1( to 3)* –
→ MACL
16 × 16 → 32 bits
MULU.W Rm,Rn 0010nnnnmmmm1110 Unsigned operation of – 1(to 3)* –
Rn × Rm → MACL
16 × 16 → 32 bits
NEG Rm,Rn 0110nnnnmmmm1011 0–Rm→Rn – 1 –
NEGC Rm,Rn 0110nnnnmmmm1010 0–Rm–T→Rn, Borrow→T – 1 Borrow
SUB Rm,Rn 0011nnnnmmmm1000 Rn–Rm→Rn – 1 –
SUBC Rm,Rn 0011nnnnmmmm1010 Rn–Rm–T→Rn, Borrow →T – 1 Borrow
SUBV Rm,Rn 0011nnnnmmmm1011 Rn–Rm→Rn, Underflow→T – 1 Underflow
Note: * The number of execution cycles indicated within the parentheses ( ) are required when
the operation result is read from the MACH/MACL register immediately after the
instruction.

Rev. 3.00 Jan. 18, 2008 Page 70 of 1458


REJ09B0033-0300
Section 2 CPU

Table 2.8 Logic Operation Instructions

Privileged
Instruction Instruction Code Operation Mode Cycles T Bit

AND Rm,Rn 0010nnnnmmmm1001 Rn & Rm → Rn – 1 –


AND #imm,R0 11001001iiiiiiii R0 & imm → R0 – 1 –
AND.B #imm,@(R0, 11001101iiiiiiii (R0+GBR) & imm → (R0+GBR) – 3 –
GBR)
NOT Rm,Rn 0110nnnnmmmm0111 ∼ Rm → Rn – 1 –
OR Rm,Rn 0010nnnnmmmm1011 Rn | Rm → Rn – 1 –
OR #imm,R0 11001011iiiiiiii R0 | imm → R0 – 1 –
OR.B #imm,@(R0, 11001111iiiiiiii (R0+GBR) | imm → (R0+GBR) – 3 –
GBR)
TAS.B @Rn 0100nnnn00011011 If (Rn) is 0, 1 → T; 1 → MSB of – 4 Test
(Rn) result
TST Rm,Rn 0010nnnnmmmm1000 Rn & Rm; if the result is 0, 1 → T – 1 Test
result
TST #imm,R0 11001000iiiiiiii R0 & imm; if the result is 0, 1 → – 1 Test
T result
TST.B #imm,@(R0, 11001100iiiiiiii (R0 + GBR) & imm; if the result – 3 Test
GBR) is 0, 1 → T result
XOR Rm,Rn 0010nnnnmmmm1010 Rn ^ Rm → Rn – 1 –
XOR #imm,R0 11001010iiiiiiii R0 ^ imm → R0 – 1 –
XOR.B #imm,@(R0, 11001110iiiiiiii (R0+GBR) ^ imm → (R0+GBR) – 3 –
GBR)

Rev. 3.00 Jan. 18, 2008 Page 71 of 1458


REJ09B0033-0300
Section 2 CPU

Table 2.9 Shift Instructions

Privileged
Instruction Instruction Code Operation Mode Cycles T Bit

ROTL Rn 0100nnnn00000100 T←Rn←MSB – 1 MSB


ROTR Rn 0100nnnn00000101 LSB→Rn→T – 1 LSB
ROTCL Rn 0100nnnn00100100 T←Rn←T – 1 MSB
ROTCR Rn 0100nnnn00100101 T→Rn→T – 1 LSB
SHAD Rm, Rn 0100nnnnmmmm1100 Rn ≥ 0: Rn << Rm → Rn – 1 –
Rn < 0: Rn >> Rm → [MSB → Rn]
SHAL Rn 0100nnnn00100000 T←Rn←0 – 1 MSB
SHAR Rn 0100nnnn00100001 MSB→Rn→T – 1 LSB
SHLD Rm, Rn 0100nnnnmmmm1101 Rm ≥ 0: Rn << Rm → Rn – 1 –
Rm < 0: Rn >> Rm → [0 → Rn]
SHLL Rn 0100nnnn00000000 T←Rn←0 – 1 MSB
SHLR Rn 0100nnnn00000001 0→Rn→T – 1 LSB
SHLL2 Rn 0100nnnn00001000 Rn<<2 → Rn – 1 –
SHLR2 Rn 0100nnnn00001001 Rn>>2 → Rn – 1 –
SHLL8 Rn 0100nnnn00011000 Rn<<8 → Rn – 1 –
SHLR8 Rn 0100nnnn00011001 Rn>>8 → Rn – 1 –
SHLL16 Rn 0100nnnn00101000 Rn<<16 → Rn – 1 –
SHLR16 Rn 0100nnnn00101001 Rn>>16 → Rn – 1 –

Rev. 3.00 Jan. 18, 2008 Page 72 of 1458


REJ09B0033-0300
Section 2 CPU

Table 2.10 Branch Instructions

Privilege Cycle
Instruction Instruction Code Operation d Mode s T Bit
BF disp 10001011dddddddd If T = 0, disp × 2 + PC → PC; – 3/1* –
if T = 1, nop
BF/S disp 10001111dddddddd Delayed branch, – 2/1* –
if T = 0, disp × 2 + PC → PC;
if T = 1, nop
BT disp 10001001dddddddd If T = 1, disp × 2 + PC → PC; – 3/1* –
if T = 0, nop
BT/S disp 10001101dddddddd Delayed branch, – 2/1* –
if T = 1, disp × 2 + PC → PC;
if T = 0, nop
BRA disp 1010dddddddddddd Delayed branch, disp × 2 + PC – 2 –
→ PC
BRAF Rm 0000mmmm00100011 Delayed branch,Rm + PC → PC – 2 –
BSR disp 1011dddddddddddd Delayed branch, PC → PR, disp – 2 –
× 2 + PC → PC
BSRF Rm 0000mmmm00000011 Delayed branch, PC → PR, Rm – 2 –
+ PC → PC
JMP @Rm 0100mmmm00101011 Delayed branch, Rm → PC – 2 –
JSR @Rm 0100mmmm00001011 Delayed branch, PC → PR, Rm – 2 –
→ PC
RTS 0000000000001011 Delayed branch, PR → PC – 2 –
Note: * One state when the branch is not executed.

Rev. 3.00 Jan. 18, 2008 Page 73 of 1458


REJ09B0033-0300
Section 2 CPU

Table 2.11 System Control Instructions

Privileged
Instruction Instruction Code Operation Mode Cycles T Bit

CLRMAC 0000000000101000 0→MACH,MACL – 1 –


CLRS 0000000001001000 0→S – 1 –
CLRT 0000000000001000 0→T – 1 0
LDC Rm,SR 0100mmmm00001110 Rm→SR √ 6 LSB
LDC Rm,GBR 0100mmmm00011110 Rm→GBR – 4 –
LDC Rm,VBR 0100mmmm00101110 Rm→VBR √ 4 –
LDC Rm,SSR 0100mmmm00111110 Rm→SSR √ 4 –
LDC Rm,SPC 0100mmmm01001110 Rm→SPC √ 4 –
LDC Rm,R0_BANK 0100mmmm10001110 Rm→R0_BANK √ 4 –
LDC Rm,R1_BANK 0100mmmm10011110 Rm→R1_BANK √ 4 –
LDC Rm,R2_BANK 0100mmmm10101110 Rm→R2_BANK √ 4 –
LDC Rm,R3_BANK 0100mmmm10111110 Rm→R3_BANK √ 4 –
LDC Rm,R4_BANK 0100mmmm11001110 Rm→R4_BANK √ 4 –
LDC Rm,R5_BANK 0100mmmm11011110 Rm→R5_BANK √ 4 –
LDC Rm,R6_BANK 0100mmmm11101110 Rm→R6_BANK √ 4 –
LDC Rm,R7_BANK 0100mmmm11111110 Rm→R7_BANK √ 4 –
LDC.L @Rm+,SR 0100mmmm00000111 (Rm)→SR, Rm+4→Rm √ 8 LSB
LDC.L @Rm+,GBR 0100mmmm00010111 (Rm)→GBR, Rm+4→Rm – 4 –
LDC.L @Rm+,VBR 0100mmmm00100111 (Rm)→VBR, Rm+4→Rm √ 4 –
LDC.L @Rm+,SSR 0100mmmm00110111 (Rm)→SSR,Rm+4→Rm √ 4 –
LDC.L @Rm+,SPC 0100mmmm01000111 (Rm)→SPC,Rm+4→Rm √ 4 –
LDC.L @Rm+, 0100mmmm10000111 (Rm)→R0_BANK,Rm+4→Rm √ 4 –
R0_BANK
LDC.L @Rm+, 0100mmmm10010111 (Rm)→R1_BANK,Rm+4→Rm √ 4 –
R1_BANK
LDC.L @Rm+, 0100mmmm10100111 (Rm)→R2_BANK,Rm+4→Rm √ 4 –
R2_BANK
LDC.L @Rm+, 0100mmmm10110111 (Rm)→R3_BANK, Rm+4→Rm √ 4 –
R3_BANK
LDC.L @Rm+, 0100mmmm11000111 (Rm)→R4_BANK, Rm+4→Rm √ 4 –
R4_BANK

Rev. 3.00 Jan. 18, 2008 Page 74 of 1458


REJ09B0033-0300
Section 2 CPU

Privileged
Instruction Instruction Code Operation Mode Cycles T Bit

LDC.L @Rm+, 0100mmmm11010111 (Rm)→R5_BANK, Rm+4→Rm √ 4 –


R5_BANK
LDC.L @Rm+, 0100mmmm11100111 (Rm)→R6_BANK, Rm+4→Rm √ 4 –
R6_BANK
LDC.L @Rm+, 0100mmmm11110111 (Rm)→R7_BANK, Rm+4→Rm √ 4 –
R7_BANK
LDS Rm,MACH 0100mmmm00001010 Rm→MACH – 1 –
LDS Rm,MACL 0100mmmm00011010 Rm→MACL – 1 –
LDS Rm,PR 0100mmmm00101010 Rm→PR – 1 –
LDS.L @Rm+,MACH 0100mmmm00000110 (Rm)→MACH, Rm+4→Rm – 1 –
LDS.L @Rm+,MACL 0100mmmm00010110 (Rm)→MACL, Rm+4→Rm – 1 –
LDS.L @Rm+,PR 0100mmmm00100110 (Rm)→PR, Rm+4→Rm – 1 –
LDTLB 0000000000111000 PTEH/PTEL→TLB √ 1 –
NOP 0000000000001001 No operation – 1 –
PREF @Rm 0000mmmm10000011 (Rm) → cache – 1 –
RTE 0000000000101011 Delayed branch, SSR → SR, √ 5 –
SPC → PC
SETS 0000000001011000 1→S – 1 –
SETT 0000000000011000 1→T – 1 1

1
SLEEP 0000000000011011 Sleep 4* –
STC SR,Rn 0000nnnn00000010 SR→Rn √ 1 –
STC GBR,Rn 0000nnnn00010010 GBR→Rn – 1 –
STC VBR,Rn 0000nnnn00100010 VBR→Rn √ 1 –
STC SSR, Rn 0000nnnn00110010 SSR→Rn √ 1 –
STC SPC,Rn 0000nnnn01000010 SPC→Rn √ 1 –
STC R0_BANK,Rn 0000nnnn10000010 R0_BANK→Rn √ 1 –
STC R1_BANK,Rn 0000nnnn10010010 R1_BANK→Rn √ 1 –
STC R2_BANK,Rn 0000nnnn10100010 R2_BANK→Rn √ 1 –
STC R3_BANK,Rn 0000nnnn10110010 R3_BANK→Rn √ 1 –
STC R4_BANK,Rn 0000nnnn11000010 R4_BANK→Rn √ 1 –
STC R5_BANK,Rn 0000nnnn11010010 R5_BANK→Rn √ 1 –
STC R6_BANK,Rn 0000nnnn11100010 R6_BANK→Rn √ 1 –

Rev. 3.00 Jan. 18, 2008 Page 75 of 1458


REJ09B0033-0300
Section 2 CPU

Instruction Privileged
Instruction Code Operation Mode Cycles T Bit

STC R7_BANK,Rn 0000nnnn11110010 R7_BANK→Rn √ 1 –


STC.L SR,@–Rn 0100nnnn00000011 Rn–4→Rn, SR→(Rn) √ 1 –
STC.L GBR,@–Rn 0100nnnn00010011 Rn–4→Rn, GBR→(Rn) – 1 –
STC.L VBR,@–Rn 0100nnnn00100011 Rn–4→Rn, VBR→(Rn) √ 1 –
STC.L SSR,@–Rn 0100nnnn00110011 Rn–4→Rn, SSR→(Rn) √ 1 –
STC.L SPC,@–Rn 0100nnnn01000011 Rn–4→Rn, SPC→(Rn) √ 1 –
STC.L R0_BANK,@–Rn 0100nnnn10000011 Rn–4→Rn, R0_BANK→(Rn) √ 1 –
STC.L R1_BANK,@–Rn 0100nnnn10010011 Rn–4→Rn, R1_BANK→(Rn) √ 1 –
STC.L R2_BANK,@–Rn 0100nnnn10100011 Rn–4→Rn, R2_BANK→(Rn) √ 1 –
STC.L R3_BANK,@–Rn 0100nnnn10110011 Rn–4→Rn, R3_BANK→(Rn) √ 1 –
STC.L R4_BANK,@–Rn 0100nnnn11000011 Rn–4→Rn, R4_BANK→(Rn) √ 1 –
STC.L R5_BANK,@–Rn 0100nnnn11010011 Rn–4→Rn, R5_BANK→(Rn) √ 1 –
STC.L R6_BANK,@–Rn 0100nnnn11100011 Rn–4→Rn, R6_BANK→(Rn) √ 1 –
STC.L R7_BANK,@–Rn 0100nnnn11110011 Rn–4→Rn, R7_BANK→(Rn) √ 1 –
STS MACH,Rn 0000nnnn00001010 MACH→Rn – 1 –
STS MACL,Rn 0000nnnn00011010 MACL→Rn – 1 –
STS PR,Rn 0000nnnn00101010 PR→Rn – 1 –
STS.L MACH,@–Rn 0100nnnn00000010 Rn–4→Rn, MACH→(Rn) – 1 –
STS.L MACL,@–Rn 0100nnnn00010010 Rn–4→Rn, MACL→(Rn) – 1 –
STS.L PR,@–Rn 0100nnnn00100010 Rn–4→Rn, PR→(Rn) – 1 –
TRAPA #imm 11000011iiiiiiii Unconditional trap exception – 8 –
2
occurs*
Notes: The table shows the minimum number of clocks required for execution. In practice, the
number of execution cycles will be increased in the following conditions.
a. If there is a conflict between an instruction fetch and a data access
b. If the destination register of a load instruction (memory → register) is also used by
the following instruction.
For addressing modes with displacement (disp) as shown below, the assembler
description in this manual indicates the value before it is scaled (x 1, x 2, or x 4)
according to the operand size to clarify the LSI operation. For details on assembler
description, refer to the description rules in each assembler.
@ (disp:4, Rn) ; Register indirect with displacement
@ (disp:8, GBR) ; GBR indirect with displacement
@ (disp:8, PC) ; PC relative with displacement
disp:8, disp:12 ; PC relative

Rev. 3.00 Jan. 18, 2008 Page 76 of 1458


REJ09B0033-0300
Section 2 CPU

1. Number of states before the chip enters the sleep state.


2. For details, refer to section 7, Exception Handling.

2.6.2 Operation Code Map

Table 2.12 shows the operation code map.

Table 2.12 Operation Code Map

Instruction Code Fx: 0000 Fx: 0001 Fx: 0010 Fx: 0011 to 1111

MSB LSB MD: 00 MD: 01 MD: 10 MD: 11

0000 Rn Fx 0000

0000 Rn Fx 0001

0000 Rn 00MD 0010 STC SR, Rn STC GBR, Rn STC VBR, Rn STC SSR, Rn

0000 Rn 01MD 0010 STC SPC, Rn

0000 Rn 10MD 0010 STC R0_BANK, Rn STC R1_BANK, Rn STC R2_BANK, Rn STC R3_BANK, Rn

0000 Rn 11MD 0010 STC R4_BANK, Rn STC R5_BANK, Rn STC R6_BANK, Rn STC R7_BANK, Rn

0000 Rm 00MD 0011 BSRF Rm BRA Rm

0000 Rm 10MD 0011 PREF @Rm

0000 Rn Rm 01MD MOV.B Rm, @(R0, Rn) MOV.W Rm, @(R0, Rn) MOV.L Rm,@(R0, Rn) MUL.L Rm, Rn

0000 0000 00MD 1000 CLRT SETT CLRMAC LDTLB

0000 0000 01MD 1000 CLRS SETS

0000 0000 Fx 1001 NOP DIV0U

0000 0000 Fx 1010

0000 0000 Fx 1011 RTS SLEEP RTE

0000 Rn Fx 1000

0000 Rn Fx 1001 MOVT Rn

0000 Rn Fx 1010 STS MACH, Rn STS MACL, Rn STS PR, Rn

0000 Rn Fx 1011

0000 Rn Rm 11MD MOV. B @(R0, Rm), Rn MOV.W @(R0, Rm), Rn MOV.L @(R0, Rm), Rn MAC.L @Rm+,@Rn+

0001 Rn Rm disp MOV.L Rm, @(disp:4, Rn)

0010 Rn Rm 00MD MOV.B Rm, @Rn MOV.W Rm, @Rn MOV.L Rm, @Rn

0010 Rn Rm 01MD MOV.B Rm, @–Rn MOV.W Rm, @–Rn MOV.L Rm, @–Rn DIV0S Rm, Rn

0010 Rn Rm 10MD TST Rm, Rn AND Rm, Rn XOR Rm, Rn OR Rm, Rn

Rev. 3.00 Jan. 18, 2008 Page 77 of 1458


REJ09B0033-0300
Section 2 CPU

Instruction Code Fx: 0000 Fx: 0001 Fx: 0010 Fx: 0011 to 1111

MSB LSB MD: 00 MD: 01 MD: 10 MD: 11

0010 Rn Rm 11MD CMP/STR Rm, Rn XTRCT Rm, Rn MULU.W Rm, Rn MULSW Rm, Rn

0011 Rn Rm 00MD CMP/EQ Rm, Rn CMP/HS Rm, Rn CMP/GE Rm, Rn

0011 Rn Rm 01MD DIV1 Rm, Rn DMULU.L Rm,Rn CMP/HI Rm, Rn CMP/GT Rm, Rn

0011 Rn Rm 10MD SUB Rm, Rn SUBC Rm, Rn SUBV Rm, Rn

0011 Rn Rm 11MD ADD Rm, Rn DMULS.L Rm,Rn ADDC Rm, Rn ADDV Rm, Rn

0100 Rn Fx 0000 SHLL Rn DT Rn SHAL Rn

0100 Rn Fx 0001 SHLR Rn CMP/PZ Rn SHAR Rn

0100 Rn Fx 0010 STS.L MACH, @–Rn STS.L MACL, @–Rn STS.L PR, @–Rn

0100 Rn 00MD 0011 STC.L SR, @–Rn STC.L GBR, @–Rn STC.L VBR, @–Rn STC.L SSR, @–Rn

0100 Rn 01MD 0011 STC.L SPC, @–Rn

0100 Rn 10MD 0011 STC.L STC.L STC.L STC.L

R0_BANK, @–Rn R1_BANK, @–Rn R2_BANK, @–Rn R3_BANK, @–Rn

0100 Rn 11MD 0011 STC.L STC.L STC.L STC.L

R4_BANK, @–Rn R5_BANK, @–Rn R6_BANK, @–Rn R7_BANK, @–Rn

0100 Rn Fx 0100 ROTL Rn ROTCL Rn

0100 Rn Fx 0101 ROTR Rn CMP/PL Rn ROTCR Rn

0100 Rm Fx 0110 LDS.L LDS.L @Rm+, MACL LDS.L @Rm+, PR

@Rm+, MACH

0100 Rm 00MD 0111 LDC.L @Rm+, SR LDC.L @Rm+, GBR LDC.L @Rm+, VBR LDC.L @Rm+, SSR

0100 Rm 01MD 0111 LDC.L @Rm+, SPC

0100 Rm 10MD 0111 LDC.L LDC.L LDC.L LDC.L

@Rm+, R0_BANK @Rm+, R1_BANK @Rm+, R2_BANK @Rm+, R3_BANK

0100 Rm 11MD 0111 LDC.L LDC.L LDC.L LDC.L

@Rm+, R4_BANK @Rm+, R5_BANK @Rm+, R6_BANK @Rm+, R7_BANK

0100 Rn Fx 1000 SHLL2 Rn SHLL8 Rn SHLL16 Rn

0100 Rn Fx 1001 SHLR2 Rn SHLR8 Rn SHLR16 Rn

0100 Rm Fx 1010 LDS Rm, MACH LDS Rm, MACL LDS Rm, PR

0100 Rm/ Fx 1011 JSR @Rm TAS.B @Rn JMP @Rm


Rn

0100 Rn Rm 1100 SHAD Rm, Rn

0100 Rn Rm 1101 SHLD Rm, Rn

Rev. 3.00 Jan. 18, 2008 Page 78 of 1458


REJ09B0033-0300
Section 2 CPU

Instruction Code Fx: 0000 Fx: 0001 Fx: 0010 Fx: 0011 to 1111

MSB LSB MD: 00 MD: 01 MD: 10 MD: 11

0100 Rm 00MD 1110 LDC Rm, SR LDC Rm, GBR LDC Rm, VBR LDC Rm, SSR

0100 Rm 01MD 1110 LDC Rm, SPC

0100 Rm 10MD 1110 LDC Rm, R0_BANK LDC Rm, R1_BANK LDC Rm, R2_BANK LDC Rm, R3_BANK

0100 Rm 11MD 1110 LDC Rm, R4_BANK LDC Rm, R5_BANK LDC Rm, R6_BANK LDC Rm, R7_BANK

0100 Rn Rm 1111 MAC.W @Rm+, @Rn+

0101 Rn Rm disp MOV.L @(disp:4, Rm), Rn

0110 Rn Rm 00MD MOV.B @Rm, Rn MOV.W @Rm, Rn MOV.L @Rm, Rn MOV Rm, Rn

0110 Rn Rm 01MD MOV.B @Rm+, Rn MOV.W @Rm+, Rn MOV.L @Rm+, Rn NOT Rm, Rn

0110 Rn Rm 10MD SWAP.B Rm, Rn SWAP.W Rm, Rn NEGC Rm, Rn NEG Rm, Rn

0110 Rn Rm 11MD EXTU.B Rm, Rn EXTU.W Rm, Rn EXTS.B Rm, Rn EXTS.W Rm, Rn

0111 Rn imm ADD # imm : 8, Rn

1000 00MD Rn disp MOV. B MOV. W

R0, @(disp: 4, Rn) R0, @(disp: 4, Rn)

1000 01MD Rm disp MOV.B MOV.W

@(disp:4, Rm), R0 @(disp: 4, Rm), R0

1000 10MD imm/disp CMP/EQ #imm:8, R0 BT disp: 8 BF disp: 8

1000 11MD imm/disp BT/S disp: 8 BF/S disp: 8

1001 Rn disp MOV.W @(disp : 8, PC), Rn

1010 disp BRA disp: 12

1011 disp BSR disp: 12

1100 00MD imm/disp MOV.B MOV.W MOV.L TRAPA #imm: 8

R0, @(disp: 8, GBR) R0, @(disp: 8, GBR) R0, @(disp: 8, GBR)

1100 01MD disp MOV.B MOV.W MOV.L MOVA

@(disp: 8, GBR), R0 @(disp: 8, GBR), R0 @(disp: 8, GBR), R0 @(disp: 8, PC), R0

1100 10MD imm TST #imm: 8, R0 AND #imm: 8, R0 XOR #imm: 8, R0 OR #imm: 8, R0

1100 11MD imm TST.B AND.B XOR.B OR.B

#imm: 8, @(R0, GBR) #imm: 8, @(R0, GBR) #imm: 8, @(R0, GBR) #imm: 8, @(R0, GBR)

1101 Rn disp MOV.L @(disp: 8, PC), Rn

1110 Rn imm MOV #imm:8, Rn

1111 ************

Note: For details, refer to the SH-3/SH-3H/SH3-DSP Software Manual.

Rev. 3.00 Jan. 18, 2008 Page 79 of 1458


REJ09B0033-0300
Section 2 CPU

Rev. 3.00 Jan. 18, 2008 Page 80 of 1458


REJ09B0033-0300
Section 3 DSP Operating Unit

Section 3 DSP Operating Unit

3.1 DSP Extended Functions


This LSI incorporates a DSP unit and X/Y memory directly connected to the DSP unit. This LSI
supports the DSP extended function instruction sets needed to control the DSP unit and X/Y
memory. The DSP extended function instructions are classified into four groups.

(1) Extended System Control Instructions for the CPU

If the DSP extended function is enabled, the following extended system control instructions can be
used for the CPU.

• Repeat loop control instructions and repeat loop control register access instructions are added.
Looped programs can be executed efficiently by using the zero-overhead repeat control unit.
For details, refer to section 3.3, CPU Extended Instructions.
• Modulo addressing control instructions and control register access instructions are added.
Function allows access to data with a circular structure. For details, refer to section 3.4, DSP
Data Transfer Instructions.
• DSP unit register access instructions are added. Some of the DSP unit registers can be used in
the same way as the CPU system registers. For details, refer to section 3.4, DSP Data Transfer
Instructions.

(2) Data Transfer Instructions for Data Transfers between DSP Unit and On-Chip X/Y
Memory

Data transfer instructions for data transfers between the DSP unit and on-chip X/Y memory are
called double-data transfer instructions. Instruction codes for these double-transfer instructions are
16 bit codes as well as CPU instruction codes. These data transfer instructions perform data
transfers between the DSP unit and on-chip X/Y memory that is directly connected to the DSP
unit. These data transfer instructions can be described in combination with other DSP unit
operation instructions. For details, refer to section 3.4, DSP Data Transfer Instructions.

(3) Data Transfer Instructions for Data Transfers between DSP Unit Registers and All
Virtual Address Spaces

Data transfer instructions for data transfers between DSP unit registers and all virtual address
spaces are called single-data transfer instructions. Instruction codes for the double-transfer
instructions are 16 bit codes as well as CPU instruction codes. These data transfer instructions

DSPS301S_010020030200 Rev. 3.00 Jan. 18, 2008 Page 81 of 1458


REJ09B0033-0300
Section 3 DSP Operating Unit

performs data transfers between the DSP unit registers and all virtual address spaces. For details,
refer to section 3.4, DSP Data Transfer Instructions.

(4) DSP Unit Operation Instructions

DSP unit operation instructions are called DSP data operation instructions. These instructions are
provided to execute digital signal processing operations at high speed using the DSP. Instruction
codes for these instructions are 32 bits. The DSP data operation instruction fields consist of two
fields: field A and field B. In field A, a function for double data transfer instructions can be
described. In field B, ALU operation instructions and multiply instructions can be described. The
instructions described in fields A and B can be executed in parallel. A maximum of four
instructions (ALU operation, multiply, and two data transfers) can be executed in parallel. For
details, refer to section 3.5, DSP Data Operation Instructions.

Notes: 1. 32-bit instruction codes are handled as two consecutive 16-bit instruction codes.
Accordingly, 32-bit instruction codes can be assigned to a word boundary. 32-bit
instruction codes must be stored in memory, upper word and lower word, in this order,
in word units.
2. In little endian, the upper and lower words must be stored in memory as data to be
accessed in word units.

15 12 11 0

0000
CPU core instruction
*
-

1110

15 10 9 0

Double-data transfer instruction 111100 A Field

15 10 9 0

Single-data transfer instruction 111101 A Field

31 26 25 16 15 0
DSP data operation instruction 111110 A Field B Field

Figure 3.1 DSP Instruction Format

Rev. 3.00 Jan. 18, 2008 Page 82 of 1458


REJ09B0033-0300
Section 3 DSP Operating Unit

3.2 DSP Mode Resources

3.2.1 Processing Modes

The CPU processing modes can be extended using the mode bit (MD) and DSP bit (DSP) in the
status register (SR), as shown below.

Table 3.1 CPU Processing Modes

Description
Access of Resources
Protected in Privileged Mode
or Privileged Instruction DSP Extended
MD DSP Processing Mode Execution Functions
0 0 User mode Prohibited Invalid
0 1 User DSP mode Prohibited Valid
1 0 Privileged mode Allowed Invalid
1 1 Privileged DSP mode Allowed Valid

As shown above, the extension of the DSP function by the DSP bit can be specified independently
of the control by the MD bit. Note, however, that the DSP bit can be modified only in privileged
mode. Before the DSP bit is modified, a transition to privileged mode or privileged DSP mode is
necessary.

3.2.2 DSP Mode Memory Map

In DSP mode, a part of the P2 area in the virtual address space can be accessed in user DSP mode.
When this area is accessed in user DSP mode, this area is referred to as a Uxy area. X/Y memory
is then assigned to this Uxy area. Accordingly, X/Y memory can also be accessed in user DSP
mode.

Rev. 3.00 Jan. 18, 2008 Page 83 of 1458


REJ09B0033-0300
Section 3 DSP Operating Unit

Table 3.2 Virtual Address Space

Address Range Name Protection Description


H'A5000000 to H'A5FFFFFF P2/Uxy Privileged or 16-Mbyte physical address space,
DSP non-cacheable, non-address
translatable
Can be accessed in privileged mode,
privileged DSP mode, and user DSP
mode

3.2.3 CPU Register Sets

In DSP mode, the status register (SR) in the CPU unit is extended to add control bits and three
control registers: a repeat start register (SR), repeat end register (RE), and modulo register (MOD)
are added as control registers.

31 30 29 28 27 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
Status Register
0 MD RB BL RC[11:0] 0 0 0 DSP DMY DMX M Q I3 I2 I1 I0 RF1 RF0 S T
(SR)
31 0
RS Repeat start register (RS)

31 0

RE Repeat end register (RE)

31 16 15 0

ME MS MODulo register (MOD)

Figure 3.2 CPU Registers in DSP Mode

Rev. 3.00 Jan. 18, 2008 Page 84 of 1458


REJ09B0033-0300
Section 3 DSP Operating Unit

(1) Extension of Status Register (SR)

In DSP mode, the following control bits are added to the status register (SR). These added bits are
called DSP extension bits. These DSP extension bits are valid only in DSP mode.

Initial
Bit Bit Name Value R/W Description
31 to 28    For details, refer to section 2, CPU.
27 to 16 RC11 to All 0 R/W Repeat Counter
RC0 Holds the number of repeat times in order to perform
loop control, and can be modified in privileged mode,
privileged DSP mode, or user DSP mode. At reset, this
bit is initialized to 0. This bit is not affected in the
exception handling state.
15 to 13    For details, refer to section 2, CPU.
12 DSP 0 R/W DSP Bit
Enables or disables the DSP extended functions. If
this bit is set to 1, the DSP extended functions are
enabled. This bit can be modified in privileged mode,
privileged DSP mode, or user DSP mode. At reset, this
bit is initialized to 0. This bit is not affected in the
exception handling state.
11 MDY 0 R/W Modulo Control Bits
10 MDX 0 R/W Enable or disable modulo addressing for X/Y memory
access. These bits can be modified in privileged mode,
privileged DSP mode, or user DSP mode. At reset,
these bits are initialized to 0. These bits are affected in
the exception handling state.
9 to 4    For details, refer to section 2, CPU.
3 FR1 0 R/W Repeat Flag Bits
2 FR0 0 R/W Used by repeat control instructions. These bits can be
modified in privileged mode, privileged DSP mode, or
user DSP mode. At reset, these bits are initialized to 0.
These bits are affected in the exception handling state.
1, 0    For details, refer to section 2, CPU.
Note: When data is written to the SR register, 0 should be written to bits that are specified as 0.

Rev. 3.00 Jan. 18, 2008 Page 85 of 1458


REJ09B0033-0300
Section 3 DSP Operating Unit

(2) Repeat Start Register (RS)

The repeat start register (RS) holds the start address of a loop repeat module that is controlled by
the repeat function. This register can be accessed in DSP mode. At reset, the initial value of this
register is undefined. This register is not affected in the exception handling state.

(3) Repeat End Register (RE)

The repeat end register (RE) holds the end address of a loop repeat module that is controlled by
the repeat function. This register can be accessed in DSP mode. At reset, this register is initialized
to 0. This register is not affected in the exception handling state.

(4) Modulo Register (MOD)

The modulo register stores the modulo end address and modulo start address for modulo
addressing in upper and lower 16 bits. The upper and lower 16 bits of the modulo register are
referred to as the ME register and MS register, respectively. This register can be accessed in DSP
mode. At reset, the initial value of this register is undefined. This register is not affected in the
exception handling state.

The above registers can be accessed by the control register load instruction (LDC) and store
instruction (STC). Note that the LDC and STC instructions for the RS, RE, and MOD registers can
be used only in privileged DSP mode and user DSP mode. The LDC and STC instruction for the
SR register can be executed only when the MD bit is set to 1 or in user DSP mode. Note, however,
that the LDC and STC instructions can modify only the RC11 to RC0, RF1 to RF0, DMX, and
DMY bits in the SR, as described below.

• In user mode, if the LCD and STC instructions are used for the RS, an illegal instruction
exception occurs.
• In privileged and privileged DSP modes, all SR bits can be modified.
• In user DSP mode, the SR can be read by the STC instruction.
• In user DSP mode, the LDC instruction can be issued to the SR but only the DSP extension
bits can be modified.

Rev. 3.00 Jan. 18, 2008 Page 86 of 1458


REJ09B0033-0300
Section 3 DSP Operating Unit

Table 3.3 Operation of SR Bits in Each Processing Mode

Access to
Privileged Privileged User DSP
DSP-Related
Mode User Mode DSP Mode Mode Bit with
MD = 1 & MD = 0 & MD = 1 & MD = 0 & Dedicated Initial Value
Field DSP = 0 DSP = 0 DSP = 1 DSP = 1 Instruction after Reset
MD S: OK, L: OK S, L: Invalid S: OK, L: OK S: OK, L: NG 1
instruction
RB S: OK, L: OK S, L: Invalid S: OK, L: OK S: OK, L: NG 1
instruction
BL S: OK, L: OK S, L: Invalid S: OK, L: OK S: OK, L: NG 1
instruction
RC [11:0] S: OK, L: OK S, L: Invalid S: OK, L: OK R: OK, L: OK SETRC 000000000000
instruction instruction
DSP S: OK, L: OK S, L: Invalid S: OK, L: OK S: OK, L: NG 0
instruction
DMY S: OK, L: OK S, L: Invalid S: OK, L: OK R: OK, L: OK 0
instruction
DMX S: OK, L: OK S, L: Invalid S: OK, L: OK R: OK, L: OK 0
instruction
Q S: OK, L: OK S, L: Invalid S: OK, L: OK S: OK, L: NG x
instruction
M S: OK, L: OK S, L: Invalid S: OK, L: OK S: OK, L: NG x
instruction
I[3:0] S: OK, L: OK S, L: Invalid S: OK, L: OK S: OK, L: NG 1111
instruction
RF[1:0] S: OK, L: OK S, L: Invalid S: OK, L: OK R: OK, L: OK SETRC x
instruction instruction
S S: OK, L: OK S, L: Invalid S: OK, L: OK S: OK, L: NG x
instruction
T S: OK, L: OK S, L: Invalid S: OK, L: OK S: OK, L: NG x
instruction
[Legend]
S: STC instruction
L: LDC instruction
OK: STC/LDC operation is enabled.
Invalid instruction: Exception occurs when an invalid instruction is executed.
NG: Previous value is retained. No change.
x: Undefined

Rev. 3.00 Jan. 18, 2008 Page 87 of 1458


REJ09B0033-0300
Section 3 DSP Operating Unit

Before entering the exception handling state, all bits including the DSP extension bits of the SR
registers are saved in the SSR. Before returning from the exception handling, all bits including the
DSP extension bits of the SR must be restored. If the repeat control must be recovered before
entering the exception handling state, the RS and RE registers must be recovered to the value that
existed before exception handling. In addition, if it is necessary to recover modulo control before
entering the exception handling state, the MOD register must be recovered to the value that
existed before exception handling.

3.2.4 DSP Registers

The DSP unit incorporates eight data registers (A0, A1, X0, X1, Y0, Y1, M0, and M1) and a status
register (DSR). Figure 3.3 shows the DSP register configuration. These are 32-bit width registers
with the exception of registers A0 and A1. Registers A0 and A1 include 8 guard bits (fields A0G
and A1G), giving them a total width of 40 bits. The DSR register stores the DSP data operation
result (zero, negative, others). The DSP register has a DC bit whose function is similar to the T bit
in the CPU register. For details on DSR bits, refer to section 3.5, DSP Data Operation Instructions.

39 32 31 0
A0G A0
A1G A1
M0
M1
Initial value
X0
DSR : All 0
X1 Others: Undefined
Y0
Y1

(a) DSP data registers

31 8 7 6 5 4 3 1 0
................ GT Z N V CS[2:0] DC

(b) DSP status register (DSR)

Figure 3.3 DSP Register Configuration

Rev. 3.00 Jan. 18, 2008 Page 88 of 1458


REJ09B0033-0300
Section 3 DSP Operating Unit

3.3 CPU Extended Instructions

3.3.1 DSP Repeat Control

In DSP mode, a specific function is provided to execute repeat loops efficiently. By using this
function, loop programs can be executed without overhead caused by the compare and branch
instructions.

(1) Examples of Repeat Loop Programs

Examples of repeat loop programs are shown below.

• Example 1: Repeat loop consisting of 4 or more instructions


LDRS RptStart ; Sets repeat start instruction address
to the RS register
LDRE RptDtct +4 ; Sets (repeat detection instruction
address + 4) to the RE register
SETRC #4 ; Sets the number of repetitions (4) to
the RC[11:0] bits of the SR register
Instr0 ; At least one instruction is required
from SETRC instruction to [Repeat start
instruction]
RptStart: instr1 ; [Repeat start instruction]
... ... ;
... ... ;
RptDtct: instr(N-3) ;Three instruction prior to the repeat
end instruction is regarded as repeat
detection instruction
RptEnd2: instr(N-2) ;
RptEnd1: instr(N-1) ;
RptEnd: instrN ; [Repeat end instruction]

In the above program example, instructions from the RptStart address (instr1 instruction) to the
RptEnd address (instrN instruction) are repeated four times. These repeated instructions in the
program are called repeat loop. The start and end instructions of the repeat loop are called the
repeat start instruction and repeat end instruction, respectively. The CPU sequentially executes
instructions and starts repeat loop control if the CPU detects the completion of a specific
instruction. This specific instruction is called the repeat detection instruction. In a repeat loop
consisting of four or more instructions, an instruction three instructions prior to the repeat end
instruction is regarded as the repeat detection instruction. In a repeat loop consisting of four or

Rev. 3.00 Jan. 18, 2008 Page 89 of 1458


REJ09B0033-0300
Section 3 DSP Operating Unit

more instructions, the same instruction is regarded as the RptStart instruction and RptDtct
instruction.

To control the repeat loop, the DSP extended control registers, such as the RE register and RS
register and the RC[11:0] and RF[1:0] bits of the SR register, are used. These registers can be
specified by the LDRE, LDRS, and SETRC instructions.

• Repeat end register (RE)


The RE register is specified by the LDRE instruction. The RE register specifies (repeat
detection instruction address +4). In a repeat loop consisting of four or more instructions, an
instruction three instructions prior to the repeat end instruction is regarded as the repeat
detection instruction. A repeat loop consisting of three or less instructions is described later.
• Repeat start register (RS)
The RE register is specified by the LDRS instruction. In a repeat loop consisting of 4 or more
instructions, the RS register specifies the repeat start instruction address. In a repeat loop
consisting of three or less instructions, a specific address is specified in the RS. This is
described later.
• Repeat counter (RC[11:0] bits of the SR)
The repeat counter is specifies the number of repetitions by the SETRC instruction. During
repeat loop execution, the RC holds the remaining number of repetitions.
• Repeat flags (RF[1:0] bits of the SR)
The repeat flags are automatically specified according to the RS and RE register values during
SETRC instruction execution. The repeat flags store information on the number of instructions
included in the repeat loop. Normally, the user cannot modify the repeat flag values.

The CPU always executes instructions by comparing the RE register to program counter values.
Because the PC stores (the current instruction address +4), if the RE matches the PC during repeat
instruction detection execution, a repeat detection instruction can be detected. If a repeat detection
instruction is executed without branching and if RC[11:0] > 0, then repeat control is performed. If
RC[11:0] ≥ 2 when the repeat end instruction is completed, the RC[11:0] is decremented by 1 and
then control is passed to the address specified by the RS register.

Examples 2 to 4 show program examples of the repeat loop consisting of three instructions, two
instructions, and one instruction, respectively. In these examples, an instruction immediately prior
to the repeat start instruction is regarded as a repeat detection instruction. The RS register specifies
the specific value that indicates the number of repeat instructions.

Rev. 3.00 Jan. 18, 2008 Page 90 of 1458


REJ09B0033-0300
Section 3 DSP Operating Unit

• Example 2: Repeat loop consisting of three instructions


LDRS RptDtct +4 ; Sets (repeat detection instruction
address + 4) to the RS register
LDRE RptDtct +4 ; Sets (repeat detection instruction
address + 4) to the RE register
SETRC #4 ; Sets the number of repetitions (4) to
the RC[11:0] bits of the SR register
; If RE-RS==0 during SETRC instruction
execution, the repeat loop is regarded
as three-instruction repeat.
RptDtct: instr0 ; An instruction prior to the Repeat
start instruction is regarded as a
repeat detection instruction.
RptStart: instr1 ; [Repeat start instruction]
Instr2 ;
RptEnd: instr3 ; [Repeat end instruction]

• Example 3: Repeat loop consisting of two instructions


LDRS RptDtct +6; Sets (repeat detection instruction
address + 6) to the RS register
LDRE RptDtct +4 ; Sets (repeat detection instruction
address + 4) to the RE register
SETRC #4 ; Sets the number of repetitions (4) to
the RC[11:0] bits of the SR register
; If RE-RS==-2 during SETRC instruction
execution, the repeat loop is regarded
as two-instruction repeat.
RptDtct: instr0 ; An instruction prior to the Repeat
start instruction is regarded as a
repeat detection instruction.
RptStart: instr1 ; [Repeat start instruction]
RptEnd: instr2 ; [Repeat end instruction]

Rev. 3.00 Jan. 18, 2008 Page 91 of 1458


REJ09B0033-0300
Section 3 DSP Operating Unit

• Example 4: Repeat loop consisting of one instruction


LDRS RptDtct +8; Sets (repeat detection instruction
address + 8) to the RS register
LDRE RptDtct +4 ; Sets (repeat detection instruction
address + 4) to the RE register
SETRC #4 ; Sets the number of repetitions (4) to
the RC[11:0] bits of the SR register
; If RE-RS==-4 during SETRC instruction
execution, the repeat loop is regarded
as one-instruction repeat.
RptDtct: instr0 ; An instruction prior to the Repeat
start instruction is regarded as a
repeat detection instruction.
RptStart:
RptEnd: instr1 ; [Repeat start instruction]==[Repeat end
instruction]

In repeat loops consisting of three instructions, two instructions and one instruction, specific
addresses are specified in the RS register. RE – RS is calculated during SETRC instruction
execution, and the number of instructions included in the repeat loop is determined according to
the result. A value of 0, –2,and –4 in the result correspond to three instructions, two instructions,
and one instruction, respectively.

If repeat instruction execution is completed without branching and if RC[11:0] > 0, an instruction
following the repeat detection instruction is regarded as a repeat start instruction and instruction
execution is repeated for the number of times corresponding to the recognized number of
instructions. If RC[11:0] ≥ 2 when the repeat end instruction is completed, the RC[11:0] is
decremented by 1 and then control is passed to the address specified by the RS register. If
RC[11:0] ==1 (or 0) when the repeat end instruction is completed, the RC[11:0] is cleared to 0 and
then the control is passed to the next instruction following the repeat end instruction.

Note: If RE – RS is a positive value, the CPU regards the repeat loop as a four-instruction repeat
loop. (In a repeat loop consisting of four or more instructions, RE – RS is always a
positive value. For details, refer to example 1 above.) If RE – RS is positive, or a value
other than 0, –2,and –4, correct operation cannot be guaranteed.

Rev. 3.00 Jan. 18, 2008 Page 92 of 1458


REJ09B0033-0300
Section 3 DSP Operating Unit

Table 3.4 shows the addresses to be specified in the repeat start register (RS) and repeat end
register (RE).

Table 3.4 RS and RE Setting Rule

Number of Instructions in Repeat Loop


1 2 3 ≥4
RS RptStart0 + 8 RptStart0 + 6 RptStart0 + 4 RptStart
RE RptStart0 + 4 RptStart0 + 4 RptStart0 + 4 RptEnd3 + 4
Note: The terms used above in table 3.2, are defined as follows.
RptStart: Address of the repeat start instruction
RptStart0: Address of the instruction one instruction prior to the repeat start instruction
RptEnd3: Address of the instruction three instructions prior to the repeat end instruction

(2) Repeat Control Instructions and Repeat Control Macros

To describe a repeat loop, the RS and RE registers must be specified appropriately by the LDRS
and LDRS instructions and then the number of repetitions must be specified by the SERTC
instruction. An 8-bit immediate data or a general register can be used as an operand of the SETRC
instruction. To specify the RC as a value greater than 256, use SETRC Rm type instructions.

Table 3.5 Repeat Control Instructions

Number of
Instruction Operation Execution States
LDRS @(disp,PC) Calculates (disp x 2 + PC) and stores the result to the 1
RS register
LDRE @(disp,PC) Calculates (disp x 2 + PC) and stores the result to the 1
RE register
SETRC #imm Sets 8-bit immediate data imm to the RC[11:0] bits of 1
the SR register and sets the information related to the
number of repetitions to the RF[1:0] bits of the SR.
RC[11:0] can be specified as 0 to 255.
SETRC Rm Sets the[11:0] bits of the Rm register to the RC[11:0] 1
bits of the SR register and sets the information related
to the number of repetitions to the RF[1:0] bits of the
SR.
RC[11:0] can be specified as 0 to 4095.

Rev. 3.00 Jan. 18, 2008 Page 93 of 1458


REJ09B0033-0300
Section 3 DSP Operating Unit

The RS and RE registers must be specified appropriately according to the rules shown in table 3.4.
The SH assembler supports control macros (REPEAT) as shown in table 3.6 to solve problems.

Table 3.6 Repeat Control Macros

Number of
Instruction Operation Execution States
REPEAT RptStart, Specifies RptStart as repeat start instruction, RptEnd as 3
RptEnd, #imm repeat end instruction, and 8-bit immediate data #imm
as number of repetitions. This macro is extended to
three instructions: LDRS, LDRE, and SETRC which are
converted correctly.
REPEAT RptStart, Specifies RptStart as repeat start instruction, RptEnd as 3
RptEnd, Rm repeat end instruction, and the [11:0] bits of Rm as
number of repetitions. This macro is extended to three
instructions: LDRS, LDRE, and SETRC which are
converted correctly.

Using the repeat macros shown in table 3.4, examples 1 to 4 shown above can be simplified to
examples 5 to 8 as shown below.

• Example 5: Repeat loop consisting of 4 or more instructions (extended to the instruction


stream shown in example 1, above)
REPEAT RptStart, RptEnd, #4
Instr0 ;
RptStart: instr1 ; [Repeat start instruction]
... ... ;
... ... ;
instr(N-3) ;
instr(N-2) ;
instr(N-1) ;
Rptend: instrN ; [Repeat end instruction]

Rev. 3.00 Jan. 18, 2008 Page 94 of 1458


REJ09B0033-0300
Section 3 DSP Operating Unit

• Example 6: Repeat loop consisting of three instructions (extended to the instruction stream
shown in example 2, above)
REPEAT RptStart, RptEnd, #4
instr0 ;
RptStart: instr1 ; [Repeat start instruction]
instr2 ;
RptEnd: instr3 ; [Repeat end instruction]

• Example 7: Repeat loop consisting of two instructions (extended to the instruction stream
shown in example 3, above)
REPEAT RptStart, RptEnd, #4
instr0 ;
RptStart: instr1 ; [Repeat start instruction]
RptEnd: instr2 ; [Repeat end instruction]

• Example 8: Repeat loop consisting of one instruction instructions (extended to the instruction
stream shown in example 4, above)
REPEAT RptStart, RptEnd, #4
instr0 ;
RptStart:
RptEnd: instr1 ; [Repeat start instruction]==[Repeat end
instruction]

In the DSP mode, the system control instructions (LDC and STC) that handle the RS and RE
registers are extended. The RC[11:0] bits and RF[1:0] bits of the SR can be controlled by the LDC
and STC instructions for the SR register. These instructions should be used if an exception is
enabled during repeat loop execution. The repeat loop can be resumed correctly by storing the RS
and RE register values and RC[11:0] bits and RF[1:0] bits of the SR register before exception
handling and by restoring the stored values after exception handling. However, note that there are
some restrictions on exception acceptance during repeat loop execution. For details refer to
Restrictions on Repeat Loop Control in section 3.3.1, DSP Repeat Control and section 7,
Exception Handling.

Rev. 3.00 Jan. 18, 2008 Page 95 of 1458


REJ09B0033-0300
Section 3 DSP Operating Unit

Table 3.7 DSP Mode Extended System Control Instructions

Number of
Instruction Operation Execution States
STC RS, Rn RS→Rn 1
STC RE, Rn RE→Rn 1
STC.L RS, @-Rn Rn-4→Rn, RS→(Rn) 1
STC.L RE, @-Rn Rn-4→Rn, RE→(Rn) 1
LDC.L @Rn+, RS (Rn)→RS, Rn+4→Rn 4
LDC.L @Rn+, RE (Rn)→RE, Rn+4→Rn 4
LDC Rn,RS Rn →RS 4
LDC Rn, RE Rn→RE 4

(3) Restrictions on Repeat Loop Control

(a) Repeat control instruction assignment

The SETRC instruction must be executed after executing the LDRS and LDRE instructions. In
addition, note that at least one instruction is required between the SETRC instruction and a repeat
start instruction.

(b) Illegal instruction one or more instructions following the repeat detection instruction

If one of the following instructions is executed between an instruction following a repeat detection
instruction to a repeat end instruction, an illegal instruction exception occurs.

• Branch instructions
BRA, BSR, BT, BF, BT/S, BF/S, BSRF, RTS, BRAF, RTE, JSR, JMP, TRAPA
• Repeat control instructions
SETRC, LDRS, LDRE
• Load instructions for SR, RS, and RE registers
LDC Rn,SR, LDC @Rn+,SR, LDC Rn,RE, LDC @Rn+,RE, LDC Rn,RS, LDC @Rn+,RS

Note: This restriction applies to all instructions for a repeat loop consisting of one to three
instructions and to three instructions including a repeat end instruction.

Rev. 3.00 Jan. 18, 2008 Page 96 of 1458


REJ09B0033-0300
Section 3 DSP Operating Unit

(c) Instructions prohibited during repeat loop (In a repeat loop consisting of four or more
instructions)

The following instructions must not be placed between the repeat start instruction and repeat
detection instruction in a repeat loop consisting of four or more instructions. Otherwise, the
correct operation cannot be guaranteed.
• Repeat control instructions
SETRC, LDRS, LDRE
• Load instructions for SR, RS, and RE registers
LDC Rn,SR, LDC @Rn+,SR, LDC Rn,RE, LDC @Rn+,RE, LDC Rn,RS, LDC @Rn+,RS

Note: Multiple repeat loops cannot be guaranteed. Describe the inner loop by repeat control
instructions, and the external loop by other instructions such as DT or BF/S.

(d) Branching to an instruction following the repeat detection instruction and restriction
on an exception acceptance

Execution of a repeat detection instruction must be completed without any branch so that the CPU
can recognize the repeat loop. Therefore, when the execution branches to an instruction following
the repeat detection instruction, the control will not be passed to a repeat start instruction after
executing a repeat end instruction because the repeat loop is not recognized by the CPU. In this
case, the RC[11:0] bits of the SR register will not be changed.

• If a conditional branch instruction is used in the repeat loop, an instruction before a repeat
detection instruction must be specified as a branch destination.
• If a subroutine call is used in the repeat loop, a delayed slot instruction of the subroutine call
instruction must be placed before a repeat detection instruction.

Here, a branch includes a return from an exception processing routine. If an exception whose
return address is placed in an instruction following the repeat detection instruction occurs, the
repeat control cannot be returned correctly. Accordingly, an exception acceptance is restricted
from the repeat detection instruction to the repeat end instruction. Exceptions such as interrupts
that can be retained by the CPU are retained. For exceptions that cannot be retained by the CPU, a
transition to an exception occurs but a program cannot be returned to the previous execution state
correctly. For details, refer to section 7, Exception Handling.

Rev. 3.00 Jan. 18, 2008 Page 97 of 1458


REJ09B0033-0300
Section 3 DSP Operating Unit

Notes: 1. If a TRAPA instruction is used as a repeat detection instruction, an instruction


following the repeat detection instruction is regarded as a return address. In this case, a
control cannot be returned to the repeat control correctly. In a TRAPA instruction, an
address of an instruction following the repeat detection address is regarded as return
address. Accordingly, to return to the repeat control correctly, place a return address
prior to the repeat detection instruction.
2. If a SLEEP instruction is placed following a repeat detection instruction, a transition to
the low-power consumption state or an exception acceptance such as interrupts can be
performed correctly. In this case, however, the repeat control cannot be returned
correctly. To return to the repeat control correctly, the SLEEP instruction must be
placed prior to the repeat detection instruction.

(e) Branch from a repeat detection instruction

If a repeat detection instruction is a delayed slot instruction of a delayed branch instruction or a


branch instruction, a repeat loop can be acknowledged when a branch does not occur in a
branch instruction. If a branch occurs in a branch instruction, a repeat control is not performed
and a branch destination instruction is executed.
(f) Program counter during repeat control

If RC[11:0] ≥ 2, the program counter (PC) value is not correct for instructions two instructions
following a repeat detection instruction. In a repeat loop consisting of one to three instructions,
the PC indicates the correct value (instruction address + 4) for an instruction (repeat start
instruction) following a repeat detect ion instruction but the PC continues to indicate the same
address (repeat start instruction address) from the subsequent instruction to a repeat end
instruction. In a repeat loop consisting of four or more instructions, the PC indicates the correct
value (instruction address + 4) for an instruction following a repeat detect ion instruction, but
PC indicates the RS and (RS +2) for instructions two and three instructions following the
repeat detection instruction. Here, RS indicates the value stored in the repeat start register
(RS). The correct operation cannot be guaranteed for the incorrect PC values.
Accordingly, PC relative addressing instructions placed two or more instructions following the
repeat detection instruction cannot be executed correctly and the correct results cannot be
obtained.

Rev. 3.00 Jan. 18, 2008 Page 98 of 1458


REJ09B0033-0300
Section 3 DSP Operating Unit

• PC relative addressing instructions


MOV.A @(disp, PC), Rn
MOV.W @(disp, PC), Rn
MOV.L @(disp, PC), Rn
(Including the case when the MOV #imm,Rn is extended to MOV.W @(disp, PC), Rn or
MOV.L @(disp, PC), Rn)

Table 3.8 PC Value during Repeat Control (When RC[11:0] ≥ 2)

Number of Instructions in Repeat Loop


1 2 3 ≥4
RptDtct RptDtct + 4 RptDtct + 4 RptDtct + 4 RptDtct +4
RptDtct1 RptDtct1 + 4 RptDtct1+ 4 RptDtct1 + 4 RptDtct1 + 4
RptDtct2 ― RptDtct1+ 4 RptDtct1 + 4 RS
RptDtct3 ― ― RptDtct1 + 4 RS + 2
Note: In table 3.8, the following labels are used.
RptDtct: An address of the repeat detection instruction
RptDtct1: An address of the instruction one instruction following the repeat start
instruction (In a repeat loop consisting of one to three instructions, RptStart is
a repeat start instruction)
RptDtct2: An address of the instruction two instruction following the repeat start
instruction
RptDtct3: An address of the instruction three instruction following the repeat start
instruction

(g) Repeat counter and repeat control

The CPU always executes a program with comparing the repeat end register (RE) and the program
counter (PC). If the PC matches the RE while the RC[11:0] bits of the SR register are other than 0,
the repeat control function is initiated.

• If RC ≥ 2, a control is passed to a repeat start instruction after a repeat end instruction has been
executed. The RC is decremented by 1 at the completion of the repeat end instruction.
In this case, restrictions (1) to (6) are also applied.
• If RC == 1, the RC is decremented to 0 at the completion of the repeat end instruction and a
control is passed to the subsequent instruction. In this case, restrictions (1) to (6) are also
applied.
• If RC == 0, the repeat control function is not initiated even if a repeat detection instruction is
executed. The repeat loop is executed once as normal instructions and a control is not be
passed to a repeat start instruction even if a repeat end instruction is executed.

Rev. 3.00 Jan. 18, 2008 Page 99 of 1458


REJ09B0033-0300
Section 3 DSP Operating Unit

3.4 DSP Data Transfer Instructions


In DSP mode, data transfer instructions are added for the DSP unit registers. The newly added
instructions are classified into the following three groups.

1. Double data transfer instructions


The DSP unit is connected to the X memory and Y memory via the specific buses called X bus
and Y bus. By using the data transfer instructions using the X and Y buses, two data items can
be transferred between the DSP unit and X/Y memories simultaneously. These instructions are
called double data transfer instructions. These double data transfer instructions can be
described in combination with the DSP operation instructions to execute data transfer and data
operation in parallel,
2. Single data transfer instructions
The DSP unit is also connected to the L bus that is used by the CPU. The DSP registers other
than the DSR can access any virtual addresses generated by the CPU. In this case, the single
data transfer instructions are used. The single data transfer instructions cannot be used in
combination with the DSP operation instructions and can access only one data item at a time.
3. System control instructions
Some of the DSP unit registers are handled as the CPU system registers. To control these
system registers, the system control registers are supported. The DSP registers are connected to
the CPU general registers via the data transfer bus (C bus).

In any DSP data transfer instructions, an address to be accessed is generated and output by the
CPU. For DSP data transfer instructions, some of the CPU general registers are used for address
generation and specific addressing modes are used.

Rev. 3.00 Jan. 18, 2008 Page 100 of 1458


REJ09B0033-0300
Section 3 DSP Operating Unit

LAB
CPU [31:0]

LDB
XAB YAB CDB [31:0]
[15:0] [15:0] [31:0]

DSP unit DSR


A0G
XDB A0
[15:0]
X memory A1G
A1
YDB
[15:0] M0
Y memory
M1
X0
X1
Y0
Y1

Legend
XAB : X bus (address)
XDB : X bus (data)
YAB : Y bus (address)
YDB : Y bus (data)
LAB : L bus (address)
LDB : L bus (data)
CDB : C bus (data)

Figure 3.4 DSP Registers and Bus Connections

(1) Double data transfer instructions (MOVX.W, MOVY.W)

With double data transfer instructions, X memory and Y memory can be accessed in parallel.

In this case, the specific buses called X bus and Y bus are used to access X memory and Y
memory, respectively. To fetch the CPU instructions, the L bus is used. Accordingly, no conflict
occurs among X, Y, and L buses.

Load instructions for X memory specify the X0 or X1 register as the destination operand. Load
instructions for Y memory specify the Y0 or Y1 register as the destination operand. Store registers
for X or Y memory specify the A0 or A1 register as the source operand. These instructions use
only word data (16 bits). When a word data transfer instruction is executed, the upper word of
register operand is used. To load word data, data is loaded to the upper word of the destination
register and the lower word of the destination register is automatically cleared to 0.

Rev. 3.00 Jan. 18, 2008 Page 101 of 1458


REJ09B0033-0300
Section 3 DSP Operating Unit

Double data transfer instructions can be described in parallel to the DSP operation instructions.
Even if a conditional operation instruction is specified in parallel to a double data transfer
instruction, the specified condition does not affect the data transfer operations. For details, refer to
section 3.5, DSP Data Operation Instructions.

Double data transfer instructions can access only the X memory or Y memory and cannot access
other memory space. The X bus and Y bus are 16 bits and support 64-byte address spaces
corresponding to address areas H'A5000000 to H'A500FFFF and H'A5010000 to H'A501FFFF,
respectively. Because these areas are included in the P2/Uxy area, they are not affected by the
cache and address translation unit.

(2) Single data transfer instructions

The single data transfer instructions access any memory location. All DSP registers other than the
DSR can be specified as source and destination operands.* Guard bit registers A0G and A1G can
also be specified as two independent registers. Because these instructions use the L bus (LAB and
LDB), these instructions can access any virtual space handled by the CPU. If these instructions
access the cacheable area while the cache is enabled, the area accessed by these instructions are
cached. The X memory and Y memory are mapped to the virtual address space and can also be
accessed by the single data transfer instructions. In this case, bus conflict may occur between data
transfer and instruction fetch because the CPU also uses the L bus for instruction fetches.

The single data transfer instructions can handle both word and longword data. In word data
transfer, only the upper word of the operand register is valid. In word data load, word data is
loaded into the upper word of the destination registers and the lower word of the destination is
automatically cleared to 0. If the guard bits are supported, the sign bit is extended before storage.
In longword data load, longword data is loaded into the upper and lower word of the destination
register. If the guard bits are supported, the sign bit is extended before storage. When the guard
register is stored, the sign bit is extended to the upper 24 bits of the LDB and are loaded onto the
LDB bus.

Notes: * Since the DSR register is defined as the system register, it can be accessed by the LDS
or STS instruction.
1. Any data transfer instruction is executed at the MA stage of the pipeline.
2. Any data transfer instruction does not modify the condition code bits of the DSR
register.

Rev. 3.00 Jan. 18, 2008 Page 102 of 1458


REJ09B0033-0300
Section 3 DSP Operating Unit

(3) System control instructions

The DSR, A0, X0, X1, Y0, and Y1 registers in the DSP unit can also be used as the CPU system
registers. Accordingly, data transfer operations between these DSP system registers and general
registers or memory can be executed by the STS and LDS instructions. These DSP system
registers can be treated as the CPU system register such as PR, MACH and MACL and can use the
same addressing modes.

Table 3.9 Extended System Control Instructions in DSP Mode

Instruction Operation Execution States


STS DSR,Rn DSR → Rn 1
STS A0,Rn A0 → Rn 1
STS X0,Rn X0 → Rn 1
STS X1,Rn X1 → Rn 1
STS Y0,Rn Y0 → Rn 1
STS Y1,Rn Y1 → Rn 1
STS.L DSR,@-Rn Rn – 4 → Rn, DSR → (Rn) 1
STS.L A0,@-Rn Rn – 4 → Rn, A0 → (Rn) 1
STS.L X0,@-Rn Rn – 4 → Rn, X0 → (Rn) 1
STS.L X1,@-Rn Rn – 4 → Rn, X1 → (Rn) 1
STS.L Y0,@-Rn Rn – 4 → Rn, Y0 → (Rn) 1
STS.L Y1,@-Rn Rn – 4 → Rn, Y1 → (Rn) 1
LDS.L @Rn+,DSR (Rn) → DSR, Rn + 4 → Rn 1
LDS.L @Rn+,A0 (Rn) → A0, Rn + 4 → Rn 1
LDS.L @Rn+,X0 (Rn) → X0, Rn + 4 → Rn 1
LDS.L @Rn+,X1 (Rn) → X1, Rn + 4 → Rn 1
LDS.L @Rn+,Y0 (Rn) → Y0, Rn + 4 → Rn 1
LDS.L @Rn+,Y1 (Rn) → Y1, Rn + 4 → Rn 1
LDS Rn,DSR Rn → DSR 1
LDS Rn,A0 Rn → A0 1
LDS Rn,X0 Rn → X0 1
LDS Rn,X1 Rn → X1 1
LDS Rn,Y0 Rn → Y0 1
LDS Rn,Y1 Rn → Y1 1

Rev. 3.00 Jan. 18, 2008 Page 103 of 1458


REJ09B0033-0300
Section 3 DSP Operating Unit

3.4.1 General Registers

The DSP instructions 10 general registers in the 16 general registers are used as address pointers
or index registers for double data transfers and single data transfers. In the following descriptions,
another register function in the DSP instructions is also indicated within parentheses [ ].

• Double data transfer instructions (X memory and Y memory are accessed simultaneously)
In double data transfers, X memory Y memory can be accessed simultaneously. To specify X
and Y memory addresses, two address pointers are supported.

Address Pointer Index Register


X memory (MOVX.W) R4,R5[Ax] R8 [Ix]
Y memory (MOVY.W) R6,R7[Ay] R9 [Iy]

• Single data transfer instructions


In single data transfer, any virtual address space can be accessed via the L bus. The following
address pointers and index registers are used.

Address Pointer Index Register


Any virtual space (MOVS.W/L) R4,R5, R2, R3[As] R8 [Is]

31 0
R0 General registers (DSP mode)
R1
X and Y double data transfers:
R2 [As2]
R3 [As3] R4, 5 [Ax] : Address register set for the X data memory
R4 [As0] R8 [Ix] : Index register for X address register set Ax
R5 [As1, Ax1]
R6 [Ay0]
R6, 7 [Ay] : Address register set for the Y data memory
R7 [Ay1]
R9 [Iy] : Index register for Y address register set Ay
R8 [Ix, Is]
R9 [Iy] Single data transfers:
R10 R4, 5, 2, 3 [As] : Address register set for all data memories
R11 R8 [Is] : Index register used for single data transfers
R12
R13
R14
R15

Figure 3.5 General Registers (DSP Mode)

Rev. 3.00 Jan. 18, 2008 Page 104 of 1458


REJ09B0033-0300
Section 3 DSP Operating Unit

In assembler, R0 to R9 are used as symbols. In the DSP data transfer instructions, the following
register names (alias) can also be used. In assembler, described as shown below.

Ix: .REG (R8)

Ix indicates the alias of register 8. Other aliases are shown below.

Ax0: .REG (R4)

Ax1: .REG (R5)

Ix: .REG (R8)

Ay0: .REG (R6)

Ay1: .REG(R7)

Iy: .REG (R9)

As0: .REG (R4); This definition is used for if the alias is required in the single data transfer

As1: .REG (R5); This definition is used for if the alias is required in the single data transfer

As2: .REG (R2)

As3: .REG (R3)

Is: .REG (R8); This definition is used for if the alias is required in the single data transfer

Rev. 3.00 Jan. 18, 2008 Page 105 of 1458


REJ09B0033-0300
Section 3 DSP Operating Unit

3.4.2 DSP Data Addressing

Table 3.10 shows the relationship between the double data transfer instructions and single data
transfer instructions.

Table 3.10 Overview of Data Transfer Instructions

Double Data Transfer


Instructions Single Data Transfer Instructions
MOVX.W
MOVY.W MOVS.W, MOVS.L
Address register Ax: R4, R5 As: R2, R3, R4, R5
Ay: R6, R7
Index register Ix: R8, Iy: R9 Is: R8
Addressing Nop/Inc (+2)/index addition: Nop/Inc (+2, +4)/index addition: post-
post-increment increment
 Dec (–2, –4): pre-decrement
Modulo addressing Possible Not possible
Data bus XDB, YDB LDB
Data length 16 bits (word) 16/32 bits (word/longword)
Bus conflict No Yes
Memory X/Y data memory Entire memory space
Source register Da: A0, A1 Ds: A0/A1, M0/M1, X0/X1, Y0/Y1,
A0G, A1G
Destination register Dx: X0/X1 Ds: A0/A1, M0/M1, X0/X1, Y0/Y1,
Dy: Y0/Y1 A0G, A1G

Rev. 3.00 Jan. 18, 2008 Page 106 of 1458


REJ09B0033-0300
Section 3 DSP Operating Unit

(1) Addressing Mode for Double Data Transfer Instructions

The double data transfer instructions supports the following three addressing modes.

• Non-update address register addressing


The Ax and Ay registers are address pointers. They are not updated.
• Increment address register addressing
The Ax and Ay registers are address pointers. After a data transfer, they are each incremented
by 2 (post-increment).
• Addition index register addressing
The Ax and Ay registers are address pointers. After a data transfer, the value of the Ix or Iy
register is added to each (post-increment). The double data transfer instructions do not
supports decrement addressing mode. To perform decrement, –2 or –4 is set in the index
register and addition index register addressing is specified.

When using X/Y data addressing, bit 0 of the address pointer is invalid; bits 0 and 1 of the address
pointer are invalid in word access. Accordingly, bit 0 of the address pointer and index register
must be cleared to 0 in X/Y data addressing.

When accessing X and Y memory using the X and Y buses, the upper word of Ax and Ay is
ignored. The result of Ay+ or Ay+Iy is stored in the lower word of Ay, while the upper word
retains its original value. The Ax and Ax +Ix operations are executed in longword (32 bits) and the
upper word may be changed according to the result.

(2) Single Data Addressing

The following four kinds of addressing can be used with single data transfer instructions.

• Non-update address register addressing


The As register is an address pointer. An access to @As is performed but As is not updated.
• Increment address register addressing:
The As register is an address pointer. After an access to @As, the As register is incremented
by 2 or 4 (post-increment).
• Addition index register addressing:
The As register is an address pointer. After an access to @As, the value of the Is register is
added to the As register (post-increment).
• Decrement address register addressing:
The As register is an address pointer. Before a data transfer, –2 or –4 is added to the As
register (i.e. 2 or 4 is subtracted) (pre-decrement).

Rev. 3.00 Jan. 18, 2008 Page 107 of 1458


REJ09B0033-0300
Section 3 DSP Operating Unit

In single data transfer instructions, all bits in 32-bit address are valid.

3.4.3 Modulo Addressing

In double data transfer instructions, a module addressing can be used. If the address pointer value
reaches the preset modulo end address while a modulo addressing mode is specified,, the address
pointer value becomes the modulo start address.

To control modulo addressing, the modulo register (MOD) extended in the DSP mode and the
DMX and DMY bits of the SR register are used.

The MOD register is provided to set the start and end addresses of the modulo address area. The
upper and lower words of the MOD register store modulo start address (MS) and modulo end
address (ME), respectively. The LDC and STC instructions are extended for MOD register
handling.

If the DMX bit in the SR register is set, the modulo addressing is specified for the X address
register. If the DMY bit in the SR register is set, the modulo addressing is specified for the Y
address register. Modulo addressing is valid for either the X or the Y address register, only; it
cannot be set for both at the same time. Therefore, DMX and DMY cannot both be set
simultaneously (if they are, the DMY setting will be valid). ( In the future, this specification may
be changed.) The MDX and MDY bits of the SR can be specified by the STC or LDC instruction
for the SR register.

If an exception is accepted during modulo addressing, the MDX and MDY bits of the SR and
MOD register must be saved. By restoring these register values, a control is returned to the
modulo addressing after an exception handling.

Table 3.11 Modulo Addressing Control Instructions

Instruction Operation Execution States


STC MOD,Rn MOD → Rn 1
STC.L MOD,Rn Rn – 4 → Rn, MOD → (Rn) 1
LDC.L @Rn+,MOD (Rn) → Rn, Rn + 4 → Rn 4
LDC Rn,MOD Rn → MOD 4

Rev. 3.00 Jan. 18, 2008 Page 108 of 1458


REJ09B0033-0300
Section 3 DSP Operating Unit

An example of the use of modulo addressing is shown below.

MOV.L #H’70047000, R10


;Specify MS=H’7000 ME = H’7004
LDC R10,MOD ;Specify ME:MS to MOD register
STC SR, R10 ;
MOV.L #H’FFFFF3FF, R11;
MOV.L #H’00000400, R12;
AND R11, R10 ;
OR R12, R10 ;
LDC R10, SR ; Specify SR.MDX=1,
SR.MDY=0, and X modulo addressing mode
MOV.L #H’A5007000, R4
MOVX.W @R4+,X0 ; R4: H’A5007000→ H’A5007002
MOVX.W @R4+,X0 ; R4: H’A5007002→ H’A5007004
MOVX.W @R4+,X0 ; R4: H’A5007004→ H’A5007000
(Matches to ME and MS is set)
MOVX.W @R4+,X0 ; R4: H’A5007000→ H’A5007002

The start and end addresses are specified in MS and ME, then the DMX or DMY bit is set to 1.
When the X or Y data transfer instruction specified by the DMX or DMY is executed, the address
register contents before updating are compared with ME*, and if they match, start address MS is
stored in the address register as the value after updating.

When the addressing type of the X/Y data transfer instruction is no-update, the X/Y data transfer
instruction is not returned to MS even if they match ME. When the addressing type of the X/Y
data transfer instruction is addition index register addressing, the address pointed may not match
the address pointer ME, and exceed it. In this case, the address pointer value does not become the
modulo start address.

The maximum modulo size is 64 kbytes. This is sufficient to access the X and Y data memory.

Note: Not only with modulo addressing, but when X and Y data addressing is used, bit 0 is
ignored. 0 must always be written to bit 0 of the address pointer, index register, MS, and
ME.

Rev. 3.00 Jan. 18, 2008 Page 109 of 1458


REJ09B0033-0300
Section 3 DSP Operating Unit

3.4.4 Memory Data Formats

Memory data formats that can be used in the DSP instructions are classified into byte and
longword. An address error will occur if word data starting from an address other than 2n or
longword data starting from an address other than 4n is accessed by MOVS.L, LDS.L, or STS.L
instruction. In such cases, the data accessed cannot be guaranteed

An address error will not occur if word data starting from an address other than 2n is accessed by
the MOVX.W or MOVY.W instruction. When using the MOVX.W or MOVY.W instruction, an
address must be specified on the boundary 2n. If an address is specified other than 2n, the data
accessed cannot be guaranteed.

Rev. 3.00 Jan. 18, 2008 Page 110 of 1458


REJ09B0033-0300
Section 3 DSP Operating Unit

3.4.5 Instruction Formats of Double and Single Transfer Instructions

The format of double data transfer instructions is shown in tables 3.12 and that of single data
transfer instructions in table 3.13.

Table 3.12 Double Data Transfer Instruction Formats

Type Mnemonic 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
X memory NOPX 1 1 1 1 0 0 0 0 0 0 0
data MOVX.W @Ax,Dx Ax Dx 0 0 1
transfer
MOVX.W @Ax+,Dx 1 0
MOVX.W @Ax+Ix,Dx 1 1
MOVX.W Da,@Ax Da 1 0 1
MOVX.W Da,@Ax+ 1 0
MOVX.W Da,@Ax+Ix 1 1
Y memory NOPY 1 1 1 1 0 0 0 0 0 0 0
data
MOVY.W @Ay,Dy Ay Dy 0 0 1
transfer
MOVY.W @Ay+,Dy 1 0
MOVY.W @Ay+Iy,Dy 1 1
MOVY.W Da,@Ay Da 1 0 1
MOVY.W Da,@Ay+ 1 0
MOVY.W Da,@Ay+Iy 1 1
Note: Ax: 0 = R4, 1 = R5
Ay: 0 = R6, 1 = R7
Dx: 0 = X0, 1 = X1
Dy: 0 = Y0, 1 = Y1
Da: 0 = A0, 1 = A1

Rev. 3.00 Jan. 18, 2008 Page 111 of 1458


REJ09B0033-0300
Section 3 DSP Operating Unit

Table 3.13 Single Data Transfer Instruction Formats

Type Mnemonic 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
Single data MOVS.W @-As,Ds 1 1 1 1 0 1 As Ds 0:(*) 0 0 0 0
transfer
MOVS.W @As,Ds 0:R4 1:(*) 0 1
MOVS.W @As+,Ds 1:R5 2:(*) 1 0
MOVS.W @As+Is,Ds 2:R2 3:(*) 1 1
MOVS.W Ds,@-As 3:R3 4:(*) 0 0 0 1
MOVS.W Ds,@As 5:A1 0 1
MOVS.W Ds,@As+ 6:(*) 1 0
MOVS.W Ds,@As+Is 7:A0 1 1
MOVS.L @-As,Ds 8:X0 0 0 1 0
MOVS.L @As,Ds 9:X1 0 1
MOVS.L @As+,Ds A:Y0 1 0
MOVS.L @As+Is,Ds B:Y1 1 1
MOVS.L Ds,@-As C:M0 0 0 1 1
MOVS.L Ds,@As D:A1G 0 1
MOVS.L Ds,@As+ E:M1 1 0
MOVS.L Ds,@As+Is F:A0G 1 1
Note: * Codes reserved for system use.

Rev. 3.00 Jan. 18, 2008 Page 112 of 1458


REJ09B0033-0300
Section 3 DSP Operating Unit

3.5 DSP Data Operation Instructions

3.5.1 DSP Registers

This LSI has eight data registers (A0, A1, X0, X1, Y0, Y1, M0 and M1) and one control register
(DSR) as DSP registers (figure 3.3).

Four kinds of operation access the DSP data registers. The first is DSP data processing. When a
DSP fixed-point data operation uses A0 or A1 as the source register, it uses the guard bits (bits 39
to 32). When it uses A0 or A1 as the destination register, guard bits 39 to 32 are valid. When a
DSP fixed-point data operation uses a DSP register other than A0 or A1 as the source register, it
sign-extends the source value to bits 39 to 32. When it uses one of these registers as the
destination register, bits 39 to 32 of the result are discarded.

The second kind of operation is an X or Y data transfer operation, MOVX.W, MOVY.W. This
operation accesses the X and Y memories through the 16-bit X and Y data buses (figure 3.4). The
register to be loaded or stored by this operation always comprises the upper 16 bits (bits 31 to 16).
X0 or X1 can be the destination of an X memory load and Y0 or Y1 can be the destination of a Y
memory load, but no other register can be the destination register in this operation. When data is
read into the upper 16 bits of a register (bits 31 to 16), the lower 16 bits of the register (bits 15 to
0) are automatically cleared. A0 and A1 can be stored in the X or Y memory by this operation, but
no other registers can be stored.

The third kind of operation is a single-data transfer instruction, MOVS.W or MOVS.L. These
instructions access any memory location through the LDB (figure 3.4). All DSP registers connect
to the LDB and can be the source or destination register of the data transfer. These instructions
have word and longword access modes. In word mode, registers to be loaded or stored by this
instruction comprise the upper 16 bits (bits 31 to 16) for DSP registers except A0G and A1G.
When data is loaded into a register other than A0G and A1G in word mode, the lower half of the
register is cleared. When A0 or A1 is used, the data is sign-extended to bits 39 to 32 and the lower
half is cleared. When A0G or A1G is the destination register in word mode, data is loaded into an
8-bit register, but A0 or A1 is not cleared. In longword mode, when the destination register is A0
or A1, it is sign-extended to bits 39 to 32.

The fourth kind of operation is system control instructions such as LDS, STS, LDS.L, or STS.L.
The DSR, A0, X0, X1, Y0, and Y1 registers of the DSP register can be treated as system registers.
For these registers, data transfer instructions between the CPU general registers and system
registers or memory access instructions are supported.

Rev. 3.00 Jan. 18, 2008 Page 113 of 1458


REJ09B0033-0300
Section 3 DSP Operating Unit

Tables 3.14 and 3.15 show the data type of registers used in DSP instructions. Some instructions
cannot use some registers shown in the tables because of instruction code limitations. For
example, PMULS can use A1 as the source register, but cannot use A0. These tables ignore details
of register selectability.

Table 3.14 Destination Register in DSP Instructions

Guard Bits Register Bits


Registers Instructions 39 32 31 16 15 0
A0, A1 DSP Fixed-point, PSHA, Sign-extended 40-bit result
operation PMULS
Integer, PDMSB Sign-extended 24-bit result Cleared
Logical, PSHL Cleared 16-bit result Cleared
Data MOVS.W Sign-extended 16-bit data Cleared
transfer MOVS.L Sign-extended 32-bit data
A0G, A1G Data MOVS.W Data No update
transfer
MOVS.L Data No update
X0, X1 DSP Fixed-point, PSHA, 32-bit result
Y0, Y1 operation PMULS
M0, M1
Integer, logical, 16-bit result Cleared
PDMSB, PSHL
Data MOVX/Y.W, MOVS.W 16-bit result Cleared
transfer
MOVS.L 32-bit data

Rev. 3.00 Jan. 18, 2008 Page 114 of 1458


REJ09B0033-0300
Section 3 DSP Operating Unit

Table 3.15 Source Register in DSP Operations

Guard Bits Register Bits


Registers Instructions 39 32 31 16 15 0
A0, A1 DSP Fixed-point, PDMSB, 40-bit data
operation PSHA
Integer 24-bit data
Logical, PSHL, PMULS 16-bit data
Data MOVX/Y.W, MOVS.W 16-bit data
transfer
MOVS.L 32-bit data
A0G, A1G Data MOVS.W Data
transfer MOVS.L Data
X0, X1 DSP Fixed-point, PDMSB, Sign* 32-bit data
Y0, Y1 PSHA
M0, M1 Integer Sign* 16-bit data
Logical, PSHL, PMULS 16-bit data
Data MOVS.W 16-bit data
transfer
MOVS.L 32-bit data
Note: * The data is sign-extended and input to the ALU.

The DSP unit incorporates one control register and DSP status register (DSR). The DSR register
stores the DSP data operation result (zero, negative, others). The DSP register also has the DC bit
whose function is similar to the T bit in the CPU register. The DC bit functions as status flag.
Conditional DSP data operations are controlled based on the DC bit. These operation control
affects only the DSP unit instructions. In other words, these operations control affects only the
DSP registers and does not affect address register update and CPU instructions such as load and
store instructions. A condition to be reflected on the DC bit should be specified to the DC status
selection bits (CS[2:0]).

The unconditional DSP type data instructions other than PMULS, MOVX, MOVY, and MOVS
change the condition flag and DC bit. However, the CPU instructions including the MAC
instruction do not modify the DC bit. In addition, conditional DSP instructions do not modify the
DSR.

Rev. 3.00 Jan. 18, 2008 Page 115 of 1458


REJ09B0033-0300
Section 3 DSP Operating Unit

Table 3.16 DSR Register Bits

Initial
Bits Bit Name Value R/W Function
31 to 8  All 0 R Reserved
These bits are always read as 0. The write value should
always be 0.
7 GT 0 R/W Signed Greater Bit
Indicates that the operation result is positive (except 0),
or that operand 1 is greater than operand 2
1: Operation result is positive, or operand 1 is greater
than operand 2
6 Z 0 R/W Zero Bit
Indicates that the operation result is zero (0), or that
operand 1 is equal to operand 2
1: Operation result is zero (0), or operands are equal
5 N 0 R/W Negative Bit
Indicates that the operation result is negative, or that
operand 1 is smaller than operand 2
1: Operation result is negative, or operand 1 is smaller
than operand 2
4 V 0 R/W Overflow Bit
Indicates that the operation result has overflowed
1: Operation result has overflowed

Rev. 3.00 Jan. 18, 2008 Page 116 of 1458


REJ09B0033-0300
Section 3 DSP Operating Unit

Initial
Bits Bit Name Value R/W Function
3 to 1 CS All 0 R/W DC Bit Status Selection
Designate the mode for selecting the operation result
status to be set in the DC bit
000: Carry/borrow mode
001: Negative value mode
010: Zero mode
011: Overflow mode
100: Signed greater mode
101: Signed greater than or equal to mode
110: Reserved (setting prohibited)
111: Reserved (setting prohibited)
0 DC 0 R/W DSP Status Bit
Sets the status of the operation result in the mode
designated by the CS bits
0: Designated mode status has not occurred
1: Designated mode status has occurred
Indicates the operation result by carry or borrow
regardless of the CS bit status after the PADDC or
PSUBC instruction has been executed.

The DSR is assigned to the system registers. For the DSR, the following load and store
instructions are supported.

STS DSR,Rn;
STS.L DSR,@-Rn;
LDS Rn,DSR;
LDS.L @Rn+,DSR;

If the DSR is read by the STS instruction, upper bits (bits 31 to 16) are all 0.

Rev. 3.00 Jan. 18, 2008 Page 117 of 1458


REJ09B0033-0300
Section 3 DSP Operating Unit

3.5.2 DSP Operation Instruction Set

DSP operation instructions are instructions for digital signal processing performed by the DSP
unit. These instructions have a 32-bit instruction code, and multiple instructions can be executed
in parallel. The instruction code is divided into a field A and field B; a parallel data transfer
instruction is specified in the field A, and a single or double data operation instruction in the field
B. Instructions can be specified independently, and are also executed independently.

B-field data operation instructions are of three kinds: double data operation instructions,
conditional single data operation instructions, and unconditional single data operation instructions.
The formats of the DSP operation instructions are shown in table 3.17. The respective operands
are selected independently from the DSP registers. The correspondence between DSP operation
instruction operands and registers is shown in table 3.18.

Table 3.17 DSP Operation Instruction Formats

Type Instruction Formats


Double data operation instructions ALUop. Sx, Sy, Du
MLTop. Se, Df, Dg
Conditional single data operation DCT ALUop. Sx, Sy, Dz
instructions DCF ALUop. Sx, Sy, Dz
DCT ALUop. Sx, Dz
DCF ALUop. Sx, Dz
DCT ALUop. Sy, Dz
DCF ALUop. Sy, Dz
Unconditional single data operation ALUop. Sx, Sy, Dz
instructions ALUop. Sx, Dz
ALUop. Sy, Dz
MLTop. Se, Sf, Dg

Rev. 3.00 Jan. 18, 2008 Page 118 of 1458


REJ09B0033-0300
Section 3 DSP Operating Unit

Table 3.18 Correspondence between DSP Instruction Operands and Registers

ALU Operations Multiply Operations


Register Sx Sy Dz Du Se Sf Dg
A0 Yes Yes Yes Yes
A1 Yes Yes Yes Yes Yes Yes
M0 Yes Yes Yes
M1 Yes Yes Yes
X0 Yes Yes Yes Yes Yes
X1 Yes Yes Yes
Y0 Yes Yes Yes Yes Yes
Y1 Yes Yes Yes

When writing parallel instructions, the field-B instruction is written first, followed by the field-A
instruction. A sample parallel processing program is shown in figure 3.6.

PADD A0, M0, A0 PMULS X0, Y0, M0 MOVX.W @R4+, X0 MOVY.W @R6+, Y0

DCF PINC M1, A1 MOVX.W @R5+R8, X0 MOVY.W @R7+, Y1

PCMP M1, M0 MOVX.W @R4, X1 [NOPY]

Figure 3.6 Sample Parallel Instruction Program

Square brackets mean that the contents can be omitted.

The no operation instructions NOPX and NOPY can be omitted. For details on the field B in DSP
data operation instructions, refer to section 3.6.4, DSP Operation Instructions.

The DSR register condition code bit (DC) is always updated on the basis of the result of an
unconditional ALU or shift operation instruction. Conditional instructions do not update the DC
bit. Multiply instructions, also, do not update the DC bit. DC bit updating is performed by means
of the CS[2:0] bits in the DSR register. The DC bit update rules are shown in table 3.19.

Rev. 3.00 Jan. 18, 2008 Page 119 of 1458


REJ09B0033-0300
Section 3 DSP Operating Unit

Table 3.19 DC Bit Update Definitions

CS [2:0] Condition Mode Description


0 0 0 Carry or borrow The DC bit is set if an ALU arithmetic operation generates a carry
mode or borrow, and is cleared otherwise.
When a PSHA or PSHL shift instruction is executed, the last bit
data shifted out is copied into the DC bit.
When an ALU logical operation is executed, the DC bit is always
cleared.
0 0 1 Negative value When an ALU or shift (PSHA) arithmetic operation is executed,
mode the MSB of the result, including the guard bits, is copied into the
DC bit.
When an ALU or shift (PSHL) logical operation is executed, the
MSB of the result, excluding the guard bits, is copied into the DC
bit.
0 1 0 Zero value mode The DC bit is set if the result of an ALU or shift operation is all-
zeros, and is cleared otherwise.
0 1 1 Overflow mode The DC bit is set if the result of an ALU or shift (PSHA) arithmetic
operation exceeds the destination register range, excluding the
guard bits, and is cleared otherwise.
When an ALU or shift (PSHL) logical operation is executed, the
DC bit is always cleared.
1 0 0 Signed greater-than This mode is similar to signed greater-or-equal mode, but DC is
mode cleared if the result is all-zeros.
DC = ~{(negative value ^ over-range) | zero value};
In case of arithmetic operation
DC = 0; In case of logical operation
1 0 1 Signed greater-or- If the result of an ALU or shift (PSHA) arithmetic operation
equal mode exceeds the destination register range, including the guard bits
(over-range), the definition is the same as in negative value mode.
If the result is not over-range, the definition is the opposite of that
in negative value mode.
When an ALU or shift (PSHL) logical operation is executed, the
DC bit is always cleared.
DC = ~(negative value ^ over-range);
In case of arithmetic operation
DC = 0 ; In case of logical operation
1 1 0 Reserved (setting prohibited)
1 1 1 Reserved (setting prohibited)

Rev. 3.00 Jan. 18, 2008 Page 120 of 1458


REJ09B0033-0300
Section 3 DSP Operating Unit

• Conditional Operations and Data Transfer


Some instructions belonging to this class can be executed conditionally, as described earlier.
The specified condition is valid only for the B field of the instruction, and is not valid for data
transfer instructions for which a parallel specification is made. Examples are shown in figure
3.7.

DCT PADD X0,Y0,A0 MOVX.W @R4+,X0 MOVY.W A0,@R6+R9

When condition is True

Before execution: X0=H'33333333, Y0=H'55555555, A0=H'123456789A,


R4=H'00008000, R6=H'00005000, R9=H'00000004
(R4)=H'1111, (R6)=H'2222
After execution: X0=H'11110000, Y0=H'55555555, A0=H'0088888888,
R4=H'00008002, R6=H'00005004, R9=H'00000004
(R4)=H'1111, (R6)=H'3456

When condition is False

Before execution: X0=H'33333333, Y0=H'55555555, A0=H'123456789A,


R4=H'00008000, R6=H'00005000, R9=H'00000004
(R4)=H'1111, (R6)=H'2222
After execution: X0=H'11110000, Y0=H'55555555, A0=H'123456789A,
R4=H'00008002, R6=H'00005004, R9=H'00000004
(R4)=H'1111, (R6)=H'3456

Figure 3.7 Examples of Conditional Operations and Data Transfer Instructions

• Assignment of NOPX and NOPY Instruction Codes


When there is no data transfer instruction to be parallel-processed simultaneously with a DSP
operation instruction, an NOPX or NOPY instruction can be written as the data transfer
instruction, or the instruction can be omitted. The instruction code is the same whether an
NOPX or NOPY instruction is written or the instruction is omitted. Examples of NOPX and
NOPY instruction codes are shown in table 3.20.

Rev. 3.00 Jan. 18, 2008 Page 121 of 1458


REJ09B0033-0300
Section 3 DSP Operating Unit

Table 3.20 Examples of NOPX and NOPY Instruction Codes

Instruction Code
PADD X0,Y0,A0 MOVX.W @R4+,X0 MOVY.W @R6+R9,Y0 1111100000001011
1011000100000111
PADD X0,Y0,A0 NOPX MOVY.W @R6+R9,Y0 1111100000000011
1011000100000111
PADD X0,Y0,A0 NOPX NOPY 1111100000000000
1011000100000111
PADD X0,Y0,A0 NOPX 1111100000000000
1011000100000111
PADD X0,Y0,A0 1111100000000000
1011000100000111
MOVX.W @R4+,X0 MOVY.W @R6+R9,Y0 1111000000001011
MOVX.W @R4+,X0 NOPY 1111000000001000
MOVS.W @R4+,X0 1111010010001000
NOPX MOVY.W @R6+R9,Y0 1111000000000011
MOVY.W @R6+R9,Y0 1111000000000011
NOPX NOPY 1111000000000000
NOP 0000000000001001

Rev. 3.00 Jan. 18, 2008 Page 122 of 1458


REJ09B0033-0300
Section 3 DSP Operating Unit

3.5.3 DSP-Type Data Formats

This LSI has several different data formats that depend on the instruction. This section explains
the data formats for DSP type instructions.

Figure 3.8 shows three DSP-type data formats with different binary point positions. A CPU-type
data format with the binary point to the right of bit 0 is also shown for reference.

The DSP-type fixed point data format has the binary point between bit 31 and bit 30. The DSP-
type integer format has the binary point between bit 16 and bit 15. The DSP-type logical format
does not have a binary point. The valid data lengths of the data formats depend on the instruction
and the DSP register.

Rev. 3.00 Jan. 18, 2008 Page 123 of 1458


REJ09B0033-0300
Section 3 DSP Operating Unit

DSP type fixed point


39 31 30 0
With guard bits S –28 to +28 – 2–31

31 30 0
Without guard bits S –1 to +1 – 2–31

39 31 30 16 15 0
Multiplier input S –1 to +1 – 2–15

DSP type integer


39 32 31 16 15 0
With guard bits S –223 to +223 – 1

31 16 15 0
Without guard bits S –215 to +215 – 1

Shift amount for 31 22 16 15 0


arithmetic shift (PSHA) S –32 to +32

31 21 16 15 0
Shift amount for
logical shift (PSHL) S –16 to +16

39 31 16 15 0
DSP type logical

CPU type integer


31 0
Longword S –231 to +231 – 1

S: Sign bit : Binary point : Does not affect the operations

Figure 3.8 Data Formats

The shift amount for the arithmetic shift (PSHA) instruction has a 7-bit field that can represent
values from –64 to +63, but –32 to +32 are valid numbers for the instruction. Also the shift
amount for a logical shift operation has a 6-bit field, but –16 to +16 are valid numbers for the
instruction.

Rev. 3.00 Jan. 18, 2008 Page 124 of 1458


REJ09B0033-0300
Section 3 DSP Operating Unit

3.5.4 ALU Fixed-Point Arithmetic Operations

Figure 3.9 shows the ALU arithmetic operation flow. Table 3.21 shows the variation of this type
of operation and table 3.22 shows the correspondence between each operand and registers.

39 31 0 39 31 0
Guard Source 1 Guard Source 2

ALU GT Z N V DC
DSR

Guard Destination
39 31 0

Figure 3.9 ALU Fixed-Point Arithmetic Operation Flow

Note: The ALU fixed-point arithmetic operations are basically 40-bit operation; 32 bits of the
base precision and 8 bits of the guard-bit parts. So the signed bit is copied to the guard-bit
parts when a register not providing the guard-bit parts is specified as the source operand.
When a register not providing the guard-bit parts is specified as a destination operand, the
lower 32 bits of the operation result are input into the destination register.

ALU fixed-point operations are executed between registers. Each source and destination operand
are selected independently from one of the DSP registers. When a register providing guard bits is
specified as an operand, the guard bits are activated for this type of operation. These operations
are executed in the DSP stage, as shown in figure 3.10. The DSP stage is the same stage as the
MA stage in which memory access is performed.

Rev. 3.00 Jan. 18, 2008 Page 125 of 1458


REJ09B0033-0300
Section 3 DSP Operating Unit

Table 3.21 Variation of ALU Fixed-Point Operations

Mnemonic Function Source 1 Source 2 Destination


PADD Addition Sx Sy Dz (Du)
PSUB Subtraction Sx Sy Dz (Du)
PADDC Addition with carry Sx Sy Dz
PSUBC Subtraction with borrow Sx Sy Dz
PCMP Comparison Sx Sy 
PCOPY Data copy Sx All 0 Dz
All 0 Sy Dz
PABS Absolute Sx All 0 Dz
All 0 Sy Dz
PNEG Negation Sx All 0 Dz
All 0 Sy Dz
PCLR Clear All 0 All 0 Dz

Table 3.22 Correspondence between Operands and Registers

Register Sx Sy Dz Du
A0 Yes Yes Yes
A1 Yes Yes Yes
M0 Yes Yes
M1 Yes Yes
X0 Yes Yes Yes
X1 Yes Yes
Y0 Yes Yes Yes
Y1 Yes Yes

As shown in figure 3.10, data loaded from the memory at the MA stage, which is programmed at
the same line as the ALU operation, is not used as a source operand for this operation, even
though the destination operand of the data load operation is identical to the source operand of the
ALU operation. In this case, previous operation results are used as the source operands for the
ALU operation, and then updated as the destination operand of the data load operation.

Rev. 3.00 Jan. 18, 2008 Page 126 of 1458


REJ09B0033-0300
Section 3 DSP Operating Unit

Operation Sequence Example


MOVX.W @R4 + X0
PADD X0, Y0, A0 MOVX.W @R4 + X0

Slot 1 2 3 4 5 6
Stage

IF MOVX MOVX & PADD

ID MOVX MOVX & PADD

EX Addressing Addressing

MA/DSP MOVX MOVX & PADD

Previous cycle result is used.

Figure 3.10 Operation Sequence Example

Every time an ALU arithmetic operation is executed, the DC, N, Z, V, and GT bits in DSR are
basically updated in accordance with the operation result. However, in case of a conditional
operation, they are not updated even though the specified condition is true and the operation is
executed. In case of an unconditional operation, they are always updated in accordance with the
operation result. The definition of a DC bit is selected by CS[2:0] (condition selection) bits in
DSR. The DC bit result is as follows:

Rev. 3.00 Jan. 18, 2008 Page 127 of 1458


REJ09B0033-0300
Section 3 DSP Operating Unit

(1) Carry or Borrow Mode: CS[2:0] = B'000

The DC bit indicates that carry or borrow is generated from the most significant bit of the
operation result, except the guard-bit parts. Some examples are shown in figure 3.11. This mode is
the default condition. When the input data is negative in a PABS or PNEG instruction, carry is
generated.

Example 1 Example 2

Guard bits Guard bits


0000 0000 1111111111111111 111111110111 0000 0000 0000
+) 0000 0000 0000 0000 0000 0001 +) 0011 11110001 0000 0000 0000
0000 0001 0000 0000 0000 0000 (1) 0011 11101000 0000 0000 0000

Carry detecting point Carry detecting point

Carry is detected Carry is not detected

Example 3 Example 4

Guard bits Guard bits


0000 0000 0000 0000 0000 0001 0000 0000 0001 0000 0000 0001
–) 0000 0000 0000 0000 0000 0001 –) 0000 0000 0001 0000 0000 0010
0000 0000 0000 0000 0000 0000 111111111111111111111111

Borrow detecting point Borrow detecting point

Borrow is not detected Borrow is detected

Figure 3.11 DC Bit Generation Examples in Carry or Borrow Mode

Rev. 3.00 Jan. 18, 2008 Page 128 of 1458


REJ09B0033-0300
Section 3 DSP Operating Unit

(2) Negative Value Mode: CS[2:0] = B'001

The DC flag indicates the same value as the MSB of the operation result. When the result is a
negative number, the DC bit shows 1. When it is 0 or a positive number, the DC bit shows 0. The
ALU always executes 40-bit arithmetic operation, so the sign bit to detect whether positive or
negative is always got from the MSB of the operation result regardless of the destination operand.
Some examples are shown in figure 3.12.

Example 1 Example 2

Guard bits Guard bits


1100 0000 0000 0000 0000 0000 0011 0000 0000 0000 0000 0000
+) 0000 0000 0000 0000 0000 0001 +) 0000 0000 1000 0000 0000 0001
1100 0000 0000 0000 0000 0001 0011 0000 1000 0000 0000 0001

Sign bit Sign bit

Negative value Positive value

Figure 3.12 DC Bit Generation Examples in Negative Value Mode

(3) Zero Value Mode: CS[2:0] = B'010

The DC flag indicates whether the operation result is 0 or not. When the result is 0, the DC bit
shows 1. When it is not 0, the DC bit shows 0.

(4) Overflow Mode: CS[2:0] = B'011

The DC bit indicates whether or not overflow occurs in the result. When an operation yields a
result beyond the range of the destination register, except the guard-bit parts, the DC bit is set.
Even though guard bits are provided in the destination register, the DC bit always indicates the
result of when no guard bits are provided. So, the DC bit is always set to 1 if the guard-bit parts
are used for large number representation. Some DC bit generation examples in overflow mode are
shown in figure 3.13.

Example 1 Example 2

Guard bits Guard bits


111111111111111111111111 111111111111111111111111
+) 111111111000 0000 0000 0000 +) 111111111000 0000 0000 0001
111111110111111111111111 111111111000 0000 0000 0000

Overflow detecting field Overflow detecting field

Overflow case Non overflow case

Figure 3.13 DC Bit Generation Examples in Overflow Mode

Rev. 3.00 Jan. 18, 2008 Page 129 of 1458


REJ09B0033-0300
Section 3 DSP Operating Unit

(5) Signed Greater Than Mode: CS[2:0] = B'100

The DC bit indicates whether or not the source 1 data (signed) is greater than the source 2 data
(signed) as the result of compare operation PCMP. The PCMP operation should be executed
before executing the conditional operation under this condition mode. This mode is similar to the
Negative Value Mode described before, because the result of a compare operation is a positive
value if the source 1 data is greater than the source 2 data. However, the signed bit of the result
shows a negative value if the compare operation yields a result beyond the range of the destination
operand, including the guard-bit parts (called “Over-range”), even though the source 1 data is
greater than the source 2 data. The DC bit is updated concerning this type of special case in this
condition mode. The equation below shows the definition of getting this condition:

DC = ~ {(Negative ^ Over-range) | Zero}

When the PCMP operation is executed under this condition mode, the result of the DC bit is the
same as the T bit’s result of the CMP/GT operation of the CPU instruction.

(6) Signed Greater Than or Equal Mode: CS[2:0] = B'101

The DC bit indicates whether the source 1 data (signed) is greater than or equal to the source 2
data (signed) as the result of compare operation PCMP. This mode is similar to the Signed Greater
Than Mode described before but the equal case is also included in this mode. The equation below
shows the definition of getting this condition:

DC = ~ (Negative ^ Over-range)

When the PCMP operation is executed under this condition mode, the result of the DC bit is the
same as the T bit’s result of a CMP/GE operation of the CPU instruction.

The N bit always indicates the same state as the DC bit set in negative value mode by the CS[2:0]
bits. See the negative value mode part above. The Z bit always indicates the same state as the DC
bit set in zero value mode by the CS[2:0] bits. See the zero value mode part above. The V bit
always indicates the same state as the DC bit set in overflow mode by the CS[2:0] bits. See the
overflow mode part above. The GT bit always indicates the same state as the DC bit set in signed
greater than mode by the CS[2:0] bits. See the signed greater than mode part above.

Note: The DC bit is always updated as the carry flag for ‘PADDC’ and is always updated as the
carry/borrow flag for ‘PSUBC’ regardless of the CS[2:0] state.

• Overflow Protection
The S bit in SR is effective for any ALU fixed-point arithmetic operations in the DSP unit. See
section 3.5.11, Overflow Protection, for details.

Rev. 3.00 Jan. 18, 2008 Page 130 of 1458


REJ09B0033-0300
Section 3 DSP Operating Unit

3.5.5 ALU Integer Operations

Figure 3.14 shows the ALU integer arithmetic operation flow. Table 3.23 shows the variation of
this type of operation. The correspondence between each operand and registers is the same as
ALU fixed-point operations as shown in table 3.22.

39 31 0 39 31 0
Guard Source 1 Guard Source 2

ALU GT Z N V DC
DSR

Ignored
Guard Destination
Cleared to 0
39 31 0

Figure 3.14 ALU Integer Arithmetic Operation Flow

Table 3.23 Variation of ALU Integer Operations

Mnemonic Function Source 1 Source 2 Destination


PINC Increment by 1 Sx +1 Dz
+1 Sy Dz
PDEC Decrement by 1 Sx –1 Dz
–1 Sy Dz
Note: The ALU integer operations are basically 24-bit operation, the upper 16 bits of the base
precision and 8 bits of the guard-bits parts. So the signed bit is copied to the guard-bit parts
when a register not providing the guard-bit parts is specified as the source operand. When
a register not providing the guard-bit parts is specified as a destination operand, the upper
word excluding the guard bits of the operation result are input into the destination register.

Rev. 3.00 Jan. 18, 2008 Page 131 of 1458


REJ09B0033-0300
Section 3 DSP Operating Unit

In ALU integer arithmetic operations, the lower word of the source operand is ignored and the
lower word of the destination operand is automatically cleared. The guard-bit parts are effective in
ALU integer arithmetic operations if they are supported. Others are basically the same operation
as ALU fixed-point arithmetic operations. As shown in table 3.23, however, this type of operation
provides two kinds of instructions only, so that the second operand is actually either +1 or –1.
When a word data is loaded into one of the DSP unit’s registers, it is input as an upper word data.
When a register providing guard bits is specified as an operand, the guard bits are also activated.
These operations, as well as fixed-point operations, are executed in the DSP stage, as shown in
figure 3.10. The DSP stage is the same stage as the MA stage in which memory access is
performed.

Every time an ALU arithmetic operation is executed, the DC, N, Z, V, and GT bits in DSR are
basically updated in accordance with the operation result. This is the same as fixed-point
operations but the lower word of each source and destination operand is not used in order to
generate them. See section 3.5.4, ALU Fixed-Point Arithmetic Operations, for details.

In case of a conditional operation, they are not updated even though the specified condition is true
and the operation is executed. In case of an unconditional operation, they are always updated in
accordance with the operation result. See section 3.5.4, ALU Fixed-Point Arithmetic Operations,
for details.

• Overflow Protection
The S bit in SR is effective for any ALU integer arithmetic operations in DSP unit. See section
3.5.11, Overflow Protection, for details.

Rev. 3.00 Jan. 18, 2008 Page 132 of 1458


REJ09B0033-0300
Section 3 DSP Operating Unit

3.5.6 ALU Logical Operations

Figure 3.15 shows the ALU logical operation flow. Table 3.24 shows the variation of this type of
operation. The correspondence between each operand and registers is the same as the ALU fixed-
point operations as shown in table 3.21.

As shown in figure 3.15, this type of operation uses only the upper word of each operand. The
lower word and guard-bit parts are ignored for the source operand and those of the destination
operand are automatically cleared. These operations are also executed in the DSP stage, as shown
in figure 3.10. The DSP stage is the same stage as the MA stage in which memory access is
performed.

39 31 0 39 31 0
Source 1 Source 2

ALU GT Z N V DC
DSR

Ignored
Destination
Cleared to 0
39 31 0

Figure 3.15 ALU Logical Operation Flow

Table 3.24 Variation of ALU Logical Operations

Mnemonic Function Source 1 Source 2 Destination


PAND Logical AND Sx Sy Dz
POR Logical OR Sx Sy Dz
PXOR Logical exclusive OR Sx Sy Dz

Rev. 3.00 Jan. 18, 2008 Page 133 of 1458


REJ09B0033-0300
Section 3 DSP Operating Unit

Every time an ALU logical operation is executed, the DC, N, Z, V, and GT bits in the DSR
register are basically updated in accordance with the operation result. In case of a conditional
operation, they are not updated even though the specified condition is true and the operation is
executed. In case of an unconditional operation, they are always updated in accordance with the
operation result. The definition of the DC bit is selected by the CS[2:0] (condition selection) bits
in DSR. The DC bit result is:

(1) Carry or Borrow Mode: CS[2:0] = 000

The DC bit is always cleared.

(2) Negative Value Mode: CS[2:0] = 001

Bit 31 of the operation result is loaded into the DC bit.

(3) Zero Value Mode: CS[2:0] = 010

The DC bit is set when the operation result is zero; otherwise it is cleared.

(4) Overflow Mode: CS[2:0] = 011

The DC bit is always cleared.

(5) Signed Greater Than Mode: CS[2:0] = 100

The DC bit is always cleared.

(6) Signed Greater Than or Equal Mode: CS[2:0] = 101

The DC bit is always cleared.

The N bit always indicates the same state as the DC bit set in negative value mode by the CS[2:0]
bits. See the negative value mode part above. The Z bit always indicates the same state as the DC
bit set in zero value mode by the CS[2:0] bits. See the zero value mode part above. The V bit
always indicates the same state as the DC bit set in overflow mode by the CS[2:0] bits. See the
overflow mode part above. The GT bit always indicates the same state as the DC bit set in signed
greater than mode by the CS[2:0] bits. See the signed greater than mode part above.

Rev. 3.00 Jan. 18, 2008 Page 134 of 1458


REJ09B0033-0300
Section 3 DSP Operating Unit

3.5.7 Fixed-Point Multiply Operation

Figure 3.16 shows the multiply operation flow. Table 3.25 shows the variation of this type of
operation and table 3.26 shows the correspondence between each operand and registers. The
multiply operation of the DSP unit is single-word signed single-precision multiplication. These
operations are executed in the DSP stage, as shown in figure 3.10. The DSP stage is the same
stage as the MA stage in which memory access is performed.

If a double-precision multiply operation is needed, the CPU standard double-word multiply


instructions can be made of use.

39 31 0 39 31 0
S Source 1 S Source 2

MAC

S Destination 0 Ignored
39 31 1 0

Figure 3.16 Fixed-Point Multiply Operation Flow

Table 3.25 Variation of Fixed-Point Multiply Operation

Mnemonic Function Source 1 Source 2 Destination


PMULS Signed multiplication Se Sf Dg

Rev. 3.00 Jan. 18, 2008 Page 135 of 1458


REJ09B0033-0300
Section 3 DSP Operating Unit

Table 3.26 Correspondence between Operands and Registers

Register Se Sf Dg
A0   Yes
A1 Yes Yes Yes
M0   Yes
M1   Yes
X0 Yes Yes 
X1 Yes  
Y0 Yes Yes 
Y1  Yes 
Note: The multiply operations basically generate 32-bit operation results. So when a register
providing the guard-bit parts are specified as a destination operand, the guard-bit parts will
copy bit 31 of the operation result.

The multiply operation of the DSP unit side is not integer but fixed-point arithmetic operation. So,
the upper words of each multiplier and multiplicand are input into a MAC unit as shown in figure
3.16. In the SH’s standard multiply operations, the lower words of both source operands are input
into a MAC unit. The operation result is also different from the SH’s case. The SH’s multiply
operation result is aligned to the LSB of the destination, but the fixed-point multiply operation
result is aligned to the MSB, so that the LSB of the fixed-point multiply operation result is always
0.

The fixed-point multiply operation is executed in one cycle. Multiply is always unconditional, but
does not affect any condition code bits, DC, N, Z, V, and GT , in DSR.

• Overflow Protection
The S bit in SR is effective for this multiply operation in the DSP unit. See section 3.5.11,
Overflow Protection, for details.
If the S bit is 0, overflow occurs only when H'8000*H'8000 ((-1.0)*(-1.0)) operation is
executed as signed fixed-point multiply. The result is H'00 8000 0000 but it does not mean
(+1.0). If the S bit is 1, overflow is prevented and the result is H'00 7FFF FFFF.

Rev. 3.00 Jan. 18, 2008 Page 136 of 1458


REJ09B0033-0300
Section 3 DSP Operating Unit

3.5.8 Shift Operations

Shift operations can use either register or immediate value as the shift amount operand. Other
source and destination operands are specified by the register. There are two kinds of shift
operations of arithmetic and logical shifts. Table 3.27 shows the variation of this type of operation.
The correspondence between each operand and registers, except for immediate operands, is the
same as the ALU fixed-point operations as shown in table 3.21.

Table 3.27 Variation of Shift Operations

Mnemonic Function Source 1 Source 2 Destination


PSHA Sx, Sy, Dz Arithmetic shift Sx Sy Dz
PSHL Sx, Sy, Dz Logical shift Sx Sy Dz
PSHA #Imm1, Dz Arithmetic shift with Dz Imm1 Dz
immediate.
PSHL #Imm2, Dz Logical shift with Dz Imm2 Dz
immediate.
–32 <= Imm1 <= +32, –16 <= Imm2 <= +16

(1) Arithmetic Shift

Figure 3.17 shows the arithmetic shift operation flow.

Left shift Right shift


39 32 31 16 15 0 39 32 31 16 15 0
0
(MSB copy)
Shift out Shift out
>=0 <0
+32 to -32 Updated GT Z N V DC
39 32 31 23 22 16 15 0 DSR
Shift amount data Sy
(source 2)
6 0
Imm1 Ignored

Figure 3.17 Arithmetic Shift Operation Flow

Rev. 3.00 Jan. 18, 2008 Page 137 of 1458


REJ09B0033-0300
Section 3 DSP Operating Unit

Note: The arithmetic shift operations are basically 40-bit operation, that is, the 32 bits of the
base precision and eight bits of the guard-bit parts. So the signed bit is copied to the guard-
bit parts when a register not providing the guard-bit parts is specified as the source
operand. When a register not providing the guard-bit parts is specified as a destination
operand, the lower 32 bits of the operation result are input into the destination register.

In this arithmetic shift operation, all bits of the source 1 and destination operands are activated.
The shift amount is specified by the source 2 operand as an integer data. The source 2 operand can
be specified by either a register or immediate operand. The available shift range is from –32 to
+32. Here, a negative value means the right shift, and a positive value means the left shift. It is
possible for any source 2 operand to specify from –64 to +63 but the result is unknown if an
invalid shift value is specified. In case of a shift with an immediate operand instruction, the source
1 operand must be the same register as the destination’s. This operation is executed in the DSP
stage, as shown in figure 3.10 as well as in fixed-point operations. The DSP stage is the same
stage as the MA stage in which memory access is performed.

Every time an arithmetic shift operation is executed, the DC, N, Z, V, and GT bits in DSR are
basically updated in accordance with the operation result. In case of a conditional operation, they
are not updated even though the specified condition is true and the operation is executed. In case
of an unconditional operation, they are always updated in accordance with the operation result.
The definition of the DC bit is selected by the CS[2:0] (condition selection) bits in DSR. The DC
bit result is:

1. Carry or Borrow Mode: CS[2:0] = B'000


The DC bit indicates the last shifted out data as the operation result.
2. Negative Value Mode: CS[2:0] = B'001
The DC bit is set to 1 when the operation result is a negative value, and cleared to 0 when the
operation result is zero or a positive value.
3. Zero Value Mode: CS[2:0] = B'010
The DC bit is set when the operation result is zero; otherwise it is cleared.
4. Overflow Mode: CS[2:0] = B'011
The DC bit is set to 1 when an overflow occurs.
5. Signed Greater Than Mode: CS[2:0] = B'100
The DC bit is always cleared to 0.
6. Signed Greater Than or Equal Mode: CS[2:0] = B'101
The DC bit is always cleared to 0.

Rev. 3.00 Jan. 18, 2008 Page 138 of 1458


REJ09B0033-0300
Section 3 DSP Operating Unit

The N bit always indicates the same state as the DC bit set in negative value mode by the CS[2:0]
bits. See the negative value mode part above. The Z bit always indicates the same state as the DC
bit set in zero value mode by the CS[2:0] bits. See the zero value mode part above. The V bit
always indicates the same state as the DC bit set in overflow mode by the CS[2:0] bits. See the
overflow mode part above. The GT bit always indicates the same state as the DC bit set in signed
greater than mode by the CS[2:0] bits. See the signed greater than mode part above.

• Overflow Protection
The S bit in SR is also effective for arithmetic shift operation in the DSP unit. See section
3.5.11, Overflow Protection, for details.

(2) Logical Shift

Figure 3.18 shows the logical shift operation flow.

Cleared to 0
Left shift Right shift
39 32 31 16 15 0 39 32 31 16 15 0

0 0
Shift out Shift out

>=0 <0
Updated GT Z N V DC
+16 to -16 DSR
39 32 31 22 21 16 15 0
Shift amount data Sy
(source 2)
5 0 Ignored
Imm2

Figure 3.18 Logical Shift Operation Flow

As shown in figure 3.18, the logical shift operation uses the upper word of the source 1 operand
and the destination operand. The lower word and guard-bit parts are ignored for the source
operand and those of the destination operand are automatically cleared as in the ALU logical
operations. The shift amount is specified by the source 2 operand as an integer data. The source 2
operand can be specified by either the register or immediate operand. The available shift range is
from –16 to +16. Here, a negative value means the right shift, and a positive value means the left
shift. It is possible for any source 2 operand to specify from –32 to +31, but the result is unknown
if an invalid shift value is specified. In case of a shift with an immediate operand instruction, the
source 1 operand must be the same register as the destination’s. These operations are executed in
the DSP stage, as shown in figure 3.10. The DSP stage is the same stage as the MA stage in which
memory access is performed.

Rev. 3.00 Jan. 18, 2008 Page 139 of 1458


REJ09B0033-0300
Section 3 DSP Operating Unit

Every time a logical shift operation is executed, the DC, N, Z, V, and GT bits in DSR are basically
updated in accordance with the operation result. In case of a conditional operation, they are not
updated even though the specified condition is true and the operation is executed. In case of an
unconditional operation, they are always updated in accordance with the operation result. The
definition of the DC bit is selected by the CS[2:0] (condition selection) bits in DSR. The DC bit
result is:

1. Carry or Borrow Mode: CS[2:0] = B'000


The DC bit indicates the last shifted out data as the operation result.
2. Negative Value Mode: CS[2:0] = B'001
Bit 31 of the operation result is loaded into the DC bit.
3. Zero Value Mode: CS[2:0] = B'010
The DC bit is set to 1 when the operation result is zero; otherwise it is cleared to 0.
4. Overflow Mode: CS[2:0] = B'011
The DC bit is always cleared to 0.
5. Signed Greater Than Mode: CS[2:0] = B'100
The DC bit is always cleared to 0.
6. Signed Greater Than or Equal Mode: CS[2:0] = B'101
The DC bit is always cleared.

The N bit always indicates the same state as the DC bit set in negative value mode by the CS[2:0]
bits. See the negative value mode part above. The Z bit always indicates the same state as the DC
bit set in zero value mode by the CS[2:0] bits. See the zero value mode part above. The V bit
always indicates the same state as the DC bit set in overflow mode by the CS[2:0] bits, but it is
always cleared in this operation. So is the GT bit.

Rev. 3.00 Jan. 18, 2008 Page 140 of 1458


REJ09B0033-0300
Section 3 DSP Operating Unit

3.5.9 Most Significant Bit Detection Operation

The PDMSB, most significant bit detection operation, is used to calculate the shift amount for
normalization. Figure 3.19 shows the PDMSB operation flow and table 3.28 shows the operation
definition. Table 3.29 shows the possible variations of this type of operation. The correspondence
between each operand and registers is the same as for ALU fixed-point operations, as shown in
table 3.21.

Note: The result of the MSB detection operation is basically 24 bits as well as ALU integer
operation, the upper 16 bits of the base precision and eight bits of the guard-bit parts.
When a register not providing the guard-bit parts is specified as a destination operand, the
upper word of the operation result is input into the destination register.

As shown in figure 3.19, the PDMSB operation uses all bits as a source operand, but the
destination operand is treated as an integer operation result because shift amount data for
normalization should be integer data as described in section 3.5.8, Shift Operations. These
operations are executed in the DSP stage, as shown in figure 3.10. The DSP stage is the same
stage as the MA stage in which memory access is performed.

Every time a PDMSB operation is executed, the DC, N, Z, V, and GT bits in DSR are basically
updated in accordance with the operation result. In case of a conditional operation, they are not
updated, even though the specified condition is true, and the operation is executed. In case of an
unconditional operation, they are always updated with the operation result.

39 31 0
Guard Source 1 or 2

GT Z N V DC
Priority encoder
DSR

Guard Cleared to 0
39 31 0

Figure 3.19 PDMSB Operation Flow

Rev. 3.00 Jan. 18, 2008 Page 141 of 1458


REJ09B0033-0300
Section 3 DSP Operating Unit

The definition of the DC bit is selected by the CS0 to CS2 (condition selection) bits in DSR. The
DC bit result is

(1) Carry or Borrow Mode: CS[2:0] = B'000

The DC bit is always cleared to 0.

(2) Negative Value Mode: CS[2:0] = B'001

The DC bit is set when the operation result is a negative value, and cleared to 0 when the
operation result is zero or a positive value.

(3) Zero Value Mode: CS[2:0] = B'010

The DC bit is set when the operation result is zero; otherwise it is cleared to 0.

(4) Overflow Mode: CS[2:0] = B'011

The DC bit is always cleared to 0.

(5) Signed Greater Than Mode: CS[2:0] = B'100

The DC bit is set to 1 when the operation result is a positive value; otherwise it is cleared to 0.

(6) Signed Greater Than or Equal Mode: CS[2:0] = B'101

The DC bit is set to 1 when the operation result is zero or a positive value; otherwise it is cleared
to 0.

Rev. 3.00 Jan. 18, 2008 Page 142 of 1458


REJ09B0033-0300
Section 3 DSP Operating Unit

Table 3.28 Operation Definition of PDMSB

Source Data Result for DST


Guard
Guard Bit Upper Word Lower Word Bit Upper Word
39 38 … 33 32 31 30 29 28 … 3 2 1 0 39 to 31 to 21 20 19 18 17 16 Decimal
32 22
0 0 … 0 0 0 0 0 0 … 0 0 0 0 All 0 All 0 0 1 1 1 1 1 +31
0 0 … 0 0 0 0 0 0 … 0 0 0 1 All 0 All 0 0 1 1 1 1 0 +30
0 0 … 0 0 0 0 0 0 … 0 0 1 * All 0 All 0 0 1 1 1 0 1 +29
0 0 … 0 0 0 0 0 0 … 0 1 * * All 0 All 0 0 1 1 1 0 0 +28
: : :
0 0 … 0 0 0 0 0 1 … * * * * All 0 All 0 0 0 0 0 1 0 +2
0 0 … 0 0 0 0 1 * … * * * * All 0 All 0 0 0 0 0 0 1 +1
0 0 … 0 0 0 1 * * … * * * * All 0 All 0 0 0 0 0 0 0 0
0 0 … 0 0 1 * * * … * * * * All 1 All 1 1 1 1 1 1 1 –1
0 0 … 0 1 * * * * … * * * * All 1 All 1 1 1 1 1 1 0 –2
: : :
0 1 … * * * * * * … * * * * All 1 All 1 1 1 1 0 0 0 –8
1 0 … * * * * * * … * * * * All 1 All 1 1 1 1 0 0 0 –8
:
1 1 … 1 0 * * * * … * * * * All 1 All 1 1 1 1 1 1 0 –2
1 1 … 1 1 0 * * * … * * * * All 1 All 1 1 1 1 1 1 1 –1
1 1 … 1 1 1 0 * * … * * * * All 0 All 0 0 0 0 0 0 0 0
1 1 … 1 1 1 1 0 * … * * * * All 0 All 0 0 0 0 0 0 1 +1
1 1 … 1 1 1 1 1 0 … * * * * All 0 All 0 0 0 0 0 1 0 +2
: : :
1 1 … 1 1 1 1 1 1 … 1 0 * * All 0 All 0 0 1 1 1 0 0 +28
1 1 … 1 1 1 1 1 1 … 1 1 0 * All 0 All 0 0 1 1 1 0 1 +29
1 1 … 1 1 1 1 1 1 … 1 1 1 0 All 0 All 0 0 1 1 1 1 0 +30
1 1 … 1 1 1 1 1 1 … 1 1 1 1 All 0 All 0 0 1 1 1 1 1 +31
Note: * means don’t care.

Rev. 3.00 Jan. 18, 2008 Page 143 of 1458


REJ09B0033-0300
Section 3 DSP Operating Unit

Table 3.29 Variation of PDMSB Operation

Mnemonic Function Source Source 2 Destination


PDMSB MSB detection Sx  Dz
 Sy Dz

The N bit always indicates the same state as the DC bit set in negative value mode by the CS[2:0]
bits. See the negative value mode part above. The Z bit always indicates the same state as the DC
bit set in zero value mode by the CS[2:0] bits. See the zero value mode part above. The V bit is
always cleared. The GT bit always indicates the same state as the DC bit set in signed greater than
mode by the CS[2:0] bits. See the signed greater than mode part above.

3.5.10 Rounding Operation

The DSP unit provides the function that rounds from 32 bits to 16 bits. In case of providing guard-
bit parts, it rounds from 40 bits to 24 bits. When a round instruction is executed, H'00008000 is
added to the source operand data and then, the lower word is cleared. Figure 3.20 shows the
rounding operation flow and figure 3.21 shows the operation definition. Table 3.30 shows the
variation of this type of operation. The correspondence between each operand and registers is the
same as ALU fixed-point operations as shown in table 3.21.

As shown in figure 3.21, the rounding operation uses full-size data for both source and destination
operands. These operations are executed in the DSP stage as shown in figure 3.10. The DSP stage
is the same stage as the MA stage in which memory access is performed.

The rounding operation is always executed unconditionally, so that the DC, N, Z, V, and GT bits
in DSR are always updated in accordance with the operation result. The definition of the DC bit is
selected by the CS0 to CS2 (condition selection) bits in DSR. The result of these condition code
bits is the same as the ALU-fixed point arithmetic operations.

Rev. 3.00 Jan. 18, 2008 Page 144 of 1458


REJ09B0033-0300
Section 3 DSP Operating Unit

39 31 0
Guard Source 1 or 2 H'00008000

ALU GT Z N V DC
DSR

Guard Cleared to 0
39 31 0

Figure 3.20 Rounding Operation Flow

Rounded result

H'00 0002

H'00 0001
Analog value

0 True value
H'00 0001 8000
H'00 0002 0000
H'00 0002 8000

Figure 3.21 Definition of Rounding Operation

Table 3.30 Variation of Rounding Operation

Mnemonic Function Source 1 Source 2 Destination


PRND Rounding Sx  Dz
 Sy Dz

• Overflow Protection
The S bit in SR is effective for any rounding operations in the DSP unit. See section 3.5.11,
Overflow Protection, for details.

Rev. 3.00 Jan. 18, 2008 Page 145 of 1458


REJ09B0033-0300
Section 3 DSP Operating Unit

3.5.11 Overflow Protection

The S bit in SR is effective for any arithmetic operations executed in the DSP unit, including the
SH’s standard multiply and MAC operations. The S bit in SR is used as the overflow protection
enable bit. The arithmetic operation overflows when the operation result exceeds the range of
two’s complement representation without guard-bit parts. Table 3.31 shows the definition of
overflow protection for fixed-point arithmetic operations, including fixed-point signed by signed
multiplication described in section 3.5.7, Fixed-Point Multiply Operation. Table 3.32 shows the
definition of overflow protection for integer arithmetic operations. The lower word of the
saturation value of the integer arithmetic operation is don’t care. Lower word value cannot be
guaranteed.

When the overflow protection is effective, overflow never occurs. So, the V bit is cleared, and the
DC bit is also cleared when the overflow mode is selected by the CS[2:0] bits.

Table 3.31 Definition of Overflow Protection for Fixed-Point Arithmetic Operations

Sign Overflow Condition Fixed Value Hex Representation


–31 –31
Positive Result > 1 – 2 1–2 H'00 7FFF FFFF
Negative Result < –1 –1 H'FF 8000 0000

Table 3.32 Definition of Overflow Protection for Integer Arithmetic Operations

Sign Overflow Condition Fixed Value Hex Representation


15 15
Positive Result > 2 – 1 2 –1 00 7FFF ****
15 15
Negative Result < –2 –2 FF 8000 ****
Note: * means don’t care.

Rev. 3.00 Jan. 18, 2008 Page 146 of 1458


REJ09B0033-0300
Section 3 DSP Operating Unit

3.5.12 Local Data Move Instruction

The DSP unit of this LSI provides additional two independent registers, MACL and MACH, in
order to support CPU standard multiply/MAC operations. They can be also used as temporary
storage registers by local data move instructions between MACH/L and other DSP registers.
Figure 3.22 shows the flow of seven local data move instructions. Table 3.33 shows the variation
of this type of instruction.

MACH
MACL

PSTS PLDS

X0 X1
Y0 Y1
M0 M1
A0 A1
A0G A1G DSR

Cannot be used

Figure 3.22 Local Data Move Instruction Flow

Table 3.33 Variation of Local Data Move Operations

Mnemonic Function Operand


PLDS Data move from DSP register to MACL/MACH Dz
PSTS Data move from MACL/MACH to DSP register Dz

This instruction is very similar to other transfer instructions. If either the A0 or A1 register is
specified as the destination operand of PSTS, the signed bit is sign-extended and copied into the
corresponding guard-bit parts, A0G or A1G. The DC bit in DSR and other condition code bits are
not updated regardless of the instruction result. This instruction can operate as a conditional. This
instruction can operate with MOVX and MOVY in parallel.

Rev. 3.00 Jan. 18, 2008 Page 147 of 1458


REJ09B0033-0300
Section 3 DSP Operating Unit

3.5.13 Operand Conflict

When an identical destination operand is specified with multiple parallel instructions, data conflict
occurs. Table 3.34 shows the correspondence between each operand and registers.

Table 3.34 Correspondence between Operands and Registers

X-Memory Y-Memory 6-Instruction 3-Instruction 3-Instruction


Load Load ALU Multiply ALU
Ax Ix Dx Ay Iy Dy Sx Sy Du Se Sf Dg Sx Sy Dz
1 2 2 1
DSP A0 * * * * *1
Registers A1 *1 *2 *1 *1 *2 *1 *1
M0 *1 *1 *1 *1
M1 *1 *1 *1 *1
2 1 2 1 1 1
X0 * * * * * * *2
X1 *2 *1 *1 *1 *2
2 1 2 1 1 1 2
Y0 * * * * * * *
Y1 *2 *1 *1 *1 *2
Notes: 1. Registers available for operands
2. Registers available for operands (when there is operand conflict)

There are three cases of operand conflict problems.

• When ALU operation and multiply instructions specify the same destination operand (Du and
Dg)
• When X-memory load and ALU operation specify the same destination operand (Dx and Du,
or Dz)
• When Y-memory load and ALU operation specify the same destination operand (Dy and Du,
or Dz)

In these cases above, the result is not guaranteed.

Rev. 3.00 Jan. 18, 2008 Page 148 of 1458


REJ09B0033-0300
Section 3 DSP Operating Unit

3.6 DSP Extended Function Instruction Set

3.6.1 CPU Extended Instructions

Table 3.35 DSP Mode Extended System Control Instructions

Instruction Instruction Code Operation Execution States T Bit

SETRC #imm 10000010iiiiiiii imm → RC (of SR) 1 –


SETRC Rn 0100nnnn00010100 Rn[11:0] → RC(of SR) 1 –
LDRS @(disp,PC) 10001100dddddddd (disp x 2 + PC) → RS 1 –
LDRE @(disp,PC) 10001110dddddddd (disp x 2 + PC) → RE 1 –
STC MOD,Rn 0000nnnn01010010 MOD →Rn 1 –
STC RS,Rn 0000nnnn01100010 RS → Rn 1 –
STC RE,Rn 0000nnnn01110010 RE → Rn 1 –
STS DSR,Rn 0000nnnn01101010 DSR → Rn 1 –
STS A0,Rn 0000nnnn01111010 A0 → Rn 1 –
STS X0,Rn 0000nnnn10001010 X0 → Rn 1 –
STS X1,Rn 0000nnnn10011010 X1 → Rn 1 –
STS Y0,Rn 0000nnnn10101010 Y0 → Rn 1 –
STS Y1,Rn 0000nnnn10111010 Y1 → Rn 1 –
STS.L DSR,@-Rn 0100nnnn01100010 Rn-4 → Rn, DSR → (Rn) 1 –
STS.L A0,@-Rn 0100nnnn01110010 Rn-4 → Rn, A0 → (Rn) 1 –
STS.L X0,@-Rn 0100nnnn10000010 Rn-4 → Rn, X0 → (Rn) 1 –
STS.L X1,@-Rn 0100nnnn10010010 Rn-4 → Rn, X1 → (Rn) 1 –
STS.L Y0,@-Rn 0100nnnn10100010 Rn-4 → Rn, Y0 → (Rn) 1 –
STS.L Y1,@-Rn 0100nnnn10110010 Rn-4 → Rn, Y1 →(Rn) 1 –
STC.L MOD,@-Rn 0100nnnn01010011 Rn-4 → Rn, MOD → (Rn) 1 –
STC.L RS,@-Rn 0100nnnn01100011 Rn-4 → Rn, RS → (Rn) 1 –
STC.L RE,@-Rn 0100nnnn01110011 Rn-4 → Rn, RE → (Rn) 1 –
LDS.L @Rn + ,DSR 0100nnnn01100110 (Rn) → DSR, Rn + 4→Rn 1 –
LDS.L @Rn + ,A0 0100nnnn01110110 (Rn) → A0, Rn + 4 → Rn 1 –
LDS.L @Rn + ,X0 0100nnnn10000110 (Rn) → X0, Rn + 4 → Rn 1 –
LDS.L @Rn + ,X1 0100nnnn10010110 (Rn) → X1, Rn + 4 → Rn 1 –
LDS.L @Rn + ,Y0 0100nnnn10100110 (Rn) → Y0, Rn + 4 → Rn 1 –

Rev. 3.00 Jan. 18, 2008 Page 149 of 1458


REJ09B0033-0300
Section 3 DSP Operating Unit

Instruction Instruction Code Operation Execution States T Bit

LDS.L @Rn + ,Y1 0100nnnn10110110 (Rn) → Y1, Rn + 4 → Rn 1 –


LDC.L @Rn + ,MOD 0100nnnn01010111 (Rn) → MOD, Rn + 4 → Rn 4 –
LDC.L @Rn + ,RS 0100nnnn01100111 (Rn) → RS, Rn + 4 → Rn 4 –
LDC.L @Rn + ,RE 0100nnnn01110111 (Rn) → RE, Rn + 4 → Rn 4 –
LDS Rn,DSR 0100nnnn01101010 Rn → DSR 1 –
LDS Rn,A0 0100nnnn01111010 Rn → A0 1 –
LDS Rn,X0 0100nnnn10001010 Rn → X0 1 –
LDS Rn,X1 0100nnnn10011010 Rn → X1 1 –
LDS Rn,Y0 0100nnnn10101010 Rn → Y0 1 –
LDS Rn,Y1 0100nnnn10111010 Rn → Y1 1 –
LDC Rn,MOD 0100nnnn01011110 Rn → MOD 4 –
LDC Rn,RS 0100nnnn01101110 Rn → RS 4 –
LDC Rn,RE 0100nnnn01111110 Rn → RE 4 –

Rev. 3.00 Jan. 18, 2008 Page 150 of 1458


REJ09B0033-0300
Section 3 DSP Operating Unit

3.6.2 Double-Data Transfer Instructions

Table 3.36 Double Data Transfer Instruction

Execution
Instruction Instruction Code Operation States DC

X NOPX 1111000*0*0*00** X memory no access 1 –


memory MOVX.W @Ax,Dx 111100A*D*0*01** (Ax) → MSW of Dx, 0 → 1 –
data LSW of Dx
transfer MOVX.W @Ax+,Dx 111100A*D*0*10** (Ax) → MSW of Dx, 0 → 1 –
LSW of Dx, Ax + 2 → Ax
MOVX.W @Ax+Ix,Dx 111100A*D*0*11** (Ax) → MSW of Dx, 0 → 1 –
LSW of Dx, Ax + Ix → Ax
MOVX.W Da,@Ax 111100A*D*1*01** MSW of Da → (Ax) 1 –
MOVX.W Da,@Ax+ 111100A*D*1*10** MSW of Da → (Ax), Ax + 2 1 –
→ Ax
MOVX.W Da,@Ax+Ix 111100A*D*1*11** MSW of Da → (Ax), Ax + Ix 1 –
→ Ax
Y NOPY 111100*0*0*0**00 Y memory no access 1 –
memory
MOVY.W @Ay,Dy 111100*A*D*0**01 (Ay) → MSW of Dy, 0 → 1 –
data LSW of Dy
transfer
MOVY.W @Ay+,Dy 111100*A*D*0**10 (Ay) → MSW of Dy, 0 → 1 –
LSW of Dy, Ay + 2 → Ay
MOVY.W @Ay+Iy,Dy 111100*A*D*0**11 (Ay) → MSW of Dy, 0 → 1 –
LSW of Dy, Ay + Iy → Ay
MOVY.W Da,@Ay 111100*A*D*1**01 MSW of Da → (Ay) 1 –
MOVY.W Da,@Ay+ 111100*A*D*1**10 MSW of Da → (Ay), Ay + 2 1 –
→ Ay
MOVY.W Da,@Ay+Iy 111100*A*D*1**11 MSW of Da → (Ay), Ay + Iy 1 –
→ Ay

Rev. 3.00 Jan. 18, 2008 Page 151 of 1458


REJ09B0033-0300
Section 3 DSP Operating Unit

3.6.3 Single-Data Transfer Instructions

Table 3.37 Single Data Transfer Instructions

Execution
Instruction Instruction Code Operation States DC Category

MOVS.W @-As,Ds 111101AADDDD0000 As-2 → As, (As) → MSW of 1 –


Ds, 0 → LSW of Ds
MOVS.W @As,Ds 111101AADDDD0100 (As) → MSW of Ds, 0 1 –
→ LSW of Ds
MOVS.W @As+,Ds 111101AADDDD1000 (As) → MSW of Ds, 0 1 –
→ LSW of Ds, As + 2 → As
MOVS.W @As+Ix,Ds 111101AADDDD1100 (Asc) → MSW of Ds, 0 1 –
→ LSW of Ds, As + Ix → As
MOVS.W Ds,@-As 111101AADDDD0001 As-2 → As, MSW of Ds 1 – *
→ (As)
MOVS.W Ds,@As 111101AADDDD0101 MSW of Ds → (As) 1 – *
MOVS.W Ds,@As+ 111101AADDDD1001 MSW of Ds → (As), As + 2 1 – *
→ As
MOVS.W Ds,@As+Ix 111101AADDDD1101 MSW of Ds → (As), As + Ix 1 – *
→ As
MOVS.L @-As,Ds 111101AADDDD0010 As-4 → As, (As) → Ds 1 –
MOVS.L @As,Ds 111101AADDDD0110 (As) → Ds 1 –
MOVS.L @As+,Ds 111101AADDDD1010 (As) → Ds, As + 4 → As 1 –
MOVS.L @As+Ix,Ds 111101AADDDD1110 (As) → Ds, As + Ix → As 1 –
MOVS.L Ds,@-As 111101AADDDD0011 As-4 → As, Ds → (As) 1 –
MOVS.L Ds,@As 111101AADDDD0111 Ds → (As) 1 –
MOVS.L Ds,@As+ 111101AADDDD1011 Ds → (As), As + 4 → As 1 –
MOVS.L Ds,@As+Ix 111101AADDDD1111 Ds → (As), As + Ix → As 1 –
Note: * If guard bit registers A0G and A1G are specified in source operand Ds, the data is
output to the LDB[7:0] bus and the sign bit is copied into the upper bits, [31:8].

Rev. 3.00 Jan. 18, 2008 Page 152 of 1458


REJ09B0033-0300
Section 3 DSP Operating Unit

The correspondence between DSP data transfer operands and registers is shown in table 3.38.

Table 3.38 Correspondence between DSP Data Transfer Operands and Registers

Register Ax Ix Dx Ay Iy Dy Da As Ds
SH R0
register R1
R2 (As2) Yes
R3 (As3) Yes
R4 (Ax0) Yes Yes
R5 (Ax1) Yes Yes
R6 (Ay0) Yes
R7 (Ay1) Yes
R8 (Ix) Yes
R9 (Iy) Yes
DSP A0 Yes Yes
register
A1 Yes Yes
M0 Yes
M1 Yes
X0 Yes Yes
X1 Yes Yes
Y0 Yes Yes
Y1 Yes Yes
A0G Yes
A1G Yes

Rev. 3.00 Jan. 18, 2008 Page 153 of 1458


REJ09B0033-0300
Section 3 DSP Operating Unit

3.6.4 DSP Operation Instructions

Table 3.39 DSP Operation Instructions

Execution
Instruction Instruction Code Operation States DC

PMULS Se,Sf, Dg 111110********** Se*Sf → Dg (Signed) 1 –


0100eeff0000gg00
PADD Sx,Sy,Du 111110********** Sx + Sy → Du Se*Sf → Dg (Signed) 1 *
PMULS Se,Sf,Dg 0111eeffxxyygguu
PSUB Sx,Sy,Du 111110********** Sy-Sy → Du Se*Sf → Dg (Signed) 1 *
PMULS Se,Sf,Dg 0110eeffxxyygguu
PADD Sx,Sy,Dz 111110********** Sx + Sy → Dz 1 *
10110001xxyyzzzz
DCT PADD Sx,Sy,Dz 111110********** If DC = 1, Sx + Sy → Dz 1 –
10110010xxyyzzzz If DC = 0, nop
DCF PADD Sx,Sy,Dz 111110********** If DC = 0, Sx + Sy → Dz 1 –
10110011xxyyzzzz If DC = 1, nop
PSUB Sx,Sy,Dz 111110********** Sx-Sy → Dz 1 *
10100001xxyyzzzz
DCT PSUB Sx,Sy,Dz 111110********** If DC = 1, Sx-Sy → Dz 1 –
10100010xxyyzzzz If DC = 0, nop
DCF PSUB Sx,Sy,Dz 111110********** If DC = 0, Sx-Sy → Dz 1 –
10100011xxyyzzzz If DC = 1, nop
PSHA Sx,Sy,Dz 111110********** If Sy >= 0, Sx<<Sy → Dz (arithmetic shift) 1 *
10010001xxyyzzzz If Sy < 0, Sx>>Sy → Dz
DCT PSHA Sx,Sy,Dz 111110********** If DC = 1 & Sy >= 0, Sx<<Sy → Dz 1 –
10010010xxyyzzzz (arithmetic shift)
If DC=1 & Sy<0, Sx>>Sy → Dz If DC=0, nop
DCF PSHA Sx,Sy,Dz 111110********** If DC = 0 & Sy >= 0, Sx<<Sy → Dz 1 –
10010011xxyyzzzz (arithmetic shift)
If DC = 0 & Sy < 0, Sx>>Sy → Dz
If DC = 1, nop
PSHL Sx,Sy,Dz 111110********** If Sy >= 0, Sx<<Sy → Dz (logical shift) 1 *
10000001xxyyzzzz If Sy < 0, Sx>>Sy → Dz

Rev. 3.00 Jan. 18, 2008 Page 154 of 1458


REJ09B0033-0300
Section 3 DSP Operating Unit

Execution
Instruction Instruction Code Operation States DC

DCT PSHL Sx,Sy,Dz 111110********** If DC = 1 & Sy >= 0, Sx<<Sy → Dz 1 –


10000010xxyyzzzz (logical shift)
If DC = 1 & Sy < 0, Sx>>Sy → Dz
If DC = 0, nop
DCF PSHL Sx,Sy,Dz 111110********** If DC = 0 & Sy >= 0, Sx<<Sy → Dz (logical 1 –
shift)
10000011xxyyzzzz
If DC = 0 & Sy < 0, Sx>>Sy → Dz
If DC = 1, nop
PCOPY Sx,Dz 111110********** Sx →Dz 1 *
11011001xx00zzzz
PCOPY Sy,Dz 111110********** Sy →Dz 1 *
1111100100yyzzzz
DCT PCOPY Sx,Dz 111110********** If DC = 1, Sx → Dz If DC = 0, nop 1 –
11011010xx00zzzz
DCT PCOPY Sy,Dz 111110********** If DC = 1, Sy → Dz If DC = 0, nop 1 –
1111101000yyzzzz
DCF PCOPY Sx,Dz 111110********** If DC = 0, Sx → Dz If DC = 1, nop 1 –
11011011xx00zzzz
DCF PCOPY Sy,Dz 111110********** If DC = 0, Sy → Dz If DC = 1, nop 1 –
1111101100yyzzzz
PDMSB Sx,Dz 111110********** Sx → Dz normalization count shift value 1 *
10011101xx00zzzz
PDMSB Sy,Dz 111110********** Sy → Dz normalization count shift value 1 *
1011110100yyzzzz
DCT PDMSB Sx,Dz 111110********** If DC = 1, normalization count shift value Sx 1 –
→ Dz
10011110xx00zzzz
If DC = 0, nop
DCT PDMSB Sy,Dz 111110********** If DC = 1, normalization count shift value Sy 1 –
→ Dz
1011111000yyzzzz
If DC = 0, nop
DCF PDMSB Sx,Dz 111110********** If DC = 0, normalization count shift value Sx 1 –
→ Dz
10011111xx00zzzz
If DC = 1, nop

Rev. 3.00 Jan. 18, 2008 Page 155 of 1458


REJ09B0033-0300
Section 3 DSP Operating Unit

Execution
Instruction Instruction Code Operation States DC
DCF PDMSB Sy,Dz 111110********** If DC = 0, normalization count shift value 1 –
Sy → Dz
1011111100yyzzzz
If DC=1, nop
PINC Sx,Dz 111110********** MSW of Sx + 1 → Dz 1 *
10011001xx00zzzz
PINC Sy,Dz 111110********** MSW of Sy + 1 → Dz 1 *
1011100100yyzzzz
DCT PINC Sx,Dz 111110********** If DC = 1, MSW of Sx + 1 → Dz 1 –
10011010xx00zzzz If DC = 0, nop
DCT PINC Sy,Dz 111110********** If DC = 1, MSW of Sy + 1 → Dz 1 –
1011101000yyzzzz If DC = 0, nop
DCF PINC Sx,Dz 111110********** If DC = 0, MSW of Sx + 1 → Dz 1 –
10011011xx00zzzz If DC = 1, nop
DCF PINC Sy,Dz 111110********** If DC = 0, MSW of Sy + 1 → Dz 1 –
1011101100yyzzzz If DC = 1, nop
PNEG Sx,Dz 111110********** 0-Sx → Dz 1 *
11001001xx00zzzz
PNEG Sy,Dz 111110********** 0-Sy → Dz 1 *
1110100100yyzzzz
DCT PNEG Sx,Dz 111110********** If DC = 1, 0-Sx → Dz 1 –
11001010xx00zzzz If DC = 0, nop
DCT PNEG Sy,Dz 111110********** If DC = 1, 0-Sy → Dz 1 –
1110101000yyzzzz If DC = 0, nop
DCF PNEG Sx,Dz 111110********** If DC = 0, 0-Sx → Dz 1 –
11001011xx00zzzz If DC = 1, nop
DCF PNEG Sy,Dz 111110********** If DC = 0, 0-Sy → Dz 1 –
1110101100yyzzzz If DC = 1, nop
POR Sx,Sy,Dz 111110********** Sx | Sy → Dz 1 *
10110101xxyyzzzz
DCT POR Sx,Sy,Dz 111110********** If DC = 1, Sx | Sy → Dz 1 –
10110110xxyyzzzz If DC = 0, nop
DCF POR Sx,Sy,Dz 111110********** If DC = 0, Sx | Sy → Dz 1 –
10110111xxyyzzzz If DC = 1, nop

Rev. 3.00 Jan. 18, 2008 Page 156 of 1458


REJ09B0033-0300
Section 3 DSP Operating Unit

Execution
Instruction Instruction Code Operation States DC
PAND Sx,Sy,Dz 111110********** Sx & Sy → Dz 1 *
10010101xxyyzzzz
DCT PAND Sx,Sy,Dz 111110********** If DC = 1, Sx & Sy → Dz 1 –
10010110xxyyzzzz If DC = 0, nop
DCF PAND Sx,Sy,Dz 111110********** If DC = 0, Sx & Sy → Dz 1 –
10010111xxyyzzzz If DC = 1, nop
PXOR Sx,Sy,Dz 111110********** Sx ^ Sy → Dz 1 *
10100101xxyyzzzz
DCT PXOR Sx,Sy,Dz 111110********** If DC = 1, Sx ^ Sy → Dz 1 –
10100110xxyyzzzz If DC = 0, nop
DCF PXOR Sx,Sy,Dz 111110********** If DC = 0, Sx ^ Sy → Dz 1 –
10100111xxyyzzzz If DC = 1, nop
PDEC Sx,Dz 111110********** Sx [39:16]-1 → Dz 1 *
10001001xx00zzzz
DCT PDEC Sx,Dz 111110********** If DC = 1, Sx [39:16]-1 → Dz 1 –
10001010xx00zzzz If DC = 0, nop
DCF PDEC Sx,Dz 111110********** If DC = 0, Sx [39:16]-1 → Dz 1 –
10001011xx00zzzz If DC = 1, nop
PDEC Sy,Dz 111110********** Sy [31:16]-1 → Dz 1 *
1010100100yyzzzz
DCT PDEC Sy,Dz 111110********** If DC = 1, Sy [31:16]-1 → Dz 1 –
1010101000yyzzzz If DC = 0, nop
DCF PDEC Sy,Dz 111110********** If DC = 0, Sy [31:16]-1 → Dz 1 –
1010101100yyzzzz If DC = 1, nop
PCLR Dz 111110********** h'00000000 → Dz 1 *
100011010000zzzz
DCT PCLR Dz 111110********** If DC = 1, h'00000000 → Dz 1 –
100011100000zzzz If DC = 0, nop
DCF PCLR Dz 111110********** If DC = 0, h'00000000 → Dz 1 –
100011110000zzzz If DC = 1, nop
PSHA #imm,Dz 111110********** If imm>=0, Dz<<imm → Dz (arithmetic 1 *
shift)
00010iiiiiiizzzz
If imm<0, Dz>>imm → Dz

Rev. 3.00 Jan. 18, 2008 Page 157 of 1458


REJ09B0033-0300
Section 3 DSP Operating Unit

Execution
Instruction Instruction Code Operation States DC

PSHL #imm,Dz 111110********** If imm>=0, Dz<<imm → Dz (logical shift) 1 *


00000iiiiiiizzzz If imm<0, Dz>>imm → Dz
PSTS MACH,Dz 111110********** MACH → Dz 1 –
110011010000zzzz
DCT PSTS MACH,Dz 111110********** If DC = 1, MACH → Dz 1 –
110011100000zzzz
DCF PSTS MACH,Dz 111110********** If DC = 0, MACH → Dz 1 –
110011110000zzzz
PSTS MACL,Dz 111110********** MACL → Dz 1 –
110111010000zzzz
DCT PSTS MACL,Dz 111110********** If DC = 1, MACL → Dz 1 –
110111100000zzzz
DCF PSTS MACL,Dz 111110********** If DC = 0, MACL → Dz 1 –
110111110000zzzz
PLDS Dz,MACH 111110********** Dz → MACH 1 –
111011010000zzzz
DCT PLDS Dz,MACH 111110********** If DC = 1, Dz → MACH 1 –
111011100000zzzz
DCF PLDS Dz,MACH 111110********** If DC = 0, Dz → MACH 1 –
111011110000zzzz
PLDS Dz,MACL 111110********** Dz → MACL 1 –
111111010000zzzz
DCT PLDS Dz,MACL 111110********** If DC = 1, Dz → MACL 1 –
111111100000zzzz
DCF PLDS Dz,MACL 111110********** If DC = 0, Dz → MACL 1 –
111111110000zzzz
PADDC Sx,Sy,Dz 111110********** Sx + Sy + DC →Dz Carry → DC 1 Carry
10110000xxyyzzzz
PSUBC Sx,Sy, 111110********** Sx-Sy-DC → Dz Borrow → DC 1 Borrow
Dz
10100000xxyyzzzz
PCMP Sx,Sy 111110********** Sx-Sy → DC update 1 *
10000100xxyy0000

Rev. 3.00 Jan. 18, 2008 Page 158 of 1458


REJ09B0033-0300
Section 3 DSP Operating Unit

Execution
Instruction Instruction Code Operation States DC

PABS Sx,Dz 111110********** If Sx<0, 0-Sx → Dz If Sx>=0, Sx→ Dz 1 *


10001000xx00zzzz
PABS Sy,Dz 111110********** If Sy<0, 0-Sy → Dz If Sy>=0, Sy → Dz 1 *
1010100000yyzzzz
PRND Sx,Dz 111110********** Sx + h'00008000 → Dz 1 *
LSW of Dz → h'0000
10011000xx00zzzz
PRND Sy,Dz 111110********** Sy + h'00008000 → Dz 1 *
LSW of Dz → h'0000
1011100000yyzzzz
Note: * See table 3.19.

Rev. 3.00 Jan. 18, 2008 Page 159 of 1458


REJ09B0033-0300
Section 3 DSP Operating Unit

3.6.5 Operation Code Map in DSP Mode

Table 3.40 shows the operation code map including an instruction codes extended in the DSP
mode.

Table 3.40 Operation Code Map

Instruction Code Fx: 0000 Fx: 0001 Fx: 0010 Fx: 0011 to 1111

MSB LSB MD: 00 MD: 01 MD: 10 MD: 11

0000 Rn Fx 0000

0000 Rn Fx 0001

0000 Rn 00MD 0010 STC SR, Rn STC GBR, Rn STC VBR, Rn STC SSR, Rn

0000 Rn 01MD 0010 STC SPC, Rn STC MOD, Rn STC RS, Rn STC RE, Rn

0000 Rn 10MD 0010 STC R0_BANK, Rn STC R1_BANK, Rn STC R2_BANK, Rn STC R3_BANK, Rn

0000 Rn 11MD 0010 STC R4_BANK, Rn STC R5_BANK, Rn STC R6_BANK, Rn STC R7_BANK, Rn

0000 Rm 00MD 0011 BSRF Rm BRAF Rm

0000 Rm 10MD 0011 PREF @Rm

0000 Rn Rm 01MD MOV.B Rm, @(R0, Rn) MOV.W Rm, @(R0, Rn) MOV.L Rm,@(R0, Rn) MUL.L Rm, Rn

0000 0000 00MD 1000 CLRT SETT CLRMAC LDTLB

0000 0000 01MD 1000 CLRS SETS

0000 0000 10MD 1000

0000 0000 11MD 1000

0000 0000 Fx 1001 NOP DIV0U

0000 0000 Fx 1010

0000 0000 Fx 1011 RTS SLEEP RTE

0000 Rn Fx 1000

0000 Rn Fx 1001 MOVT Rn

0000 Rn 00MD 1010 STS MACH, Rn STS MACL, Rn STS PR, Rn

0000 Rn 01MD 1010 STS DSR, Rn STS A0, Rn

0000 Rn 10MD 1010 STS X0, Rn STS X1, Rn STS Y0, Rn STS Y1, Rn

0000 Rn Fx 1011

Rev. 3.00 Jan. 18, 2008 Page 160 of 1458


REJ09B0033-0300
Section 3 DSP Operating Unit

Instruction Code Fx: 0000 Fx: 0001 Fx: 0010 Fx: 0011 to 1111

MSB LSB MD: 00 MD: 01 MD: 10 MD: 11

0000 Rn Rm 11MD MOV. B MOV.W MOV.L MAC.L


@(R0, Rm), Rn @(R0, Rm), Rn @(R0, Rm), Rn @Rm+,@Rn+

0001 Rn Rm disp MOV.L


Rm, @(disp:4, Rn)

0010 Rn Rm 00MD MOV.B Rm, @Rn MOV.W Rm, @Rn MOV.L Rm, @Rn

0010 Rn Rm 01MD MOV.B Rm, @−Rn MOV.W Rm, @−Rn MOV.L Rm, @−Rn DIV0S Rm, Rn

0010 Rn Rm 10MD TST Rm, Rn AND Rm, Rn XOR Rm, Rn OR Rm, Rn

0010 Rn Rm 11MD CMP/STR Rm, Rn XTRCT Rm, Rn MULU.W Rm, Rn MULSW Rm, Rn

0011 Rn Rm 00MD CMP/EQ Rm, Rn CMP/HS Rm, Rn CMP/GE Rm, Rn

0011 Rn Rm 01MD DIV1 Rm, Rn DMULU.L Rm,Rn CMP/HI Rm, Rn CMP/GT Rm, Rn

0011 Rn Rm 10MD SUB Rm, Rn SUBC Rm, Rn SUBV Rm, Rn

0011 Rn Rm 11MD ADD Rm, Rn DMULS.L Rm,Rn ADDC Rm, Rn ADDV Rm, Rn

0100 Rn Fx 0000 SHLL Rn DT Rn SHAL Rn

0100 Rn Fx 0001 SHLR Rn CMP/PZ Rn SHAR Rn

0100 Rn Fx 0010 STS.L STS.L STS.L


MACH, @−Rn MACL, @−Rn PR, @−Rn

0100 Rn 00MD 0011 STC.L SR, @−Rn STC.L GBR, @−Rn STC.L VBR, @−Rn STC.L SSR, @−Rn

0100 Rn 01MD 0011 STC.L SPC, @−Rn STC.L MOD, @−Rn STC.L RS, @−Rn STC.L RE, @−Rn

0100 Rn 10MD 0011 STC.L STC.L STC.L STC.L


R0_BANK, @−Rn R1_BANK, @−Rn R2_BANK, @−Rn R3_BANK, @−Rn

0100 Rn 11MD 0011 STC.L STC.L STC.L STC.L


R4_BANK, @−Rn R5_BANK, @−Rn R6_BANK, @−Rn R7_BANK, @−Rn

0100 Rn Fx 0100 ROTL Rn SETRC Rn ROTCL Rn

0100 Rn Fx 0101 ROTR Rn CMP/PL Rn ROTCR Rn

0100 Rm 00MD 0110 LDS.L LDS.L LDS.L


@Rm+, MACH @Rm+, MACL @Rm+, PR

0100 Rm 01MD 0110 LDS.L LDS.L


@Rm+, DSR @Rm+, A0

0100 Rm 10MD 0110 LDS.L @Rm+, X0 LDS.L @Rm+, X1 LDS.L @Rm+, Y0 LDS.L @Rm+, Y1

Rev. 3.00 Jan. 18, 2008 Page 161 of 1458


REJ09B0033-0300
Section 3 DSP Operating Unit

Instruction Code Fx: 0000 Fx: 0001 Fx: 0010 Fx: 0011 to 1111

MSB LSB MD: 00 MD: 01 MD: 10 MD: 11

0100 Rm 00MD 0111 LDC.L @Rm+, SR LDC.L @Rm+, GBR LDC.L @Rm+, VBR LDC.L @Rm+, SSR

0100 Rm 01MD 0111 LDC.L @Rm+, SPC LDC.L @Rm+, MOD LDC.L @Rm+, RS LDC.L @Rm+, RE

0100 Rm 10MD 0111 LDC.L LDC.L LDC.L LDC.L


@Rm+, R0_BANK @Rm+, R1_BANK @Rm+, R2_BANK @Rm+, R3_BANK

0100 Rm 11MD 0111 LDC.L LDC.L LDC.L LDC.L


@Rm+, R4_BANK @Rm+, R5_BANK @Rm+, R6_BANK @Rm+, R7_BANK

0100 Rn Fx 1000 SHLL2 Rn SHLL8 Rn SHLL16 Rn

0100 Rn Fx 1001 SHLR2 Rn SHLR8 Rn SHLR16 Rn

0100 Rm 00MD 1010 LDS Rm, MACH LDS Rm, MACL LDS Rm, PR

0100 Rm 01MD 1010 LDS Rm, DSR LDS Rm, A0

0100 Rm 10MD 1010 LDS Rm, X0 LDS Rm, X1 LDS Rm, Y0 LDS Rm, Y1

0100 Rm/Rn Fx 1011 JSR @Rm TAS.B @Rn JMP @Rm

0100 Rn Rm 1100 SHAD Rm, Rn

0100 Rn Rm 1101 SHLD Rm, Rn

0100 Rm 00MD 1110 LDC Rm, SR LDC Rm, GBR LDC Rm, VBR LDC Rm, SSR

0100 Rm 01MD 1110 LDC Rm, SPC LDC Rm, MOD LDC Rm, RS LDC Rm, RE

0100 Rm 10MD 1110 LDC LDC LDC LDC


Rm, R0_BANK Rm, R1_BANK Rm, R2_BANK Rm, R3_BANK

0100 Rm 11MD 1110 LDC LDC LDC LDC


Rm, R4_BANK Rm, R5_BANK Rm, R6_BANK Rm, R7_BANK

0100 Rn Rm 1111 MAC.W @Rm+, @Rn+

0101 Rn Rm disp MOV.L @ (disp:4, Rm), Rn

0110 Rn Rm 00MD MOV.B @Rm, Rn MOV.W @Rm, Rn MOV.L @Rm, Rn MOV Rm, Rn

0110 Rn Rm 01MD MOV.B @Rm+, Rn MOV.W @Rm+, Rn MOV.L @Rm+, Rn NOT Rm, Rn

0110 Rn Rm 10MD SWAP.B Rm, Rn SWAP.W Rm, Rn NEGC Rm, Rn NEG Rm, Rn

0110 Rn Rm 11MD EXTU.B Rm, Rn EXTU.W Rm, Rn EXTS.B Rm, Rn EXTS.W Rm, Rn

0111 Rn imm ADD #imm : 8, Rn

1000 00MD Rn disp MOV.B MOV.W SETRC #imm


R0, @(disp: 4, Rn) R0, @(disp: 4, Rn)
imm

Rev. 3.00 Jan. 18, 2008 Page 162 of 1458


REJ09B0033-0300
Section 3 DSP Operating Unit

Instruction Code Fx: 0000 Fx: 0001 Fx: 0010 Fx: 0011 to 1111

MSB LSB MD: 00 MD: 01 MD: 10 MD: 11

1000 01MD Rm disp MOV.B MOV.W


@(disp:4, Rm), R0 @(disp: 4, Rm), R0

1000 10MD imm/disp CMP/EQ #imm:8, R0 BT disp: 8 BF disp: 8

1000 11MD imm/disp LDRS @(disp:8,PC) BT/S disp: 8 LDRE @(disp:8,PC) BF/S disp: 8

1001 Rn disp MOV.W @ (disp : 8, PC), Rn

1010 disp BRA disp : 12

1011 disp BSR disp: 12

1100 00MD imm/disp MOV.B MOV.W MOV.L TRAPA #imm: 8


R0, @(disp: 8, GBR) R0, @(disp: 8, GBR) R0, @(disp: 8, GBR)

1100 01MD disp MOV.B MOV.W MOV.L MOVA


@(disp: 8, GBR), R0 @(disp: 8, GBR), R0 @(disp: 8, GBR), R0 @(disp: 8, PC), R0

1100 10MD imm TST #imm: 8, R0 AND #imm: 8, R0 XOR #imm: 8, R0 OR #imm: 8, R0

1100 11MD imm TST.B AND.B XOR.B OR.B


#imm: 8, @(R0, GBR) #imm: 8, @(R0, GBR) #imm: 8, @(R0, GBR) #imm: 8, @(R0, GBR)

1101 Rn disp MOV.L @(disp: 8, PC), Rn

1110 Rn imm MOV #imm:8, Rn

1111 00** ******** MOVX.W, MOVY.W Double data transfer instruction

1111 01** ******** MOVS.W, MOVS.L Single data transfer instruction

1111 10** ******** MOVX.W, MOVY.W Double data transfer instruction, with DSP parallel operation instruction (32-
bit instruction )

1111 11** ********

Notes: 1. For details, refer to the SH-3/SH-3E/SH3-DSP Software Manual.


2. Instructions in the hatched areas are DSP extended instructions. These instructions
can be executed only when the DSP bit in the SR register is set to 1.

Rev. 3.00 Jan. 18, 2008 Page 163 of 1458


REJ09B0033-0300
Section 3 DSP Operating Unit

Rev. 3.00 Jan. 18, 2008 Page 164 of 1458


REJ09B0033-0300
Section 4 Memory Management Unit (MMU)

Section 4 Memory Management Unit (MMU)


This LSI has an on-chip memory management unit (MMU) that supports a virtual memory system.
The on-chip translation look-aside buffer (TLB) caches information for user-created address
translation tables located in external memory. It enables high-speed translation of virtual addresses
into physical addresses. Address translation uses the paging system and supports two page sizes (1
kbyte or 4 kbytes). The access rights to virtual address space can be set for each of the privileged
and user modes to provide memory protection.

4.1 Role of MMU


The MMU is a feature designed to make efficient use of physical memory. As shown in figure 4.1,
if a process is smaller in size than the physical memory, the entire process can be mapped onto
physical memory. However, if the process increases in size to the extent that it no longer fits into
physical memory, it becomes necessary to partition the process and to map those parts requiring
execution onto memory as occasion demands (figure 4.1 (1)). Having the process itself consider
this mapping onto physical memory would impose a large burden on the process. To lighten this
burden, the idea of virtual memory was born as a means of performing en bloc mapping onto
physical memory (figure 4.1 (2)). In a virtual memory system, substantially more virtual memory
than physical memory is provided, and the process is mapped onto this virtual memory. Thus a
process only has to consider operation in virtual memory. Mapping from virtual memory to
physical memory is handled by the MMU. The MMU is normally controlled by the operating
system, switching physical memory to allow the virtual memory required by a process to be
mapped onto physical memory in a smooth fashion. Switching of physical memory is performed
via secondary storage, etc.

The virtual memory system that came into being in this way is particularly effective in a time-
sharing system (TSS) in which a number of processes are running simultaneously (figure 4.1 (3)).
If processes running in a TSS had to take mapping onto virtual memory into consideration while
running, it would not be possible to increase efficiency. Virtual memory is thus used to reduce this
load on the individual processes and so improve efficiency (figure 4.1 (4)). In the virtual memory
system, virtual memory is allocated to each process. The task of the MMU is to perform efficient
mapping of these virtual memory areas onto physical memory. It also has a memory protection
feature that prevents one process from inadvertently accessing another process’s physical memory.

When address translation from virtual memory to physical memory is performed using the MMU,
it may occur that the relevant translation information is not recorded in the MMU, with the result
that one process may inadvertently access the virtual memory allocated to another process. In this
case, the MMU will generate an exception, change the physical memory mapping, and record the
new address translation information.

MMUS300S_000020020300 Rev. 3.00 Jan. 18, 2008 Page 165 of 1458


REJ09B0033-0300
Section 4 Memory Management Unit (MMU)

Although the functions of the MMU could also be implemented by software alone, the need for
translation to be performed by software each time a process accesses physical memory would
result in poor efficiency. For this reason, a buffer for address translation (translation look-aside
buffer: TLB) is provided in hardware to hold frequently used address translation information. The
TLB can be described as a cache for storing address translation information. Unlike cache
memory, however, if address translation fails, that is, if an exception is generated, switching of
address translation information is normally performed by software. This makes it possible for
memory management to be performed flexibly by software.

The MMU has two methods of mapping from virtual memory to physical memory: a paging
method using fixed-length address translation, and a segment method using variable-length
address translation. With the paging method, the unit of translation is a fixed-size address space
(usually of 1 to 64 kbytes) called a page.

In the following text, the address space in virtual memory is referred to as virtual address space,
and address space in physical memory as physical memory space.

Rev. 3.00 Jan. 18, 2008 Page 166 of 1458


REJ09B0033-0300
Section 4 Memory Management Unit (MMU)

Virtual
memory
Process 1 Process 1 MMU
Physical Physical
Physical memory memory
memory
Process 1

(1) (2)

Virtual
Process 1 Process 1 memory
MMU
Physical Physical
memory memory

Process 2 Process 2

Process 3
Process 3

(3) (4)

Figure 4.1 MMU Functions

Rev. 3.00 Jan. 18, 2008 Page 167 of 1458


REJ09B0033-0300
Section 4 Memory Management Unit (MMU)

4.1.1 MMU of This LSI

(1) Virtual Address Space

This LSI supports a 32-bit virtual address space that enables access to a 4-Gbyte address space. As
shown in figures 4.2 and 4.3, the virtual address space is divided into several areas. In privileged
mode, a 4-Gbyte space comprising areas P0 to P4 are accessible. In user mode, a 2-Gbyte space of
U0 area is accessible, and a 16-Mbyte space of Uxy area is also accessible if the DSP bit in the SR
register is set to 1. Access to any area (excluding the U0 area and Uxy area) in user mode will
result in an address error.

If the MMU is enabled by setting the AT bit in the MMUCR register to 1, P0, P3, and U0 areas
can be used as any physical address area in 1- or 4-kbyte page units. By using an 8-bit address
space identifier, P0, P2, and U0 areas can be increased to up to 256 areas. Mapping from virtual
address to 29-bit physical address can be achieved by the TLB.

(a) P0, P3, and U0 Areas

The P0, P3, and U0 areas can be address translated by the TLB and can be accessed through the
cache. If the MMU is enabled, these areas can be mapped to any physical address space in 1- or 4-
kbyte page units via the TLB. If the CE bit in the cache control register (CCR1) is set to 1 and if
the corresponding cache enable bit (C bit) of the TLB entry is set to 1, access via the cache is
enabled. If the MMU is disabled, replacing the upper three bits of an address in these areas with 0s
creates the address in the corresponding physical address space. If the CE bit in the CCR1 register
is set to 1, access via the cache is enabled. When the cache is used, either the copy-back or write-
through mode is selected for write access via the WT bit in CCR1.

If these areas are mapped to the on-chip module control register area or on-chip memory area in
area 1 in the physical address space via the TLB, the C bit of the corresponding page must be
cleared to 0.

(b) P1 Area

The P1 area can be accessed via the cache and cannot be address-translated by the TLB. Whether
the MMU is enabled or not, replacing the upper three bits of an address in these areas with 0s
creates the address in the corresponding physical address space. Use of the cache is determined by
the CE bit in the cache control register (CCR1). When the cache is used, either the copy-back or
write-through mode is selected for write access by the CB bit in the CCR1 register.

Rev. 3.00 Jan. 18, 2008 Page 168 of 1458


REJ09B0033-0300
Section 4 Memory Management Unit (MMU)

(c) P2 Area

The P2 area cannot be accessed via the cache and cannot be address-translated by the TLB.
Whether the MMU is enabled or not, replacing the upper three bits of an address in this area with
0s creates the address in the corresponding physical address space.

(d) P4 Area

The P4 area is mapped to the on-chip I/O of this LSI. This area cannot be accessed via the cache
and cannot be address-translated by the TLB. Figure 4.4 shows the configuration of the P4 area.

256 256 H'0000 0000


External Address
Space
H'0000 0000
Area 0
Area 1
Area 2
Area 3
P0 area U0 area
Cacheable Area 4 Cacheable
Address translation possible Address translation possible
Area 5
Area 6
Area 7

H'8000 0000 H'8000 0000


P1 area
Cacheable
Address translation not possible Address error
H'A000 0000
P2 area H'A500 0000
Non-Cacheable Uxy area*
H'A5FF FFFF
Address translation not possible
H'C000 0000
P3 area
Cacheable
Address translation possible Address error
H'E000 0000
P4 area
Non-Cacheable
Address translation not possible
H'FFFF FFFF H'FFFF FFFF
Privileged mode User mode

Note: Only exists when SR.DSP = 1

Figure 4.2 Virtual Address Space (MMUCR.AT = 1)

Rev. 3.00 Jan. 18, 2008 Page 169 of 1458


REJ09B0033-0300
Section 4 Memory Management Unit (MMU)

External address space


H'0000 0000 H'0000 0000
Area 0
Area 1
Area 2
Area 3
P0 area U0 area
Area 4 Cacheable
Cacheable
Area 5
Area 6
Area 7

H'8000 0000 H'8000 0000


P1 area
Cacheable Address error
H'A000 0000
H'A500 0000
P2 area
Uxy area*
Non-cacheable H'A5FF FFFF
H'C000 0000
P3 area
Cacheable
Address error
H'E000 0000
P4 area
Non-cacheable
H'FFFF FFFF H'FFFF FFFF
Privileged mode User mode

Note: Only exists when SR.DSP = 1

Figure 4.3 Virtual Address Space (MMUCR.AT = 0)

Rev. 3.00 Jan. 18, 2008 Page 170 of 1458


REJ09B0033-0300
Section 4 Memory Management Unit (MMU)

H'E000 0000

Reserved

H'F000 0000
Cache address array
H'F100 0000
Cache data array
H'F200 0000
TLB address array
H'F300 0000
TLB data array
H'F400 0000

Reserved

H'FC00 0000
Control register area
H'FFFF FFFF

Figure 4.4 P4 Area

The area from H'F000 0000 to H'F0FF FFFF is for direct access to the cache address array. For
more information, see section 5.4, Memory-Mapped Cache.

The area from H'F100 0000 to H'F1FF FFFF is for direct access to the cache data array. For more
information, see section 5.4, Memory-Mapped Cache.

The area from H'F200 0000 to H'F2FF FFFF is for direct access to the TLB address array. For
more information, see section 4.6, Memory-Mapped TLB.

The area from H'F300 0000 to H'F3FF FFFF is for direct access to the TLB data array. For more
information, see section 4.6, Memory-Mapped TLB.

The area from H'FC00 0000 to H'FFFF FFFF is reserved for registers of the on-chip peripheral
modules. For more information, see section 37, List of Registers.

(e) Uxy Area

The Uxy area is mapped to the on-chip memory of this LSI. This area is made usable in user mode
when the DSP bit in the SR register is set to 1. In user mode, accessing this area when the DSP bit
is 0 will result in an address error. This area cannot be accessed via the cache and cannot be
address-translated by the TLB. For more information on the Uxy area, see section 6, X/Y
Memory.

Rev. 3.00 Jan. 18, 2008 Page 171 of 1458


REJ09B0033-0300
Section 4 Memory Management Unit (MMU)

(2) Physical Address Space

This LSI supports a 29-bit physical address space. As shown in figure 4.5, the physical address
space is divided into eight areas. Area 1 is mapped to the on-chip module control register area and
on-chip memory area. Area 7 is reserved.

For details on physical address space, refer to section 9, Bus State Controller (BSC).

H'0000 0000
Area 0
H'0400 0000
Area 1
(On-chip registers and
On-chip memories)
H'0800 0000
Area 2
H'0C00 0000
Area 3
H'1000 0000
Area 4
H'1400 0000
Area 5
H'1800 0000
Area 6
H'1C00 0000
Area 7
(Reserved)
H'1FFF FFFF

Figure 4.5 Physical Address Space

(3) Address Transition

When the MMU is enabled, the virtual address space is divided into units called pages. Physical
addresses are translated in page units. Address translation tables in external memory hold
information such as the physical address that corresponds to the virtual address and memory
protection codes. When an access to area P1 or P2 occurs, there is no TLB access and the physical
address is defined uniquely by hardware. If it belongs to area P0, P3 or U0, the TLB is searched
by virtual address and, if that virtual address is registered in the TLB, the access hits the TLB. The
corresponding physical address and the page control information are read from the TLB and the
physical address is determined.

If the virtual address is not registered in the TLB, a TLB miss exception occurs and processing
will shift to the TLB miss handler. In the TLB miss handler, the TLB address translation table in
external memory is searched and the corresponding physical address and the page control

Rev. 3.00 Jan. 18, 2008 Page 172 of 1458


REJ09B0033-0300
Section 4 Memory Management Unit (MMU)

information are registered in the TLB. After returning from the handler, the instruction that caused
the TLB miss is re-executed. When the MMU is enabled, address translation information that
results in a physical address space of H'2000 0000 to H'FFFF FFFF should not be registered in the
TLB.

When the MMU is disabled, masking the upper three bits of the virtual address to 0s creates the
address in the corresponding physical address space. Since this LSI supports 29-bit address space
as physical address space, the upper three bits of the virtual address are ignored as shadow areas.
For details, refer to section 9, Bus State Controller (BSC). For example, address H'0000 1000 in
the P0 area, address H'8000 1000 in the P1 area, address H'A000 1000 in the P2 area, and address
H'C000 1000 in the P3 area are all mapped to the same physical memory. If these addresses are
accessed while the cache is enabled, the upper three bits are always cleared to 0 to guarantee the
continuity of addresses stored in the address array of the cache.

(4) Single Virtual Memory Mode and Multiple Virtual Memory Mode

There are two virtual memory modes: single virtual memory mode and multiple virtual memory
mode. In single virtual memory mode, multiple processes run in parallel using the virtual address
space exclusively and the physical address corresponding to a given virtual address is specified
uniquely. In multiple virtual memory mode, multiple processes run in parallel sharing the virtual
address space, so a given virtual address may be translated into different physical addresses
depending on the process. By the value set to the MMU control register (MMUCR), either single
or multiple virtual mode is selected.

In terms of operation, the only difference between single virtual memory mode and multiple
virtual memory mode is in the TLB address comparison method (see section 4.3.3, TLB Address
Comparison).

(5) Address Space Identifier (ASID)

In multiple virtual memory mode, the address space identifier (ASID) is used to differentiate
between processes running in parallel and sharing virtual address space. The ASID is eight bits in
length and can be set by software setting of the ASID of the currently running process in page
table entry register high (PTEH) within the MMU. When the process is switched using the ASID,
the TLB does not have to be purged.

In single virtual memory mode, the ASID is used to provide memory protection for processes
running simultaneously and using the virtual address space exclusively (see section 4.3.3, TLB
Address Comparison).

Rev. 3.00 Jan. 18, 2008 Page 173 of 1458


REJ09B0033-0300
Section 4 Memory Management Unit (MMU)

4.2 Register Descriptions


There are four registers for MMU processing. These are all peripheral module registers, so they
are located in address space area P4 and can only be accessed from privileged mode by specifying
the address.

The MMU has the following registers. Refer to section 37, List of Registers, for more details on
the addresses and access size of these registers.

• Page table entry register high (PTEH)


• Page table entry register low (PTEL)
• Translation table base register (TTB)
• MMU control register (MMUCR)

4.2.1 Page Table Entry Register High (PTEH)

The page table entry register high (PTEH) register residing at address H'FFFF FFF0, which
consists of a virtual page number (VPN) and ASID. The VPN set is the VPN of the virtual address
at which the exception is generated in case of an MMU exception or address error exception.
When the page size is 4 kbytes, the VPN is the upper 20 bits of the virtual address, but in this case
the upper 22 bits of the virtual address are set. The VPN can also be modified by software. As the
ASID, software sets the number of the currently executing process. The VPN and ASID are
recorded in the TLB by the LDTLB instruction.

A program that modifies the ASID in PTEH should be allocated in the P1 or P2 areas.

Initial
Bit Bit Name Value R/W Description
31 to 10 VPN  R/W The Number of the Logical Page
9, 8  All 0 R Reserved
These bits are always read as 0. The write value
should always be 0.
7 to 0 ASID  R/W Address Space Identifier

Rev. 3.00 Jan. 18, 2008 Page 174 of 1458


REJ09B0033-0300
Section 4 Memory Management Unit (MMU)

4.2.2 Page Table Entry Register Low (PTEL)

The page table entry register low (PTEL) register residing at address H'FFFF FFF4, and used to
store the physical page number and page management information to be recorded in the TLB by
the LDTLB instruction. The contents of this register are only modified in response to a software
command.

Initial
Bit Bit Name Value R/W Description
31 to 29  All 0 R/W Reserved
These bits are always read as 0. The write value
should always be 0.
28 to 10 PPN  R/W The Number of the Physical Page
9  0 R Page Management Information
8 V  R/W For more details, see section 4.3, TLB Functions.
7  0 R
6, 5 PR  R/W
4 SZ  R/W
3 C  R/W
2 D  R/W
1 SH  R/W
0  0 R

4.2.3 Translation Table Base Register (TTB)

The translation table base register (TTB) residing at address H'FFFF FFF8, which points to the
base address of the current page table. The hardware does not set any value in TTB automatically.
TTB is available to software for general purposes. The initial value is undefined.

4.2.4 MMU Control Register (MMUCR)

The MMU control register (MMUCR) residing at address H'FFFF FFE0. Any program that
modifies MMUCR should reside in the P1 or P2 area.

Rev. 3.00 Jan. 18, 2008 Page 175 of 1458


REJ09B0033-0300
Section 4 Memory Management Unit (MMU)

Initial
Bit Bit Name Value R/W Description
31 to 9  All 0 R Reserved
These bits are always read as 0. The write value should
always be 0.
8 SV 0 R/W Single Virtual Memory Mode
0: Multiple virtual memory mode
1: Single virtual memory mode
7, 6  All 0 R Reserved
These bits are always read as 0. The write value should
always be 0.
5, 4 RC All 0 R/W Random Counter
A 2-bit random counter that is automatically updated by
hardware according to the following rules in the event of
an MMU exception.
When a TLB miss exception occurs, all of TLB entry
way corresponding to the virtual address at which the
exception occurred are checked. If all ways are valid, 1
is added to RC; if there is one or more invalid way, they
are set by priority from way 0, in the order way 0, way 1,
way 2, way 3. In the event of an MMU exception other
than a TLB miss exception, the way which caused the
exception is set in RC.
3  0 R Reserved
This bit is always read as 0. The write value should
always be 0.
2 TF 0 R/W TLB Flush
Write 1 to flush the TLB (clear all valid bits of the TLB to
0). When they are read, 0 is always returned.
1 IX 0 R/W Index Mode
0: VPN bits 16 to 12 are used as the TLB index number.
1: The value obtained by EX-ORing ASID bits 4 to 0 in
PTEH and VPN bits 16 to 12 is used as the TLB
index number.
0 AT 0 R/W Address Translation
Enables/disables the MMU.
0: MMU disabled
1: MMU enabled

Rev. 3.00 Jan. 18, 2008 Page 176 of 1458


REJ09B0033-0300
Section 4 Memory Management Unit (MMU)

4.3 TLB Functions

4.3.1 Configuration of the TLB

The TLB caches address translation table information located in the external memory. The address
translation table stores the virtual page number and the corresponding physical number, the
address space identifier, and the control information for the page, which is the unit of address
translation. Figure 4.6 shows the overall TLB configuration. The TLB is 4-way set associative
with 128 entries. There are 32 entries for each way. Figure 4.7 shows the configuration of virtual
addresses and TLB entries.

Way 0 to 3 Way 0 to 3

Entry 0 VPN(31 to 17) VPN(11 to 10) ASID(7 to 0) V Entry 0 PPN(28 to 10)PR(1 to 0) SZ C D SH

Entry 1 Entry 1

Entry 31 Entry 31

Address array Data array

Figure 4.6 Overall Configuration of the TLB

Rev. 3.00 Jan. 18, 2008 Page 177 of 1458


REJ09B0033-0300
Section 4 Memory Management Unit (MMU)

31 10 9 0
VPN Offset

Virtual address (1-kbyte page)

31 12 11 0
VPN Offset
Virtual address (4-kbyte page)

(15) (2) (8) (1) (19) (2) (1) (1) (1) (1)
VPN (31 to 17) VPN (11 to 10) ASID V PPN PR SZ C D SH

TLB entry
[Legend]
VPN: Virtual page number
Upper 19 bits of virtual address for a 1-kbyte page, or upper 20 bits of logical address for a 4-kbyte page. Since VPN
bits 16 to 12 are used as the index number, they are not stored in the TLB entry. Attention must be paid to the
synonym problem (see section 4.4.4, Avoiding Synonym Problems).
ASID: Address space identifier
Indicates the process that can access a virtual page. In single virtual memory mode and user mode, or in multiple
virtual memory mode, if the SH bit is 0, the address is compared with the ASID in PTEH when address comparison is
performed.
SH: Share status bit
0: Page not shared between processes
1: Page shared between processes
SZ: Page-size bit
0: 1-kbyte page
1: 4-kbyte page
V: Valid bit
Indicates whether entry is valid.
0: Invalid
1: Valid
Cleared to 0 by a power-on reset. Not affected by a manual reset.
PPN: Physical page number
Upper 22 bits of physical address. PPN bits 11 to10 are not used in case of a 4-kbyte page.
PR: Protection key field
2-bit field encoded to define the access rights to the page.
00: Reading only is possible in privileged mode.
01: Reading/writing is possible in privileged mode.
10: Reading only is possible in privileged/user mode.
11: Reading/writing is possible in privileged/user mode.
C: Cacheable bit
Indicates whether the page is cacheable.
0: Non-cacheable
1: Cacheable
D: Dirty bit
Indicates whether the page has been written to.
0: Not written to
1: Written to

Figure 4.7 Virtual address and TLB Structure

Rev. 3.00 Jan. 18, 2008 Page 178 of 1458


REJ09B0033-0300
Section 4 Memory Management Unit (MMU)

4.3.2 TLB Indexing

The TLB uses a 4-way set associative scheme, so entries must be selected by index. VPN bits 16
to 12 and ASID bits 4 to 0 in PTEH are used as the index number regardless of the page size. The
index number can be generated in two different ways depending on the setting of the IX bit in
MMUCR.

1. When IX = 1, VPN bits 16 to 12 are EX-ORed with ASID bits 4 to 0 to generate a 5-bit index
number
2. When IX = 0, VPN bits 16 to 12 alone are used as the index number

The first method is used to prevent lowered TLB efficiency that results when multiple processes
run simultaneously in the same virtual address space (multiple virtual memory) and a specific
entry is selected by indexing of each process. In single virtual memory mode (MMUCR.SV = 1),
IX bit should be set to 0. Figures 4.8 and 4.9 show the indexing schemes.

Virtual address PTEH register


31 17 16 12 11 0 31 10 7 0
VPN 0 ASID

ASID(4 to 0)
Exclusive-OR
Index

Way 0 to 3

0 VPN(31 to 17) VPN(11 to 10) ASID(7 to 0) V PPN(28 to 10) PR(1 to 0) SZ C D SH

31

Address Array Data Array

Figure 4.8 TLB Indexing (IX = 1)

Rev. 3.00 Jan. 18, 2008 Page 179 of 1458


REJ09B0033-0300
Section 4 Memory Management Unit (MMU)

Virtual address
31 17 16 12 11 0

Index

Way 0 to 3

0 VPN(31 to 17) VPN(11 to 10) ASID(7 to 0) V PPN(28 to 10) PR(1 to 0) SZ C D SH

31

Address array Data array

Figure 4.9 TLB Indexing (IX = 0)

4.3.3 TLB Address Comparison

The results of address comparison determine whether a specific virtual page number is registered
in the TLB. The virtual page number of the virtual address that accesses external memory is
compared to the virtual page number of the indexed TLB entry. The ASID within the PTEH is
compared to the ASID of the indexed TLB entry. All four ways are searched simultaneously. If
the compared values match, and the indexed TLB entry is valid (V bit = 1), the hit is registered.

It is necessary to have software ensure that TLB hits do not occur simultaneously in more than one
way, as hardware operation is not guaranteed if this occurs. An example of setting which causes
TLB hits to occur simultaneously in more than one way is described below. It is necessary to
ensure that this kind of setting is not made by software.

1. If there are two identical TLB entries with the same VPN and a setting is made such that a
TLB hit is made only by a process with ASID = H'FF when one is in the shared state (SH = 1)
and the other in the non-shared state (SH = 0), then if the ASID in PTEH is set to H'FF, there
is a possibility of simultaneous TLB hits in both these ways.
2. If several entries which have different ASID with the same VPN are registered in single virtual
memory mode, there is the possibility of simultaneous TLB hits in more than one way when
accessing the corresponding page in privileged mode. Several entries with the same VPN must
not be registered in single virtual memory mode.

Rev. 3.00 Jan. 18, 2008 Page 180 of 1458


REJ09B0033-0300
Section 4 Memory Management Unit (MMU)

3. There is the possibility of simultaneous TLB hits in more than one way. These hits may occur
depending on the contents of ASID in PTEH when a page to which SH is set 1 is registered in
the TLB in index mode (MMUCR.IX = 1). Therefore a page to which SH is set 1 must not be
registered in index mode. When memory is shared by several processings, different pages must
be registered in each ASID.

The object compared varies depending on the page management information (SZ, SH) in the TLB
entry. It also varies depending on whether the system supports multiple virtual memory or single
virtual memory.

The page-size information determines whether VPN (11 to 10) is compared. VPN (11 to 10) is
compared for 1-kbyte pages (SZ = 0) but not for 4-kbyte pages (SZ = 1).

The sharing information (SH) determines whether the PTEH.ASID and the ASID in the TLB entry
are compared. ASIDs are compared when there is no sharing between processes (SH = 0) but not
when there is sharing (SH = 1).

When single virtual memory is supported (MMUCR.SV = 1) and privileged mode is engaged
(SR.MD = 1), all process resources can be accessed. This means that ASIDs are not compared
when single virtual memory is supported and privileged mode is engaged. The objects of address
comparison are shown in figure 4.10.

SH = 1 or No
(SR.MD = 1 and
MMUCR.SV = 1)?

Yes

No (4-kbyte) No (4-kbyte)
SZ = 0? SZ = 0?

Yes (1-kbyte) Yes (1-kbyte)

Bits compared: Bits compared: Bits compared: Bits compared:


VPN 31 to 17 VPN 31 to 17 VPN 31 to 17 VPN 31 to 17
VPN 11 to 10 VPN 11 to 10 ASID 7 to 0
ASID 7 to 0

Figure 4.10 Objects of Address Comparison

Rev. 3.00 Jan. 18, 2008 Page 181 of 1458


REJ09B0033-0300
Section 4 Memory Management Unit (MMU)

4.3.4 Page Management Information

In addition to the SH and SZ bits, the page management information of TLB entries also includes
D, C, and PR bits.

The D bit of a TLB entry indicates whether the page is dirty (i.e., has been written to). If the D bit
is 0, an attempt to write to the page results in an initial page write exception. For physical page
swapping between secondary memory and main memory, for example, pages are controlled so that
a dirty page is paged out of main memory only after that page is written back to secondary
memory. To record that there has been a write to a given page in the address translation table in
memory, an initial page write exception is used.

The C bit in the entry indicates whether the referenced page resides in a cacheable or non-
cacheable area of memory. When the control registers and on-chip memory in area 1 are mapped,
set the C bit to 0. The PR field specifies the access rights for the page in privileged and user modes
and is used to protect memory. Attempts at non-permitted accesses result in TLB protection
violation exceptions.

Access states designated by the D, C, and PR bits are shown in table 4.1.

Rev. 3.00 Jan. 18, 2008 Page 182 of 1458


REJ09B0033-0300
Section 4 Memory Management Unit (MMU)

Table 4.1 Access States Designated by D, C, and PR Bits

Privileged Mode User Mode


Reading Writing Reading Writing
D bit 0 Permitted Initial page write Permitted Initial page write
exception exception
1 Permitted Permitted Permitted Permitted
C bit 0 Permitted Permitted Permitted Permitted
(no caching) (no caching) (no caching) (no caching)
1 Permitted Permitted Permitted Permitted
(with caching) (with caching) (with caching) (with caching)
PR bit 00 Permitted TLB protection TLB protection TLB protection
violation violation violation exception
exception exception
01 Permitted Permitted TLB protection TLB protection
violation violation exception
exception
10 Permitted TLB protection Permitted TLB protection
violation violation exception
exception
11 Permitted Permitted Permitted Permitted

4.4 MMU Functions

4.4.1 MMU Hardware Management

There are two kinds of MMU hardware management as follows.

1. The MMU decodes the virtual address accessed by a process and performs address translation
by controlling the TLB in accordance with the MMUCR settings.
2. In address translation, the MMU receives page management information from the TLB, and
determines the MMU exception and whether the cache is to be accessed (using the C bit). For
details of the determination method and the hardware processing, see section 4.5, MMU
Exceptions.

Rev. 3.00 Jan. 18, 2008 Page 183 of 1458


REJ09B0033-0300
Section 4 Memory Management Unit (MMU)

4.4.2 MMU Software Management

There are three kinds of MMU software management, as follows.

1. MMU register setting


MMUCR setting, in particular, should be performed in areas P1 and P2 for which address
translation is not performed. Also, since SV and IX bit changes constitute address translation
system changes, in this case, TLB flushing should be performed by simultaneously writing 1 to
the TF bit also. Since MMU exceptions are not generated in the MMU disabled state with the
AT bit cleared to 0, use in the disabled state must be avoided with software that does not use
the MMU.
2. TLB entry recording, deletion, and reading
TLB entry recording can be done in two ways by using the LDTLB instruction, or by writing
directly to the memory-mapped TLB. For TLB entry deletion and reading, the memory
allocation TLB can be accessed. See section 4.4.3, MMU Instruction (LDTLB), for details of
the LDTLB instruction, and section 4.6, Memory-Mapped TLB, for details of the memory-
mapped TLB.
3. MMU exception processing
When an MMU exception is generated, it is handled on the basis of information set from the
hardware side. See section 4.5, MMU Exceptions, for details.

When single virtual memory mode is used, it is possible to create a state in which physical
memory access is enabled in the privileged mode only by clearing the share status bit (SH) to 0 to
specify recording of all TLB entries. This strengthens inter-process memory protection, and
enables special access levels to be created in the privileged mode only.

Recording a 1- or 4- kbyte page TLB entry may result in a synonym problem. See section 4.4.4,
Avoiding Synonym Problems.

4.4.3 MMU Instruction (LDTLB)

The load TLB instruction (LDTLB) is used to record TLB entries. When the IX bit in MMUCR is
0, the LDTLB instruction changes the TLB entry in the way specified by the RC bit in MMUCR
to the value specified by PTEH and PTEL, using VPN bits 16 to 12 specified in PTEH as the
index number. When the IX bit in MMUCR is 1, the EX-OR of VPN bits 16 to 12 specified in
PTEH and ASID bits 4 to 0 in PTEH are used as the index number.

Rev. 3.00 Jan. 18, 2008 Page 184 of 1458


REJ09B0033-0300
Section 4 Memory Management Unit (MMU)

Figure 4.11 shows the case where the IX bit in MMUCR is 0.

When an MMU exception occurs, the virtual page number of the virtual address that caused the
exception is set in PTEH by hardware. The way is set in the RC bit in MMUCR for each exception
according to the rules (see section 4.2.4, MMU Control Register (MMUCR)). Consequently, if the
LDTLB instruction is issued after setting only PTEL in the MMU exception processing routine,
TLB entry recording is possible. Any TLB entry can be updated by software rewriting of PTEH
and the RC bits in MMUCR.

As the LDTLB instruction changes address translation information, there is a risk of destroying
address translation information if this instruction is issued in the P0, U0, or P3 area. Make sure,
therefore, that this instruction is issued in the P1 or P2 area. Also, an instruction associated with an
access to the P0, U0, or P3 area (such as the RTE instruction) should be issued at least two
instructions after the LDTLB instruction.

MMUCR
31 9 0
0 SV 0 0 RC 0 TF IX AT

Index Way selection

PTEH register PTEL register


31 17 12 10 8 0 31 29 28 10 0
VPN VPN 0 ASID 000 PPN 0 V 0 PR SZ C D SH 0

Write Write

Way 0 to 3

0 VPN(31 to 17) VPN(11 to 10) ASID(7 to 0) V PPN(28 to 10) PR(1 to 0) SZ C D SH

31

Address array Data array

Figure 4.11 Operation of LDTLB Instruction

Rev. 3.00 Jan. 18, 2008 Page 185 of 1458


REJ09B0033-0300
Section 4 Memory Management Unit (MMU)

4.4.4 Avoiding Synonym Problems

When a 1- or 4-kbyte page is recorded in a TLB entry, a synonym problem may arise. If a number
of virtual addresses are mapped onto a single physical address, the same physical address data will
be recorded in a number of cache entries, and it will not be possible to guarantee data congruity.
The reason that this problem occurs is explained below with reference to figure 4.12.

The relationship between bit n of the virtual address and cache size is shown in the following
table. Note that no synonym problems occur in 4-kbyte page when the cache size is 16 kbytes.

Cache Size Bit n in Virtual Address


16 kbytes 11
32 kbytes 12

To achieve high-speed operation of this LSI’s cache, an index number is created using virtual
address bits 12 to 4. When a 1-kbyte page is used, virtual address bits 12 to 10 is subject to
address translation and when a 4-kbyte page is used, a virtual address bit 12 is subject to address
translation. Therefore, the physical address bits 12 to 10 may not be the same as the virtual address
bits 12 to 10.

For example, assume that, with 1-kbyte page TLB entries, TLB entries for which the following
translation has been performed are recorded in two TLBs:

Virtual address 1 H'0000 0000 → physical address H'0000 0C00

Virtual address 2 H'000 00C00 → physical address H'0000 0C00

Virtual address 1 is recorded in cache entry H'000, and virtual address 2 in cache entry H'0C0.
Since two virtual addresses are recorded in different cache entries despite the fact that the physical
addresses are the same, memory inconsistency will occur as soon as a write is performed to either
virtual address.

Consequently, the following restrictions apply to the recording of address translation information
in TLB entries.

1. When address translation information whereby a number of 1-kbyte page TLB entries are
translated into the same physical address is recorded in the TLB, ensure that the VPN bits 12 is
the same.
2. When address translation information whereby a number of 4-kbyte page TLB entries are
translated into the same physical address is recorded in the TLB, ensure that the VPN bit 12 is
the same.

Rev. 3.00 Jan. 18, 2008 Page 186 of 1458


REJ09B0033-0300
Section 4 Memory Management Unit (MMU)

3. Do not use the same physical addresses for address translation information of different page
sizes.

The above restrictions apply only when performing accesses using the cache.

Note: When multiple items of address translation information use the same physical memory to
provide for future SuperH RISC engine family expansion, ensure that the VPN bits 20 to
10 are the same.

• When using a 4-kbyte page


Virtual address
31 13 12 11 10 0
VPN Offset

Virtual address 12 to 4
Physical address
28 13 12 11 10 0
PPN Offset Cache

Physical address 28 to 10

• When using a 1-kbyte page


Virtual address
31 13 12 11 10 0
VPN Offset

Virtual address 12 to 4
Physical address
28 13 12 11 10 0
PPN Offset Cache

Physical address 28 to 10

Figure 4.12 Synonym Problem (32-kbyte Cache)

Rev. 3.00 Jan. 18, 2008 Page 187 of 1458


REJ09B0033-0300
Section 4 Memory Management Unit (MMU)

4.5 MMU Exceptions


When the address translation unit of the MMU is enabled, occurrence of the MMU exception is
checked following the CPU address error check. There are four MMU exceptions: TLB miss, TLB
invalid, TLB protection violation, and initial page write, and these MMU exceptions are checked
in this order.

4.5.1 TLB Miss Exception

A TLB miss results when the virtual address and the address array of the selected TLB entry are
compared and no match is found. TLB miss exception processing includes both hardware and
software operations.

• Hardware Operations
In a TLB miss, this hardware executes a set of prescribed operations, as follows:
A. The VPN field of the virtual address causing the exception is written to the PTEH register.
B. The virtual address causing the exception is written to the TEA register.
C. Either exception code H'040 for a load access, or H'060 for a store access, is written to the
EXPEVT register.
D. The PC value indicating the address of the instruction in which the exception occurred is
written to the save program counter (SPC). If the exception occurred in a delay slot, the PC
value indicating the address of the related delayed branch instruction is written to the SPC.
E The contents of the status register (SR) at the time of the exception are written to the save
status register (SSR).
F. The mode (MD) bit in SR is set to 1 to place the privileged mode.
G. The block (BL) bit in SR is set to 1 to mask any further exception requests.
H. The register bank (RB) bit in SR is set to 1.
I. The RC field in the MMU control register (MMUCR) is incremented by 1 when all entries
indexed are valid. When some entries indexed are invalid, the smallest way number of
them is set in RC. The setting priority is way0, way1, way2, and way3.
J. Execution branches to the address obtained by adding the value of the VBR contents and
H'0000 0400 to invoke the user-written TLB miss exception handler.

Rev. 3.00 Jan. 18, 2008 Page 188 of 1458


REJ09B0033-0300
Section 4 Memory Management Unit (MMU)

• Software (TLB Miss Handler) Operations


The software searches the page tables in external memory and allocates the required page table
entry. Upon retrieving the required page table entry, software must execute the following
operations:
A. Write the value of the physical page number (PPN) field and the protection key (PR), page
size (SZ), cacheable (C), dirty (D), share status (SH), and valid (V) bits of the page table
entry recorded in the address translation table in the external memory into the PTEL
register.
B. If using software for way selection for entry replacement, write the desired value to the RC
field in MMUCR.
C. Issue the LDTLB instruction to load the contents of PTEH and PTEL into the TLB.
D. Issue the return from exception handler (RTE) instruction to terminate the handler routine
and return to the instruction stream. Issue the RTE instruction after issuing two instructions
from the LDTLB instruction.

4.5.2 TLB Protection Violation Exception

A TLB protection violation exception results when the virtual address and the address array of the
selected TLB entry are compared and a valid entry is found to match, but the type of access is not
permitted by the access rights specified in the PR field. TLB protection violation exception
processing includes both hardware and software operations.

• Hardware Operations
In a TLB protection violation exception, this hardware executes a set of prescribed operations,
as follows:
A. The VPN field of the virtual address causing the exception is written to the PTEH register.
B. The virtual address causing the exception is written to the TEA register.
C. Either exception code H'0A0 for a load access, or H'0C0 for a store access, is written to the
EXPEVT register.
D. The PC value indicating the address of the instruction in which the exception occurred is
written into SPC (if the exception occurred in a delay slot, the PC value indicating the
address of the related delayed branch instruction is written into SPC).
E. The contents of SR at the time of the exception are written to SSR.
F. The MD bit in SR is set to 1 to place the privileged mode.
G. The BL bit in SR is set to 1 to mask any further exception requests.
H. The RB bit in SR is set to 1.
I. The way that generated the exception is set in the RC field in MMUCR.

Rev. 3.00 Jan. 18, 2008 Page 189 of 1458


REJ09B0033-0300
Section 4 Memory Management Unit (MMU)

J. Execution branches to the address obtained by adding the value of the VBR contents and
H'0000 0100 to invoke the TLB protection violation exception handler.

• Software (TLB Protection Violation Handler) Operations


Software resolves the TLB protection violation and issues the RTE (return from exception
handler) instruction to terminate the handler and return to the instruction stream. Issue the RTE
instruction after issuing two instructions from the LDTLB instruction.

4.5.3 TLB Invalid Exception

A TLB invalid exception results when the virtual address is compared to a selected TLB entry
address array and a match is found but the entry is not valid (the V bit is 0). TLB invalid exception
processing includes both hardware and software operations.

• Hardware Operations
In a TLB invalid exception, this hardware executes a set of prescribed operations, as follows:
A. The VPN field of the virtual address causing the exception is written to the PTEH register.
B. The virtual address causing the exception is written to the TEA register.
C. Either exception code H'040 for a load access, or H'060 for a store access, is written to the
EXPEVT register.
D. The PC value indicating the address of the instruction in which the exception occurred is
written to the SPC. If the exception occurred in a delay slot, the PC value indicating the
address of the delayed branch instruction is written to the SPC.
E. The contents of SR at the time of the exception are written into SSR.
F. The mode (MD) bit in SR is set to 1 to place the privileged mode.
G. The block (BL) bit in SR is set to 1 to mask any further exception requests.
H. The RB bit in SR is set to 1.
I. The way number causing the exception is written to RC in MMUCR.
J. Execution branches to the address obtained by adding the value of the VBR contents and
H'0000 0100, and the TLB protection violation exception handler starts.

Rev. 3.00 Jan. 18, 2008 Page 190 of 1458


REJ09B0033-0300
Section 4 Memory Management Unit (MMU)

• Software (TLB Invalid Exception Handler) Operations


The software searches the page tables in external memory and assigns the required page table
entry. Upon retrieving the required page table entry, software must execute the following
operations:
A. Write the values of the physical page number (PPN) field and the values of the protection
key (PR), page size (SZ), cacheable (C), dirty (D), share status (SH), and valid (V) bits of
the page table entry recorded in the external memory to the PTEL register.
B. If using software for way selection for entry replacement, write the desired value to the RC
field in MMUCR.
C. Issue the LDTLB instruction to load the contents of PTEH and PTEL into the TLB.
D. Issue the RTE instruction to terminate the handler and return to the instruction stream. The
RTE instruction should be issued after two instructions form the LDTLB instruction.

4.5.4 Initial Page Write Exception

An initial page write exception results in a write access when the virtual address and the address
array of the selected TLB entry are compared and a valid entry with the appropriate access rights
is found to match, but the D (dirty) bit of the entry is 0 (the page has not been written to). Initial
page write exception processing includes both hardware and software operations.

• Hardware Operations
In an initial page write exception, this hardware executes a set of prescribed operations, as
follows:
A. The VPN field of the virtual address causing the exception is written to the PTEH register.
B. The virtual address causing the exception is written to the TEA register.
C. Exception code H'080 is written to the EXPEVT register.
D. The PC value indicating the address of the instruction in which the exception occurred is
written to the SPC. If the exception occurred in a delay slot, the PC value indicating the
address of the related delayed branch instruction is written to the SPC.
E. The contents of SR at the time of the exception are written to SSR.
F. The MD bit in SR is set to 1 to place the privileged mode.
G. The BL bit in SR is set to 1 to mask any further exception requests.
H. The RB bit in SR is set to 1.
I. The way that caused the exception is set in the RC field in MMUCR.
J. Execution branches to the address obtained by adding the value of the VBR contents and
H'0000 0100 to invoke the user-written initial page write exception handler.

Rev. 3.00 Jan. 18, 2008 Page 191 of 1458


REJ09B0033-0300
Section 4 Memory Management Unit (MMU)

• Software (Initial Page Write Handler) Operations


The software must execute the following operations:
A. Retrieve the required page table entry from external memory.
B. Set the D bit of the page table entry in the external memory to 1.
C. Write the value of the PPN field and the PR, SZ, C, D, SH, and V bits of the page table
entry in the external memory to the PTEL register.
D. If using software for way selection for entry replacement, write the desired value to the RC
field in MMUCR.
E. Issue the LDTLB instruction to load the contents of PTEH and PTEL into the TLB.
F. Issue the RTE instruction to terminate the handler and return to the instruction stream. The
RTE instruction must be issued after two LDTLB instructions.

4.5.5 MMU Exception in Repeat Loop

If a CPU address error or MMU exception occurs in a specific instruction in the repeat loop, the
SPC may indicate an illegal address or the repeat loop cannot be reexecuted correctly even if the
SPC is correct. Accordingly, if a CPU address error or MMU exception occurs in a specific
instruction in the repeat loop, this LSI generates a specific exception code to set the EXPEVT to
H′070 for a TLB miss exception, TLB invalid exception, initial page write exception, and CPU
address error and to H'0D0 for a TLB protection violation exception. In addition, a vector offset
for TLB miss exception is H'100. For details, refer to section 7.4.3, Exception in Repeat Control
Period.

Rev. 3.00 Jan. 18, 2008 Page 192 of 1458


REJ09B0033-0300
Section 4 Memory Management Unit (MMU)

Start

Yes
Address error?

CPU address No
error
SH = 0 and
No (MMUCR.SV = 0 or
SR.MD = 0)?

Yes
No
VPNs match?
VPNs
No and ASIDs
Yes match?

Yes

No
V = 1?

TLB miss TLB invalid


exception Yes exception

User mode User or Privileged mode


privileged?

PR? PR?
00/01 10 11 01/11 00/10
W W W W
R/W? R/W? R/W? R/W?
R R R R

No
D = 1?

Yes

TLB protection TLB protection


violation exception violation exception

Initial page write No (Non-cacheable) Yes (Cacheable)


exception C = 1?

Memory Cache
access access

Figure 4.13 MMU Exception Generation Flowchart

Rev. 3.00 Jan. 18, 2008 Page 193 of 1458


REJ09B0033-0300
Section 4 Memory Management Unit (MMU)

4.6 Memory-Mapped TLB


In order for TLB operations to be managed by software, TLB contents can be read or written to in
the privileged mode using the MOV instruction. The TLB is assigned to the P4 area in the virtual
address space. The TLB address array (VPN, V bit, and ASID) is assigned to H'F200 0000 to
H'F2FF FFFF, and the data array (PPN, PR, SZ, C, D, and SH bits) to H'F300 0000 to H'F3FF
FFFF. The V bit in the address array can also be accessed from the data array. Only longword
access is possible for both the address array and the data array. However, the instruction data
cannot be fetched from both arrays.

4.6.1 Address Array

The address array is assigned to H'F200 0000 to H'F2FF FFFF. To access an address array, the 32-
bit address field (for read/write operations) and 32-bit data field (for write operations) must be
specified. The address field specifies information for selecting the entry to be accessed; the data
field specifies the VPN, V bit and ASID to be written to the address array (figure 4.14 (1)).

In the address field, specify the entry address for selecting the entry (bits 16 to 12), W for
selecting the way (bits 9 to 8) and H′F2 to indicate address array access (bits 31 to 24). The IX bit
in MMUCR indicates whether an EX-OR is taken of the entry address and ASID.

The following two operations can be used on the address array:

1. Address array read


VPN, V, and ASID are read from the TLB entry corresponding to the entry address and way
set in the address field.
2. TLB address array write
The data specified in the data field are written to the TLB entry corresponding to the entry
address and way set in the address field.

4.6.2 Data Array

The data array is assigned to H'F300 0000 to H'F3FF FFFF. To access a data array, the 32-bit
address field (for read/write operations), and 32-bit data field (for write operations) must be
specified. The address section specifies information for selecting the entry to be accessed; the data
section specifies the longword data to be written to the data array (figure 4.14 (2)).

In the address section, specify the entry address for selecting the entry (bits 16 to 12), W for
selecting the way (bits 9 to 8), and H'F3 to indicate data array access (bits 31 to 24). The IX bit in
MMUCR indicates whether an EX-OR is taken of the entry address and ASID.

Rev. 3.00 Jan. 18, 2008 Page 194 of 1458


REJ09B0033-0300
Section 4 Memory Management Unit (MMU)

Both reading and writing use the longword of the data array specified by the entry address and
way number. The access size of the data array is fixed at longword.

(1) TLB Address Array Access

• Read Access
31 24 23 17 16 12 1110 9 8 7 6 2 1 0
Address field 1 1 1 1 0 0 1 0 *............* VPN * * W 0 * . . . . . . . . . * 00

31 17 16 12 1110 9 8 7 0
Data field VPN 0 . . . . . . . 0 VPN 0 V ASID

• Write Access
31 24 23 17 16 12 11 10 9 8 7 6 2 1 0
Address field 1 1 1 1 0 0 1 0 *............* VPN * * W 0 * . . . . . . . . . * 00

31 17 16 12 11 10 9 8 7 0
Data field VPN * . . . . . . . * VPN * V ASID

VPN: Virtual page number


V: Valid bit
W: Way (00: Way 0, 01: Way 1, 10: Way 2, 11: Way 3)
ASID: Address space identifier
*: Don’t care bit

(2) TLB Data Array Access

• Read/Write Access
31 24 23 17 16 12 1110 9 8 7 2 1 0
Address field 1 1 1 1 0 0 1 1 *............* VPN * * W * . . . . . . . . . . . * 00

31 29 28 10 9 8 7 6 5 4 3 2 1 0
Data field 0 0 0 PPN X V X PR SZ C D SH X

PPN: Physical page number


PR: Protection key field
C: Cacheable bit
SH: Share status bit
VPN: Virtual page number
X: 0 for read, don’t care bit for write
W: Way (00: Way 0, 01: Way 1, 10: Way 2, 11: Way 3)
V: Valid bit
SZ: Page-size bit
D: Dirty bit
*: Don’t care bit

Figure 4.14 Specifying Address and Data for Memory-Mapped TLB Access

Rev. 3.00 Jan. 18, 2008 Page 195 of 1458


REJ09B0033-0300
Section 4 Memory Management Unit (MMU)

4.6.3 Usage Examples

(1) Invalidating Specific Entries

Specific TLB entries can be invalidated by writing 0 to the entry’s V bit. R0 specifies the write
data and R1 specifies the address.

; R0=H'1547 381C R1=H'F201 3000


; MMUCR.IX=0
; the V bit of way 0 of the entry selected by the VPN(16–12)=B'1 0011
; index is cleared to 0,achieving invalidation.
MOV.L R0,@R1

(2) Reading the Data of a Specific Entry

This example reads the data section of a specific TLB entry. The bit order indicated in the data
field in figure 4.17 (2) is read. R0 specifies the address and the data section of a selected entry is
read to R1.

; R0=H'F300 4300 VPN(16-12)=B'00100 Way 3


; MOV.L @R0,R1

4.7 Usage Note


The following operations should be performed in the P1 or P2 area. In addition, when the P0, P3,
or U0 area is accessed consecutively (this access includes instruction fetching), the instruction
code should be placed at least two instructions after the instruction that executes the following
operations.

1. Modification of SR.MD or SR.BL


2. Execution of the LDTLB instruction
3. Write to the memory-mapped TLB
4. Modification of MMUCR
5. Modification of PTEH.ASID

Rev. 3.00 Jan. 18, 2008 Page 196 of 1458


REJ09B0033-0300
Section 5 Cache

Section 5 Cache

5.1 Features
• Capacity: 16 or 32 kbytes
• Structure: Instructions/data mixed, 4-way set associative
• Locking: Way 2 and way 3 are lockable
• Line size: 16 bytes
• Number of entries: 256 entries/way in 16-kbyte mode to 512 entries/way in 32-kbyte mode
• Write system: Write-back/write-through is selectable for spaces P0, P1, P3, and U0
Group 1 (P0, P3, and U0 areas)
Group 2 (P1 area)
• Replacement method: Least-recently used (LRU) algorithm

Note: After power-on reset or manual reset, initialized as 16-kbyte mode (256 entries/way).

5.1.1 Cache Structure

The cache mixes instructions and data and uses a 4-way set associative system. It is composed of
four ways (banks), and each of which is divided into an address section and a data section. Note
that the following sections will be described for the 16-kbyte mode as an example. For other cache
size modes, change the number of entries and size/way according to table 5.1. Each of the address
and data sections is divided into 256 entries. The entry data is called a line. Each line consists of
16 bytes (4 bytes × 4). The data capacity per way is 4 kbytes (16 bytes × 256 entries) in the cache
as a whole (4 ways). The cache capacity is 16 kbytes as a whole.

Table 5.1 Number of Entries and Size/Way in Each Cache Size

Cache Size Number of Entries Size/Way


16 kbytes 256 4 kbytes
32 kbytes 512 8 kbytes

CACH001A_000020020800 Rev. 3.00 Jan. 18, 2008 Page 197 of 1458


REJ09B0033-0300
Section 5 Cache

Figure 5.1 shows the cache structure.

Address array (ways 0 to 3) Data array (ways 0 to 3) LRU

Entry 0 V U Tag address 0 LW0 LW1 LW2 LW3 0


Entry 1 1 1

. . .
. . .
. . .
. . .
. . .
. . .

Entry 255 255 255

24 (1 + 1 + 22) bits 128 (32 × 4) bits 6 bits

LW0 to LW3: Longword data 0 to 3

Figure 5.1 Cache Structure

(1) Address Array

The V bit indicates whether the entry data is valid. When the V bit is 1, data is valid; when 0, data
is not valid. The U bit indicates whether the entry has been written to in write-back mode. When
the U bit is 1, the entry has been written to; when 0, it has not. The tag address holds the physical
address used in the external memory access. It is composed of 22 bits (address bits 31 to 10) used
for comparison during cache searches.

In this LSI, the top three of 32 physical address bits are used as shadow bits (see section 9, Bus
State Controller (BSC)), and therefore the top three bits of the tag address are cleared to 0.

The V and U bits are initialized to 0 by a power-on reset, but are not initialized by a manual reset.
The tag address is not initialized by either a power-on or manual reset.

(2) Data Array

Holds a 16-byte instruction or data. Entries are registered in the cache in line units (16 bytes). The
data array is not initialized by a power-on or manual reset.

Rev. 3.00 Jan. 18, 2008 Page 198 of 1458


REJ09B0033-0300
Section 5 Cache

(3) LRU

With the 4-way set associative system, up to four instructions or data with the same entry address
can be registered in the cache. When an entry is registered, LRU shows which of the four ways it
is recorded in. There are six LRU bits, controlled by hardware. A least-recently-used (LRU)
algorithm is used to select the way.

Six LRU bits indicate the way to be replaced, when a cache miss occurs. Table 5.2 shows the
relationship between the LRU bits and the way to be replaced when the cache locking mechanism
is disabled. (For the relationship when the cache locking mechanism is enabled, refer to section
5.2.2, Cache Control Register 2 (CCR2).) If a bit pattern other than those listed in table 5.2 is set
in the LRU bits by software, the cache will not function correctly. When modifying the LRU bits
by software, set one of the patterns listed in table 5.2.

The LRU bits are initialized to H'000000 by a power-on reset, but are not initialized by a manual
reset.

Table 5.2 LRU and Way Replacement (when Cache Locking Mechanism is Disabled)

LRU (Bits 5 to 0) Way to be Replaced


000000, 000100, 010100, 100000, 110000, 110100 3
000001, 000011, 001011, 100001, 101001, 101011 2
000110, 000111, 001111, 010110, 011110, 011111 1
111000, 111001, 111011, 111100, 111110, 111111 0

5.2 Register Descriptions


The cache has the following registers. Refer to section 37, List of Registers, for more details on
the addresses and access size of these registers.

• Cache control register 1 (CCR1)


• Cache control register 2 (CCR2)
• Cache control register 3 (CCR3)

Rev. 3.00 Jan. 18, 2008 Page 199 of 1458


REJ09B0033-0300
Section 5 Cache

5.2.1 Cache Control Register 1 (CCR1)

The cache is enabled or disabled using the CE bit in CCR1. CCR1 also has a CF bit (which
invalidates all cache entries), and WT and CB bits (which select either write-through mode or
write-back mode). Programs that change the contents of the CCR1 register should be placed in
address space that is not cached.

Initial
Bit Bit Name Value R/W Description
31 to 4  All 0 R Reserved
These bits are always read as 0. The write value should
always be 0.
3 CF 0 R/W Cache Flush
Writing 1 flushes all cache entries (clears the V, U, and
LRU bits of all cache entries to 0). This bit is always
read as 0. Write-back to external memory is not
performed when the cache is flushed.
2 CB 0 R/W Write-Back
Indicates the cache’s operating mode for space P1.
0: Write-through mode
1: Write-back mode
1 WT 0 R/W Write-Through
Indicates the cache’s operating mode for spaces P0,
U0, and P3.
0: Write-back mode
1: Write-through mode
0 CE 0 R/W Cache Enable
Indicates whether the cache function is used.
0: The cache function is not used.
1: The cache function is used.

Rev. 3.00 Jan. 18, 2008 Page 200 of 1458


REJ09B0033-0300
Section 5 Cache

5.2.2 Cache Control Register 2 (CCR2)

The CCR2 register controls the cache locking mechanism in cache lock mode only. The CPU
enters the cache lock mode when the DSP bit (bit 12) in the status register (SR) is set to 1 or the
lock enable bit (bit 16) in the cache control register 2 (CCR2) is set to 1. The cache locking
mechanism is disabled in non-cache lock mode (DSP bit = 0).

When a prefetch instruction (PREF@Rn) is issued in cache lock mode and a cache miss occurs,
the line of data pointed to by Rn will be loaded into the cache, according to the setting of bits 9
and 8 (W3LOAD, W3LOCK) and bits 1 and 0 (W2LOAD, W2LOCK in CCR2).

Table 5.3 shows the relationship between the settings of bits and the way that is to be replaced
when the cache is missed by a prefetch instruction.

On the other hand, when the cache is hit by a prefetch instruction, new data is not loaded into the
cache and the valid entry is held. For example, a prefetch instruction is issued while bits
W3LOAD and W3LOCK are set to 1 and the line of data to which Rn points is already in way 0,
the cache is hit and new data is not loaded into way 3.

In cache lock mode, bits W3LOCK and W2LOCK restrict the way that is to be replaced, when
instructions other than the prefetch instruction are issued. Table 5.4 shows the relationship
between the settings of bits in CCR2 and the way that is to be replaced when the cache is missed
by instructions other than the prefetch instruction.

Programs that change the contents of the CCR2 register should be placed in address space that is
not cached.

Rev. 3.00 Jan. 18, 2008 Page 201 of 1458


REJ09B0033-0300
Section 5 Cache

Initial
Bit Bit Name Value R/W Description
31 to 17  All 0 R Reserved
These bits are always read as 0. The write value
should always be 0.
16 LE 0 R/W Lock enable (LE)
Controls cache lock mode.
0: Enters cache lock mode when the DSP bit in the SR
register is set to 1.
1: Enters cache lock mode regardless of the DSP bit
value.
15 to 10  All 0 R Reserved
These bits are always read as 0. The write value
should always be 0.
9 W3LOAD 0 R/W Way 3 Load (W3LOAD)
8 W3LOCK 0 R/W Way 3 Lock (W3LOCK)
When the cache is missed by a prefetch instruction
while in cache lock mode and when bits W3LOAD and
W3LOCK in CCR2 are set to 1, the data is always
loaded into way 3. Under any other condition, the
prefetched data is loaded into the way to which LRU
points.
7 to 2  All 0 R Reserved
These bits are always read as 0. The write value
should always be 0.
1 W2LOAD 0 R/W Way 2 Load (W2LOAD)
0 W2LOCK 0 R/W Way 2 Lock (W2LOCK)
When the cache is missed by a prefetch instruction
while in cache lock mode and when bits W2LOAD and
W2LOCK in CCR2 are set to 1, the data is always
loaded into way 2. Under any other condition, the
prefetched data is loaded into the way to which LRU
points.
Note: W2LOAD and W3LOAD should not be set to 1 at the same time.

Rev. 3.00 Jan. 18, 2008 Page 202 of 1458


REJ09B0033-0300
Section 5 Cache

Table 5.3 Way Replacement when a PREF Instruction Misses the Cache

DSP Bit W3LOAD W3LOCK W2LOAD W2LOCK Way to be Replaced


0 * * * * Determined by LRU (table 5.2)
1 * 0 * 0 Determined by LRU (table 5.2)
1 * 0 0 1 Determined by LRU (table 5.5)
1 0 1 * 0 Determined by LRU (table 5.6)
1 0 1 0 1 Determined by LRU (table 5.7)
1 0 * 1 1 Way 2
1 1 1 0 * Way 3
Note: * Don’t care
W3LOAD and W2LOAD should not be set to 1 at the same time.

Table 5.4 Way Replacement when Instructions other than the PREF Instruction Miss the
Cache

DSP Bit W3LOAD W3LOCK W2LOAD W2LOCK Way to be Replaced


0 * * * * Determined by LRU (table 5.2)
1 * 0 * 0 Determined by LRU (table 5.2)
1 * 0 * 1 Determined by LRU (table 5.5)
1 * 1 * 0 Determined by LRU (table 5.6)
1 * 1 * 1 Determined by LRU (table 5.7)
Note: * Don’t care
W3LOAD and W2LOAD should not be set to 1 at the same time.

Table 5.5 LRU and Way Replacement (when W2LOCK = 1 and W3LOCK =0)

LRU (Bits 5 to 0) Way to be Replaced


000000, 000001, 000100, 010100, 100000, 100001, 110000, 110100 3
000011, 000110, 000111, 001011, 001111, 010110, 011110, 011111 1
101001, 101011, 111000, 111001, 111011, 111100, 111110, 111111 0

Rev. 3.00 Jan. 18, 2008 Page 203 of 1458


REJ09B0033-0300
Section 5 Cache

Table 5.6 LRU and Way Replacement (when W2LOCK = 0 and W3LOCK =1)

LRU (Bits 5 to 0) Way to be Replaced


000000, 000001, 000011, 001011, 100000, 100001, 101001, 101011 2
000100, 000110, 000111, 001111, 010100, 010110, 011110, 011111 1
110000, 110100, 111000, 111001, 111011, 111100, 111110, 111111 0

Table 5.7 LRU and Way Replacement (when W2LOCK = 1 and W3LOCK =1)

LRU (Bits 5 to 0) Way to be Replaced


000000, 000001, 000011, 000100, 000110, 000111, 001011, 001111, 1
010100, 010110, 011110, 011111
100000, 100001, 101001, 101011, 110000, 110100, 111000, 111001, 0
111011, 111100, 111110, 111111

5.2.3 Cache Control Register 3 (CCR3)

The CCR3 register controls the cache size to be used. The cache size must be specified according
to the LSI to be selected. If the specified cache size exceeds the size of cache incorporated in the
LSI, correct operation cannot be guaranteed. Note that programs that change the contents of the
CCR3 register should be placed in un-cached address space. In addition, note that all cache entries
must be invalidated by setting the CF bit in the CCR1 to 1 before accessing the cache after the
CCR3 is modified.

Initial
Bit Bit Name Value R/W Description
31 to 24  All 0 R Reserved
These bits are always read as 0. The write value
should always be 0.
23 to 16 CSIZE7 to H'01 R/W Cache Size
CSIZE0 Specify the cache size as shown below.
0000 0001: 16-kbyte cache
0000 0010: 32-kbyte cache
Settings other than above are prohibited.
15 to 0  All 0 R Reserved
These bits are always read as 0. The write value
should always be 0.

Rev. 3.00 Jan. 18, 2008 Page 204 of 1458


REJ09B0033-0300
Section 5 Cache

5.3 Operation

5.3.1 Searching the Cache

If the cache is enabled (the CE bit in CCR1 = 1), whenever instructions or data in spaces P0, P1,
P3, and U0 are accessed the cache will be searched to see if the desired instruction or data is in the
cache. Figure 5.2 illustrates the method by which the cache is searched. The cache is a physical
cache and holds physical addresses in its address section. The example of operation in 16-kbyte
mode is described below:

Entries are selected using bits 11 to 4 of the address (virtual) of the access to memory and the tag
address of that entry is read. In parallel with reading the tag address, the virtual address is
converted into the physical address. The virtual address of the access to memory and the physical
address (tag address) read from the address array are compared. The address comparison uses all
four ways. When the comparison shows a match and the selected entry is valid (V = 1), a cache hit
occurs. When the comparison does not show a match or the selected entry is not valid (V = 0), a
cache miss occurs. Figure 5.2 shows a hit on way 1.

Rev. 3.00 Jan. 18, 2008 Page 205 of 1458


REJ09B0033-0300
Section 5 Cache

Virtual address
31 12 11 4 3 21 0

Entry selection Longword (LW) selection

Ways 0 to 3 Ways 0 to 3

MMU 0 V U Tag address LW0 LW1 LW2 LW3


1

255

Physical address

CMP0 CMP1 CMP2 CMP3

Hit signal 1

CMP0: Comparison circuit 0


CMP1: Comparison circuit 1
CMP2: Comparison circuit 2
CMP3: Comparison circuit 3

Figure 5.2 Cache Search Scheme

Rev. 3.00 Jan. 18, 2008 Page 206 of 1458


REJ09B0033-0300
Section 5 Cache

5.3.2 Read Access

(1) Read Hit

In a read access, instructions and data are transferred from the cache to the CPU. The LRU is
updated to indicate that the hit way is the most recently hit way.

(2) Read Miss

An external bus cycle starts and the entry is updated. The way to be replaced is shown in table 5.4.
Entries are updated in 16-byte units. When the desired instruction or data that caused the miss is
loaded from external memory to the cache, the instruction or data is transferred to the CPU in
parallel with being loaded to the cache. When it is loaded to the cache, the U bit is cleared to 0 and
the V bit is set to 1 to indicate that the hit way is the most recently hit way. When the U bit for the
entry which is to be replaced by entry updating in write-back mode is 1, the cache-update cycle
starts after the entry is transferred to the write-back buffer. After the cache completes its update
cycle, the write-back buffer writes the entry back to the memory. Transfer is in 16-byte units.

5.3.3 Prefetch Operation

(1) Prefetch Hit

The LRU is updated to indicate that the hit way is the most recently hit way. The other contents of
the cache are not changed. Instructions and data are not transferred from the cache to the CPU.

(2) Prefetch Miss

Instructions and data are not transferred from the cache to the CPU. The way that is to be replaced
is shown in table 5.3. The other operations are the same as those for a read miss.

5.3.4 Write Access

(1) Write Hit

In a write access in write-back mode, the data is written to the cache and no external memory
write cycle is issued. The U bit of the entry that has been written to is set to 1, and the LRU is
updated to indicate that the hit way is the most recently hit way. In write-through mode, the data is
written to the cache and an external memory write cycle is issued. The U bit of the entry that has
been written to is not updated, and the LRU is updated to indicate that the hit way is the most
recently hit way.

Rev. 3.00 Jan. 18, 2008 Page 207 of 1458


REJ09B0033-0300
Section 5 Cache

(2) Write Miss

In write-back mode, an external write cycle starts when a write miss occurs, and the entry is
updated. The way to be replaced is shown in table 5.4. When the U bit of the entry which is to be
replaced by entry updating is 1, the cache-update cycle starts after the entry has been transferred to
the write-back buffer. Data is written to the cache and the U bit and the V bit are set to 1. The
LRU is updated to indicate that the replaced way is the most recently updated way. After the cache
has completed its update cycle, the write-back buffer writes the entry back to the memory.
Transfer is in 16-byte units. In write-through mode, no write to cache occurs in a write miss; the
write is only to the external memory.

5.3.5 Write-Back Buffer

When the U bit of the entry to be replaced in write-back mode is 1, the entry must be written back
to the external memory. To increase performance, the entry to be replaced is first transferred to the
write-back buffer and fetching of new entries to the cache takes priority over writing back to the
external memory. After the fetching of new entries to the cache completes, the write-back buffer
writes the entry back to the external memory. During the write-back cycles, the cache can be
accessed. The write-back buffer can hold one line of cache data (16 bytes) and its physical
address. Figure 5.3 shows the configuration of the write-back buffer.

PA (31 to 4) Longword 0 Longword 1 Longword 2 Longword 3

PA (31 to 4): Physical address written to external memory


Longword 0 to 3: One line of cache data to be written to external
memory

Figure 5.3 Write-Back Buffer Configuration

5.3.6 Coherency of Cache and External Memory

Use software to ensure coherency between the cache and the external memory. When memory
shared by this LSI and another device is placed in an address space to which caching applies, use
the memory-mapped cache to make the data invalid and written back, as required. Memory that is
shared by this LSI’s CPU and DMAC should also be handled in this way.

Rev. 3.00 Jan. 18, 2008 Page 208 of 1458


REJ09B0033-0300
Section 5 Cache

5.4 Memory-Mapped Cache


To allow software management of the cache, cache contents can be read and written by means of
MOV instructions in privileged mode. The cache is mapped onto the P4 area in virtual address
space. The address array is mapped onto addresses H'F0000000 to H'F0FFFFFF, and the data
array onto addresses H'F1000000 to H'F1FFFFFF. Only longword can be used as the access size
for the address array and data array, and instruction fetches cannot be performed.

5.4.1 Address Array

The address array is mapped onto H'F0000000 to H'F0FFFFFF. To access an address array, the
32-bit address field (for read/write accesses) and 32-bit data field (for write accesses) must be
specified. The address field specifies information for selecting the entry to be accessed; the data
field specifies the tag address, V bit, U bit, and LRU bits to be written to the address array.

In the address field, specify the entry address for selecting the entry, W for selecting the way, A
for enabling or disabling the associative operation, and H'F0 for indicating address array access.
As for W, B'00 indicates way 0, B'01 indicates way 1, B'10 indicates way 2, and B'11 indicates
way 3.

In the data field, specify the tag address, LRU bits, U bit, and V bit. Figure 5.4 shows the address
and data formats in 16-byte mode. For other cache size modes, change the entry address and Was
shown in table 5.8. The following three operations are available in the address array.

(1) Address-Array Read

Read the tag address, LRU bits, U bit, and V bit for the entry that corresponds to the entry address
and way specified by the address field of the read instruction. In reading, the associative operation
is not performed, regardless of whether the associative bit (A bit) specified in the address is 1 or 0.

(2) Address-Array Write (Non-Associative Operation)

Write the tag address, LRU bits, U bit, and V bit, specified by the data field of the write
instruction, to the entry that corresponds to the entry address and way as specified by the address
field of the write instruction. Ensure that the associative bit (A bit) in the address field is set to 0.
When writing to a cache line for which the U bit = 1 and the V bit =1, write the contents of the
cache line back to memory, then write the tag address, LRU bits, U bit, and V bit specified by the
data field of the write instruction. Always clear the uppermost 3 bits (bits 31 to 29) of the tag
address to 0. When 0 is written to the V bit, 0 must also be written to the U bit for that entry.

Rev. 3.00 Jan. 18, 2008 Page 209 of 1458


REJ09B0033-0300
Section 5 Cache

(3) Address-Array Write (Associative Operation)

When writing with the associative bit (A bit) of the address = 1, the addresses in the four ways for
the entry specified by the address field of the write instruction are compared with the tag address
that is specified by the data field of the write instruction. If the MMU is enabled in this case, a
virtual address specified by data is translated into a physical address via the TLB before
comparison. Write the U bit and the V bit specified by the data field of the write instruction to the
entry of the way that has a hit. However, the tag address and LRU bits remain unchanged. When
there is no way that receives a hit, nothing is written and there is no operation. This function is
used to invalidate a specific entry in the cache. When the U bit of the entry that has received a hit
is 1 at this point, writing back should be performed. However, when 0 is written to the V bit, 0
must also be written to the U bit of that entry.

5.4.2 Data Array

The data array is mapped onto H'F1000000 to H'F1FFFFFF. To access a data array, the 32-bit
address field (for read/write accesses) and 32-bit data field (for write accesses) must be specified.
The address field specifies information for selecting the entry to be accessed; the data field
specifies the longword data to be written to the data array.

In the address field, specify the entry address for selecting the entry, L for indicating the longword
position within the (16-byte) line, W for selecting the way, and H'F1 for indicating data array
access. As for L, B'00 indicates longword 0, B'01 indicates longword 1, B'10 indicates longword
2, and B'11 indicates longword 3. As for W, B'00 indicates way 0, B′01 indicates way 1, B'10
indicates way 2, and B′11 indicates way 3.

Since access size of the data array is fixed at longword, bits 1 and 0 of the address field should be
set to B'00.

Figure 5.4 shows the address and data formats in 16-kbyte mode. For other cache size modes,
change the entry address and W as shown in table 5.8.

The following two operations on the data array are available. The information in the address array
is not affected by these operations.

(1) Data-Array Read

Read the data specified by L of the address filed, from the entry that corresponds to the entry
address and the way that is specified by the address filed.

Rev. 3.00 Jan. 18, 2008 Page 210 of 1458


REJ09B0033-0300
Section 5 Cache

(2) Data-Array Write

Write the longword data specified by the data filed, to the position specified by L of the address
field, in the entry that corresponds to the entry address and the way specified by the address field.

(1) Address array access


(a) Address specification

Read access
31 24 23 14 13 12 11 4 3 2 0

1111 0000 *--------* W Entry address 0 * 0 0

Write access
31 24 23 14 13 12 11 4 3 2 0

1111 0000 *--------* W Entry address A * 0 0

(b) Data specification (both read and write accesses)


31 10 9 4 3 2 1 0

Tag address (31 to 10) LRU X X U V

(2) Data array access (both read and write accesses)


(a) Address specification
31 24 23 14 13 12 11 4 3 2 1 0

1111 0001 *--------* W Entry address L 0 0

(b) Data specification


31 0

Longword

*: Don’t care bit


X: 0 for read, don’t care for write

Figure 5.4 Specifying Address and Data for Memory-Mapped Cache Access
(16-kbyte mode)

Table 5.8 Address Format Based on the Size of Cache to be Assigned to Memory

Cache Size Entry Address Bits W Bit


16 kbytes 11 to 4 13 and 12
32 kbytes 12 to 4 14 to 13

Rev. 3.00 Jan. 18, 2008 Page 211 of 1458


REJ09B0033-0300
Section 5 Cache

5.4.3 Usage Examples

(1) Invalidating Specific Entries

Specific cache entries can be invalidated by writing 0 to the entry’s V bit in the memory-mapped
cache access. When the A bit is 1, the tag address specified by the write data is compared to the
tag address within the cache selected by the entry address, and a match is found, the entry is
written back if the entry’s U bit is 1 and the V bit and U bit specified by the write data are written.
If no match is found, there is no operation. In the example shown below, R0 specifies the write
data and R1 specifies the address.

; R0=H'01100010; VPN=B'0000 0001 0001 0000 0000 00, U=0, V=0


; R1=H'F0000088; address array access, entry=B'00001000, A=1
;
MOV.L R0,@R1

(2) Reading the Data of a Specific Entry

To read the data field of a specific entry is enabled by the memory-mapped cache access. The
longword indicated in the data field of the data array in figure 5.4 is read into the register. In the
example shown below, R0 specifies the address and R1 shows what is read.

; R0=H'F100 004C; data array access, entry=B'00000100


; Way = 0, longword address = 3
;
MOV.L @R0,R1 ; Longword 3 is read.

Rev. 3.00 Jan. 18, 2008 Page 212 of 1458


REJ09B0033-0300
Section 6 X/Y Memory

Section 6 X/Y Memory


This LSI has on-chip X-memory and Y-memory which can be used to store instructions or data.

6.1 Features
• Page
There are four pages. The X memory is divided into two pages (pages 0 and 1) and the Y
memory is divided into two pages (pages 0 and 1).
• Memory map
The X/Y memory is located in the virtual address space, physical address space, and X-bus and
Y-bus address spaces.
In the virtual address space, this memory is located in the addresses shown in table 6.1. These
addresses are included in space P2 (when SR.MD = 1) or Uxy (when SR.MD = 0 and SR.DSP
= 1) according to the CPU operating mode.

Table 6.1 X/Y Memory Virtual Addresses

Page Memory Size (Total Four Pages) 16 kbytes


Page 0 of X memory H'A5007000 to H'A5007FFF
Page 1 of X memory H'A5008000 to H'A5008FFF
Page 0 of Y memory H'A5017000 to H'A5017FFF
Page 1 of Y memory H'A5018000 to H'A5018FFF

On the other hand, this memory is located in a part of area 1 in the physical address space. When
this memory is accessed from the physical address space, addresses in which the upper three bits
are 0 in addresses shown in table 6.1 are used. In the X-bus and Y-bus address spaces, addresses in
which the upper 16 bits are ignored in addresses of X memory and Y memory shown in table 6.1
are used.

• Ports
Each page has three independent read/write ports and is connected to each bus. The X memory
is connected to the I bus, X bus, and L bus. The Y memory is connected to the I bus, Y bus,
and L bus. The L bus is used when this memory is accessed from the virtual address space.
The I bus is used when this memory is accessed from the physical address space. The X bus
and Y bus are used when this memory is accessed from the X-bus and Y-bus address spaces.

XYM0000S_000020020300 Rev. 3.00 Jan. 18, 2008 Page 213 of 1458


REJ09B0033-0300
Section 6 X/Y Memory

• Priority order
In the event of simultaneous accesses to the same page from different buses, the accesses are
processed according to the priority order. The priority order is: I bus > X bus > L bus in the X
memory and I bus > Y bus > L bus in the Y memory.

6.2 Operation

6.2.1 Access from CPU

Methods for accessing by the CPU are directly via the L bus from the virtual addresses, and via
the I bus after the virtual addresses are converted to be the physical addresses using the MMU. As
long as a conflict on the page does not occur, access via the L bus is performed in one cycle.
Several cycles are necessary for accessing via the I bus. According to the CPU operating mode,
access from the CPU is as follows:

(1) Privileged mode and privileged DSP mode (SR. MD = 1)

The X/Y memory can be accessed by the CPU directly from space P2. The MMU can be used to
map the virtual addresses in spaces P0 and P3 to this memory.

(2) User DSP mode (SR.MD = 0 and SR.DSP = 1)

The X/Y memory can be accessed by the CPU directly from space Uxy. The MMU can be used to
map the virtual addresses in space U0 to this memory.

(3) User mode (SR.MD = 0 and SR.DSP = 0)

The MMU can be used to map the virtual addresses in space U0 to this memory.

6.2.2 Access from DSP

Methods for accessing from the DSP differ according to instructions.

With a X data transfer instruction and a Y data transfer instruction, the X/Y memory is always
accessed via the X bus or Y bus. As long as a conflict on the page does not occur, access via the X
bus or Y bus is performed in one cycle. The X memory access via the X bus and the Y memory
access via the Y bus can be performed simultaneously.

In the case of a single data transfer instruction, methods for accessing from the DSP are directly
via the L bus from the virtual addresses, and via the I bus after the virtual addresses are converted
to be the physical addresses using the MMU. As long as a conflict on the page does not occur,

Rev. 3.00 Jan. 18, 2008 Page 214 of 1458


REJ09B0033-0300
Section 6 X/Y Memory

access via the L bus is performed in one cycle. Several cycles are necessary for accessing via the I
bus. According to the CPU operating mode, access from the CPU is as follows:

(1) Privileged DSP mode (SR. MD = 1 and SR.DSP = 1)

The X/Y memory can be accessed by the DSP directly from space P2. The MMU can be used to
map the virtual addresses in spaces P0 and P3 to this memory.

(2) User DSP mode (SR.MD = 0 and SR.DSP = 1)

The X/Y memory can be accessed by the DSP directly from space Uxy. The MMU can be used to
map the virtual addresses in space U0 to this memory.

6.2.3 Access from Bus Master Module

The X/Y memory is always accessed by bus master modules such as the DMAC and USB host via
the I bus, which is a physical address bus. Addresses in which the upper three bits are 0 in
addresses shown in table 6.1 must be used.

6.3 Usage Notes

6.3.1 Page Conflict

In the event of simultaneous accesses to the same page from different buses, the conflict on the
pages occurs. Although each access is completed correctly, this kind of conflict tends to lower
X/Y memory accessibility. Therefore it is advisable to provide software measures to prevent such
conflict as far as possible. For example, conflict will not arise if different memory or different
pages are accessed by each bus.

6.3.2 Bus Conflict

The I bus is shared by several bus master modules. When the X/Y memory is accessed via the I
bus, a conflict between the other I-bus master modules may occur on the I bus. This kind of
conflict tends to lower X/Y memory accessibility. Therefore it is advisable to provide software
measures to prevent such conflict as far as possible. For example, by accessing the X/Y memory
by the CPU not via the I bus but directly from space P2 or Uxy, conflict on the I bus can be
prevented.

Rev. 3.00 Jan. 18, 2008 Page 215 of 1458


REJ09B0033-0300
Section 6 X/Y Memory

6.3.3 MMU and Cache Settings

When the X/Y memory is accessed via the I bus using the cache from the CPU and DSP, correct
operation cannot be guaranteed. If the X/Y memory is accessed while the cache is enabled
(CCR1.CE = 1), it is advisable to access the X/Y memory via the L bus from space P2 or Uxy. If
the X/Y memory is accessed from space P0, P3, or U0, it is advisable to access the X/Y memory
via the I bus, which does not use the cache, with MMU setting enabled (MMUCR.AT = 1) and
cache disabled (C bit = 0) as page attributes. Since access using the MMU occurs via the I bus,
several cycles are necessary (the number of necessary cycles varies according to the ratio between
the internal clock (Iφ) and bus clock (Bφ) or the operation state of the DMAC). In a program that
requires high performance, it is advisable to access the X/Y memory from space P2 or Uxy. The
relationship described above is summarized in table 6.2.

Table 6.2 MMU and Cache Settings

Setting Virtual Address Space and Access Enabled or Disabled


CCR1.CE MMUCR.AT P0, U0 P1 P2, Uxy P3
0 0 B B A B
0 1 B B A B
1 0 X X A X
1 1 C X A C
Note: A: Accessible (recommended)
B: Accessible
C: Accessible (Note that MMU page attribute must be specified as cache disabled by
clearing the C bit to 0.)
X: Not accessible

6.3.4 Sleep Mode

In sleep mode, I bus master modules such as the DMAC cannot access the X/Y memory.

Rev. 3.00 Jan. 18, 2008 Page 216 of 1458


REJ09B0033-0300
Section 7 Exception Handling

Section 7 Exception Handling


Exception handling is separate from normal program processing, and is performed by a routine
separate from the normal program. For example, if an attempt is made to execute an undefined
instruction code or an instruction protected by the CPU processing mode, a control function may
be required to return to the source program by executing the appropriate operation or to report an
abnormality and carry out end processing. In addition, a function to control processing requested
by LSI on-chip modules or an LSI external module to the CPU may also be required.

Transferring control to a user-defined exception processing routine and executing the process to
support the above functions are called exception handling. This LSI has two types of exceptions:
general exceptions and interrupts. The user can execute the required processing by assigning
exception handling routines corresponding to the required exception processing and then return to
the source program.

A reset input can terminate the normal program execution and pass control to the reset vector after
register initialization. This reset operation can also be regarded as an exception handling. This
section describes an overview of the exception handling operation. Here, general exceptions and
interrupts are referred to as exception handling. For interrupts, this section describes only the
process executed for interrupt requests. For details on how to generate an interrupt request, refer to
section 8, Interrupt Controller (INTC).

7.1 Register Descriptions


There are five registers for exception handling. A register with an undefined initial value should
be initialized by the software. Refer to section 37, List of Registers, for more details on the
addresses and access size of these registers.

• TRAPA exception register (TRA)


• Exception event register (EXPEVT)
• Interrupt event register (INTEVT)
• Interrupt event register 2 (INTEVT2)
• Exception address register (TEA)

Rev. 3.00 Jan. 18, 2008 Page 217 of 1458


REJ09B0033-0300
Section 7 Exception Handling

Figure 7.1 shows the bit configuration of each register.

31 10 9 21 0
0 TRA 0 TRA

31 12 11 0
0 EXPEVT EXPEVT

31 12 11 0
0 INTEVT INTEVT

31 12 11 0
0 INTEVT2 INTEVT2

31 0
TEA TEA

Figure 7.1 Register Bit Configuration

7.1.1 TRAPA Exception Register (TRA)

TRA is assigned to address H'FFFFFFD0 and consists of the 8-bit immediate data (imm) of the
TRAPA instruction. TRA is automatically specified by the hardware when the TRAPA instruction
is executed. Only bits 9 to 2 of the TRA can be re-written using the software.

Initial
Bit Bit Name Value R/W Description
31 to 10   R Reserved
These bits are always read as 0. The write value
should always be 0.
9 to 2 TRA  R/W 8-bit Immediate Data
1, 0   R Reserved
These bits are always read as 0. The write value
should always be 0.

Rev. 3.00 Jan. 18, 2008 Page 218 of 1458


REJ09B0033-0300
Section 7 Exception Handling

7.1.2 Exception Event Register (EXPEVT)

EXPEVT is assigned to address H'FFFFFFD4 and consists of a 12-bit exception code. Exception
codes to be specified in EXPEVT are those for resets and general exceptions. These exception
codes are automatically specified the hardware when an exception occurs. Only bits 11 to 0 of
EXPEVT can be re-written using the software.

Initial
Bit Bit Name Value R/W Description
31 to 12  All 0 R Reserved
These bits are always read as 0. The write value
should always be 0.
11 to 0 EXPEVT * R/W 12-bit Exception Code
Note: Initialized to H'000 at power-on reset and H'020 at manual reset.

7.1.3 Interrupt Event Register (INTEVT)

INTEVT is assigned to address H'FFFFFFD8 and stores an exception code or a code which
indicates interrupt priority order. A code to be specified when an interrupt occurs is determined by
an interrupt source. (For details, see section 8.4.6, Interrupt Exception Handling and Priority.)
These exception and interrupt priority order codes are automatically specified by the hardware
when an exception occurs. INTEVT can be modified using the software. Only bits 11 to 0 of
INTEVT can be modified using the software.

Initial
Bit Bit Name Value R/W Description
31 to 12  All 0 R Reserved
These bits are always read as 0. The write value
should always be 0.
11 to 0 INTEVT  R 12-bit Exception Code

Rev. 3.00 Jan. 18, 2008 Page 219 of 1458


REJ09B0033-0300
Section 7 Exception Handling

7.1.4 Interrupt Event Register 2 (INTEVT2)

INTEVT2 is assigned to address H'A4000000 and consists of a 12-bit exception code. Exception
codes to be specified in INTEVT2 are those for interrupt requests. These exception codes are
automatically specified by the hardware when an exception occurs. INTEVT2 cannot be modified
using the software.

Initial
Bit Bit Name Value R/W Description
31 to 12  All 0 R Reserved
These bits are always read as 0. The write value
should always be 0.
11 to 0 INTEVT2  R 12-bit Exception Code

7.1.5 Exception Address Register (TEA)

TEA is assigned to address H'FFFFFFFC and the virtual address for an exception occurrence is
stored in this register when an exception related to memory accesses occurs. TEA can be modified
using the software.

Initial
Bit Bit Name Value R/W Description
31 to 0 TEA All 0 R/W The virtual address for an exception occurrence

Rev. 3.00 Jan. 18, 2008 Page 220 of 1458


REJ09B0033-0300
Section 7 Exception Handling

7.2 Exception Handling Function

7.2.1 Exception Handling Flow

In exception handling, the contents of the program counter (PC) and status register (SR) are saved
in the saved program counter (SPC) and saved status register (SSR), respectively, and execution of
the exception handler is invoked from a vector address. By executing the return from exception
handler (RTE) in the exception handler routine, it restores the contents of PC and SR, and returns
to the processor state at the point of interruption and the address where the exception occurred.

A basic exception handling sequence consists of the following operations. If an exception occurs
and the CPU accepts it, operations 1 to 8 are executed.

1. The contents of PC is saved in SPC.


2. The contents of SR is saved in SSR.
3. The block (BL) bit in SR is set to 1, masking any subsequent exceptions.
4. The mode (MD) bit in SR is set to 1 to place the privileged mode.
5. The register bank (RB) bit in SR is set to 1.
6. An exception code identifying the exception event is written to bits 11 to 0 of the exception
event register (EXPEVT); an exception code identifying the interrupt request is written to bits
11 to 0 of the interrupt event register (INTEVT) or interrupt event register 2 (INTEVT2).
7. If a TRAPA instruction is executed, an 8-bit immediate data specified by the TRAPA
instruction is set to TRA. For an exception related to memory accesses, the logic address
where the exception occurred is written to TEA.*1
8. Instruction execution jumps to the designated exception vector address to invoke the handler
routine.

The above operations from 1 to 8 are executed in sequence. During these operations, no other
exceptions may be accepted unless multiple exception acceptance is enabled.

In an exception handling routine for a general exception, the appropriate exception handling must
be executed based on an exception source determined by the EXPEVT. In an interrupt exception
handling routine, the appropriate exception handling must be executed based on an exception
source determined by the INTEVT or INTEVT2. After the exception handling routine has been
completed, program execution can be resumed by executing an RTE instruction. The RTE
instruction causes the following operations to be executed.

Rev. 3.00 Jan. 18, 2008 Page 221 of 1458


REJ09B0033-0300
Section 7 Exception Handling

1. The contents of the SSR are restored into the SR to return to the processing state in effect
before the exception handling took place.
2. A delay slot instruction of the RTE instruction is executed.*2
3. Control is passed to the address stored in the SPC.

The above operations from 1 to 3 are executed in sequence. During these operations, no other
exceptions may be accepted. By changing the SPC and SSR before executing the RTE instruction,
a status different from that in effect before the exception handling can also be specified.

Notes: 1. The MMU registers are also modified if an MMU exception occurs.
2. For details on the CPU processing mode in which RTE delay slot instructions are
executed, please refer to section 7.5, Usage Notes.

7.2.2 Exception Vector Addresses

A vector address for general exceptions is determined by adding a vector offset to a vector base
address. The vector offset for general exceptions other than the TLB miss exception is
H'00000100. The vector offset for interrupts is H'00000600. The vector base address is loaded into
the vector base register (VBR) using the software. The vector base address should reside in the P1
or P2 fixed physical address space.

7.2.3 Exception Codes

The exception codes are written to bits 11 to 0 of the EXPEVT (for reset or general exceptions) or
the INTEVT and INTEVT2 (for interrupt requests) to identify each specific exception event. See
section 8, Interrupt Controller (INTC), for details of the exception codes for interrupt requests.
Table 7.1 lists exception codes for resets and general exceptions.

7.2.4 Exception Request and BL Bit (Multiple Exception Prevention)

The BL bit in SR is set to 1 when a reset or exception is accepted. While the BL bit is set to 1,
acceptance of general exceptions is restricted as described below, making it possible to effectively
prevent multiple exceptions from being accepted.

If the BL bit is set to 1, an interrupt request is not accepted and is retained. The interrupt request is
accepted when the BL bit is cleared to 0. If the CPU is in low power consumption mode, an
interrupt is accepted even if the BL bit is set to 1 and the CPU returns from the low power
consumption mode.

Rev. 3.00 Jan. 18, 2008 Page 222 of 1458


REJ09B0033-0300
Section 7 Exception Handling

A DMA error is not accepted and is retained if the BL bit is set to 1 and accepted when the BL bit
is cleared to 0. User break requests generated while the BL bit is set are ignored and are not
retained. Accordingly, user breaks are not accepted even if the BL bit is cleared to 0.

If a general exception other than a DMA address error or user break occurs while the BL bit is set
to 1, the CPU enters a state similar to that in effect immediately after a reset, and passes control to
the reset vector (H'A0000000) (multiple exception). In this case, unlike a normal reset, modules
other than the CPU are not initialized, the contents of EXPEVT, SPC, and SSR are undefined, and
this status is not detected by an external device.

To enable acceptance of multiple exceptions, the contents of SPC and SSR must be saved while
the BL bit is set to 1 after an exception has been accepted, and then the BL bit must be cleared to
0. Before restoring the SPC and SSR, the BL bit must be set to 1.

7.2.5 Exception Source Acceptance Timing and Priority

(1) Exception Request of Instruction Synchronous Type and Instruction Asynchronous


Type

Resets and interrupts are requested asynchronously regardless of the program flow. In general
exceptions, a DMA address error and a user break under the specific condition are also requested
asynchronously. The user cannot expect on which instruction an exception is requested. For
general exceptions other than a DMA address error and a user break under a specific condition,
each general exception corresponds to a specific instruction.

(2) Re-execution Type and Processing-completion Type Exceptions

All exceptions are classified into two types: a re-execution type and a processing-completion type.
If a re-execution type exception is accepted, the current instruction executed when the exception is
accepted is terminated and the instruction address is saved to the SPC. After returning from the
exception processing, program execution resumes from the instruction where the exception was
accepted. In a processing-completion type exception, the current instruction executed when the
exception is accepted is completed, the next instruction address is saved to the SPC, and then the
exception processing is executed.

During a delayed branch instruction and delay slot, the following operations are executed. A re-
execution type exception detected in a delay slot is accepted before executing the delayed branch
instruction. A processing-completion type exception detected in a delayed branch instruction or a
delay slot is accepted when the delayed branch instruction has been executed. In this case, the
acceptance of delayed branch instruction or a delay slot precedes the execution of the branch
destination instruction. In the above description, a delay slot indicates an instruction following an

Rev. 3.00 Jan. 18, 2008 Page 223 of 1458


REJ09B0033-0300
Section 7 Exception Handling

unconditional delayed branch instruction or an instruction following a conditional delayed branch


instruction whose branch condition is satisfied. If a branch does not occur in a conditional delayed
branch, the normal processing is executed.

(3) Acceptance Priority and Test Priority

Acceptance priorities are determined for all exception requests. The priority of resets, general
exceptions, and interrupts are determined in this order: a reset is always accepted regardless of the
CPU status. Interrupts are accepted only when resets or general exceptions are not requested.

If multiple general exceptions occur simultaneously in the same instruction, the priority is
determined as follows.

1. A processing-completion type exception generated at the previous instruction*


2. A user break before instruction execution (re-execution type)
3. An exception related to an instruction fetch (CPU address error and MMU related exceptions:
re-execution type)
4. An exception caused by an instruction decode (General illegal instruction exceptions and slot
illegal instruction exceptions: re-execution type, unconditional trap: processing-completion
type)
5. An exception related to data access (CPU address error and MMU related exceptions: re-
execution type)
6. Unconditional trap (processing-completion type)
7. A user break other than one before instruction execution (processing-completion type)
8. DMA address error (processing-completion type)

Note: * If a processing-completion type exception is accepted at an instruction, exception


processing starts before the next instruction is executed. This exception processing
executed before an exception generated at the next instruction is detected.

Only one exception is accepted at a time. Accepting multiple exceptions sequentially results in all
exception requests being processed.

Rev. 3.00 Jan. 18, 2008 Page 224 of 1458


REJ09B0033-0300
Section 7 Exception Handling

Table 7.1 Exception Event Vectors

Exception Current Exception Process Vector Vector


1
Type Instruction Exception Event Priority* Order at BL=1 Code Offset

Reset Aborted Power-on reset 1 1 Reset H'000 —


(asynchro-
Manual reset 1 2 Reset H'020 —
nous)
General Re-executed User break(before 2 0 Ignored H'1E0 H'00000100
exception instruction execution)
events
CPU address error 2 1 Reset H'0E0 H'00000100
(synchro- 4
(instruction access) *
nous)
TLB miss 2 1-1 Reset H'040 H'00000400
4 5
(instruction access) * *
TLB invalid (instruction 2 1-2 Reset H'040 H'00000100
4 5
access)* *
TLB protection violation 2 1-3 Reset H'0A0 H'00000100
4 5
(instruction access)* *
Illegal general instruction 2 2 Reset H'180 H'00000100
exception
Illegal slot 2 2 Reset H'1A0 H'00000100
instruction exception
CPU address error 2 3 Reset H'0E0/ H'00000100
4
(data access)* H'100
TLB miss 2 3-1 Reset H'040/ H'00000400
4 5
(data access)* * H'060
Re-executed TLB invalid 2 3-2 Reset H'040/ H'00000100
4 5
(data access)* * H'060
TLB protection violation 2 3-3 Reset H'0A0/ H'00000100
4 5
(data access)* * H'0C0
Initial page write 2 3-4 Reset H'080 H'00000100
4 5
(data access)* *
Completed Unconditional trap 2 4 Reset H'160 H'00000100
(TRAPA instruction)
User breakpoint (After 2 5 Ignored H'1E0 H'00000100
instruction execution,
address)

Rev. 3.00 Jan. 18, 2008 Page 225 of 1458


REJ09B0033-0300
Section 7 Exception Handling

Exception Current Exception Process Vector Vector


1
Type Instruction Exception Event Priority* Order at BL=1 Code Offset

General Completed User breakpoint 2 5 Ignored H'1E0 H'00000100


exception (Data break, I-BUS
events break)
(asynchro-
DMA address error 2 6 Retained H'5C0 H'00000100
nous)
2 3
General Completed Interrupt requests 3 —* Retained —* H'00000600
interrupt
requests
(asynchro-
nous)
Notes: 1. Priorities are indicated from high to low, 1 being the highest and 3 the lowest.
A reset has the highest priority. An interrupt is accepted only when general exceptions
are not requested.
2. For details on priorities in multiple interrupt sources, refer to section 8, Interrupt
Controller (INTC).
3. If an interrupt is accepted, the exception event register (EXPEVT) is not changed. The
interrupt source code is specified in the interrupt event registers (INTEVT and
INTEVT2). For details, refer to section 8, Interrupt Controller (INTC).
4. If one of these exceptions occurs in a specific part of the repeat loop, a specific code
and vector offset are specified.
5. These exception codes are valid when the MMU is used.

Rev. 3.00 Jan. 18, 2008 Page 226 of 1458


REJ09B0033-0300
Section 7 Exception Handling

7.3 Individual Exception Operations


This section describes the conditions for specific exception handling, and the processor operations.
This section describes resets and general exceptions. For interrupt operations, refer to section 8,
Interrupt Controller (INTC).

7.3.1 Resets

(1) Power-On Reset

• Conditions
Power-on reset is request
• Operations
Set EXPEVT to H'000, initialize the CPU and on-chip peripheral modules, and branch to the
reset vector H'A0000000. For details, refer to the register descriptions in the relevant sections.

(2) Manual Reset

• Conditions
Manual reset is request
• Operations
Set EXPEVT to H'020, initialize the CPU and on-chip peripheral modules, and branch to the
reset vector H'A0000000. For details, refer to the register descriptions in the relevant sections.

7.3.2 General Exceptions

(1) CPU address error

• Conditions
 Instruction is fetched from odd address (4n + 1, 4n + 3)
 Word data is accessed from addresses other than word boundaries (4n + 1, 4n + 3)
 Longword is accessed from addresses other than longword boundaries (4n + 1, 4n + 2,
4n + 3)
 The area ranging from H'80000000 to H'FFFFFFFF in virtual space is accessed in user
mode
• Types
Instruction synchronous, re-execution type

Rev. 3.00 Jan. 18, 2008 Page 227 of 1458


REJ09B0033-0300
Section 7 Exception Handling

• Save address
Instruction fetch: An instruction address to be fetched when an exception occurred
Data access: An instruction address where an exception occurs (a delayed branch instruction
address if an instruction is assigned to a delay slot)
• Exception code
An exception occurred during read: H'0E0
An exception occurred during write: H'100
• Remarks
The virtual address (32 bits) that caused the exception is set in TEA.

(2) Illegal general instruction exception

• Conditions
 When undefined code not in a delay slot is decoded
Delayed branch instructions: JMP, JSR, BRA, BRAF, BSR, BSRF, RTS, RTE, BT/S, BF/S

Note: For details on undefined code, refer to table 2.12. When an undefined code other than
H'F000 to H'FFFF is decoded, operation cannot be guaranteed.

 When a privileged instruction not in a delay slot is decoded in user mode


Privileged instructions: LDC, STC, RTE, LDTLB, SLEEP; instructions that access GBR
with LDC/STC are not privileged instructions.
• Types
Instruction synchronous, re-execution type
• Save address
An instruction address where an exception occurs
• Exception code
H'180
• Remarks
None

Rev. 3.00 Jan. 18, 2008 Page 228 of 1458


REJ09B0033-0300
Section 7 Exception Handling

(3) Illegal slot instruction

• Conditions
 When undefined code in a delay slot is decoded
Delayed branch instructions: JMP, JSR, BRA, BRAF, BSR, BSRF, RTS, RTE, BT/S, BF/S
 When a privileged instruction in a delay slot is decoded in user mode
Privileged instructions: LDC, STC, RTE, LDTLB, SLEEP; instructions that access GBR
with LDC/STC are not privileged instructions.
 When an instruction that rewrites PC in a delay slot is decoded
Instructions that rewrite PC: JMP, JSR, BRA, BRAF, BSR, BSRF, RTS, RTE, BT, BF,
BT/S, BF/S, TRAPA, LDC Rm, SR, LDC.L @Rm+, SR
• Types
Instruction synchronous, re-execution type
• Save address
A delayed branch instruction address
• Exception code
H'1A0
• Remarks
None

(4) Unconditional trap

• Conditions
TRAPA instruction executed
• Types
Instruction synchronous, processing-completion type
• Save address
An address of an instruction following TRAPA
• Exception code
H'160
• Remarks
The exception is a processing-completion type, so an instruction after the TRAPA instruction
is saved to SPC. The 8-bit immediate value in the TRAPA instruction is set in TRA[9:2].

Rev. 3.00 Jan. 18, 2008 Page 229 of 1458


REJ09B0033-0300
Section 7 Exception Handling

(5) User break point trap

• Conditions
When a break condition set in the user break controller is satisfied
• Types
Break (L bus) before instruction execution: Instruction synchronous, re-execution type
Operand break (L bus): Instruction synchronous, processing-completion type
Data break (L bus): Instruction asynchronous, processing-completion type
I bus break: Instruction asynchronous, processing-completion type
• Save address
Re-execution type: An address of the instruction where a break occurs (a delayed branch
instruction address if an instruction is assigned to a delay slot)
Processing-completion type: An address of the instruction following the instruction where a
break occurs (a delayed branch instruction destination address if an instruction is assigned to a
delay slot)
• Exception code
H'1E0
• Remarks
For details on user break controller, refer to section 33, User Break Controller (UBC).

(6) DMA address error

• Conditions
 Word data accessed from addresses other than word boundaries (4n + 1, 4n + 3)
 Longword accessed from addresses other than longword boundaries (4n + 1, 4n + 2, 4n +
3)
• Types
Instruction asynchronous, processing-completion type
• Save address
An address of the instruction following the instruction where a break occurs (a delayed branch
instruction destination address if an instruction is assigned to a delay slot)
• Exception code
H'5C0

Rev. 3.00 Jan. 18, 2008 Page 230 of 1458


REJ09B0033-0300
Section 7 Exception Handling

• Remarks
An exception occurs when a DMA transfer is executed while an exception instruction address
described above is specified in the DMAC. Since the DMA transfer is performed
asynchronously with the CPU instruction operation, an exception is also requested
asynchronously with the instruction execution. For details on DMAC, refer to section 10,
Direct Memory Access Controller (DMAC).

7.3.3 General Exceptions (MMU Exceptions)

When the address translation unit of the memory management unit (MMU) is valid, MMU
exceptions are checked after a CPU address error has been checked. Four types of MMU
exceptions are defined: TLB miss exception, TLB invalid exception, TLB protection exception,
initial page write exception. These exceptions are checked in this order.

A vector offset for a TLB miss exception is defined as H'00000400 to simplify exception source
determination. For details on MMU exception operations, refer to section 4, Memory Management
Unit (MMU).

(1) TLB miss exception

• Conditions
Comparison of TLB addresses shows no address match.
• Types
Instruction synchronous, re-execution type
• Save address
Instruction fetch: An instruction address to be fetched when an exception occurred
Data access: An instruction address where an exception occurs (a delayed branch instruction
address if an instruction is assigned to a delay slot)
• Exception code
An exception occurred during read: H'040
An exception occurred during write: H'060
• Remarks
• The virtual address (32 bits) that caused the exception is set in TEA, and the MMU register is
updated. The vector address for TLB miss exception is VBR + H'0400. To speed up TLB miss
processing, the offset differs from other exceptions.

Rev. 3.00 Jan. 18, 2008 Page 231 of 1458


REJ09B0033-0300
Section 7 Exception Handling

(2) TLB invalid exception

• Conditions
Comparison of TLB addresses shows address match but V = 0.
• Types
Instruction synchronous, re-execution type
• Save address
Instruction fetch: An instruction address to be fetched when an exception occurred
Data access: An instruction address where an exception occurs (a delayed branch instruction
address if an instruction is assigned to a delay slot)
• Exception code
An exception occurred during read: H'040
An exception occurred during write: H'060
• Remarks
The virtual address (32 bits) that caused the exception is set in TEA, and the MMU register is
updated.

(3) TLB protection exception

• Conditions
When a hit access violates the TLB protection information (PR bits).
• Types
Instruction synchronous, re-execution type
• Save address
Instruction fetch: An instruction address to be fetched when an exception occurred
Data access: An instruction address where an exception occurs (a delayed branch instruction
address if an instruction is assigned to a delay slot)
• Exception code
An exception occurred during read: H'0A0
An exception occurred during write: H'0C0
• Remarks
The virtual address (32 bits) that caused the exception is set in TEA, and the MMU register is
updated.

Rev. 3.00 Jan. 18, 2008 Page 232 of 1458


REJ09B0033-0300
Section 7 Exception Handling

(4) Initial page write exception

• Conditions
A hit occurred to the TLB for a store access, but D = 0.
• Types
Instruction synchronous, re-execution type
• Save address
Instruction fetch: An instruction address to be fetched when an exception occurred
Data access: An instruction address where an exception occurs (a delayed branch instruction
address if an instruction is assigned to a delay slot)
• Exception code
H'080
• Remarks
The virtual address (32 bits) that caused the exception is set in TEA, and the MMU register is
updated.

Rev. 3.00 Jan. 18, 2008 Page 233 of 1458


REJ09B0033-0300
Section 7 Exception Handling

7.4 Exception Processing While DSP Extension Function is Valid


When the DSP extension function is valid (the DSP bit in SR is set to 1), some exception
processing acceptance conditions or exception processing may be changed.

7.4.1 Illegal Instruction Exception and Illegal Slot Instruction Exception

In the DSP mode, a DSP extension instruction can be executed. If a DSP extension instruction is
executed when the DSP bit in SR is cleared to 0 (in a mode other than the DSP mode), an illegal
instruction exception occurs.

In the DSP mode, STC and LDC instructions for the SR register can be executed even in user
mode. (Note, however, that only the RC[11:0], DMX, DMY, and RF[1:0] bits in the DSP
extension bits can be changed.)

7.4.2 CPU Address Error

In the DSP mode, a part of the space P2 (Uxy area: H'A5000000 to H'A5FFFFFF) can be accessed
in user mode and no CPU address error will occur even if the area is accessed.

7.4.3 Exception in Repeat Control Period

If an exception is requested or an exception is accepted during repeat control, the exception may
not be accepted correctly or a program execution may not be returned correctly from exception
processing that is different from the normal state. These restrictions may occur from repeat
detection instruction to repeat end instruction while the repeat counter is 1 or more. In this section,
this period is called the repeat control period.

The following shows program examples where the number of instructions in the repeat loop are 4
or more, 3, 2, and 1, respectively. In this section, a repeat detection instruction and its instruction
address are described as RptDtct. The first, second, and third instructions following the repeat
detection instruction are described as RptDtct1, RptDtct2, and RptDtct3. In addition, [A], [B],
[C1], and [C2] in the following examples indicate instructions where a restriction occurs. Table
7.2 summarizes the instruction positions and restriction types.

Rev. 3.00 Jan. 18, 2008 Page 234 of 1458


REJ09B0033-0300
Section 7 Exception Handling

Table 7.2 Instruction Positions and Restriction Types

Instruction Illegal Interrupt, CPU Address


1
Position SPC* Instruction*2 Break*3 Error*4
[A]
[B] Retained
[C1] Added Retained Instruction/data
[C2] Illegal Added Retained Instruction/data
Notes: 1. A specific address is specified in the SPC if an exception occurs while SR.RC[11:0] ≥ 2.
2. There are a greater number of instructions that can be illegal instructions while
SR.RC[11:0] ≥ 1.
3. An interrupt, break or DMA address error request is retained while SR.RC[11:0] ≥1.
4. A specific exception code is specified while SR.RC[11:0] ≥1.

• Example 1: Repeat loop consisting of four or greater instructions


LDRS RptStart ; [A]
LDRE RptDtct + 4 ; [A]
SETRC #4 ; [A]
instr0 ; [A]
RptStart: instr1 ; [A][Repeat start instruction]
……… ; [A]
……… ; [A]
RptDtct: RptDtct ; [B] A repeat detection
instruction is an
instruction three
instructions before a
repeat end instruction
RptDtct1 ; [C1]
RptDtct2 ; [C2]
RptEnd: RptDtct3 ; [C2][Repeat end instruction]
instrNext ; [A]

Rev. 3.00 Jan. 18, 2008 Page 235 of 1458


REJ09B0033-0300
Section 7 Exception Handling

• Example 2: Repeat loop consisting of three instructions


LDRS RptDtct + 4 ; [A]
LDRE RptDtct + 4 ; [A]
SETRC #4 ; [A]
RptDtct: RptDtct ; [B] A repeat detection
instruction is an
instruction prior to a
repeat start instruction
RptStart: RptDtct1 ; [C1][Repeat start instruction]
RptDtct2 ; [C2]
RptEnd: RptDtct3 ; [C2][Repeat end instruction]
instrNext ; [A]

• Example 3: Repeat loop consisting of two instructions


LDRS RptDtct + 6 ; [A]
LDRE RptDtct + 4 ; [A]
SETRC #4 ; [A]
RptDtct: RptDtct ; [B] A repeat detection
instruction is an
instruction prior to a
repeat start instruction
RptStart: RptDtct1 ; [C1][Repeat start instruction]
RptEnd: RptDtct2 ; [C2][Repeat end instruction]
instrNext ; [A]

• Example 4: Repeat loop consisting of one instruction


LDRS RptDtct + 8 ; [A]
LDRE RptDtct + 4 ; [A]
SETRC #4 ; [A]
RptDtct: RptDtct ; [B] A repeat detection
instruction is an
instruction prior to a
repeat start instruction
RptStart:
RptEnd: RptDtct1 ; [C1][Repeat start
instruction]== [Repeat end
instruction]
instrNext ; [A]

Rev. 3.00 Jan. 18, 2008 Page 236 of 1458


REJ09B0033-0300
Section 7 Exception Handling

(1) SPC Saved by an Exception in Repeat Control Period

If an exception is accepted in the repeat control period while the repeat counter (RC[11:0]) in the
SR register is two or greater, the program counter to be saved may not indicate the value to be
returned correctly. To execute the repeat control after returning from an exception processing, the
return address must indicate an instruction prior to a repeat detection instruction. Accordingly, if
an exception is accepted in repeat control period, an exception other than re-execution type
exception by a repeat detection instruction cannot return to the repeat control correctly.

Table 7.3 SPC Value When a Re-Execution Type Exception Occurs in Repeat Control
(SR.RC[11:0]≥2)

Number of Instructions in a Repeat Loop


Instruction Where an
Exception Occurs 1 2 3 4 or Greater
RptDtct RptDtct RptDtct RptDtct RptDtct
RptDtct1 RptDtct1 RptDtct1 RptDtct1 RptDtct1
RptDtct2  RptDtct1 RptDtct1 RS-4
RptDtct3   RptDtct1 RS-2
Note: The following labels are used here.
RptDtct: Repeat detection instruction address
RptDtct1: Instruction address immediately after the repeat detect instruction
RptDtct2: Second instruction address from the repeat detect instruction
RptDtct3: Third instruction address from the repeat detect instruction
RS: Repeat start instruction address
If a re-execution type exception is accepted at an instruction in the hatched areas above, a
return address to be saved in the SPC is incorrect. If SR.RC[11:0] is 1 or 0, a correct return
address is saved in the SPC.

Rev. 3.00 Jan. 18, 2008 Page 237 of 1458


REJ09B0033-0300
Section 7 Exception Handling

(2) Illegal Instruction Exception in Repeat Control Period

If one of the following instructions is executed at the address following RptDtct1, a general illegal
instruction exception occurs. For details on an address to be saved in the SPC, refer to SPC Saved
by an Exception in Repeat Control Period in section 7.4.3, Exception in Repeat Control Period.

• Branch instructions
BRA, BSR, BT, BF, BT/S, BF/S, BSRF, RTS, BRAF, RTE, JSR, JMP, TRAPA
• Repeat control instructions
SETRC, LDRS, LDRE
• Load instructions for SR, RS, and RE
LDC Rn,SR, LDC @Rn+,SR, LDC Rn,RE, LDC @Rn+,RE, LDC Rn,RS, LDC @Rn+, Rs

Note: An extension instruction of this LSI and is not disclosed to the user.

In a repeat loop consisting of one to three instructions, some restrictions apply to repeat
detection instructions and all the remaining instructions. In a repeat loop consisting of four
or more instructions, restrictions apply to only the three instructions that include a repeat
end instruction.

(3) An Exception Retained in Repeat Control Period

In the repeat control period, an interrupt or some exception will be retained to prevent an
exception acceptance at an instruction where returning from the exception cannot be performed
correctly. For details, refer to repeat loop program examples 1 to 4. In the examples, exceptions
generated at instructions indicated as [B], [C], ([C1], or [C2]), the following processing is
executed.

• Interrupt, DMA address error


An exception request is not accepted and retained at instructions [B] and [C]. If an instruction
indicates as [A] is executed at the next time, an exception request is accepted.* As shown in
examples 1 to 4, any interrupt or DMA address error cannot be accepted in a repeat loop
consisting of four instructions or less.

Note: An interrupt request or a DMA address error exception request is retained in the interrupt
controller (INTC) and the direct memory access controller (DMAC) until the CPU can
accept a request.

Rev. 3.00 Jan. 18, 2008 Page 238 of 1458


REJ09B0033-0300
Section 7 Exception Handling

• User break before instruction execution


A user break before instruction execution is accepted at instruction [B], and an address of
instruction [B] is saved in the SPC. This exception cannot be accepted at instruction [C] but
the exception request is retained until an instruction [A] or [B] is executed at the next time.
Then, the exception request is accepted before an instruction [A] or [B] is executed. In this
case, an address of instruction [A] or [B] is saved in the SPC.
• User break after instruction execution
A user break after instruction execution cannot be accepted at instructions [B] and [C] but the
exception request is retained until an instruction [A] or [B] is executed at the next time. Then,
the exception request is accepted before an instruction [A] or [B] is executed. In this case, an
address of instruction [A] or [B] is saved in the SPC.

Table 7.4 Exception Acceptance in the Repeat Loop

Exception Type Instruction [B] Instruction [C]


Interrupt Not accepted Not accepted
DMA address error Not accepted Not accepted
User break before instruction execution Accepted Not accepted
User break after instruction execution Not accepted Not accepted

(4) CPU Address Error in Repeat Control Period

If a CPU address error occurs in the repeat control period, the exception is accepted but an
exception code (H'070) indicating the repeat loop period is specified in the EXPEVT. If a CPU
address error occurs in instructions following a repeat detection instruction to repeat end
instruction, an exception code for instruction access or data access is specified in the EXPEVT.

The SPC is saved according to the description, SPC Saved by an Exception in Repeat Control
Period in section 7.4.3, Exception in Repeat Control Period.

After the CPU address error exception processing, the repeat control cannot be returned correctly.
To execute a repeat loop correctly, care must be taken not to generate a CPU address error in the
repeat control period.

Note: In a repeat loop consisting of one to three instructions, some restrictions apply to repeat
detection instructions and all the remaining instructions. In a repeat loop consisting of four
or more instructions, restrictions apply to only the three instructions that include a repeat
end instruction. The restriction occurs when SR.RC[11:0] ≥ 1.

Rev. 3.00 Jan. 18, 2008 Page 239 of 1458


REJ09B0033-0300
Section 7 Exception Handling

Table 7.5 Instruction Where a Specific Exception Occurs When a Memory Access
Exception Occurs in Repeat Control (SR.RC[11:0]≥1)

Number of Instructions in a Repeat Loop


Instruction Where an
Exception Occurs 1 2 3 4 or Greater
RptDtct    
RptDtct1 Instruction/data Instruction/data Instruction/data Instruction/data
access access access access
RptDtct2  Instruction/data Instruction/data Instruction/data
access access access
RptDtct3   Instruction/data Instruction/data
access access
Note: The following labels are used here.
RptDtct: Repeat detection instruction address
RptDtct1: Instruction address immediately after the repeat detect instruction
RptDtct2: Second instruction address from the repeat detect instruction
RptDtct3: Third instruction address from the repeat detect instruction

(5) MMU Exception in Repeat Control Period

If an MMU exception occurs in the repeat control period, a specific exception code is generated as
well as a CPU address error. For a TLB miss exception, TLB invalid exception, and initial page
write exception, an exception code (H'070) indicating the repeat loop period is specified in the
EXPEVT. For a TLB protection exception, an exception code (H'0D0) is specified in the
EXPEVT. In a TLB miss exception, vector offset is specified as H'00000100.

An instruction where an exception occurs and the SPC value to be saved are the same as those for
the CPU address error.

After this exception processing, the repeat control cannot be returned correctly. To execute a
repeat loop correctly, care must be taken not to generate an MMU related exception in the repeat
control period.

Note: In a repeat loop consisting of one to three instructions, some restrictions apply to repeat
detection instructions and all the remaining instructions. In a repeat loop consisting of four
or more instructions, restrictions apply to only the three instructions that include a repeat
end instruction. The restriction occurs when SR.RC[11:0] ≥ 1.

Rev. 3.00 Jan. 18, 2008 Page 240 of 1458


REJ09B0033-0300
Section 7 Exception Handling

7.5 Usage Notes


1. An instruction assigned at a delay slot of the RTE instruction is executed after the contents of
the SSR is restored into the SR. An acceptance of an exception related to instruction access is
determined according to the SR before restore. An acceptance of other exceptions is
determined by processing mode of the SR after restore, and BL bit value. A processing-
completion type exception is accepted before an instruction at the RTE branch destination
address is executed. However, note that the correct operation cannot be guaranteed if a re-
execution type exception occurs.
2. In an instruction assigned at a delay slot of the RTE instruction, a user break cannot be
accepted.
3. If the MD and BL bits of the SR register are changed by the LDC instruction, an exception is
accepted according to the changed SR value from the next instruction.* A processing-
completion type exception is accepted before the next instruction is executed. An interrupt
and DMA address error in re-execution type exceptions are accepted before the next
instruction is executed.

Note: * If an LDC instruction is executed for the SR, the following instructions are re-fetched
and an instruction fetch exception is accepted according to the modified SR value.

Rev. 3.00 Jan. 18, 2008 Page 241 of 1458


REJ09B0033-0300
Section 7 Exception Handling

Rev. 3.00 Jan. 18, 2008 Page 242 of 1458


REJ09B0033-0300
Section 8 Interrupt Controller (INTC)

Section 8 Interrupt Controller (INTC)


The interrupt controller (INTC) determines the priority of interrupt sources and controls interrupt
requests to the CPU. The INTC registers set the priority of each interrupt, allowing the user to
process interrupt requests according to the user-set priority.

8.1 Features
• 16 levels of interrupt priority can be set
By setting the interrupt-priority registers, the priorities of on-chip peripheral modules, and IRQ
and PINT interrupts can be selected from 16 levels for individual request sources.
• NMI noise canceller function
An NMI input-level bit indicates the NMI pin state. By reading this bit in the interrupt
exception service routine, the pin state can be checked, enabling it to be used as a noise
canceller.
• IRQ interrupts can be set
Detection of low level, high level, rising edge, or falling edge
• Interrupt request signal can be externally output (IRQOUT pin)
By notifying the external bus master that the external interrupt and on-chip peripheral module
interrupt requests have been generated, the bus mastership can be requested.

Rev. 3.00 Jan. 18, 2008 Page 243 of 1458


REJ09B0033-0300
Section 8 Interrupt Controller (INTC)

Figure 8.1 shows a block diagram of the interrupt controller.

IRLQOUT
NMI
6
IRQ5 to IRQ0 Input/output
4
IRL3 to IRL0 control
16
PINT5 to PINT0

Com- Interrupt
(Interrupt request) parator request
DMAC
SCIF SR
SIOF
I3 I2 I1 I0
TMU
TPU CPU
Priority
WDT identifier
ADC
USBF
USBH
RTC
SIM
LCDC
PCC
MMC
I2C
CMT
AFEIF
SSL
SDHI
REF

PINTER IPR
ICR
IRR0
Internal bus

Bus
interface

INTC
[Legend]
ICR: Interrupt control register
IPR: Interrupt priority register
IRR: Interrupt request register
PINTER: PINT interrupt enable register
REF: Refresh request in bus state controller

Figure 8.1 Block Diagram of INTC

Rev. 3.00 Jan. 18, 2008 Page 244 of 1458


REJ09B0033-0300
Section 8 Interrupt Controller (INTC)

8.2 Input/Output Pins


Table 8.1 shows the INTC pin configuration.

Table 8.1 Pin Configuration

Name Abbreviation I/O Description


Nonmaskable interrupt input pin NMI Input Input of interrupt request signal, not
maskable by the interrupt mask bits
in SR
Interrupt input pins IRQ5 to IRQ0 Input Input of interrupt request signals
IRL3 to IRL0*
1

Port interrupt input pins PINT15 to Input Input of port interrupt signals
PINT0
Bus request signal pin IRQOUT*2 Output Bus request signal for an interrupt
Notes: 1. IRL3 to IRL0 and IRQ3 to IRQ0 cannot be used simultaneously because these pins are
multiplexed.
2. When the NMI or H-UDI interrupt requests are generated and the response time of CPU
is short, this pin may not be asserted.

Rev. 3.00 Jan. 18, 2008 Page 245 of 1458


REJ09B0033-0300
Section 8 Interrupt Controller (INTC)

8.3 Register Descriptions


The INTC has the following registers. Refer to section 37, List of Registers, for more details on
the addresses and access size of these registers.

• Interrupt control register 0 (ICR0)


• Interrupt control register 1 (ICR1)
• Interrupt control register 2 (ICR2)
• PINT interrupt enable register (PINTER)
• Interrupt priority register A (IPRA)
• Interrupt priority register B (IPRB)
• Interrupt priority register C (IPRC)
• Interrupt priority register D (IPRD)
• Interrupt priority register E (IPRE)
• Interrupt priority register F (IPRF)
• Interrupt priority register G (IPRG)
• Interrupt priority register H (IPRH)
• Interrupt priority register I (IPRI)
• Interrupt priority register J (IPRJ)
• Interrupt request register 0 (IRR0)
• Interrupt request register 1 (IRR1)
• Interrupt request register 2 (IRR2)
• Interrupt request register 3 (IRR3)
• Interrupt request register 4 (IRR4)
• Interrupt request register 5 (IRR5)
• Interrupt request register 6 (IRR6)
• Interrupt request register 7 (IRR7)
• Interrupt request register 8 (IRR8)
• Interrupt request register 9 (IRR9)

Rev. 3.00 Jan. 18, 2008 Page 246 of 1458


REJ09B0033-0300
Section 8 Interrupt Controller (INTC)

8.3.1 Interrupt Priority Registers A to J (IPRA to IPRJ)

IPRA to IPRJ are 16-bit readable/writable registers in which priority levels from 0 to 15 are set for
on-chip peripheral module and IRQ interrupts.

Bit Bit Name Initial Value R/W Description


15 IPR15 0 R/W These bits set the priority level for each interrupt
14 IPR14 0 R/W source in 4-bit units. For details, see table 8.2.

13 IPR13 0 R/W
12 IPR12 0 R/W
11 IPR11 0 R/W
10 IPR10 0 R/W
9 IPR9 0 R/W
8 IPR8 0 R/W
7 IPR7 0 R/W
6 IPR6 0 R/W
5 IPR5 0 R/W
4 IPR4 0 R/W
3 IPR3 0 R/W
2 IPR2 0 R/W
1 IPR1 0 R/W
0 IPR0 0 R/W

Rev. 3.00 Jan. 18, 2008 Page 247 of 1458


REJ09B0033-0300
Section 8 Interrupt Controller (INTC)

Table 8.2 Interrupt Sources and IPRA to IPRJ

Register Bits 15 to 12 Bits 11 to 8 Bits 7 to 4 Bits 3 to 0


IPRA TMU0 TMU1 TMU2 RTC
IPRB WDT REF SIM Reserved*
IPRC IRQ3 IRQ2 IRQ1 IRQ0
IPRD Reserved* TMU (TMU_SUNI) IRQ5 IRQ4
IPRE DMAC (1) Reserved* LCDC SSL
IPRF ADC DMAC (2) USBF CMT
IPRG SCIF0 SCIF1 Reserved* Reserved*
IPRH PINTA PINTB TPU I 2C
IPRI SIOF0 SIOF1 MMC PCC
IPRJ Reserved* USBH SDHI AFEIF
Note: * Reserved. Always read as 0. The write value should always be 0. The SSL and SDHI-
related bits are effective only for the models that include them. Reserved bits apply if
they are not included.

As shown in table 8.2, on-chip peripheral module or IRQ interrupts are assigned to four 4-bit
groups in each register. These 4-bit groups (bits 15 to 12, bits 11 to 8, bits 7 to 4, and bits 3 to 0)
are set with values from H'0 (0000) to H'F (1111). Setting H'0 means priority level 0 (masking is
requested); H'F means priority level 15 (the highest level).

Rev. 3.00 Jan. 18, 2008 Page 248 of 1458


REJ09B0033-0300
Section 8 Interrupt Controller (INTC)

8.3.2 Interrupt Control Register 0 (ICR0)

ICR0 is a register that sets the input signal detection mode of the external interrupt input pin NMI,
and indicates the input signal level at the NMI pin.

Initial
Bit Bit Name Value R/W Description
15 NMIL 0/1* R NMI Input Level
Sets the level of the signal input at the NMI pin. This bit
can be read from to determine the NMI pin level. This bit
cannot be modified.
0: NMI input level is low
1: NMI input level is high
14 to 9 — All 0 R Reserved
These bits are always read as 0. The write value should
always be 0.
8 NMIE 0 R/W NMI Edge Select
Selects whether the falling or rising edge of the interrupt
request signal at the NMI pin is detected.
0: Interrupt request is detected on falling edge of NMI
input
1: Interrupt request is detected on rising edge of NMI
input
7 to 0 — All 0 R Reserved
These bits are always read as 0. The write value should
always be 0.
Note: * The initial value is 1 when NMI input is high, 0 when NMI input is low.

Rev. 3.00 Jan. 18, 2008 Page 249 of 1458


REJ09B0033-0300
Section 8 Interrupt Controller (INTC)

8.3.3 Interrupt Control Register 1 (ICR1)

ICR1 is a 16-bit register that specifies the detection mode for external interrupt input pins IRQ5 to
IRQ0 individually: rising edge, falling edge, high level, or low level.

Initial
Bit Bit Name Value R/W Description
15 MAI 0 R/W All Interrupt Mask
When this bit is set to 1, all interrupt requests are masked
while low level is input to the NMI pin. The NMI interrupt
is masked in standby mode.
0: When the NMI pin is low, all interrupt requests are not
masked
1: When the NMI pin is low, all interrupt requests are
masked
14 IRQLVL 1 R/W Interrupt Request Level Detection
Enables or disables the use of pins IRQ3 to IRQ0 as four
independent interrupt pins. The IRQ4 and IRQ5 are not
affected.
0: Use of pins IRQ3 to IRQ0 as four independent interrupt
pins enabled
1: Use of pins IRL3 to IRL0 as encoded 15 level interrupt
pins
13 BLMSK 0 R/W BL Bit Mask
When the BL bit in the SR register is set to 1, specifies
whether the NMI interrupt is masked.
0: When the BL bit is set to 1, the NMI interrupt is masked
1: The NMI interrupt is accepted regardless of the BL bit
setting
12 — 0 R Reserved
This bit is always read as 0. The write value should
always be 0.

Rev. 3.00 Jan. 18, 2008 Page 250 of 1458


REJ09B0033-0300
Section 8 Interrupt Controller (INTC)

Initial
Bit Bit Name Value R/W Description
11 IRQ51S 0 R/W IRQn Sense Select
10 IRQ50S 0 R/W These bits select whether interrupt request signals
9 IRQ41S 0 R/W corresponding to pins IRQ5 to IRQ0 are detected by a
rising edge, falling edge, high level, or low level.
8 IRQ40S 0 R/W
Bit 2n + 1 Bit 2n
7 IRQ31S 0 R/W
IRQn1S IRQn0S
6 IRQ30S 0 R/W
0 0 Interrupt request is detected on
5 IRQ21S 0 R/W
falling edge of IRQn input
4 IRQ20S 0 R/W
0 1 Interrupt request is detected on
3 IRQ11S 0 R/W rising edge of IRQn input
2 IRQ10S 0 R/W 1 0 Interrupt request is detected on
1 IRQ01S 0 R/W low level of IRQn input
0 IRQ00S 0 R/W 1 1 Interrupt request is detected on
high level of IRQn input
[Legend] n= 0 to 5

Rev. 3.00 Jan. 18, 2008 Page 251 of 1458


REJ09B0033-0300
Section 8 Interrupt Controller (INTC)

8.3.4 Interrupt Request Register 0 (IRR0)

IRR0 is an 8-bit register that indicates interrupt requests from the TMU and IRQ0 to IRQ5.

Initial
Bit Bit Name Value R/W Description
7  0 R Reserved
This bit is always read as 0. The write value should
always be 0.
6 TMU_ 0 R/W TMU_SUNI Interrupt Request
SUNIR Indicates whether the TMU_SUNI (TMU) interrupt request
is generated.
0: TMU_SUNI interrupt request is not generated
1: TMU_SUNI interrupt request is generated
5 IRQ5R 0 R/W IRQn Interrupt Request
4 IRQ4R 0 R/W Indicates whether there is interrupt request input to the
3 IRQ3R 0 R/W IRQn pin. When edge-detection mode is set for IRQn, an
interrupt request is cleared by writing 0 to the IRQnR bit
2 IRQ2R 0 R/W after reading IRQnR = 1.
1 IRQ1R 0 R/W When level-detection mode is set for IRQn, these bits
indicate whether an interrupt request is input. The
0 IRQ0R 0 R/W
interrupt request is set/cleared by only 1/0 input to the
IRQn pin.
IRQnR
0: No interrupt request input to IRQn pin
1: Interrupt request input to IRQn pin
[Legend] n = 0 to 5

Rev. 3.00 Jan. 18, 2008 Page 252 of 1458


REJ09B0033-0300
Section 8 Interrupt Controller (INTC)

8.3.5 Interrupt Request Register 1 (IRR1)

IRR1 is an 8-bit register that indicates whether interrupt requests from the DMAC are generated.
This register is initialized to H'00 by a power-on reset or manual reset, but is not initialized in
standby mode.

Bit Bit Name Initial Value R/W Description


7 to 4  All 0 R Reserved
These bits are always read as 0. The write value
should always be 0.
3 DEI3R 0 R/W DEI3 Interrupt Request
Indicates whether the DEI3 (DMAC) interrupt is
generated.
0: DEI3 interrupt request is not generated
1: DEI3 interrupt request is generated
2 DEI2R 0 R/W DEI2 Interrupt Request
Indicates whether the DEI2 (DMAC) interrupt
request is generated.
0: DEI2 interrupt request is not generated
1: DEI2 interrupt request is generated
1 DEI1R 0 R/W DEI1 Interrupt Request
Indicates whether the DEI1 (DMAC) interrupt
request is generated.
0: DEI1 interrupt request is not generated
1: DEI1 interrupt request is generated
0 DEI0R 0 R/W DEI0 Interrupt Request
Indicates whether the DEI0 (DMAC) interrupt
request is generated.
0: DEI0 interrupt request is not generated
1: DEI0 interrupt request is generated

Rev. 3.00 Jan. 18, 2008 Page 253 of 1458


REJ09B0033-0300
Section 8 Interrupt Controller (INTC)

8.3.6 Interrupt Request Register 2 (IRR2)

IRR2 is an 8-bit register that indicates whether interrupt requests from the SSL and LCDC are
generated. This register is initialized to H'00 by a power-on reset or manual reset, but is not
initialized in standby mode.

Note: On the models not having the SSL, the SSL-related bits are reserved. The write value
should always be 0.

Bit Bit Name Initial Value R/W Description


7 to 5  All 0 R Reserved
These bits are always read as 0. The write value
should always be 0.
4 SSLIR 0 R/W SSLI Interrupt Request
Indicates whether the SSLI (SSL) interrupt
request is generated.
0: SSLI interrupt request is not generated
1: SSLI interrupt request is generated
Note: On the models not having the SSL, this bit
is reserved and always read as 0. The write
value should always be 0.
3 to 1  All 0 R Reserved
These bits are always read as 0. The write value
should always be 0.
0 LCDIR 0 R/W LCDCI Interrupt Request
Indicates whether the LCDCI (LCDC) interrupt
request is generated.
0: LCDCI interrupt request is not generated
1: LCDCI interrupt request is generated

Rev. 3.00 Jan. 18, 2008 Page 254 of 1458


REJ09B0033-0300
Section 8 Interrupt Controller (INTC)

8.3.7 Interrupt Request Register 3 (IRR3)

IRR3 is an 8-bit register that indicates whether interrupt requests from the RTC and SIM are
generated. This register is initialized to H'00 by a power-on reset or manual reset, but is not
initialized in standby mode.

Bit Bit Name Initial Value R/W Description


7 TENDIR 0 R/W TENDI Interrupt Request
Indicates whether the TENDI (SIM) interrupt is
generated.
0: TENDI interrupt request is not generated
1: TENDI interrupt request is generated
6 TXIR 0 R/W TXI Interrupt Request
Indicates whether the TXI (SIM) interrupt request
is generated.
0: TXI interrupt request is not generated
1: TXI interrupt request is generated
5 RXIR 0 R/W RXI Interrupt Request
Indicates whether the RXI (SIM) interrupt request
is generated.
0: RXI interrupt request is not generated
1: RXI interrupt request is generated
4 ERIR 0 R/W ERI Interrupt Request
Indicates whether the ERI (SIM) interrupt request
is generated.
0: ERI interrupt request is not generated
1: ERI interrupt request is generated
3  0 R Reserved
This bit is always read as 0. The write value should
always be 0.
2 CUIR 0 R/W CUI Interrupt Request
Indicates whether the CUI (RTC) interrupt request
is generated.
0: CUI interrupt request is not generated
1: CUI interrupt request is generated

Rev. 3.00 Jan. 18, 2008 Page 255 of 1458


REJ09B0033-0300
Section 8 Interrupt Controller (INTC)

Bit Bit Name Initial Value R/W Description


1 PRIR 0 R/W PRI Interrupt Request
Indicates whether the PRI (RTC) interrupt request
is generated.
0: PRI interrupt request is not generated
1: PRI interrupt request is generated
0 ATIR 0 R/W ATI Interrupt Request
Indicates whether the ATI (RTC) interrupt request
is generated.
0: ATI interrupt request is not generated
1: ATI interrupt request is generated

8.3.8 Interrupt Request Register 4 (IRR4)

IRR4 is an 8-bit register that indicates whether interrupt requests from the REF, WDT, and TMU
are generated. This register is initialized to H'00 by a power-on reset or manual reset, but is not
initialized in standby mode.

Bit Bit Name Initial Value R/W Description


7  0 R Reserved
This bit always read as 0. The write value should
always be 0.
6 TUNI2R 0 R/W TUNI2 Interrupt Request
Indicates whether the TUNI2 (TMU) interrupt
request is generated.
0: TUNI2 interrupt request is not generated
1: TUNI2 interrupt request is generated
5 TUNI1R 0 R/W TUNI1Interrupt Request
Indicates whether the TUNI1 (TMU) interrupt
request is generated.
0: TUNI1 interrupt request is not generated
1: TUNI1 interrupt request is generated

Rev. 3.00 Jan. 18, 2008 Page 256 of 1458


REJ09B0033-0300
Section 8 Interrupt Controller (INTC)

Bit Bit Name Initial Value R/W Description


4 TUNI0R 0 R/W TUNI0 Interrupt Request
Indicates whether the TUNI0 (TMU) interrupt
request is generated.
0: TUNI0 interrupt request is not generated
1: TUNI0 interrupt request is generated
3 ITIR 0 R/W ITI Interrupt Request
Indicates whether the ITI (WDT) interrupt request
is generated.
0: ITI interrupt request is not generated
1: ITI interrupt request is generated
2, 1  All 0 R Reserved
These bits are always read as 0. The write value
should always be 0.
0 RCMIR 0 R/W RCMI Interrupt Request
Indicates whether the RCMI (REF) interrupt
request is generated.
0: RCMI interrupt request is not generated
1: RCMI interrupt request is generated

8.3.9 Interrupt Request Register 5 (IRR5)

IRR5 is an 8-bit register that indicates whether interrupt requests from the SCIF0, SCIF1, DMAC,
and ADC are generated. This register is initialized to H'00 by a power-on reset or manual reset,
but is not initialized in standby mode.

Rev. 3.00 Jan. 18, 2008 Page 257 of 1458


REJ09B0033-0300
Section 8 Interrupt Controller (INTC)

Bit Bit Name Initial Value R/W Description


7 ADCIR 0 R/W ADCI Interrupt Request
Indicates whether the ADCI (ADC) interrupt
request is generated.
0: ADCI interrupt request is not generated
1: ADCI interrupt request is generated
6  0 R Reserved
This bit is always read as 0. The write value
should always be 0.
5 DEI5R 0 R/W DEI5 Interrupt Request
Indicates whether the DEI5 (DMAC) interrupt
request is generated.
0: DEI5 interrupt request is not generated
1: DEI5 interrupt request is generated
4 DEI4R 0 R/W DEI4 Interrupt Request
Indicates whether the DEI4 (DMAC) interrupt
request is generated.
0: DEI4 interrupt request is not generated
1: DEI4 interrupt request is generated
3, 2  All 0 R Reserved
These bits are always read as 0. The write value
should always be 0.
1 SCIF1IR 0 R/W SCIF1I Interrupt Request
Indicates whether the SCIF1I (SCIF1) interrupt
request is generated.
0: SCIF1I interrupt request is not generated
1: SCIF1I interrupt request is generated
0 SCIF0IR 0 R/W SCIF0I Interrupt Request
Indicates whether the SCIF0I (SCIF0) interrupt
request is generated.
0: SCIF0I interrupt request is not generated
1: SCIF0I interrupt request is generated

Rev. 3.00 Jan. 18, 2008 Page 258 of 1458


REJ09B0033-0300
Section 8 Interrupt Controller (INTC)

8.3.10 Interrupt Request Register 6 (IRR6)

IRR6 is an 8-bit register that indicates whether interrupt requests from the PINT, SIOF0, and
SIOF1 are generated. This register is initialized to H'00 by a power-on reset or manual reset, but is
not initialized in standby mode.

Bit Bit Name Initial Value R/W Description


7, 6  All 0 R Reserved
This bit is always read as 0. The write value
should always be 0.
5 SIOF1IR 0 R/W SIOF1I Interrupt Request
Indicates whether the SIOF1I (SIOF1) interrupt
request is generated.
0: SIOF1I interrupt request is not generated
1: SIOF1I interrupt request is generated
4 SIOF0IR 0 R/W SIOF0I Interrupt Request
Indicates whether the SIOF0I (SIOF0) interrupt
request is generated.
0: SIOF0I interrupt request is not generated
1: SIOF0I interrupt request is generated
3, 2  All 0 R Reserved
These bits are always read as 0. The write value
should always be 0.
1 PINTBR 0 R/W PINTB Interrupt Request
Indicates whether the PINTB (PINT) interrupt
request is generated.
0: PINTB interrupt request is not generated
1: PINTB interrupt request is generated
0 PINTAR 0 R/W PINTA Interrupt Request
Indicates whether the PINTA (PINT) interrupt
request is generated.
0: PINTA interrupt request is not generated
1: PINTA interrupt request is generated

Rev. 3.00 Jan. 18, 2008 Page 259 of 1458


REJ09B0033-0300
Section 8 Interrupt Controller (INTC)

8.3.11 Interrupt Request Register 7 (IRR7)

IRR7 is an 8-bit register that indicates whether interrupt requests from the TPU and IIC are
generated. This register is initialized to H'00 by a power-on reset or manual reset, but is not
initialized in standby mode.

Bit Bit Name Initial Value R/W Description


7 to 5  All 0 R Reserved
These bits are always read as 0. The write value
should always be 0.
4 IICIR 0 R/W IICI Interrupt Request
Indicates whether the IICI (IIC) interrupt request
is generated.
0: IICI interrupt request is not generated
1: IICI interrupt request is generated
3 TPI3R 0 R/W TPI3 Interrupt Request
Indicates whether the TPI3 (TPU) interrupt
request is generated.
0: TPI3 interrupt request is not generated
1: TPI3 interrupt request is generated
2 TPI2R 0 R/W TPI2 Interrupt Request
Indicates whether the TPI2 (TPU) interrupt
request is generated.
0: TPI2 interrupt request is not generated
1: TPI2 interrupt request is generated
1 TPI1R 0 R/W TPI1 Interrupt Request
Indicates whether the TPI1 (TPU) interrupt
request is generated.
0: TPI1 interrupt request is not generated
1: TPI1 interrupt request is generated
0 TPI0R 0 R/W TPI0 Interrupt Request
Indicates whether the TPI0 (TPU) interrupt
request is generated.
0: TPI0 interrupt request is not generated
1: TPI0 interrupt request is generated

Rev. 3.00 Jan. 18, 2008 Page 260 of 1458


REJ09B0033-0300
Section 8 Interrupt Controller (INTC)

8.3.12 Interrupt Request Register 8 (IRR8)

IRR8 is an 8-bit register that indicates whether interrupt requests from the SDHI, MMC, and
AFEIF are generated. This register is initialized to H'00 by a power-on reset or manual reset, but is
not initialized in standby mode.

Note: Note: On the models not having the SDHI, the SDHI-related bits are reserved. The write
value should always be 0.

Bit Bit Name Initial Value R/W Description


7 MMCI3R 0 R/W MMCI3 Interrupt Request
Indicates whether the MMCI3 (MMC) interrupt
request is generated.
0: MMCI3 interrupt request is not generated
1: MMCI3 interrupt request is generated
6 MMCI2R 0 R/W MMCI2 Interrupt Request
Indicates whether the MMCI2 (MMC) interrupt
request is generated.
0: MMCI2 interrupt request is not generated
1: MMCI2 interrupt request is generated
5 MMCI1R 0 R/W MMCI1 Interrupt Request
Indicates whether the MMCI1 (MMC) interrupt
request is generated.
0: MMCI1 interrupt request is not generated
1: MMCI1 interrupt request is generated
4 MMCI0R 0 R/W MMCI0 Interrupt Request
Indicates whether the MMCI0 (MMC) interrupt
request is generated.
0: MMCI0 interrupt request is not generated
1: MMCI0 interrupt request is generated
3 AFECIR 0 R/W AFECI Interrupt Request
Indicates whether the AFECI (AFEIF) interrupt
request is generated.
0: AFECI interrupt request is not generated
1: AFECI interrupt request is generated

Rev. 3.00 Jan. 18, 2008 Page 261 of 1458


REJ09B0033-0300
Section 8 Interrupt Controller (INTC)

Bit Bit Name Initial Value R/W Description


2, 1  All 0 R Reserved
These bits are always read as 0. The write value
should always be 0.
0 SDIR 0 R/W SDI Interrupt Request
Indicates whether the SDI (SDHI) interrupt
request is generated.
0: SDI interrupt request is not generated
1: SDI interrupt request is generated
Note: On the models not having the SDHI, this bit
is reserved and always read as 0. The write
value should always be 0.

8.3.13 Interrupt Request Register 9 (IRR9)

IRR9 is an 8-bit register that indicates whether interrupt requests from the PCC, USBH, USBF,
and CMT are generated. This register is initialized to H'00 by a power-on reset or manual reset,
but is not initialized in standby mode.

Bit Bit Name Initial Value R/W Description


7 PCCIR 0 R/W PCCI Interrupt Request
Indicates whether the PCCI (PCC) interrupt
request is generated.
0: PCCI interrupt request is not generated
1: PCCI interrupt request is generated
6 USBHIR 0 R USBHI Interrupt Request
Indicates whether the USBHI (USBH) interrupt
request is generated.
0: USBHI interrupt request is not generated
1: USBHI interrupt request is generated
5  0 R Reserved
This bit is always read as 0. The write value
should always be 0.

Rev. 3.00 Jan. 18, 2008 Page 262 of 1458


REJ09B0033-0300
Section 8 Interrupt Controller (INTC)

Bit Bit Name Initial Value R/W Description


4 CMIR 0 R/W CMI Interrupt Request
Indicates whether the CMI (CMT) interrupt
request is generated.
0: CMI interrupt request is not generated
1: CMI interrupt request is generated
3  0 R Reserved
This bit is always read as 0. The write value
should always be 0.
2 USBFI1R 0 R USBFI1 Interrupt Request
Indicates whether the USBFI1 (USBF) interrupt
request is generated.
0: USBFI1interrupt request is not generated
1: USBFI1 interrupt request is generated
1 USBFI0R 0 R USBFI0 Interrupt Request
Indicates whether the USBFI0 (USBF) interrupt
request is generated.
0: USBFI0 interrupt request is not generated
1: USBFI0 interrupt request is generated
0  0 R Reserved
This bit is always read as 0. The write value
should always be 0.

Rev. 3.00 Jan. 18, 2008 Page 263 of 1458


REJ09B0033-0300
Section 8 Interrupt Controller (INTC)

8.3.14 PINT Interrupt Enable Register (PINTER)

PINTER is a 16-bit register which enables interrupt requests input to the external interrupt input
pins PINT0 to PINT15. This register is initialized to H'0000 by a power-on reset or manual reset,
but is not initialized in standby mode.

Bit Bit Name Initial Value R/W Description


15 PINT15E 0 R/W PINTn Interrupt Enable
14 PINT14E 0 R/W Select whether the interrupt requests input to the
13 PINT13E 0 R/W pins PINT15 to PINT0 is enabled.

12 PINT12E 0 R/W 0: Disable PINTn input interrupt requests

11 PINT11E 0 R/W 1: Enable PINTn input interrupt requests

10 PINT10E 0 R/W n = 0 to 15

9 PINT9E 0 R/W
8 PINT8E 0 R/W
7 PINT7E 0 R/W
6 PINT6E 0 R/W
5 PINT5E 0 R/W
4 PINT4E 0 R/W
3 PINT3E 0 R/W
2 PINT2E 0 R/W
1 PINT1E 0 R/W
0 PINT0E 0 R/W

Rev. 3.00 Jan. 18, 2008 Page 264 of 1458


REJ09B0033-0300
Section 8 Interrupt Controller (INTC)

8.3.15 Interrupt Control Register 2 (ICR2)

INCR2 is a 16-bit register which specifies low or high detection mode to the external interrupt
input pins PINT0 to PINT15 individually. This register is initialized to H'0000 by a power-on reset
or manual reset, but is not initialized in standby mode.

Bit Bit Name Initial Value R/W Description


15 PINT15S 0 R/W PINTn Sense Select
14 PINT14S 0 R/W Selects whether to detect an interrupt request
13 PINT13S 0 R/W signal for the pins PINT15 to PINT0 by a high-
level or low-level.
12 PINT12S 0 R/W
0: Detects interrupt request by PINTn input low
11 PINT11S 0 R/W
1: Detects interrupt request by PINTn input high
10 PINT10S 0 R/W
n = 0 to 15
9 PINT9S 0 R/W
8 PINT8S 0 R/W
7 PINT7S 0 R/W
6 PINT6S 0 R/W
5 PINT5S 0 R/W
4 PINT4S 0 R/W
3 PINT3S 0 R/W
2 PINT2S 0 R/W
1 PINT1S 0 R/W
0 PINT0S 0 R/W

Rev. 3.00 Jan. 18, 2008 Page 265 of 1458


REJ09B0033-0300
Section 8 Interrupt Controller (INTC)

8.4 Interrupt Sources


There are four types of interrupt sources: NMI, IRQ, IRL, and on-chip peripheral modules. Each
interrupt has a priority level (0 to 16), with 1 the lowest and 16 the highest. Priority level 0 masks
an interrupt, so the interrupt request is ignored.

8.4.1 NMI Interrupt

The NMI interrupt has the highest priority level of 16. When the BLMSK bit in the interrupt
control register 1 (ICR1) is 1 or the BL bit in the status register (SR) is 0, NMI interrupts are
accepted if the MAI bit in ICR1 is 0. NMI interrupts are edge-detected. In sleep or standby mode,
the interrupt is accepted regardless of the BL setting. The NMI edge select bit (NMIE) in the
interrupt control register 0 (ICR0) is used to select either rising or falling edge detection.

When using edge-input detection for NMI interrupts, a pulse width of at least two Pφ cycles
(peripheral clock) is necessary. NMI interrupt exception handling does not affect the interrupt
mask bits (I3 to I0) in the status register (SR). When the BL bit is 1, only an NMI interrupt is
accepted if the BLMSK bit in ICR1 is 1.

It is possible to wake the chip up from sleep mode or standby mode with an NMI interrupt.

8.4.2 IRQ Interrupts

IRQ interrupts are input by level or edge from pins IRQ0 to IRQ5. The priority level can be set by
interrupt priority registers C and D (IPRC and IPRD) in a range from 0 to 15.

When using edge-sensing for IRQ interrupts, clear the interrupt source by having software read 1
from the corresponding bit in IRR0, then write 0 to the bit.

When ICR1 is rewritten, IRQ interrupts may be mistakenly detected, depending on the IRQ pin
states. To prevent this, rewrite the register while interrupts are masked, then release the mask after
clearing the illegal interrupt by reading the interrupt request register 0 (IRR0) and writing 0 to
IRR0.

Edge input interrupt detection requires input of a pulse width of more than two cycles on a Pφ
clock basis.

When using level-sensing for IRQ interrupts, the pin levels must be retained until the CPU
samples the pins. Therefore, the interrupt source must be cleared by the interrupt handler.

Rev. 3.00 Jan. 18, 2008 Page 266 of 1458


REJ09B0033-0300
Section 8 Interrupt Controller (INTC)

The interrupt mask bits (I3 to I0) in the status register (SR) are not affected by IRQ interrupt
handling. IRQ interrupts specified for edge detection can be used to recover from a standby state
when the corresponding interrupt level is higher than that set in the I3 to I0 bits of the SR register.
(However, when RTC is used, recovering from standby by using the clock for RTC is enabled.)

8.4.3 IRL interrupts

IRL interrupts are input by pins IRL3 to IRL0 as level. The priority level is the higher level that is
indicated by IRL3 to IRL0 pins. When the values of IRL3 to IRL0 pins are 0 (B'0000), it indicates
the highest level interrupt request (interrupt priority level 15). When the values of the pins are 15
(B'1111), no interrupt is requested (interrupt priority level 0). Figure 8.2 shows an example of
connection for IRL interrupt.

IRL interrupts are included with noise canceller function and detected when the sampled levels of
each peripheral module clock keep same value for 2 cycles. This prevents sampling error level in
IRL pin changing.

IRL interrupts priority level should be kept until interrupt is accepted and its handling is started.
However, changing to higher level is enabled.

The interrupt mask bits I3 to I0 in the status register (SR) are not affected by the IRL interrupt
handling.

SH7720 / SH7721 Group

Interrupt Priority 4
request encoder IRL3 to IRL0
IRL3 to IRL0

Figure 8.2 Example of IRL Interrupt Connection

Rev. 3.00 Jan. 18, 2008 Page 267 of 1458


REJ09B0033-0300
Section 8 Interrupt Controller (INTC)

8.4.4 PINT Interrupts

PINT interrupts are input by level from pins PINT0 to PINT15. The priority level of PINT0 to
PINT7 (PINTA) and PINT8 to PINT15 (PINTB) can be set by the interrupt priority level register
H (IPRH) in a range from 0 to 15. The PINT interrupt level should be retained until the interrupt
processing starts after an interrupt request has been accepted.

The interrupt mask bits I3 to I0 in the status register (SR) are not affected by the PIN interrupt
processing routine.

While an RTC clock is supplied, recovery from a standby state on a PINT interrupt is possible if
the interrupt level is higher than that set in the I3 to I0 bits of the SR register.

8.4.5 On-Chip Peripheral Module Interrupts

On-chip peripheral module interrupts are generated by the following modules:

• DMA controller (DMAC)


• I2C bus interface (IIC)
• Smart card interface (SIM)
• Compare match timer (CMT)
• Timer unit (TMU)
• Timer pulse unit (TPU)
• Watchdog timer (WDT)
• User debugging interface (H-UDI)
• LCD controller (LCDC)
• Secure sockets layer (SSL)
• Analog front end interface (AFEIF)
• USB function controller (USBF)
• USB host controller (USBH)
• Bus state controller (BSC)
• Serial I/O with FIFO 0 (SIOF0)
• Serial I/O with FIFO 1 (SIOF1)
• Serial communication interface with FIFO 0 (SCIF0)
• Serial communication interface with FIFO 1 (SCIF1)
• MultiMediaCard interface (MMC)
• SD host interface (SDHI)

Rev. 3.00 Jan. 18, 2008 Page 268 of 1458


REJ09B0033-0300
Section 8 Interrupt Controller (INTC)

• Realtime clock (RTC)


• A/D converter (ADC)
• PC card controller (PCC)

Not every interrupt source is assigned a different interrupt vector. Sources are reflected in the
interrupt event registers (INTEVT and INTEVT2). It is easy to identify sources by using the value
of INTEVT or INTEVT2 as a branch offset.

A priority level (from 0 to 15) can be set for each module except H-UDI by writing to the interrupt
priority registers A, B, and E to J (IPRA, IPRB, and IPRE to IPRJ). The priority level of the H-
UDI interrupt is 15 (fixed).

The interrupt mask bits (I3 to I0) in the status register are not affected by on-chip peripheral
module interrupt handling.

8.4.6 Interrupt Exception Handling and Priority

There are four types of interrupt sources: NMI, IRQ, IRL, and on-chip peripheral modules. The
priority of each interrupt source is set within priority levels 0 to 16; level 16 is the highest and
level 1 is the lowest. When the priority is set to level 0, that interrupt is masked and the interrupt
request is ignored.

Tables 8.3 and 8.4 list the interrupt sources, the codes for the interrupt event registers (INTEVT
and INTEVT2), and the interrupt priority.

Each interrupt source is assigned a unique code by INTEVT and INTEVT2. The start address of
the exception handling routine is common for each interrupt source. This is why, for instance, the
value of INTEVT or INTEVT2 is used as an offset at the start of the exception handling routine
and branched to in order to identify the interrupt source.

IRQ interrupt and on-chip peripheral module interrupt priorities can be set freely between 0 and 15
for each module by setting interrupt priority registers A to J (IPRA to IPRJ). A reset assigns
priority level 0 to IRQ and on-chip peripheral module interrupts.

If the same priority level is assigned to two or more interrupt sources and interrupts from those
sources occur simultaneously, their priority order is the default priority order indicated at the right
in tables 8.3 and 8.4.

Rev. 3.00 Jan. 18, 2008 Page 269 of 1458


REJ09B0033-0300
Section 8 Interrupt Controller (INTC)

Table 8.3 Interrupt Exception Handling Sources and Priority (IRQ Mode)

Interrupt Priority
Interrupt Priority IPR within IPR Default
Interrupt Source Code *1 (Initial Value) (Bit Numbers) Setting Unit Priority
 
2
NMI H'1C0* 16 High
 
2
H-UDI H'5E0* 15

3
IRQ IRQ0 H'600* 0 to 15 (0) IPRC (3 to 0)

3
IRQ1 H'620* 0 to 15 (0) IPRC (7 to 4)

3
IRQ2 H'640* 0 to 15 (0) IPRC (11 to 8)
IRQ3 H'660*3 0 to 15 (0) IPRC (15 to 12) 

3
IRQ4 H'680* 0 to 15 (0) IPRD (3 to 0)

3
IRQ5 H'6A0* 0 to 15 (0) IPRD (7 to 4)

3
TMU TMU_SUNI H'6C0* 0 to 15 (0) IPRD (11 to 8)
3
DMAC (1) DEI0 H'800* 0 to 15 (0) IPRE (15 to 12) High
3
DEI1 H'820* 0 to 15 (0)
3
DEI2 H'840* 0 to 15 (0)
3
DEI3 H'860* 0 to 15 (0) Low
LCDC LCDCI H'900*3 0 to 15 (0) IPRE (7 to 4) 
SSL SSLI H'980*3 0 to 15 (0) IPRE (3 to 0) 
3
USBF USBFI0 H'A20* 0 to 15 (0) IPRF (7 to 4) High
3
USBFI1 H'A40* Low

3
USBH USBHI H'A60* 0 to 15 (0) IPRJ (11 to 8)
3
DMAC (2) DEI4 H'B80* 0 to 15 (0) IPRF (11 to 8) High
3
DEI5 H'BA0* Low

3
ADC ADCI H'BE0* 0 to 15 (0) IPRF (15 to 12)
SCIF0 SCIFI0 H'C00*3 0 to 15 (0) IPRG (15 to 12) 
SCIF1 SCIFI1 H'C20*3 0 to 15 (0) IPRG (11 to 8) 

3
PINT PINTA H'C80* 0 to 15 (0) IPRH (15 to 12)

3
PINTB H'CA0* 0 to 15 (0) IPRH (11 to 8)

3
SIOF0 SIOFI0 H'D00* 0 to 15 (0) IPRI (15 to 12)

3
SIOF1 SIOFI1 H'D20* 0 to 15 (0) IPRI (11 to 8) Low

Rev. 3.00 Jan. 18, 2008 Page 270 of 1458


REJ09B0033-0300
Section 8 Interrupt Controller (INTC)

Interrupt Priority
Interrupt Priority IPR within IPR Default
Interrupt Source Code *1 (Initial Value) (Bit Numbers) Setting Unit Priority
3
TPU TPI0 H'D80* 0 to 15 (0) IPRH (7 to 4) High High
3
TPI1 H'DA0*
TPI2 H'DC0*3
TPI3 H'DE0*3 Low

3
IIC IICI H'E00* 0 to 15 (0) IPRH (3 to 0)
3
MMC MMCI0 H'E80* 0 to 15 (0) IPRI (7 to 4) High
3
MMCI1 H'EA0*
MMCI2 H'EC0*3
MMCI3 H'EE0*3 Low

3
CMT CMI H'F00* 0 to 15 (0) IPRF (3 to 0)

3
PCC PCCI H'F60* 0 to 15 (0) IPRI (3 to 0)

3
SDHI SDI H'F80* 0 to 15 (0) IPRJ (7 to 4)

3
AFEIF AFECI H'FE0* 0 to 15 (0) IPRJ (3 to 0)

2
TMU0 TUNI0 H'400* 0 to 15 (0) IPRA (15 to 12)

2
TMU1 TUNI1 H'420* 0 to 15 (0) IPRA (11 to 8)

2
TMU2 TUNI2 H'440* 0 to 15 (0) IPRA (7 to 4)
2
RTC ATI H'480* 0 to 15 (0) IPRA (3 to 0) High
2
PRI H'4A0*
CUI H'4C0*2 Low
2
SIM ERI H'4E0* 0 to 15 (0) IPRB (7 to 4) High
2
RXI H'500*
TXI H'520*2
TEND H'540*2 Low

2
WDT ITI H'560* 0 to 15 (0) IPRB (15 to 12)

2
REF RCMI H'580* 0 to 15 (0) IPRB (11 to 8) Low
Notes: 1. INTEVT2 code.
2. The code set in INTEVT is as same as INTEVT2.
3. The code set in INTEVT indicates interrupt level H'200 to H'3C0. For the
correspondence of interrupt level and INTEVT, see table 8.5.

Rev. 3.00 Jan. 18, 2008 Page 271 of 1458


REJ09B0033-0300
Section 8 Interrupt Controller (INTC)

Table 8.4 Interrupt Exception Handling Sources and Priority (IRL Mode)

Priority
Interrupt Interrupt Priority IPR within IPR Default
Interrupt Source Code *1 (Initial Value) (Bit Numbers) Setting Unit Priority
 
2
NMI H'1C0* 16 High
 
2
H-UDI H'5E0* 15
IRL3 to RL0=B'0000 H'200*  
3
IRL 15
IRL3 to IRL0=B'0001 H'220*  
3
14
IRL3 to IRL0=B'0010 H'240*  
3
13
IRL3 to IRL0=B'0011 H'260*3 12  
IRL3 to IRL0=B'0100 H'280*  
3
11
IRL3 to IRL0=B'0101 H'2A0*  
3
10
IRL3 to IRL0=B'0110 H'2C0*  
3
9
IRL3 to IRL0=B'0111 H'2E0*  
3
8
IRL3 to IRL0=B'1000 H'300*  
3
7
IRL3 to IRL0=B'1001 H'320*  
3
6
IRL3 to IRL0=B'1010 H'340*  
3
5
IRL3 to IRL0=B'1011 H'360*3 4  
IRL3 to IRL0=B'1100 H'380*  
3
3
IRL3 to IRL0=B'1101 H'3A0*  
3
2
IRL3 to IRL0=B'1110 H'3C0*  
3
1

3
IRQ IRQ4 H'680* 0 to 15 (0) IPRD (3 to 0)

3
IRQ5 H'6A0* 0 to 15 (0) IPRD (7 to 4)
IPRD (11 to 8) 
3
TMU TMU_SUNI H'6C0* 0 to 15 (0)
3
DMAC DEI0 H'800* 0 to 15 (0) IPRE High
(1) (15 to 12)
DEI1 H'820*3 0 to 15 (0)
3
DEI2 H'840* 0 to 15 (0)
3
DEI3 H'860* 0 to 15 (0) Low

3
LCDC LCDCI H'900* 0 to 15 (0) IPRE (7 to 4)

3
SSL SSLI H'980* 0 to 15 (0) IPRE (3 to 0) Low

Rev. 3.00 Jan. 18, 2008 Page 272 of 1458


REJ09B0033-0300
Section 8 Interrupt Controller (INTC)

Priority
Interrupt Interrupt Priority IPR within IPR Default
Interrupt Source Code *1 (Initial Value) (Bit Numbers) Setting Unit Priority
3
USBF USBFI0 H'A20* 0 to 15 (0) IPRF (7 to 4) High High
3
USBFI1 H'A40* Low
IPRJ (11 to 8) 
3
USBH USBHI H'A60* 0 to 15 (0)
DMAC DEI4 H'B80*3 0 to 15 (0) IPRF (11 to 8) High
(2) DEI5 H'BA0*3 Low

3
ADC ADCI H'BE0* 0 to 15 (0) IPRF
(15 to 12)
SCIF0 SCIFI0 H'C00*3 0 to 15 (0) IPRG (15 to 
12)
SCIF1 SCUFI1 H'C20*3 0 to 15 (0) IPRG (11 to 8) 

3
PINT PINTA H'C80* 0 to 15 (0) IPRH (15 to
12)
PINTB H'CA0*3 0 to 15 (0) IPRH (11 to 8) 
IPRI (15 to 12) 
3
SIOF0 SIOFI0 H'D00* 0 to 15 (0)

3
SIOF1 SIOFI1 H'D20* 0 to 15 (0) IPRI (11 to 8)
3
TPU TPI0 H'D80* 0 to 15 (0) IPRH (7 to 4) High
3
TPI1 H'DA0*
TPI2 H'DC0*3
TPI3 H'DE0*3 Low

3
IIC IICI H'E00* 0 to 15 (0) IPRH (3 to 0)
3
MMC MMCI0 H'E80* 0 to 15 (0) IPRI (7 to 4) High
3
MMCI1 H'EA0*
MMCI2 H'EC0*3
MMCI3 H'EE0*3 Low

3
CMT CMI H'F00* 0 to 15 (0) IPRF (3 to 0)

3
PCC PCCI H'F60* 0 to 15 (0) IPRI (3 to 0)

3
SDHI SDI H'F80* 0 to 15 (0) IPRJ (7 to 4)

3
AFEIF AFECI H'FE0* 0 to 15 (0) IPRJ (3 to 0) Low

Rev. 3.00 Jan. 18, 2008 Page 273 of 1458


REJ09B0033-0300
Section 8 Interrupt Controller (INTC)

Priority
Interrupt Interrupt Priority IPR within IPR Default
Interrupt Source Code *1 (Initial Value) (Bit Numbers) Setting Unit Priority

2
TMU0 TUNI0 H'400* 0 to 15 (0) IPRA High
(15 to 12)
TMU1 TUNI1 H'420*2 0 to 15 (0) IPRA (11 to 8) 

2
TMU2 TUNI2 H'440* 0 to 15 (0) IPRA (7 to 4)
2
RTC ATI H'480* 0 to 15 (0) IPRA (3 to 0) High
2
PRI H'4A0*
CUI H'4C0*2 Low
2
SIM ERI H'4E0* 0 to 15 (0) IPRB (7 to 4) High
2
RXI H'500*
TXI H'520*2
TEND H'540*2 Low

2
WDT ITI H'560* 0 to 15 (0) IPRB (15 to
12)
REF RCMI H'580*2 0 to 15 (0) IPRB (11 to 8)  Low
Notes: 1. INTEVT2 code.
2. The code set in INTEVT is as same as INTEVT2.
3. The code set in INTEVT indicates interrupt level H'200 to H'3C0. For the
correspondence of interrupt level and INTEVT, see table 8.5.

Rev. 3.00 Jan. 18, 2008 Page 274 of 1458


REJ09B0033-0300
Section 8 Interrupt Controller (INTC)

Table 8.5 Interrupt Level and INTEVT Code

Interrupt Level INTEVT Code


15 H'200
14 H'220
13 H'240
12 H'260
11 H'280
10 H'2A0
9 H'2C0
8 H'2E0
7 H'300
6 H'320
5 H'340
4 H'360
3 H'380
2 H'3A0
1 H'3C0

Rev. 3.00 Jan. 18, 2008 Page 275 of 1458


REJ09B0033-0300
Section 8 Interrupt Controller (INTC)

8.5 Operation

8.5.1 Interrupt Sequence

The sequence of interrupt operations is described below. Figure 8.3 is a flowchart of the
operations.

1. The interrupt request sources send interrupt request signals to the interrupt controller.
2. The interrupt controller selects the highest-priority interrupt from the interrupt requests sent,
following the priority levels set in the interrupt priority registers A to J (IPRA to IPRJ). Lower
priority interrupts are held pending. If two of these interrupts have the same priority level or if
multiple interrupts occur within a single module, the interrupt with the highest priority is
selected, according to table 8.3, Interrupt Exception Handling Sources and Priority (IRQ
Mode) and table 8.4, Interrupt Exception Handling Sources and Priority (IRL Mode).
3. The priority level of the interrupt selected by the interrupt controller is compared with the
interrupt mask bits (I3 to I0) in the status register (SR) of the CPU. If the request priority level
is higher than the level in bits I3 to I0, the interrupt controller accepts the interrupt and sends
an interrupt request signal to the CPU.
4. Detection timing: The INTC operates, and notifies the CPU of interrupt requests, in
synchronization with the peripheral clock (Pφ). The CPU receives an interrupt at a break in
instructions.
5. The interrupt source code is set in the interrupt event registers (INTEVT and INTEVT2).
6. The status register (SR) and program counter (PC) are saved to SSR and SPC, respectively.
7. The block bit (BL), mode bit (MD), and register bank bit (RB) in SR are set to 1.
8. The CPU jumps to the start address of the interrupt handler (the sum of the value set in the
vector base register (VBR) and H'00000600). This jump is not a delayed branch. The interrupt
handler may branch with the INTEVT or INTEVT2 value as its offset in order to identify the
interrupt source. This enables it to branch to the handling routine for the individual interrupt
source.

Notes: 1. The interrupt mask bits (I3 to I0) in the status register (SR) are not changed by
acceptance of an interrupt in this LSI.
2. The interrupt source flag should be cleared in the interrupt handler. To ensure that an
interrupt source that should have been cleared is not inadvertently accepted again, read
the interrupt source flag after it has been cleared, and then clear the BL bit or execute
an RTE instruction.

Rev. 3.00 Jan. 18, 2008 Page 276 of 1458


REJ09B0033-0300
Section 8 Interrupt Controller (INTC)

Program
execution state

Interrupt No
generated?

Yes

SR.BL=0,
No sleep mode,
or standby mode?

Yes

No
NMI?
Yes

Level 15 No
interrupt?

Yes Level 14 No
interrupt?
Yes I3 to I0 levels are
Set interrupt source in Yes Level 1 No
14 or lower?
INTEVT and INTEVT2 interrupt?
No I3 to I0 levels are
Save SR to SSR; Yes
Yes 13 or lower?
save PC to SPC
No
I3 to I0 levels are 0?
Set BL, MD, and RB Yes
bits in SR to 1
No
Branch to exception
handler

I3 to I0: Interrupt mask bits in status register (SR)

Figure 8.3 Interrupt Operation Flowchart

Rev. 3.00 Jan. 18, 2008 Page 277 of 1458


REJ09B0033-0300
Section 8 Interrupt Controller (INTC)

8.5.2 Multiple Interrupts

When handling multiple interrupts, an interrupt handler should include the following procedures:

1. To determine the interrupt source, branch to a specific interrupt handler corresponding to a


code set in INTEVT or INTEVT2. The code in INTEVT or INTEVT2 can be used as an offset
for branching to the specific handler.
2. Clear the interrupt source in each specific handler.
3. Save SSR and SPC to memory.
4. Clear the BL bit in SR, and set the accepted interrupt level in the interrupt mask bits in SR.
5. Handle the interrupt.
6. Execute the RTE instruction.

When these procedures are followed in order, an interrupt of higher priority than the one being
handled can be accepted after clearing BL in step 4. Figure 8.3 shows a sample interrupt operation
flowchart.

Rev. 3.00 Jan. 18, 2008 Page 278 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

Section 9 Bus State Controller (BSC)


The bus state controller (BSC) outputs control signals for various types of memory that is
connected to the external address space and external devices. The BSC functions enable this LSI
to connect directly with SRAM, SDRAM, and other memory storage devices, and external
devices.

9.1 Features
The BSC has the following features:

(1) External address space

• A maximum 32 or 64 Mbytes for each of the eight areas, CS0, CS2 to CS4, CS5A, CS5B,
CS6A and CS6B, totally 384 Mbytes (divided into eight areas).
• A maximum 64 Mbytes for each of the six areas, CS0, CS2 to CS4, CS5, and CS6, totally a
total of 384 Mbytes (divided into six areas).
• Can specify the normal space interface, byte-selection SRAM, burst ROM (clock synchronous
or asynchronous), SDRAM, PCMCIA for each address space.
• Can select the data bus width (8, 16, or 32 bits) for each address space.
• Controls the insertion of the wait state for each address space.
• Controls the insertion of the wait state for each read access and write access.
• Can set the independent idling cycle in the continuous access for five cases: read-write (in
same space/different space), read-read (in same space/different space), or the first cycle is a
write access.

(2) Normal space interface

• Supports the interface that can directly connect to the SRAM.

(3) Burst ROM (clock asynchronous) interface

• High-speed access to the ROM that has the page mode function.

Rev. 3.00 Jan. 18, 2008 Page 279 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

(4) SDRAM interface

• Can set the SDRAM in up to two areas.


• Multiplex output for row address/column address.
• Efficient access by single read/single write.
• High-speed access by bank-active mode.
• Supports an auto-refresh and self-refresh.
• Supports low-power function.

(5) Byte-selection SRAM interface

• Can connect directly to a byte-selection SRAM.

(6) PCMCIA direct interface

• Supports IC memory cards and I/O card interfaces defined in the JEIDA specifications Ver. 4.2
(PCMCIA2.1 Rev 2.1).
• Controls the insertion of the wait state using software.
• Supports the bus sizing function of the I/O bus width (only in little endian mode).

(7) Burst ROM (clock synchronous) interface

• Can connect directly to a burst ROM of the clock synchronous type.

(8) Bus arbitration

• Shares all of the resources with other CPU and outputs the bus enable after receiving the bus
request from external devices.

(9) Refresh function

• Supports the auto-refresh and self-refresh functions.


• Specifies the refresh interval using the refresh counter and clock selection.
• Can execute concentrated refresh by specifying the refresh counts (1, 2, 4, 6, or 8).

Rev. 3.00 Jan. 18, 2008 Page 280 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

(10) Interval timer using refresh counter

• Generates an interrupt request by a compare match.

Note: The PCMCIA direct interfaces supported by the BSC are only signals and bus protocols
shown in table 9.1. For details on other control signals, see section 29, PC Card Controller
(PCC) (external circuits and this LSI on-chip PC card controller).
Both area 5 and area 6 have the PCMCIA direct interface function which is common to the
SH3. The on-chip PC card controller supports only area 6.

Rev. 3.00 Jan. 18, 2008 Page 281 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

The block diagram of the BSC is shown in figure 9.1.

Internal master
module

Internal bus
BACK Bus
BREQ mastership CMNCR Internal slave
controller module

CS0WCR

...
...
Wait
WAIT controller CS6BWCR

RWTCNT

CS0, CS2, CS3,


CS4, CS5A, CS5B, Area CS0BCR
...

CS6A, CS6B controller

Module bus
...

CS6BBCR
MD5 to MD3
...

A25 to A0,
D31 to D0
BS, RD/WR, RD,
WE3(BE3) to WE0(BE0), Memory
RAS, CAS, controller
CKE, DQMxx,
CE2A, CE2B
CE1A, CE1B
ICIORD, ICIOWR
SDCR
IOIS16
RTCSR

RTCNT
Refresh
REFOUT
controller
Comparator

Interrupt
controller RTCOR

BSC
[Legend]
CMNCR: Common control register
CSnWCR: CSn space wait control register (n = 0, 2, 3, 4, 5A, 5B, 6A, 6B)
RWTCNT: Reset wait counter
CSnBCR: CSn space bus control register (n = 0, 2, 3, 4, 5A, 5B, 6A, 6B)
SDCR: SDRAM control register
RTCSR: Refresh timer control/status register
RTCNT: Refresh timer counter
RTCOR: Refresh time constant register

Figure 9.1 Block Diagram of BSC

Rev. 3.00 Jan. 18, 2008 Page 282 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

9.2 Input/Output Pins


The configuration of pins in this module is shown in table 9.1.

Table 9.1 Pin Configuration

Name I/O Function


A25 to A0 O Address bus
D31 to D0 I/O Data bus
BS O Bus cycle start
Asserted when a normal space, burst ROM (clock
synchronous/asynchronous), or PCMCIA is accessed. Asserted by
the same timing as CAS in SDRAM access.
CS0, CS2 to CS4 O Chip select
CS5A/CE2A O Chip select
Active only for address map 1
Corresponds to PCMCIA card select signals D15 to D8 when the
PCMCIA is used.
CS5B/CE1A O Chip select
Corresponds to PCMCIA card select signals D7 to D0 when the
PCMCIA is used.
CS6A/CE2B O Chip select
Active only for address map 1
Corresponds to PCMCIA card select signals D15 to D8 when the
PCMCIA is used.
CS6B/CE1B O Chip select
Corresponds to PCMCIA card select signals D7 to D0 when the
PCMCIA is used.
RD/WR O Read/write signal
Connects to WE pins when SDRAM or byte-selection SRAM is
connected.
RD O Read strobe (read data output enable signal)
A strobe signal to indicate the memory read cycle when the
PCMCIA is used.

Rev. 3.00 Jan. 18, 2008 Page 283 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

Name I/O Function


WE3(BE3)/DQMUU/ O Indicates that D31 to D24 are being written to.
ICIOWR Connected to the byte select signal when a byte-selection SRAM
is connected.
Corresponds to signals D31 to D24 when SDRAM is connected.
Functions as the I/O write strobe signal when the PCMCIA is
used.
WE2(BE2)/DQMUL/ O Indicates that D23 to D16 are being written to.
ICIORD Connected to the byte select signal when a byte-selection SRAM
is connected.
Corresponds to signals D23 to D16 when the SDRAM is used.
Functions as the I/O read strobe signal when the PCMCIA is used.
WE1(BE1)/DQMLU/ O Indicates that D15 to D8 are being written to.
WE Connected to the byte select signal when a byte-selection SRAM
is connected.
Corresponds to signals D15 to D8 when the SDRAM is used.
Functions as the memory write strobe signal when the PCMCIA is
used.
WE0(BE0)/DQMLL O Indicates that D7 to D0 are being written to.
Connected to the byte select signal when a byte-selection SRAM
is connected.
Corresponds to select signals D7 to D0 when the SDRAM is used.
RAS O Connects to RAS pin when SDRAM is connected.
CAS O Connects to CAS pin when SDRAM is connected.
CKE O Connects to CKE pin when SDRAM is connected.
IOIS16 I PCMCIA 16-bit I/O signal
Valid only in little endian mode.
Pulled low in bit endian mode.
WAIT I External wait input (sampled at the falling edge of CKIO)
BREQ I Bus request input
BACK O Bus acknowledge output
MD5 to MD3 I MD5: Selects data alignment (big endian or little endian)
MD4 and MD3: Specify area 0 bus width (8/16/32 bits)
REFOUT O Bus mastership request signal for refreshing

Rev. 3.00 Jan. 18, 2008 Page 284 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

9.3 Area Overview

9.3.1 Area Division

In the architecture of this LSI, both virtual spaces and physical spaces have 32-bit address spaces.
The upper three bits divide into the P0 to P4 areas, and specify the cache access method. For
details see section 5, Cache. The remaining 29 bits are used for division of the space into ten areas
(address map 1) or eight areas (address map 2) according to the MAP bit in CMNCR setting. The
BSC performs control for this 29-bit space.

As listed in tables 9.2 and 9.3, this LSI can be connected directly to eight or six areas of memory,
and it outputs chip select signals (CS0, CS2 to CS4, CS5A, CS5B, CS6A, and CS6B) for each of
them. CS0 is asserted during area 0 access; CS5A is asserted during area 5A access when address
map 1 is selected; and CS5B is asserted when address map 2 is selected.

9.3.2 Shadow Area

The BSC decodes A28 to A25 of the physical address and generates chip select signals that
correspond to areas 0, 2 to 4, 5A, 5B, 6A, and 6B. Address bits A31 to A29 are ignored. This
means that the range of area 0 addresses, for example, is H'00000000 to H'03FFFFFF, and its
corresponding shadow space is the address space in P1 to P3 areas obtained by adding to it
H'20000000 × n (n = 1 to 6).

The address range for area 7 is H'1C000000 to H'1FFFFFFF. The address space H'1C000000 +
H'20000000 × n to H'1FFFFFFF + H'20000000 × n (n = 0 to 6) corresponding to the area 7
shadow space is reserved, so do not use it.

Area P4 (H'E0000000 to H'EFFFFFFF) is an I/O area and is assigned for internal register
addresses. Therefore, area P4 does not become shadow space.

Rev. 3.00 Jan. 18, 2008 Page 285 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

H'00000000
Area 0 (CS0)
Area 1 (Internal I/O)
H'20000000 Area 2 (CS2)

P0 Area 3 (CS3)
H'40000000 Area 4 (CS4)
Area 5A (CS5A)
H'60000000 Area 5B (CS5B)
Area 6A (CS6A)
H'80000000 Area 6B (CS6B)
P1 Area 7 (Reserved area)
H'A0000000
P2 Physical address space

H'C0000000
P3
H'E0000000
P4

Address space

Figure 9.2 Address Space

Rev. 3.00 Jan. 18, 2008 Page 286 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

9.3.3 Address Map

The external address space has a capacity of 384 Mbytes and is used by dividing eight partial
spaces (address map 1) or six partial spaces (address map 2). The kind of memory to be connected
and the data bus width are specified in each partial space. The address map for the external address
space is listed below.

Table 9.2 Address Space Map 1 (CMNCR.MAP = 0)

Physical Address Area Memory to be Connected Capacity


H'00000000 to H'03FFFFFF Area 0 Normal memory 64 Mbytes
Burst ROM (Asynchronous)
Burst ROM (Synchronous)
H'04000000 to H'07FFFFFF Area 1 Internal I/O register area*2 64 Mbytes
H'08000000 to H'0BFFFFFF Area 2 Normal memory 64 Mbytes
Byte-selection SRAM
SDRAM
H'0C000000 to H'0FFFFFFF Area 3 Normal memory 64 Mbytes
Byte-selection SRAM
SDRAM
H'10000000 to H'13FFFFFF Area 4 Normal memory 64 Mbytes
Byte-selection SRAM
Burst ROM (Asynchronous)
H'14000000 to H'15FFFFFF Area 5A Normal memory 32 Mbytes
H'16000000 to H'17FFFFFF Area 5B Normal memory 32 Mbytes
Byte-selection SRAM
H'18000000 to H'19FFFFFF Area 6A Normal memory 32 Mbytes
H'1A000000 to H'1BFFFFFF Area 6B Normal memory 32 Mbytes
Byte-selection SRAM
H'1C000000 to H'1FFFFFFF Area 7 Reserved area*1 64 Mbytes
Notes: 1. Do not access the reserved area. If the reserved area is accessed, the correct
operation cannot be guaranteed.
2. Set the top three bits of the address to 101 to allocate in the P2 space.

Rev. 3.00 Jan. 18, 2008 Page 287 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

Table 9.3 Address Space Map 2 (CMNCR.MAP = 1)

Physical Address Area Memory to be Connected Capacity


H'00000000 to H'03FFFFFF Area 0 Normal memory 64 Mbytes
Burst ROM (Asynchronous)
Burst ROM (Synchronous)
H'04000000 to H'07FFFFFF Area 1 Internal I/O register area*3 64 Mbytes
H'08000000 to H'0BFFFFFF Area 2 Normal memory 64 Mbytes
Byte-selection SRAM
SDRAM
H'0C000000 to H'0FFFFFFF Area 3 Normal memory 64 Mbytes
Byte-selection SRAM
SDRAM
H'10000000 to H'13FFFFFF Area 4 Normal memory 64 Mbytes
Byte-selection SRAM
Burst ROM (Asynchronous)
2
H'14000000 to H'17FFFFFF Area 5* Normal memory 64 Mbytes
Byte-selection SRAM
PCMCIA
2
H'18000000 to H'1BFFFFFF Area 6* Normal memory 64 Mbytes
Byte-selection SRAM
PCMCIA
H'1C000000 to H'1FFFFFFF Area 7 Reserved area*1 64 Mbytes
Notes: 1. Do not access the reserved area. If the reserved area is accessed, the correct
operation cannot be guaranteed.
2. For area 5, CS5BBCR and CS5BWCR are valid.
For area 6, CS6BBCR and CS6BWCR are valid.
3. Set the top three bits of the address to 101 to allocate in the P2 space.

Rev. 3.00 Jan. 18, 2008 Page 288 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

9.3.4 Area 0 Memory Type and Memory Bus Width

The memory bus width in this LSI can be set for each area. In area 0, external pins can be used to
select byte (8 bits), word (16 bits), or longword (32 bits) on power-on reset. The memory bus
width of the other area is set by the register. The correspondence between the memory type,
external pins (MD3, MD4), and bus width is listed in the table below.

Table 9.4 Correspondence between External Pins (MD3 and MD4), Memory Type of CS0,
and Memory Bus Width

MD4 MD3 Memory Type Bus Width


0 0 Normal memory Reserved (Setting prohibited)
1 8 bits*
1 0 16 bits
1 32 bits
Note: * The bus width must not be specified as eight bits if the burst ROM (clock synchronous)
interface is selected.

9.3.5 Data Alignment

This LSI supports the big endian and little endian methods of data alignment. The data alignment
is specified using the external pin (MD5) at power-on reset as shown in table 9.5.

Table 9.5 Correspondence between External Pin (MD5) and Endians

MD5 Endian
0 Big endian
1 Little endian

Rev. 3.00 Jan. 18, 2008 Page 289 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

9.4 Register Descriptions


The BSC has the following registers. Refer to section 37, List of Registers, for more details on the
addresses and access size of these registers.

Do not access spaces other than CS0 until the termination of the setting the memory interface.

• Common control register (CMNCR)


• Bus control register for CS0 (CS0BCR)
• Bus control register for CS2 (CS2BCR)
• Bus control register for CS3 (CS3BCR)
• Bus control register for CS4 (CS4BCR)
• Bus control register for CS5A (CS5ABCR)
• Bus control register for CS5B (CS5BBCR)
• Bus control register for CS6A (CS6ABCR)
• Bus control register for CS6B (CS6BBCR)
• Wait control register for CS0 (CS0WCR)
• Wait control register for CS2 (CS2WCR)
• Wait control register for CS3 (CS3WCR)
• Wait control register for CS4 (CS4WCR)
• Wait control register for CS5A (CS5AWCR)
• Wait control register for CS5B (CS5BWCR)
• Wait control register for CS6A (CS6AWCR)
• Wait control register for CS6B (CS6BWCR)
• SDRAM control register (SDCR)
• Refresh timer control/status register (RTCSR)
• Refresh timer counter (RTCNT)
• Refresh time constant register (RTCOR)
• SDRAM mode register (SDMR2)
• SDRAM mode register (SDMR3)

Rev. 3.00 Jan. 18, 2008 Page 290 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

9.4.1 Common Control Register (CMNCR)

CMNCR is a 32-bit register that controls the common items for each area. Do not access external
memory other than area 0 until the CMNCR initialization is complete.

Initial
Bit Bit Name Value R/W Description
31 to 15  All 0 R Reserved
These bits are always read as 0. The write value should
always be 0.
14 BSD 0 R/W Bus Access Start Timing Specification After Bus
Acknowledge
Specifies the bus access start timing after the external bus
acknowledge signal is received.
0: Starts the external access at the same timing as the
address drive start after the bus acknowledge signal is
received.
1: Starts the external access one cycle following the address
drive start after the bus acknowledge signal is received.
13  0 R Reserved
This bit is always read as 0. The write value should always be
0.
12 MAP 0 R/W Space Specification
Selects the address map for the external address space. The
address maps to be selected are shown in tables 9.2 and 9.3.
0: Selects address map 1
1: Selects address map 2
11 BLOCK 0 R/W Bus Lock Bit
Specifies whether or not the BREQ signal is received.
0: Receives BREQ
1: Does not receive BREQ

Rev. 3.00 Jan. 18, 2008 Page 291 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

Initial
Bit Bit Name Value R/W Description
10 DPRTY1 0 R/W DMA Burst Transfer Priority
9 DPRTY0 0 R/W Specify the priority for a refresh request/bus mastership request
during DMA burst transfer.
00: Accepts a refresh request and bus mastership request
during DMA burst transfer
01: Accepts a refresh request but does not accept a bus
mastership request during DMA burst transfer
10: Accepts neither a refresh request nor a bus mastership
request during DMA burst transfer
11: Reserved (Setting prohibited)
8 DMAIW2 0 R/W Wait States between Access Cycles when DMA Single Address
7 DMAIW1 0 R/W is Transferred
6 DMAIW0 0 R/W Specify the number of idle cycles to be inserted after an access
to an external device with DACK when DMA single address
transfer is performed. The method of inserting idle cycles
depends on the contents of DMAIWA.
000: No idle cycle inserted
001: 1 idle cycle inserted
010: 2 idle cycles inserted
011: 4 idle cycled inserted
100: 6 idle cycled inserted
101: 8 idle cycle inserted
110: 10 idle cycles inserted
111: 12 idle cycled inserted
5 DMAIWA 0 R/W Method of Inserting Wait States between Access Cycles when
DMA Single Address is Transferred
Specifies the method of inserting the idle cycles specified by the
DMAIW1 and DMAIW0 bits. Clearing this bit will make this LSI
insert the idle cycles when another device, which includes this
LSI, drives the data bus after an external device with DACK
drove it. Setting this bit will make this LSI insert the idle cycles
even when the continuous accesses to an external device with
DACK are performed.
0: Inserts the idle cycles when another device drives the data
bus after an external device with DACK drove it.
1: Inserts the idle cycles every time when an external device
with DACK is accessed.

Rev. 3.00 Jan. 18, 2008 Page 292 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

Initial
Bit Bit Name Value R/W Description
4  1 R Reserved
This bit is always read as 1. The write value should always
be 1.
3 ENDIAN 0/1* R Endian Flag
Samples the external pin for specifying endian on power-on
reset (MD5). All address spaces are defined by this bit. This
is a read-only bit.
0: The external pin for specifying endian (MD5) was low level
on power-on reset. This LSI is being operated as big
endian.
1: The external pin for specifying endian (MD5) was high
level on power-on reset. This LSI is being operated as
little endian.
2  0 R Reserved
This bit is always read as 0. The write value should always
be 0.
1 HIZMEM 0 R/W High-Z Memory Control
Specifies the pin state in standby mode for A25 to A0, BS,
CSn, RD/WR, WEn(BEn)/DQMxx, and RD. When a bus is
released, these pins enter the high-impedance state
regardless of the setting of this bit.
0: High impedance in standby mode
1: Driven in standby mode
0 HIZCNT 0 R/W High-Z Control
Specifies the state in standby mode and bus released for
CKIO, CKE, RAS, and CAS.
0: High impedance in standby mode and bus released for
CKIO, CKE, RAS, and CAS.
1: Driven in standby mode and bus released for CKIO, CKE,
RAS, and CAS.
Note: * The external pin (MD5) for specifying endian is sampled on power-on reset. When big
endian is specified, this bit is read as 0 and when little endian is specified, this bit is
read as 1.

Rev. 3.00 Jan. 18, 2008 Page 293 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

9.4.2 CSn Space Bus Control Register (CSnBCR)

This register specifies the type of memory connected to each space, data-bus width of each space,
and the number of wait cycles between access cycles.

Do not access external memory other than area 0 until the CSnBCR initialization is completed.

(n = 0, 2, 3, 4, 5A, 5B, 6A, 6B)

Initial
Bit Bit Name Value R/W Description
31  0 R Reserved
This bit is always read as 0. The write value should always
be 0.
30 IWW2 0 R/W Idle Cycles between Write-Read Cycles and Write-Write
29 IWW1 1 R/W Cycles

28 IWW0 1 R/W These bits specify the number of idle cycles to be inserted
after the access to a memory that is connected to the space.
The target access cycles are the write-read cycle and write-
write cycle.
000: No idle cycle
001: 1 idle cycle inserted
010: 2 idle cycles inserted
011: 4 idle cycles inserted
100: 6 idle cycles inserted
101: 8 idle cycles inserted
110: 10 idle cycles inserted
111: 12 idle cycles inserted

Rev. 3.00 Jan. 18, 2008 Page 294 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

Initial
Bit Bit Name Value R/W Description
27 IWRWD2 0 R/W Idle Cycles for Another Space Read-Write
26 IWRWD1 1 R/W Specify the number of idle cycles to be inserted after the
25 IWRWD0 1 R/W access to a memory that is connected to the space. The
target access cycle is a read-write one in which continuous
accesses switch between different spaces.
000: No idle cycle inserted
001: 1 idle cycles inserted
010: 2 idle cycles inserted
011: 4 idle cycles inserted
100: 6 idle cycles inserted
101: 8 idle cycles inserted
110: 10 idle cycles inserted
111: 12 idle cycles inserted
24 IWRWS2 0 R/W Idle Cycles for Read-Write in Same Space
23 IWRWS1 1 R/W Specify the number of idle cycles to be inserted after the
22 IWRWS0 1 R/W access to a memory that is connected to the space. The
target cycle is a read-write cycle of which continuous
accesses are for the same space.
000: No idle cycle inserted
001: 1 idle cycles inserted
010: 2 idle cycles inserted
011: 4 idle cycles inserted
100: 6 idle cycles inserted
101: 8 idle cycles inserted
110: 10 idle cycles inserted
111: 12 idle cycles inserted

Rev. 3.00 Jan. 18, 2008 Page 295 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

Initial
Bit Bit Name Value R/W Description
21 IWRRD2 0 R/W Idle Cycles for Read-Read in Another Space
20 IWRRD1 1 R/W Specify the number of idle cycles to be inserted after the
19 IWRRD0 1 R/W access to a memory that is connected to the space. The
target cycle is a read-read cycle of which continuous
accesses switch between different spaces.
000: No idle cycle inserted
001: 1 idle cycles inserted
010: 2 idle cycles inserted
011: 4 idle cycles inserted
100: 6 idle cycles inserted
101: 8 idle cycles inserted
110: 10 idle cycles inserted
111: 12 idle cycles inserted
18 IWRRS2 0 R/W Idle Cycles for Read-Read in Same Space
17 IWRRS1 1 R/W Specify the number of idle cycles to be inserted after the
16 IWRRS0 1 R/W access to a memory that is connected to the space. The
target cycle is a read-read cycle of which continuous
accesses are for the same space.
000: No idle cycle inserted
001: 1 idle cycles inserted
010: 2 idle cycles inserted
011: 4 idle cycles inserted
100: 6 idle cycles inserted
101: 8 idle cycles inserted
110: 10 idle cycles inserted
111: 12 idle cycles inserted

Rev. 3.00 Jan. 18, 2008 Page 296 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

Initial
Bit Bit Name Value R/W Description
15 TYPE3 0 R/W Memory Type
14 TYPE2 0 R/W Specify the type of memory connected to a space.
13 TYPE1 0 R/W 0000: Normal space
12 TYPE0 0 R/W 0001: Burst ROM (clock asynchronous)
0010: Reserved (setting prohibited)
0011: Byte-selection SRAM
0100: SDRAM
0101: PCMCIA
0110: Reserved (setting prohibited)
0111: Burst ROM (clock synchronous)
1000: Reserved (setting prohibited)
1001: Reserved (setting prohibited)
1010: Reserved (setting prohibited)
1011: Reserved (setting prohibited)
1100: Reserved (setting prohibited)
1101: Reserved (setting prohibited)
1110: Reserved (setting prohibited)
1111: Reserved (setting prohibited)
Note: Memory type for area 0 immediately after reset is
normal space. The normal space, burst ROM (clock
asynchronous), or burst ROM (clock synchronous) can
be selected by these bits.
For details on memory type in each area, see tables 9.2 and
9.3.
11  0 R Reserved
This bit is always read as 0. The write value should always
be 0.

Rev. 3.00 Jan. 18, 2008 Page 297 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

Initial
Bit Bit Name Value R/W Description
10 BSZ1 1* R/W Data Bus Width
9 BSZ0 1* R/W Specify the data bus width of spaces.
00: Reserved (setting prohibited)
01: 8-bit size
10: 16-bit size
11: 32-bit size
Notes: 1. The data bus width for area 0 is specified by the
external pin. The BSZ1 and BSZ0 bit settings in
CS0BCR are ignored.
2. If area 5 or area 6 is specified as PCMCIA space,
the bus width can be specified as either 8 bits or
16 bits.
3. If area 2 or area 3 is specified as SDRAM space,
the bus width can be specified as either 16 bits or
32 bits.
8 to 0  All 0 R Reserved
These bits are always read as 0. The write value should
always be 0.
Note: * CS0BCR samples the external pins (MD3 and MD4) that specify the bus width at
power-on reset.

Rev. 3.00 Jan. 18, 2008 Page 298 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

9.4.3 CSn Space Wait Control Register (CSnWCR)

This register specifies various wait cycles for memory accesses. The bit configuration of this
register varies as shown below according to the memory type (TYPE3, TYPE2, TYPE1, or
TYPE0) specified by the CSn space bus control register (CSnBCR). Specify CSnWCR before
accessing the target area. Specify CSnBCR first, then specify CSnWCR.

(n = 0, 2, 3, 4, 5A, 5B, 6A, 6B)

(1) Normal Space, Byte-Selection SRAM

• CS0WCR, CS6BWCR

Initial
Bit Bit Name Value R/W Description
31 to 21  All 0 R Reserved
These bits are always read as 0. The write value should
always be 0.
20 BAS 0 R/W Byte Access Selection for Byte-Selection SRAM
Specifies the WEn (BEn) and RD/WR signal timing when
the byte-selection SRAM interface is used.
0: Asserts the WEn (BEn) signal at the read/write timing
and asserts the RD/WR signal during the write access
cycle.
1: Asserts the WEn (BEn) signal during the read/write
access cycle and asserts the RD/WR signal at the write
timing.
19 to 13  All 0 R Reserved
These bits are always read as 0. The write value should
always be 0.
12 SW1 0 R/W Number of Delay Cycles from Address, CSn Assertion to
11 SW0 0 R/W RD, WEn (BEn) Assertion
Specify the number of delay cycles from address and CSn
assertion to RD and WEn (BEn) assertion.
00: 0.5 cycle
01: 1.5 cycles
10: 2.5 cycles
11: 3.5 cycles

Rev. 3.00 Jan. 18, 2008 Page 299 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

Initial
Bit Bit Name Value R/W Description
10 WR3 1 R/W Number of Access Wait Cycles
9 WR2 0 R/W Specify the number of wait cycles that are necessary for
8 WR1 1 R/W read or write access.

7 WR0 0 R/W 0000: 0 cycle


0001: 1 cycle
0010: 2 cycles
0011: 3 cycles
0100: 4 cycles
0101: 5 cycles
0110: 6 cycles
0111: 8 cycles
1000: 10 cycles
1001: 12 cycles
1010: 14 cycles
1011: 18 cycles
1100: 24 cycles
1101: Reserved (Setting prohibited)
1110: Reserved (Setting prohibited)
1111: Reserved (Setting prohibited)
6 WM 0 R/W External Wait Mask Specification
Specifies whether or not the external wait input is valid. The
specification by this bit is valid even when the number of
access wait cycle is 0.
0: External wait is valid
1: External wait is ignored
5 to 2  All 0 R Reserved
These bits are always read as 0. The write value should
always be 0.

Rev. 3.00 Jan. 18, 2008 Page 300 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

Initial
Bit Bit Name Value R/W Description
1 HW1 0 R/W Number of Delay Cycles from RD, WEn (BEn) negation to
0 HW0 0 R/W Address, CSn negation
Specify the number of delay cycles from RD and WEn
(BEn) negation to address and CSn negation.
00: 0.5 cycle
01: 1.5 cycles
10: 2.5 cycles
11: 3.5 cycles

• CS2WCR, CS3WCR

Initial
Bit Bit Name Value R/W Description
31 to 21  All 0 R Reserved
These bits are always read as 0. The write value should
always be 0.
20 BAS 0 R/W Byte Access Selection for Byte-Selection SRAM
Specifies the WEn (BEn) and RD/WR signal timing when
the byte-selection SRAM interface is used.
0: Asserts the WEn (BEn) signal at the read/write timing
and asserts the RD/WR signal during the write access
cycle.
1: Asserts the WEn (BEn) signal during the read/write
access cycle and asserts the RD/WR signal at the write
timing.
19 to 11  All 0 R Reserved
These bits are always read as 0. The write value should
always be 0.

Rev. 3.00 Jan. 18, 2008 Page 301 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

Initial
Bit Bit Name Value R/W Description
10 WR3 1 R/W Number of Access Wait Cycles
9 WR2 0 R/W Specify the number of wait cycles that are necessary for
8 WR1 1 R/W read or write access.

7 WR0 0 R/W 0000: 0 cycle


0001: 1 cycle
0010: 2 cycles
0011: 3 cycles
0100: 4 cycles
0101: 5 cycles
0110: 6 cycles
0111: 8 cycles
1000: 10 cycles
1001: 12 cycles
1010: 14 cycles
1011: 18 cycles
1100: 24 cycles
1101: Reserved (setting prohibited)
1110: Reserved (setting prohibited)
1111: Reserved (setting prohibited)
6 WM 0 R/W External Wait Mask Specification
Specify whether or not the external wait input is valid. The
specification by this bit is valid even when the number of
access wait cycle is 0.
0: External wait is valid
1: External wait is ignored
5 to 0  All 0 R Reserved
These bits are always read as 0. The write value should
always be 0.

Rev. 3.00 Jan. 18, 2008 Page 302 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

• CS4WCR

Initial
Bit Bit Name Value R/W Description
31 to 21  All 0 R Reserved
These bits are always read as 0. The write value should
always be 0.
20 BAS 0 R/W Byte Access Selection for Byte-Selection SRAM
Specifies the WEn (BEn) and RD/WR signal timing when
the byte-selection SRAM interface is used.
0: Asserts the WEn (BEn) signal at the read/write timing
and asserts the RD/WR signal during the write access
cycle.
1: Asserts the WEn (BEn) signal during the read/write
access cycle and asserts the RD/WR signal at the write
timing.
19  0 R Reserved
This bit is always read as 0. The write value should always
be 0.
18 WW2 0 R/W Number of Write Access Wait Cycles
17 WW1 0 R/W Specify the number of cycles that are necessary for write
16 WW0 0 R/W access.
000: The same cycles as WR3 to WR0 setting (read or
write access wait)
001: 0 cycles
010: 1 cycle
011: 2 cycles
100: 3 cycles
101: 4 cycles
110: 5 cycles
111: 6 cycles
15 to 13  All 0 R Reserved
These bits are always read as 0. The write value should
always be 0.

Rev. 3.00 Jan. 18, 2008 Page 303 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

Initial
Bit Bit Name Value R/W Description
12 SW1 0 R/W Number of Delay Cycles from Address, CSn Assertion to
11 SW0 0 R/W RD, WEn (BEn) Assertion-
Specify the number of delay cycles from address and CSn
assertion to RD and WEn (BEn) assertion.
00: 0.5 cycle
01: 1.5 cycles
10: 2.5 cycles
11: 3.5 cycles
10 WR3 1 R/W Number of Access Wait Cycles
9 WR2 0 R/W Specify the number of wait cycles that are necessary for
8 WR1 1 R/W read or write access.

7 WR0 0 R/W 0000: 0 cycle


0001: 1 cycle
0010: 2 cycles
0011: 3 cycles
0100: 4 cycles
0101: 5 cycles
0110: 6 cycles
0111: 8 cycles
1000: 10 cycles
1001: 12 cycles
1010: 14 cycles
1011: 18 cycles
1100: 24 cycles
1101: Reserved (setting prohibited)
1110: Reserved (setting prohibited)
1111: Reserved (setting prohibited)
6 WM 0 R/W External Wait Mask Specification
Specifies whether or not the external wait input is valid.
The specification by this bit is valid even when the number
of access wait cycles is 0.
0: External wait is valid
1: External wait is ignored

Rev. 3.00 Jan. 18, 2008 Page 304 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

Initial
Bit Bit Name Value R/W Description
5 to 2  All 0 R Reserved
These bits are always read as 0. The write value should
always be 0.
1 HW1 0 R/W Number of Delay Cycles from RD, WEn (BEn) negation to
0 HW0 0 R/W Address, CSn negation
Specify the number of delay cycles from RD and WEn
(BEn) negation to address and CSn negation.
00: 0.5 cycle
01: 1.5 cycles
10: 2.5 cycles
11: 3.5 cycles

• CS5AWCR

Initial
Bit Bit Name Value R/W Description
31 to 19  All 0 R Reserved
These bits are always read as 0. The write value should
always be 0.
18 WW2 0 R/W Number of Write Access Wait Cycles
17 WW1 0 R/W Specify the number of cycles that are necessary for write
16 WW0 0 R/W access.
000: The same cycles as WR3 to WR0 setting (read or
write access wait)
001: 0 cycles
010: 1 cycle
011: 2 cycles
100: 3 cycles
101: 4 cycles
110: 5 cycles
111: 6 cycles
15 to 13  All 0 R Reserved
These bits are always read as 0. The write value should
always be 0.

Rev. 3.00 Jan. 18, 2008 Page 305 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

Initial
Bit Bit Name Value R/W Description
12 SW1 0 R/W Number of Delay Cycles from Address, CSn Assertion to
11 SW0 0 R/W RD, WEn (BEn) Assertion
Specify the number of delay cycles from address and CSn
assertion to RD and WEn (BEn) assertion.
00: 0.5 cycle
01: 1.5 cycles
10: 2.5 cycles
11: 3.5 cycles
10 WR3 1 R/W Number of Access Wait Cycles
9 WR2 0 R/W Specify the number of wait cycles that are necessary for
8 WR1 1 R/W read or write access.

7 WR0 0 R/W 0000: 0 cycle


0001: 1 cycle
0010: 2 cycles
0011: 3 cycles
0100: 4 cycles
0101: 5 cycles
0110: 6 cycles
0111: 8 cycles
1000: 10 cycles
1001: 12 cycles
1010: 14 cycles
1011: 18 cycles
1100: 24 cycles
1101: Reserved (setting prohibited)
1110: Reserved (setting prohibited)
1111: Reserved (setting prohibited)
6 WM 0 R/W External Wait Mask Specification
Specify whether or not the external wait input is valid. The
specification by this bit is valid even when the number of
access wait cycle is 0.
0: External wait is valid
1: External wait is ignored

Rev. 3.00 Jan. 18, 2008 Page 306 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

Initial
Bit Bit Name Value R/W Description
5 to 2  All 0 R Reserved
These bits are always read as 0. The write value should
always be 0.
1 HW1 0 R/W Number of Delay Cycles from RD, WEn (BEn) negation to
0 HW0 0 R/W Address, CSn negation
Specify the number of delay cycles from RD and WEn
(BEn) negation to address and CSn negation.
00: 0.5 cycle
01: 1.5 cycles
10: 2.5 cycles
11: 3.5 cycles

• CS5BWCR

Initial
Bit Bit Name Value R/W Description
31 to 21  All 0 R Reserved
These bits are always read as 0. The write value should
always be 0.
20 BAS 0 R/W Byte Access Selection for Byte-Selection SRAM
Specifies the WEn (BEn) and RD/WR signal timing when
the byte-selection SRAM interface is used.
0: Asserts the WEn (BEn) signal at the read/write timing
and asserts the RD/WR signal during the write access
cycle.
1: Asserts the WEn (BEn) signal during the read/write
access cycle and asserts the RD/WR signal at the write
timing.
19  0 R Reserved
This bit is always read as 0. The write value should always
be 0.

Rev. 3.00 Jan. 18, 2008 Page 307 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

Initial
Bit Bit Name Value R/W Description
18 WW2 0 R/W Number of Write Access Wait Cycles
17 WW1 0 R/W Specify the number of cycles that are necessary for write
16 WW0 0 R/W access.
000: The same cycles as WR3 to WR0 setting (read or
write access wait)
001: 0 cycles
010: 1 cycle
011: 2 cycles
100: 3 cycles
101: 4 cycles
110: 5 cycles
111: 6 cycles
15 to 13  All 0 R Reserved
These bits are always read as 0. The write value should
always be 0.
12 SW1 0 R/W Number of Delay Cycles from Address, CSn Assertion to
11 SW0 0 R/W RD, WEn (BEn) Assertion
Specify the number of delay cycles from address and CSn
assertion to RD and WEn (BEn) assertion.
00: 0.5 cycle
01: 1.5 cycles
10: 2.5 cycles
11: 3.5 cycles

Rev. 3.00 Jan. 18, 2008 Page 308 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

Initial
Bit Bit Name Value R/W Description
10 WR3 1 R/W Number of Access Wait Cycles
9 WR2 0 R/W Specify the number of wait cycles that are necessary for read
8 WR1 1 R/W or write access.

7 WR0 0 R/W 0000: 0 cycle


0001: 1 cycle
0010: 2 cycles
0011: 3 cycles
0100: 4 cycles
0101: 5 cycles
0110: 6 cycles
0111: 8 cycles
1000: 10 cycles
1001: 12 cycles
1010: 14 cycles
1011: 18 cycles
1100: 24 cycles
1101: Reserved (setting prohibited)
1110: Reserved (setting prohibited)
1111: Reserved (setting prohibited)
6 WM 0 R/W External Wait Mask Specification
Specify whether or not the external wait input is valid. The
specification by this bit is valid even when the number of
access wait cycles is 0.
0: External wait is valid
1: External wait is ignored
5 to 2  All 0 R Reserved
These bits are always read as 0. The write value should
always be 0.
1 HW1 0 R/W Number of Delay Cycles from RD, WEn (BEn) negation to
0 HW0 0 R/W Address, CSn negation
Specify the number of delay cycles from RD and WEn (BEn)
negation to address and CSn negation.
00: 0.5 cycle
01: 1.5 cycles
10: 2.5 cycles
11: 3.5 cycles

Rev. 3.00 Jan. 18, 2008 Page 309 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

• CS6AWCR
Initial
Bit Bit Name Value R/W Description
31 to 13  All 0 R Reserved
These bits are always read as 0. The write value should
always be 0.
12 SW1 0 R/W Number of Delay Cycles from Address, CSn Assertion to
11 SW0 0 R/W RD, WEn (BEn) Assertion
Specify the number of delay cycles from address and CSn
assertion to RD and WEn (BEn) assertion.
00: 0.5 cycle
01: 1.5 cycles
10: 2.5 cycles
11: 3.5 cycles
10 WR3 1 R/W Number of Access Wait Cycles
9 WR2 0 R/W Specify the number of wait cycles that are necessary for
8 WR1 1 R/W read or write access.

7 WR0 0 R/W 0000: 0 cycle


0001: 1 cycle
0010: 2 cycles
0011: 3 cycles
0100: 4 cycles
0101: 5 cycles
0110: 6 cycles
0111: 8 cycles
1000: 10 cycles
1001: 12 cycles
1010: 14 cycles
1011: 18 cycles
1100: 24 cycles
1101: Reserved (setting prohibited)
1110: Reserved (setting prohibited)
1111: Reserved (setting prohibited)
6 WM 0 R/W External Wait Mask Specification
Specify whether or not the external wait input is valid. The
specification by this bit is valid even when the number of
access wait cycle is 0.
0: External wait is valid
1: External wait is ignored

Rev. 3.00 Jan. 18, 2008 Page 310 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

Initial
Bit Bit Name Value R/W Description
5 to 2  All 0 R Reserved
These bits are always read as 0. The write value should
always be 0.
1 HW1 0 R/W Number of Delay Cycles from RD, WEn (BEn) negation to
0 HW0 0 R/W Address, CSn negation
Specify the number of delay cycles from RD and WEn
(BEn) negation to address and CSn negation.
00: 0.5 cycle
01: 1.5 cycles
10: 2.5 cycles
11: 3.5 cycles

(2) Burst ROM (Clock Asynchronous)

• CS0WCR

Initial
Bit Bit Name Value R/W Description
31 to 21  All 0 R Reserved
These bits are always read as 0. The write value should
always be 0.
20 BEN 0 R/W Burst Enable Specification
Enables or disables 8-burst access for a 16-bit bus width or
16-burst access for an 8-bit bus width during 16-byte access.
If this bit is set to 1, 2-burst access is performed four times
when the bus width is 16 bits and 4-burst access is
performed four times when the bus width is 8 bits.
To use a device that does not support 8-burst access or 16-
burst access, set this bit to 1.
0: Enables 8-burst access for a 16-bit bus width and 16-burst
access for an 8-bit bus width.
1: Disables 8-burst access for a 16-bit bus width and 16-burst
access for an 8-bit bus width.
19, 18  All 0 R Reserved
These bits are always read as 0. The write value should
always be 0.

Rev. 3.00 Jan. 18, 2008 Page 311 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

Initial
Bit Bit Name Value R/W Description
17 BW1 0 R/W Number of Burst Wait Cycles
16 BW0 0 R/W Specify the number of wait cycles to be inserted between
the second or later access cycles in burst access.
00: 0 cycles
01: 1 cycle
10: 2 cycles
11: 3 cycles
15 to 11  All 0 R Reserved
These bits are always read as 0. The write value should
always be 0.
10 W3 1 R/W Number of Access Wait Cycles
9 W2 0 R/W Specify the number of wait cycles to be inserted in the first
8 W1 1 R/W access cycle.

7 W0 0 R/W 0000: 0 cycles


0001: 1 cycle
0010: 2 cycles
0011: 3 cycles
0100: 4 cycles
0101: 5 cycles
0110: 6 cycles
0111: 8 cycles
1000: 10 cycles
1001: 12 cycles
1010: 14 cycles
1011: 18 cycles
1100: 24 cycles
1101: Reserved (setting prohibited)
1110: Reserved (setting prohibited)
1111: Reserved (setting prohibited)

Rev. 3.00 Jan. 18, 2008 Page 312 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

Initial
Bit Bit Name Value R/W Description
6 WM 0 R/W External Wait Mask Specification
Specify whether or not the external wait input is valid. The
specification by this bit is valid even when the number of
access wait cycles is 0.
0: External wait is valid
1: External wait is ignored
5 to 0  All 0 R Reserved
These bits are always read as 0. The write value should
always be 0.

• CS4WCR

Initial
Bit Bit Name Value R/W Description
31 to 21  All 0 R Reserved
These bits are always read as 0. The write value should
always be 0.
20 BEN 0 R/W Burst Enable Specification
Enables or disables 8-burst access for a 16-bit bus width or
16- burst access for an 8-bit bus width during 16-byte access.
If this bit is set to 1, 2-burst access is performed four times
when the bus width is 16 bits and 4-burst access is
performed four times when the bus width is 8 bits.
To use a device that does not support 8-burst access or 16-
burst access, set this bit to 1.
0: Enables 8-burst access for a 16-bit bus width and 16-burst
access for an 8-bit bus width.
1: Disables 8-burst access for a 16-bit bus width and 16-burst
access for an 8-bit bus width.
19, 18  All 0 R Reserved
These bits are always read as 0. The write value should
always be 0.

Rev. 3.00 Jan. 18, 2008 Page 313 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

Initial
Bit Bit Name Value R/W Description
17 BW1 0 R/W Number of Burst Wait Cycles
16 BW0 0 R/W Specify the number of wait cycles to be inserted between the
second or later access cycles in burst access.
00: 0 cycles
01: 1 cycle
10: 2 cycles
11: 3 cycles
15 to 13  All 0 R Reserved
These bits are always read as 0. The write value should
always be 0.
12 SW1 0 R/W Number of Delay Cycles from Address, CSn Assertion to RD,
11 SW0 0 R/W WEn (BEn) Assertion
Specify the number of delay cycles from address and CSn
assertion to RD and WEn (BEn) assertion. These bits can be
specified only in area 4.
00: 0.5 cycle
01: 1.5 cycles
10: 2.5 cycles
11: 3.5 cycles

Rev. 3.00 Jan. 18, 2008 Page 314 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

Initial
Bit Bit Name Value R/W Description
10 W3 1 R/W Number of Access Wait Cycles
9 W2 0 R/W Specify the number of wait cycles to be inserted in the first
8 W1 1 R/W access cycle.

7 W0 0 R/W 0000: 0 cycles


0001: 1 cycle
0010: 2 cycles
0011: 3 cycles
0100: 4 cycles
0101: 5 cycles
0110: 6 cycles
0111: 8 cycles
1000: 10 cycles
1001: 12 cycles
1010: 14 cycles
1011: 18 cycles
1100: 24 cycles
1101: Reserved (setting prohibited)
1110: Reserved (setting prohibited)
1111: Reserved (setting prohibited)
6 WM 0 R/W External Wait Mask Specification
Specifies whether or not the external wait input is valid.
The specification by this bit is valid even when the number
of access wait cycles is 0.
0: External wait is valid
1: External wait is ignored
5 to 2  All 0 R Reserved
These bits are always read as 0. The write value should
always be 0.
1 HW1 0 R/W Number of Delay Cycles from RD, WEn (BEn) negation to
0 HW0 0 R/W Address, CSn negation
Specify the number of delay cycles from RD and WEn
(BEn) negation to address and CSn negation. These bits
can be specified only in area 4.
00: 0.5 cycle
01: 1.5 cycles
10: 2.5 cycles
11: 3.5 cycles

Rev. 3.00 Jan. 18, 2008 Page 315 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

(3) SDRAM

• CS2WCR
Initial
Bit Bit Name Value R/W Description
31 to 9  All 0 R Reserved
These bits are always read as 0. The write value should
always be 0.
8 A2CL1 1 R/W CAS Latency for Area 2
7 A2CL0 0 R/W Specify the CAS latency for area 2.
00: 1 cycle
01: 2 cycles
10: 3 cycles
11: 4 cycles
6 to 0  All 0 R Reserved
These bits are always read as 0. The write value should
always be 0.

• CS3WCR
Initial
Bit Bit Name Value R/W Description
31 to 15  All 0 R Reserved
These bits are always read as 0. The write value should
always be 0.
14 TRP1 0 R/W Number of Cycles from Auto-Precharge/PRE Command to
13 TRP0 0 R/W ACTV Command
Specify the number of minimum cycles from the start of auto-
precharge or issuing of PRE command to the issuing of
ACTV command for the same bank. The setting for areas 2
and 3 is common.
00: 1 cycle
01: 2 cycles
10: 3 cycles
11: 4 cycles
12  0 R Reserved
This bit is always read as 0. The write value should always be
0.

Rev. 3.00 Jan. 18, 2008 Page 316 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

Initial
Bit Bit Name Value R/W Description
11 TRCD1 0 R/W Number of Cycles from ACTV Command to
10 TRCD0 1 R/W READ(A)/WRIT(A) Command
Specify the number of minimum cycles from issuing ACTV
command to issuing READ(A)/WRIT(A) command. The
setting for areas 2 and 3 is common.
00: 1 cycle
01: 2 cycles
10: 3 cycles
11: 4 cycles
9  0 R Reserved
This bit is always read as 0. The write value should always
be 0.
8 A3CL1 1 R/W CAS Latency for Area 3.
7 A3CL0 0 R/W Specify the CAS latency for area 3.
00: 1 cycle
01: 2 cycles
10: 3 cycles
11: 4 cycles
When connecting the SDRAM to area 2 and area 3, set
the CAS latency to the bits 8 and 7 in the CS2WCR
register and the SDMR2 and SDMR3 registers for SDRAM
mode setting. (See table 9.19.)
6, 5  All 0 R Reserved
These bits are always read as 0. The write value should
always be 0.
4 TRWL1 0 R/W Number of Cycles from WRITA/WRIT Command to Auto-
3 TRWL0 0 R/W Precharge/PRE Command
Specifies the number of cycles from issuing WRITA/WRIT
command to the start of auto-precharge or to issuing PRE
command. The setting for areas 2 and 3 is common.
00: 0 cycles
01: 1 cycle
10: 2 cycles
11: 3 cycles

Rev. 3.00 Jan. 18, 2008 Page 317 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

Initial
Bit Bit Name Value R/W Description
2  0 R Reserved
This bit is always read as 0. The write value should always
be 0.
1 TRC1 0 R/W Number of Cycles from REF Command/Self-Refresh
0 TRC0 0 R/W Release to ACTV Command
Specify the number of minimum cycles from issuing the
REF command or releasing self-refresh to issuing the
ACTV command. The setting for areas 2 and 3 is
common.
00: 3 cycles
01: 4 cycles
10: 6 cycles
11: 9 cycles
Note: * If both areas 2 and 3 are specified as SDRAM, TRP1/0, TRCD0/1, TRWL1/0, and
TRC1/0 bit settings are common.
If only one area is connected to the SDRAM, specify area 3. In this case, specify area 2
as normal space or byte-selection SRAM.

Rev. 3.00 Jan. 18, 2008 Page 318 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

(4) PCMCIA

• CS5BWCR, CS6BWCR

Initial
Bit Bit Name Value R/W Description
31 to 22  All 0 R Reserved
These bits are always read as 0. The write value should
always be 0.
21 SA1 0 R/W Space Attribute Specification
20 SA0 0 R/W Specify memory card interface or I/O card interface when the
PCMCIA interface is selected.
SA1
0: Specifies memory card interface when A25 = 1
1: Specifies I/O card interface when A25 = 1
SA0
0: Specifies memory card interface when A25 = 0
1: Specifies I/O card interface when A25 = 0
Note: When using the PC card controller, specifies the
following settings.
When the bit 4 (P0USE) in the PCC0GCR register of
PCC is 1 and the bit 5 (P0PCCT) of the PCC0GCR
register is 0, both SA1 and SA0 should be 0. When
the bit 4 (P0USE) and the bit 5 (P0PCCT) in the
PCC0GCR register of PCC are 1, both SA1 and SA0
should be 1.
19 to 15  All 0 R Reserved
These bits are always read as 0. The write value should
always be 0.

Rev. 3.00 Jan. 18, 2008 Page 319 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

Initial
Bit Bit Name Value R/W Description
14 TED3 0 R/W Delay from Address to RD or WE Assert
13 TED2 0 R/W Specify the delay time from address output to RD or WE
12 TED1 0 R/W assert in PCMCIA interface.

11 TED0 0 R/W 0000: 0.5 cycle


0001: 1.5 cycles
0010: 2.5 cycles
0011: 3.5 cycles
0100: 4.5 cycles
0101: 5.5 cycles
0110: 6.5 cycles
0111: 7.5 cycles
1000: 8.5 cycles
1001: 9.5 cycles
1010: 10.5 cycles
1011: 11.5 cycles
1100: 12.5 cycles
1101: 13.5 cycles
1110: 14.5 cycles
1111: 15.5 cycles

Rev. 3.00 Jan. 18, 2008 Page 320 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

Initial
Bit Bit Name Value R/W Description
10 PCW3 1 R/W Number of Access Wait Cycles
9 PCW2 0 R/W Specify the number of wait cycles to be inserted.
8 PCW1 1 R/W 0000: 3 cycles
7 PCW0 0 R/W 0001: 6 cycles
0010: 9 cycles
0011: 12 cycles
0100: 15 cycles
0101: 18 cycles
0110: 22 cycles
0111: 26 cycles
1000: 30 cycles
1001: 33 cycles
1010: 36 cycles
1011: 38 cycles
1100: 52 cycles
1101: 60 cycles
1110: 64 cycles
1111: 80 cycles
6 WM 0 R/W External Wait Mask Specification
Specify whether or not the external wait input is valid. The
specification by this bit is valid even when the number of
access wait cycle is 0.
0: External wait is valid
1: External wait is ignored
5, 4  All 0 R Reserved
These bits are always read as 0. The write value should
always be 0.

Rev. 3.00 Jan. 18, 2008 Page 321 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

Initial
Bit Bit Name Value R/W Description
3 TEH3 0 R/W Delay from RD or WE Negate to Address
2 TEH2 0 R/W Specify the address hold time from RD or WE negate in the
1 TEH1 0 R/W PCMCIA interface.

0 TEH0 0 R/W 0000: 0.5 cycle


0001: 1.5 cycles
0010: 2.5 cycles
0011: 3.5 cycles
0100: 4.5 cycles
0101: 5.5 cycles
0110: 6.5 cycles
0111: 7.5 cycles
1000: 8.5 cycles
1001: 9.5 cycles
1010: 10.5 cycles
1011: 11.5 cycles
1100: 12.5 cycles
1101: 13.5 cycles
1110: 14.5 cycles
1111: 15.5 cycles

Rev. 3.00 Jan. 18, 2008 Page 322 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

(5) Burst ROM (Clock Synchronous)

• CS0WCR

Initial
Bit Bit Name Value R/W Description
31 to 18  All 0 R Reserved
These bits are always read as 0. The write value should
always be 0.
17 BW1 0 R/W Number of Burst Wait Cycles
16 BW0 0 R/W Specify the number of wait cycles to be inserted between the
second or later access cycles in burst access.
00: 0 cycles
01: 1 cycle
10: 2 cycles
11: 3 cycles
15 to 11  All 0 R Reserved
These bits are always read as 0. The write value should
always be 0.
10 W3 1 R/W Number of Access Wait Cycles
9 W2 0 R/W Specify the number of wait cycles to be inserted in the first
8 W1 1 R/W access cycle.

7 W0 0 R/W 0000: 0 cycles


0001: 1 cycle
0010: 2 cycles
0011: 3 cycles
0100: 4 cycles
0101: 5 cycles
0110: 6 cycles
0111: 8 cycles
1000: 10 cycles
1001: 12 cycles
1010: 14 cycles
1011: 18 cycles
1100: 24 cycles
1101: Reserved (setting prohibited)
1110: Reserved (setting prohibited)
1111: Reserved (setting prohibited)

Rev. 3.00 Jan. 18, 2008 Page 323 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

Initial
Bit Bit Name Value R/W Description
6 WM 0 R/W External Wait Mask Specification
Specify whether or not the external wait input is valid. The
specification by this bit is valid even when the number of
access wait cycles is 0.
0: External wait is valid
1: External wait is ignored
5 to 0  All 0 R Reserved
These bits are always read as 0. The write value should
always be 0.

Rev. 3.00 Jan. 18, 2008 Page 324 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

9.4.4 SDRAM Control Register (SDCR)

SDCR specifies the method to refresh and access SDRAM, and the types of SDRAMs to be
connected.

Initial
Bit Bit Name Value R/W Description
31 to 21  All 0 R Reserved
These bits are always read as 0. The write value should
always be 0.
20 A2ROW1 0 R/W Number of Bits of Row Address for Area 2
19 A2ROW0 0 R/W Specify the number of bits of row address for area 2.
00: 11 bits
01: 12 bits
10: 13 bits
11: Reserved (setting prohibited)
18  0 R Reserved
This bit is always read as 0. The write value should always
be 0.
17 A2COL1 0 R/W Number of Bits of Column Address for Area 2
16 A2COL0 0 R/W Specify the number of bits of column address for area 2.
00: 8 bits
01: 9 bits
10: 10 bits
11: Reserved (setting prohibited)
15, 14  All 0 R Reserved
These bits are always read as 0. The write value should
always be 0.
13 DEEP 0 R/W Deep Power-Down Mode
This bit is valid for low-power SDRAM. If the RMODE bit is
set to 1 while this bit is set to 1, the deep power-down entry
command is issued and the low-power SDRAM enters the
deep power-down mode.
0: Self-refresh mode
1: Deep power-down mode

Rev. 3.00 Jan. 18, 2008 Page 325 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

Initial
Bit Bit Name Value R/W Description
12  0 R Reserved
This bit is always read as 0. The write value should always
be 0.
11 RFSH 0 R/W Refresh Control
Specifies whether or not the refresh operation of the SDRAM
is performed.
0: No refresh
1: Refresh
10 RMODE 0 R/W Refresh Control
Specifies whether to perform auto-refresh or self-refresh
when the RFSH bit is 1. When the RFSH bit is 1 and this bit
is 1, self-refresh starts immediately. When the RFSH bit is 1
and this bit is 0, auto-refresh starts according to the contents
that are set in RTCSR, RTCNT, and RTCOR.
0: Auto-refresh is performed
1: Self-refresh is performed
9 PDOWN 0 R Power-Down Mode
Specifies whether the SDRAM is entered in power-down
mode or not after the access to SDRAM is completed. If this
bit is set to 1, the CKE pin is pulled to low to place the
SDRAM to power-down mode.
0: Does not place the SDRAM in power-down mode after
access completion.
1: Places the SDRAM in power-down mode after access
completion.

Rev. 3.00 Jan. 18, 2008 Page 326 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

Initial
Bit Bit Name Value R/W Description
8 BACTV 0 R/W Bank Active Mode
Specifies to access whether in auto-precharge mode (using
READA and WRITA commands) or in bank active mode
(using READ and WRIT commands).
0: Auto-precharge mode (using READA and WRITA
commands)
1: Bank active mode (using READ and WRIT commands)
Note: Bank active mode can be used only in area 3. In this
case, the bus width can be selected as 16 or 32 bits.
When both areas 2 and 3 are set to SDRAM, specify
auto-precharge mode.
7 to 5  All 0 R Reserved
These bits are always read as 0. The write value should
always be 0.
4 A3ROW1 0 R/W Number of Bits of Row Address for Area 3
3 A3ROW0 0 R/W Specify the number of bits of the row address for area 3.
00: 11 bits
01: 12 bits
10: 13 bits
11: Reserved (setting prohibited)
2  0 R Reserved
This bit is always read as 0. The write value should always
be 0.
1 A3COL1 0 R/W Number of Bits of Column Address for Area 3
0 A3COL0 0 R/W Specify the number of bits of the column address for area 3.
00: 8 bits
01: 9 bits
10: 10 bits
11: Reserved (setting prohibited)

Rev. 3.00 Jan. 18, 2008 Page 327 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

9.4.5 Refresh Timer Control/Status Register (RTCSR)

RTCSR specifies various items about refresh for SDRAM.

When RTCSR is written, the upper 16 bits of the write data must be H'A55A to cancel write
protection.

Initial
Bit Bit Name Value R/W Description
31 to 8  All 0 R Reserved
These bits are always read as 0. The write value should
always be 0.
7 CMF 0 R/W Compare Match Flag
Indicates that a compare match occurs between the refresh
timer counter (RTCNT) and refresh time constant register
(RTCOR). This bit is set or cleared in the following
conditions.
0: Clearing condition: When 0 is written in CMF after reading
out RTCSR during CMF = 1.
1: Setting condition: When the condition RTCNT = RTCOR is
satisfied.
6 CMIE 0 R/W Compare Match Interrupt Enable
Enables or disables a CMF interrupt request when the CMF
bit of RTCSR is set to 1.
0: Disables the CMF interrupt request
1: Enables the CMF interrupt request
5 CKS2 0 R/W Clock Select
4 CKS1 0 R/W Select the clock input to count-up the refresh timer counter
3 CKS0 0 R/W (RTCNT).
000: Stop the counting-up
001: Bφ/4
010: Bφ/16
011: Bφ/64
100: Bφ/256
101: Bφ/1024
110: Bφ/2048
111: Bφ/4096

Rev. 3.00 Jan. 18, 2008 Page 328 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

Initial
Bit Bit Name Value R/W Description
2 RRC2 0 R/W Refresh Count
1 RRC1 0 R/W Specify the number of continuous refresh cycles, when the
0 RRC0 0 R/W refresh request occurs after the coincidence of the values of
the refresh timer counter (RTCNT) and the refresh time
constant register (RTCOR). These bits can make the period
of occurrence of refresh long.
000: Once
001: Twice
010: 4 times
011: 6 times
100: 8 times
101: Reserved (setting prohibited)
110: Reserved (setting prohibited)
111: Reserved (setting prohibited)

9.4.6 Refresh Timer Counter (RTCNT)

RTCNT is an 8-bit counter that increments using the clock selected by bits CKS2 to CKS0 in
RTCSR. When RTCNT matches RTCOR, RTCNT is cleared to 0. The value in RTCNT returns to
0 after counting up to 255. When the RTCNT is written, the upper 16 bits of the write data must
be H'A55A to cancel write protection.

Initial
Bit Bit Name Value R/W Description
31 to 8  All 0 R Reserved
These bits are always read as 0. The write value should
always be 0.
7 to 0  All 0 R/W 8-bit Counter

Rev. 3.00 Jan. 18, 2008 Page 329 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

9.4.7 Refresh Time Constant Register (RTCOR)

RTCOR is an 8-bit register. When RTCOR matches RTCNT, the CMF bit in RTCSR is set to 1
and RTCNT is cleared to 0.

When the RFSH bit in SDCR is 1, a memory refresh request is issued by this matching signal.
This request is maintained until the refresh operation is performed. If the request is not processed
when the next matching occurs, the previous request is ignored.

If the CMIE bit of the RTCSR is set to 1, an interrupt is requested by this matching signal. This
request is maintained until the CMF bit in RTCSR is cleared to 0. Clearing the CMF bit in RTCSR
affects only interrupts and does not affect refresh requests. This makes it possible to count the
number of refresh requests during refresh by interrupts, and to specify the refresh and interval
timer interrupts simultaneously. When the RTCOR is written, the upper 16 bits of the write data
must be H'A55A to cancel write protection.

Initial
Bit Bit Name Value R/W Description
31 to 8  All 0 R Reserved
These bits are always read as 0. The write value should
always be 0.
7 to 0  All 0 R/W 8-bit Counter

9.4.8 SDRAM Mode Registers 2, 3 (SDMR2 and SRMR3)

For the settings of SDRAM mode registers (SDMR2 and SDMR3), see table 9.19.

Rev. 3.00 Jan. 18, 2008 Page 330 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

9.5 Operation

9.5.1 Endian/Access Size and Data Alignment

This LSI supports big endian, in which the 0 address is the most significant byte (MSByte) in the
byte data and little endian, in which the 0 address is the least significant byte (LSByte) in the byte
data. Endian is specified on power-on reset by the external pin (MD5). When MD5 pin is low
level on power-on reset, the endian will become big endian and when MD5 pin is high level on
power-on reset, the endian will become little endian.

Three data bus widths (8 bits, 16 bits, and 32 bits) are available for normal memory and byte-
selection SRAM. Two data bus widths (16 bits and 32 bits) are available for SDRAM. Two data
bus widths (8 bits and 16 bits) are available for PCMCIA interface. Data alignment is performed
in accordance with the data bus width of the device and endian. This also means that when
longword data is read from a byte-width device, the read operation must be done four times. In
this LSI, data alignment and conversion of data length is performed automatically between the
respective interfaces.

Tables 9.6 to 9.11 show the relationship between endian, device data width, and access unit.

Table 9.6 32-Bit External Device/Big Endian Access and Data Alignment

Data Bus Strobe Signals

D31 to D23 to D15 to WE3(BE3), WE2(BE2), WE1(BE1), WE0(BE0),


Operation D24 D16 D8 D7 to D0 DQMUU DQMUL DQMLU DQMLL

Byte access Data    Assert   


at 0 7 to 0
Byte access  Data    Assert  
at 1 7 to 0
Byte access   Data    Assert 
at 2 7 to 0
Byte access    Data    Assert
at 3 7 to 0
Word access Data Data   Assert Assert  
at 0 15 to 8 7 to 0
Word access   Data Data   Assert Assert
at 2 15 to 8 7 to 0
Longword Data Data Data Data Assert Assert Assert Assert
access at 0 31 to 24 23 to 16 15 to 8 7 to 0

Rev. 3.00 Jan. 18, 2008 Page 331 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

Table 9.7 16-Bit External Device/Big Endian Access and Data Alignment

Data Bus Strobe Signals

D31 to D23 to D15 to D7 to WE3(BE3), WE2(BE2), WE1(BE1), WE0(BE0),


Operation D24 D16 D8 D0 DQMUU DQMUL DQMLU DQMLL

Byte access at 0   Data    Assert 


7 to 0
Byte access at 1    Data    Assert
7 to 0
Byte access at 2   Data    Assert 
7 to 0
Byte access at 3    Data    Assert
7 to 0
Word access at 0   Data Data   Assert Assert
15 to 8 7 to 0
Word access at 2   Data Data   Assert Assert
15 to 8 7 to 0
Longword 1st   Data Data   Assert Assert
access time at 0 31 to 23 to
at 0 24 16
2nd   Data Data   Assert Assert
time at 2 15 to 8 7 to 0

Rev. 3.00 Jan. 18, 2008 Page 332 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

Table 9.8 8-Bit External Device/Big Endian Access and Data Alignment

Data Bus Strobe Signals

D31 to D23 to D15 to D7 to WE3(BE3), WE2(BE2), WE1(BE1), WE0(BE0),


Operation D24 D16 D8 D0 DQMUU DQMUL DQMLU DQMLL

Byte access at 0    Data    Assert


7 to 0
Byte access at 1    Data    Assert
7 to 0
Byte access at 2    Data    Assert
7 to 0
Byte access at 3    Data    Assert
7 to 0
Word 1st time    Data    Assert
access at 0 at 0 15 to 8
2nd time    Data    Assert
at 1 7 to 0
Word 1st time    Data    Assert
access at 2 at 2 15 to 8
2nd time    Data    Assert
at 3 7 to 0
Longword 1st time    Data    Assert
access at 0 at 0 31 to 24
2nd time    Data    Assert
at 1 23 to 16
3rd time    Data    Assert
at 2 15 to 8
4th time    Data    Assert
at 3 7 to 0

Rev. 3.00 Jan. 18, 2008 Page 333 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

Table 9.9 32-Bit External Device/Little Endian Access and Data Alignment

Data Bus Strobe Signals

D31 to D23 to D15 to D7 to WE3(BE3), WE2(BE2), WE1(BE1), WE0(BE0),


Operation D24 D16 D8 D0 DQMUU DQMUL DQMLU DQMLL

Byte access    Data   Assert


at 0 7 to 0

Byte access   Data    Assert 


at 1 7 to 0
Byte access  Data    Assert  
at 2 7 to 0
Byte access Data    Assert   
at 3 7 to 0
Word access   Data Data   Assert Assert
at 0 15 to 8 7 to 0
Word access Data Data   Assert Assert  
at 2 15 to 8 7 to 0
Longword Data Data Data Data Assert Assert Assert Assert
access at 0 31 to 24 23 to 16 15 to 8 7 to 0

Rev. 3.00 Jan. 18, 2008 Page 334 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

Table 9.10 16-Bit External Device/Little Endian Access and Data Alignment

Data Bus Strobe Signals

D31 to D23 to D15 to D7 to WE3(BE3), WE2(BE2), WE1(BE1), WE0(BE0),


Operation D24 D16 D8 D0 DQMUU DQMUL DQMLU DQMLL

Byte access at 0    Data    Assert


7 to 0
Byte access at 1   Data    Assert 
7 to 0
Byte access at 2    Data    Assert
7 to 0
Byte access at 3   Data    Assert 
7 to 0
Word access at 0   Data Data   Assert Assert
15 to 8 7 to 0
Word access at 2   Data Data   Assert Assert
15 to 8 7 to 0
Longword 1st   Data Data   Assert Assert
access time at 0 15 to 8 7 to 0
at 0
2nd   Data Data   Assert Assert
time at 1 31 to 24 23 to 16

Rev. 3.00 Jan. 18, 2008 Page 335 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

Table 9.11 8-Bit External Device/Little Endian Access and Data Alignment

Data Bus Strobe Signals

D31 to D23 to D15 D7 to WE3(BE3), WE2(BE2), WE1(BE1), WE0(BE0),


Operation D24 D16 to D8 D0 DQMUU DQMUL DQMLU DQMLL

Byte access at 0    Data    Assert


7 to 0
Byte access at 1    Data    Assert
7 to 0
Byte access at 2    Data    Assert
7 to 0
Byte access at 3    Data    Assert
7 to 0
Word 1st time    Data    Assert
access at 0 at 0 7 to 0
2nd time    Data    Assert
at 1 15 to 8
Word 1st time    Data    Assert
access at 2 at 2 7 to 0
2nd time    Data    Assert
at 3 15 to 8
Longword 1st time    Data    Assert
access at 0 at 0 7 to 0
2nd time    Data    Assert
at 1 15 to 8
3rd time    Data    Assert
at 2 23 to 16
4th time    Data    Assert
at 3 31 to 24

Rev. 3.00 Jan. 18, 2008 Page 336 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

9.5.2 Normal Space Interface

(1) Basic Timing

For access to a normal space, this LSI uses strobe signal output in consideration of the fact that
mainly static RAM will be directly connected. When using SRAM with a byte-selection pin, see
section 9.5.7, Byte-Selection SRAM Interface. Figure 9.3 shows the basic timings of normal space
access. A no-wait normal access is completed in two cycles. The BS signal is asserted for one
cycle to indicate the start of a bus cycle.

T1 T2

CKIO

CSn

RD/WR

Read RD

RD/WR

WEn(BEn)
Write
D

BS

DACKn *

Note: * The waveform for DACKn is when active low is specified.

Figure 9.3 Normal Space Basic Access Timing (Access Wait 0)

Rev. 3.00 Jan. 18, 2008 Page 337 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

There is no access size specification when reading. The correct access start address is output in the
least significant bit of the address, but since there is no access size specification, 32 bits are always
read in case of a 32-bit device, and 16 bits in case of a 16-bit device. When writing, only the WEn
(BEn) signal for the byte to be written is asserted.

It is necessary to output the data that has been read using RD when a buffer is established in the
data bus. The RD/WR signal is in a read state (high output) when no access has been carried out.
Therefore, care must be taken when controlling the external data buffer, to avoid collision.

Figures 9.4 and 9.5 show the basic timings of normal space accesses. If the WM bit of the
CSnWCR is cleared to 0, a Tnop cycle is inserted to evaluate the external wait (figure 9.4). If the
WM bit of the CSnWCR is set to 1, external waits are ignored and no Tnop cycle is inserted
(figure 9.5).

Rev. 3.00 Jan. 18, 2008 Page 338 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

T1 T2 Tnop T1 T2

CKIO

A25 to A0

CSn

RD/WR

RD
Read
D15 to D0

WEn(BEn)

Write

D15 to D0

BS

DACKn*

WAIT

Note: * The waveform for DACKn is when active low is specified.

Figure 9.4 Continuous Access for Normal Space 1, Bus Width = 16 bits, Longword Access,
CSnWCR.WM Bit = 0 (Access Wait = 0, Cycle Wait = 0)

Rev. 3.00 Jan. 18, 2008 Page 339 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

T1 T2 T1 T2

CKIO

A25 to A0

CSn

RD/WR

RD
Read
D15 to D0

WEn(BEn)
Write

D15 to D0

BS

DACKn*

WAIT

Note: * The waveform for DACKn is when active low is specified.

Figure 9.5 Continuous Access for Normal Space 2, Bus Width = 16 bits, Longword Access,
CSnWCR.WM Bit = 1 (Access Wait = 0, Cycle Wait = 0)

Rev. 3.00 Jan. 18, 2008 Page 340 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

128k × 8-bit
This LSI SRAM
A18 A16

••••

••••

••••

••••
A2 A0
CSn CS
RD OE
D31 I/O7

••••
••••
••••

••••
D24 I/O0
WE3(BE3) WE
D23

••••

••••
D16 A16
WE2(BE2)

••••

••••
D15 A0
••••

•••• CS
D8 OE
WE1(BE1) I/O7

••••

••••
D7
••••

••••

I/O0
D0 WE
WE0(BE0)

A16

••••

••••
A0
CS
OE
I/O7

••••
••••
I/O0
WE

A16
••••

••••
A0
CS
OE
I/O7
••••

••••

I/O0
WE

Figure 9.6 Example of 32-Bit Data-Width SRAM Connection

Rev. 3.00 Jan. 18, 2008 Page 341 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

128k × 8-bit
This LSI SRAM
A17 A16

••••

••••

••••

••••
A1 A0
CSn CS
RD OE
D15 I/O7

••••
••••
••••

••••
D8 I/O0
WE1(BE1) WE
D7
••••

••••
D0 A16
WE0(BE0)

••••

••••
A0
CS
OE
I/O7

••••

••••
I/O0
WE

Figure 9.7 Example of 16-Bit Data-Width SRAM Connection

128 k x 8 bits
This LSI SRAM

A16 A16
...

...
A0 A0
CSn CS
RD OE
D7 I/O7
...
...

D0 I/O0
WE0(BE0) WE

Figure 9.8 Example of 8-Bit Data-Width SRAM Connection

Rev. 3.00 Jan. 18, 2008 Page 342 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

9.5.3 Access Wait Control

Wait cycle insertion on a normal space access can be controlled by the settings of bits WR3 to
WR0 in CSnWCR. It is possible for areas 4, 5A, and 5B to insert wait cycles independently in
read access and in write access. The areas other than 4, 5A, and 5B have common access wait for
read cycle and write cycle. The specified number of Tw cycles is inserted as wait cycles in a
normal space access shown in figure 9.9.

T1 Tw T2

CKIO

A25 to A0

CSn

RD/WR

RD
Read
D31 to D0

WEn(BEn)
Write
D31 to D0

BS

DACKn*

Note: * The waveform for DACKn is when active low is specified.

Figure 9.9 Wait Timing for Normal Space Access (Software Wait Only)

When the WM bit in CSnWCR is cleared to 0, the external wait input WAIT signal is also
sampled. WAIT pin sampling is shown in figure 9.10. A 2-cycle wait is specified as a software
wait. The WAIT signal is sampled on the falling edge of CKIO at the transition from the T1 or Tw
cycle to the T2 cycle.

Rev. 3.00 Jan. 18, 2008 Page 343 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

Wait states inserted


by WAIT signal
T1 Tw Tw Twx T2

CKIO

A25 to A0

CSn

RD/WR

RD
Read
D31 to D0

WEn(BEn)
Write
D31 to D0

WAIT

BS

DACKn*

Note: * The waveform for DACKn is when active low is specified.

Figure 9.10 Wait State Timing for Normal Space Access


(Wait State Insertion using WAIT Signal)

Rev. 3.00 Jan. 18, 2008 Page 344 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

9.5.4 CSn Assert Period Expansion

The number of cycles from CSn assertion to RD and WEn (BEn) assertion can be specified by
setting bits SW1 and SW0 in CSnWCR. The number of cycles from RD and WEn (BEn) negation
to CSn negation can be specified by setting bits HW1 and HW0. Therefore, a flexible interface to
an external device can be obtained. Figure 9.11 shows an example. A Th cycle and a Tf cycle are
added before and after an ordinary cycle, respectively. In these cycles, RD and WEn (BEn) are not
asserted, while other signals are asserted. The data output is prolonged to the Tf cycle, and this
prolongation is useful for devices with slow writing operations.

Th T1 T2 Tf

CKIO

A25 to A0

CSn

RD/WR

RD
Read
D31 to D0

WEn(BEn)
Write
D31 to D0

BS

DACKn*

Note: * The waveform for DACKn is when active low is specified.

Figure 9.11 CSn Assert Period Expansion

Rev. 3.00 Jan. 18, 2008 Page 345 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

9.5.5 SDRAM Interface

(1) SDRAM Direct Connection

The SDRAM that can be connected to this LSI is a product that has 11/12/13 bits of row address,
8/9/10 bits of column address, 4 or less banks, and uses the A10 pin for setting precharge mode in
read and write command cycles.

The control signals for direct connection of SDRAM are RAS, CAS, RD/WR, DQMUU,
DQMUL, DQMLU, DQMLL, CKE, CS2, and CS3. All the signals other than CS2 and CS3 are
common to all areas, and signals other than CKE are valid when CS2 or CS3 is asserted. SDRAM
can be connected to up to 2 spaces. The data bus width of the area that is connected to SDRAM
can be set to 32 or 16 bits.

Burst read/single write (burst length 1) and burst read/burst write (burst length 1) are supported as
the SDRAM operating mode.

Commands for SDRAM can be specified by RAS, CAS, RD/WR, and specific address signals.
These commands are shown below.

• NOP
• Auto-refresh (REF)
• Self-refresh (SELF)
• All banks precharge (PALL)
• Specified bank precharge (PRE)
• Bank active (ACTV)
• Read (READ)
• Read with precharge (READA)
• Write (WRIT)
• Write with precharge (WRITA)
• Write mode register (MRS)

The byte to be accessed is specified by DQMUU, DQMUL, DQMLU, and DQMLL. Reading or
writing is performed for a byte whose corresponding DQMxx is low. For details on the
relationship between DQMxx and the byte to be accessed, refer to section 9.5.1, Endian/Access
Size and Data Alignment.

Rev. 3.00 Jan. 18, 2008 Page 346 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

Figures 9.12 and 9.13 show examples of the connection of the SDRAM with the LSI.

64-Mbit SDRAM
This LSI (1M x 16 bits x 4 banks)

A15 A13

...
...
A2 A0
CKE CKE
CKIO CLK
CSn CS

RAS RAS
CAS CAS
RD/WR WE
D31 I/O15

...
...

D16 I/O0
DQMUU DQMU
DQMUL DQML
D15
...

A13
D0

...
DQMLU
A0
DQMLL
CKE
CLK
CS

RAS
CAS
WE
I/O15
...

I/O0
DQMU
DQML

Figure 9.12 Example of 32-Bit Data-Width SDRAM Connection

Rev. 3.00 Jan. 18, 2008 Page 347 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

64-Mbit SDRAM
This LSI (1M x 16 bits x 4 banks)

A14 A13

...
...
A1 A0
CKE CKE
CKIO CLK
CSn CS

RAS RAS
CAS CAS
RD/WR WE
D15 I/O15

...
...

D0 I/O0
DQMLU DQMU
DQMLL DQML

Figure 9.13 Example of 16-Bit Data-Width SDRAM Connection

(2) Address Multiplexing

An address multiplexing is specified so that SDRAM can be connected without external


multiplexing circuitry according to the setting of bits BSZ[1:0]in CSnBCR, AxROW[1:0] and
AxCOL[1:0] in SDCR. Tables 9.12 to 9.17 show the relationship between the settings of bits
BSZ[1:0], AxROW[1:0], and AxCOL[1:0] and the bits output at the address pins. Do not specify
those bits in the manner other than this table, otherwise the operation of this LSI is not guaranteed.
A25 to A18 are not multiplexed and the original values of address are always output at these pins.

When the data bus width is 16 bits (BSZ[1:0] =B'10), A0 of SDRAM specifies a word address.
Therefore, connect this A0 pin of SDRAM to the A1 pin of the LSI; the A1 pin of SDRAM to the
A2 pin of the LSI, and so on. When the data bus width is 32 bits (BSZ[1:0] =B'11), the A0 pin of
SDRAM specifies a longword address. Therefore, connect this A0 pin of SDRAM to the A2 pin of
the LSI; the A1 pin of SDRAM to the A3 pin of the LSI, and so on.

Rev. 3.00 Jan. 18, 2008 Page 348 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

Table 9.12 Relationship between A2/3BSZ[1:0], A2/3ROW[1:0], A2/3COL[1:0], and


Address Multiplex Output (1)-1

Setting
A2/3 A2/3 A2/3
BSZ ROW COL
[1:0] [1:0] [1:0]
11 (32 bits) 00 (11 bits) 00 (8 bits)
Output Pin of Row Address Column Address Synchronous
This LSI Output Output DRAM Pin Function
A17 A25 A17 Unused
A16 A24 A16
A15 A23 A15
2
A14 A22* A22*2 A12 (BA1) Specifies bank
2 2
A13 A21* A21* A11 (BA0)
A12 A20 L/H*1 A10/AP Specifies
address/precharge
A11 A19 A11 A9 Address
A10 A18 A10 A8
A9 A17 A9 A7
A8 A16 A8 A6
A7 A15 A7 A5
A6 A14 A6 A4
A5 A13 A5 A3
A4 A12 A4 A2
A3 A11 A3 A1
A2 A10 A2 A0
A1 A9 A1 Unused
A0 A8 A0
Example of connected memory
64-Mbit product (512 kwords x 32 bits x 4 banks, column 8 bits product): 1
16-Mbit product (512 kwords x 16 bits x 2 banks, column 8 bits product): 2
Notes: 1. L/H is a bit used in the command specification; it is fixed at low or high according to the
access mode.
2. Bank address specification

Rev. 3.00 Jan. 18, 2008 Page 349 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

Table 9.12 Relationship between A2/3BSZ[1:0], A2/3ROW[1:0], A2/3COL[1:0], and


Address Multiplex Output (1)-2

Setting
A2/3 A2/3 A2/3
BSZ ROW COL
[1:0] [1:0] [1:0]
11 (32 bits) 01 (12 bits) 00 (8 bits)
Output Pin of Row Address Column Address Synchronous
This LSI Output Output DRAM Pin Function
A17 A24 A17 Unused
A16 A23 A16
2
A15 A23* A23*2 A13 (BA1) Specifies bank
2 2
A14 A22* A22* A12 (BA0)
A13 A21 A13 A11 Address
A12 A20 L/H*1 A10/AP Specifies
address/precharge
A11 A19 A11 A9 Address
A10 A18 A10 A8
A9 A17 A9 A7
A8 A16 A8 A6
A7 A15 A7 A5
A6 A14 A6 A4
A5 A13 A5 A3
A4 A12 A4 A2
A3 A11 A3 A1
A2 A10 A2 A0
A1 A9 A1 Unused
A0 A8 A0
Example of connected memory
128-Mbit product (1 Mword x 32 bits x 4 banks, column 8 bits product): 1
64-Mbit product (1 Mword x 16 bits x 4 banks, column 8 bits product): 2
Notes: 1. L/H is a bit used in the command specification; it is fixed at low or high according to the
access mode.
2. Bank address specification

Rev. 3.00 Jan. 18, 2008 Page 350 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

Table 9.13 Relationship between A2/3BSZ[1:0], A2/3ROW[1:0], A2/3COL[1:0], and


Address Multiplex Output (2)-1

Setting
A2/3 A2/3 A2/3
BSZ ROW COL
[1:0] [1:0] [1:0]
11 (32 bits) 01 (12 bits) 01 (9 bits)
Output Pin of Row Address Column Address Synchronous
This LSI Output Output DRAM Pin Function
A17 A26 A17 Unused
A16 A25 A16
2
A15 A24* A24*2 A13 (BA1) Specifies bank
2 2
A14 A23* A23* A12 (BA0)
A13 A22 A13 A11 Address
A12 A21 L/H*1 A10/AP Specifies
address/precharge
A11 A20 A11 A9 Address
A10 A19 A10 A8
A9 A18 A9 A7
A8 A17 A8 A6
A7 A16 A7 A5
A6 A15 A6 A4
A5 A14 A5 A3
A4 A13 A4 A2
A3 A12 A3 A1
A2 A11 A2 A0
A1 A10 A1 Unused
A0 A9 A0
Example of connected memory
256-Mbit product (2 Mwords x 32 bits x 4 banks, column 9 bits product): 1
128-Mbit product (2 Mwords x 16 bits x 4 banks, column 9 bits product): 2
Notes: 1. L/H is a bit used in the command specification; it is fixed at low or high according to the
access mode.
2. Bank address specification

Rev. 3.00 Jan. 18, 2008 Page 351 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

Table 9.13 Relationship between A2/3BSZ[1:0], A2/3ROW[1:0], A2/3COL[1:0], and


Address Multiplex Output (2)-2

Setting
A2/3 A2/3 A2/3
BSZ ROW COL
[1:0] [1:0] [1:0]
11 (32 bits) 01 (12 bits) 10 (10 bits)
Output Pin of Row Address Column Address Synchronous
This LSI Output Output DRAM Pin Function
A17 A27 A17 Unused
A16 A26 A16
2
A15 A25* A25*2 A13 (BA1) Specifies bank
2 2
A14 A24* A24* A12 (BA0)
A13 A23 A13 A11 Address
A12 A22 L/H*1 A10/AP Specifies
address/precharge
A11 A21 A11 A9 Address
A10 A20 A10 A8
A9 A19 A9 A7
A8 A18 A8 A6
A7 A17 A7 A5
A6 A16 A6 A4
A5 A15 A5 A3
A4 A14 A4 A2
A3 A13 A3 A1
A2 A12 A2 A0
A1 A11 A1 Unused
A0 A10 A0
Example of connected memory
512-Mbit product (4 Mwords x 32 bits x 4 banks, column 10 bits product): 1
256-Mbit product (4 Mwords x 16 bits x 4 banks, column 10 bits product): 2
Notes: 1. L/H is a bit used in the command specification; it is fixed at low or high according to the
access mode.
2. Bank address specification

Rev. 3.00 Jan. 18, 2008 Page 352 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

Table 9.14 Relationship between A2/3BSZ[1:0], A2/3ROW[1:0], A2/3COL[1:0], and


Address Multiplex Output (3)

Setting
A2/3 A2/3 A2/3
BSZ ROW COL
[1:0] [1:0] [1:0]
11 (32 bits) 10 (13 bits) 01 (9 bits)
Output Pin of Row Address Column Address Synchronous
This LSI Output Output DRAM Pin Function
A17 A26 A17 Unused
2 2
A16 A25* A25* A14 (BA1) Specifies bank
2 2
A15 A24* A24* A13 (BA0)
A14 A23 A14 A12 Address
A13 A22 A13 A11
A12 A21 L/H*1 A10/AP Specifies
address/precharge
A11 A20 A11 A9 Address
A10 A19 A10 A8
A9 A18 A9 A7
A8 A17 A8 A6
A7 A16 A7 A5
A6 A15 A6 A4
A5 A14 A5 A3
A4 A13 A4 A2
A3 A12 A3 A1
A2 A11 A2 A0
A1 A10 A1 Unused
A0 A9 A0
Example of connected memory
512-Mbit product (4 Mwords x 32 bits x 4 banks, column 9 bits product): 1
256-Mbit product (4 Mwords x 16 bits x 4 banks, column 9 bits product): 2
Notes: 1. L/H is a bit used in the command specification; it is fixed at low or high according to the
access mode.
2. Bank address specification

Rev. 3.00 Jan. 18, 2008 Page 353 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

Table 9.15 Relationship between A2/3BSZ[1:0], A2/3ROW[1:0], A2/3COL[1:0], and


Address Multiplex Output (4)-1

Setting
A2/3 A2/3 A2/3
BSZ ROW COL
[1:0] [1:0] [1:0]
10 (16 bits) 00 (11 bits) 00 (8 bits)
Output Pin of Row Address Column Address Synchronous
This LSI Output Output DRAM Pin Function
A17 A25 A17 Unused
A16 A24 A16
A15 A23 A15
A14 A22 A14
2
A13 A21* A21*2 A12 (BA1) Specifies bank
A12 A20*2 A20*2 A11 (BA0)
1
A11 A19 L/H* A10/AP Specifies
address/precharge
A10 A18 A10 A9 Address
A9 A17 A9 A8
A8 A16 A8 A7
A7 A15 A7 A6
A6 A14 A6 A5
A5 A13 A5 A4
A4 A12 A4 A3
A3 A11 A3 A2
A2 A10 A2 A1
A1 A9 A1 A0
A0 A8 A0 Unused
Example of connected memory
16-Mbit product (512 kwords x 16 bits x 2 banks, column 8 bits product): 1
Notes: 1. L/H is a bit used in the command specification; it is fixed at low or high according to the
access mode.
2. Bank address specification

Rev. 3.00 Jan. 18, 2008 Page 354 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

Table 9.15 Relationship between A2/3BSZ[1:0], A2/3ROW[1:0], A2/3COL[1:0], and


Address Multiplex Output (4)-2

Setting
A2/3 A2/3 A2/3
BSZ ROW COL
[1:0] [1:0] [1:0]
10 (16 bits) 01 (12 bits) 00 (8 bits)
Output Pin of Row Address Column Address Synchronous
This LSI Output Output DRAM Pin Function
A17 A25 A17 Unused
A16 A24 A16
A15 A23 A15
2
A14 A22* A22*2 A13 (BA1) Specifies bank
2 2
A13 A21* A21* A12 (BA0)
A12 A20 A12 A11 Address
1
A11 A19 L/H* A10/AP Specifies
address/precharge
A10 A18 A10 A9 Address
A9 A17 A9 A8
A8 A16 A8 A7
A7 A15 A7 A6
A6 A14 A6 A5
A5 A13 A5 A4
A4 A12 A4 A3
A3 A11 A3 A2
A2 A10 A2 A1
A1 A9 A1 A0
A0 A8 A0 Unused
Example of connected memory
64-Mbit product (1 Mword x 16 bits x 4 banks, column 8 bits product): 1
Notes: 1. L/H is a bit used in the command specification; it is fixed at low or high according to the
access mode.
2. Bank address specification

Rev. 3.00 Jan. 18, 2008 Page 355 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

Table 9.16 Relationship between A2/3BSZ[1:0], A2/3ROW[1:0], A2/3COL[1:0], and


Address Multiplex Output (5)-1

Setting
A2/3 A2/3 A2/3
BSZ ROW COL
[1:0] [1:0] [1:0]
10 (16 bits) 01 (12 bits) 01 (9 bits)
Output Pin of Row Address Column Address Synchronous
This LSI Output Output DRAM Pin Function
A17 A26 A17 Unused
A16 A25 A16
A15 A24 A15
2
A14 A23* A23*2 A13 (BA1) Specifies bank
2 2
A13 A22* A22* A12 (BA0)
A12 A21 A12 A11 Address
1
A11 A20 L/H* A10/AP Specifies
address/precharge
A10 A19 A10 A9 Address
A9 A18 A9 A8
A8 A17 A8 A7
A7 A16 A7 A6
A6 A15 A6 A5
A5 A14 A5 A4
A4 A13 A4 A3
A3 A12 A3 A2
A2 A11 A2 A1
A1 A10 A1 A0
A0 A9 A0 Unused
Example of connected memory
128-Mbit product (2 Mwords x 16 bits x 4 banks, column 9 bits product): 1
Notes: 1. L/H is a bit used in the command specification; it is fixed at low or high according to the
access mode.
2. Bank address specification

Rev. 3.00 Jan. 18, 2008 Page 356 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

Table 9.16 Relationship between A2/3BSZ[1:0], A2/3ROW[1:0], A2/3COL[1:0], and


Address Multiplex Output (5)-2

Setting
A2/3 A2/3 A2/3
BSZ ROW COL
[1:0] [1:0] [1:0]
10 (16 bits) 01 (12 bits) 10 (10 bits)
Output Pin of Row Address Column Address Synchronous
This LSI Output Output DRAM Pin Function
A17 A27 A17 Unused
A16 A26 A16
A15 A25 A15
2
A14 A24* A24*2 A13 (BA1) Specifies bank
2 2
A13 A23* A23* A12 (BA0)
A12 A22 A12 A11 Address
1
A11 A21 L/H* A10/AP Specifies
address/precharge
A10 A20 A10 A9 Address
A9 A19 A9 A8
A8 A18 A8 A7
A7 A17 A7 A6
A6 A16 A6 A5
A5 A15 A5 A4
A4 A14 A4 A3
A3 A13 A3 A2
A2 A12 A2 A1
A1 A11 A1 A0
A0 A10 A0 Unused
Example of connected memory
256-Mbit product (4 Mwords x 16 bits x 4 banks, column 10 bits product): 1
Notes: 1. L/H is a bit used in the command specification; it is fixed at low or high according to the
access mode.
2. Bank address specification

Rev. 3.00 Jan. 18, 2008 Page 357 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

Table 9.17 Relationship between A2/3BSZ[1:0], A2/3ROW[1:0], A2/3COL[1:0], and


Address Multiplex Output (6)-1

Setting
A2/3 A2/3 A2/3
BSZ ROW COL
[1:0] [1:0] [1:0]
10 (16 bits) 10 (13 bits) 01 (9 bits)
Output Pin of Row Address Column Address Synchronous
This LSI Output Output DRAM Pin Function
A17 A26 A17 Unused
A16 A25 A16
2
A15 A24* A24*2 A14 (BA1) Specifies bank
2 2
A14 A23* A23* A13 (BA0)
A13 A22 A13 A12 Address
A12 A21 A12 A11
1
A11 A20 L/H* A10/AP Specifies
address/precharge
A10 A19 A10 A9 Address
A9 A18 A9 A8
A8 A17 A8 A7
A7 A16 A7 A6
A6 A15 A6 A5
A5 A14 A5 A4
A4 A13 A4 A3
A3 A12 A3 A2
A2 A11 A2 A1
A1 A10 A1 A0
A0 A9 A0 Unused
Example of connected memory
256-Mbit product (4 Mwords x 16 bits x 4 banks, column 9 bits product): 1
Notes: 1. L/H is a bit used in the command specification; it is fixed at low or high according to the
access mode.
2. Bank address specification

Rev. 3.00 Jan. 18, 2008 Page 358 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

Table 9.17 Relationship between A2/3BSZ[1:0], A2/3ROW[1:0], A2/3COL[1:0], and


Address Multiplex Output (6)-2

Setting
A2/3 A2/3 A2/3
BSZ ROW COL
[1:0] [1:0] [1:0]
10 (16 bits) 10 (13 bits) 10 (10 bits)
Output Pin of Row Address Column Address Synchronous
This LSI Output Output DRAM Pin Function
A17 A27 A17 Unused
A16 A26 A16
2
A15 A25* A25*2 A14 (BA1) Specifies bank
2 2
A14 A24* A24* A13 (BA0)
A13 A23 A13 A12 Address
A12 A22 A12 A11
1
A11 A21 L/H* A10/AP Specifies
address/precharge
A10 A20 A10 A9 Address
A9 A19 A9 A8
A8 A18 A8 A7
A7 A17 A7 A6
A6 A16 A6 A5
A5 A15 A5 A4
A4 A14 A4 A3
A3 A13 A3 A2
A2 A12 A2 A1
A1 A11 A1 A0
A0 A10 A0 Unused
Example of connected memory
512-Mbit product (8 Mwords x 16 bits x 4 banks, column 10 bits product): 1
Notes: 1. L/H is a bit used in the command specification; it is fixed at low or high according to the
access mode.
2. Bank address specification

Rev. 3.00 Jan. 18, 2008 Page 359 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

(3) Burst Read

A burst read occurs in the following cases with this LSI.

1. Access size in reading is larger than data bus width.


2. 16-byte transfer in cache miss.
3. 16-byte transfer in DMAC or USDH(access to non-cacheable area)
4. 16- to 128-byte transfer by LCDC*

This LSI always accesses the SDRAM with burst length 1. For example, read access of burst
length 1 is performed consecutively four times to read 16-byte continuous data from the SDRAM
that is connected to a 32-bit data bus.

Table 9.18 shows the relationship between the access size and the number of bursts.

Note: * For details, see section 26, LCD Controller (LCDC).

Table 9.18 Relationship between Access Size and Number of Bursts

Bus Width Access Size Number of Bursts


16 bits 8 bits 1
16 bits 1
32 bits 2
16 bytes 8
128 bytes 64
32 bits 8 bits 1
16 bits 1
32 bits 1
16 bytes 4
128 bytes 32

Figures 9.14 and 9.15 show a timing chart in burst read. In burst read, an ACTV command is
output in the Tr cycle, the READ command is issued in the Tc1, Tc2, and Tc3 cycles, the READA
command is issued in the Tc4 cycle, and the read data is received at the rising edge of the external
clock (CKIO) in the Td1 to Td4 cycles. The Tap cycle is used to wait for the completion of an
auto-precharge induced by the READ command in the SDRAM. In the Tap cycle, a new
command will not be issued to the same bank. However, access to another CS space or another
bank in the same SDRAM space is enabled. The number of Tap cycles is specified by the TRP1
and TRP0 bits in CS3WCR.

Rev. 3.00 Jan. 18, 2008 Page 360 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

In this LSI, wait cycles can be inserted by specifying each bit in CSnWCR to connect the SDRAM
in variable frequencies. Figure 9.15 shows an example in which wait cycles are inserted. The
number of cycles from the Tr cycle where the ACTV command is output to the Tc1 cycle where
the READA command is output can be specified using the TRCD1 and TRCD0 bits in CS3WCR.
If the TRCD1 and TRCD0 bits specify two cycles or more, a Trw cycle where the NOT command
is issued is inserted between the Tr cycle and Tc1 cycle. The number of cycles from the Tc1 cycle
where the READA command is output to the Td1 cycle where the read data is latched can be
specified for the CS2 and CS3 spaces independently, using the A2CL1 and A2CL0 bits in
CS2WCR or the A3CL1 and A3CL0 bits in CS3WCR and TRCD0 bit in CS3WCR. The number
of cycles from Tc1 to Td1 corresponds to the synchronous DRAM CAS latency. The CAS latency
for the synchronous DRAM is normally defined as up to three cycles. However, the CAS latency
in this LSI can be specified as 1 to 4 cycles. This CAS latency can be achieved by connecting a
latch circuit between this LSI and the synchronous DRAM.

Td1 Td2 Td3 Td4


Tr Tc1 Tc2 Tc3 Tc4 Tde Tap

CKIO

A25 to A0

A12/A11*1

CSn

RAS

CAS

RD/WR

DQMxx

D31 to D0

BS

DACKn*2

Notes: 1. Address pin to be connected to the A10 pin of SDRAM.


2. The waveform for DACKn is when active low is specified.

Figure 9.14 Burst Read Basic Timing (Auto-Precharge)

Rev. 3.00 Jan. 18, 2008 Page 361 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

Tw Td1 Td2 Td3 Td4


Tr Trw Tc1 Tc2 Tc3 Tc4 Tde Tap

CKIO

A25 to A0

A12/A11*1

CSn

RAS

CAS

RD/WR

DQMxx

D31 to D0

BS

DACKn*2

Notes: 1. Address pin to be connected to the A10 pin of SDRAM.


2. The waveform for DACKn is when active low is specified.

Figure 9.15 Burst Read Wait Specification Timing (Auto-Precharge)

Rev. 3.00 Jan. 18, 2008 Page 362 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

(4) Single Read

A read access ends in one cycle when data exists in non-cacheable region and the data bus width is
larger than or equal to access size. As the burst length is set to 1 in SDRAM burst read/single
write mode, only the required data is output. Consequently, no unnecessary bus cycles are
generated even when a cache-through area is accessed.

Figure 9.16 shows the single read basic timing.

Tr Tc1 Td1 Tde Tap

CKIO

A25 to A0

A12/A11*1

CSn

RAS

CAS

RD/WR

DQMxx

D31 to D0

BS

DACKn*2

Notes: 1. Address pin to be connected to the A10 pin of SDRAM.


2. The waveform for DACKn is when active low is specified.

Figure 9.16 Basic Timing for Single Read (Auto-Precharge)

Rev. 3.00 Jan. 18, 2008 Page 363 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

(5) Burst Write

A burst write occurs in the following cases in this LSI.

1. Access size in writing is larger than data bus width.


2. Copyback of the cache
3. 16-byte transfer in DMAC (access to non-cacheable region)

This LSI always accesses SDRAM with burst length 1. For example, write access of burst length 1
is performed continuously 4 times to write 16-byte continuous data to the SDRAM that is
connected to a 32-bit data bus. The relationship between the access size and the number of bursts
is shown in table 9.18.

Figure 9.17 shows a timing chart for burst writes. In burst write, an ACTV command is output in
the Tr cycle, the WRIT command is issued in the Tc1, Tc2, and Tc3 cycles, and the WRITA
command is issued to execute an auto-precharge in the Tc4 cycle. In the write cycle, the write data
is output simultaneously with the write command. After the write command with the auto-
precharge is output, the Trw1 cycle that waits for the auto-precharge initiation is followed by the
Tap cycle that waits for completion of the auto-precharge induced by the WRITA command in the
SDRAM. In the Tap cycle, a new command will not be issued to the same bank. However, access
to another CS space or another bank in the same SDRAM space is enabled. The number of Trw1
cycles is specified by the TRWL1 and TRWL0 bits in CS3WCR. The number of Tap cycles is
specified by the TRP1 and TRP0 bits in CS3WCR.

Rev. 3.00 Jan. 18, 2008 Page 364 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

Tr Tc1 Tc2 Tc3 Tc4 Trwl Tap

CKIO

A25 to A0

A12/A11*1

CSn

RAS

CAS

RD/WR

DQMxx

D31 to D0

BS

DACKn*2

Notes: 1. Address pin to be connected to the A10 pin of SDRAM.


2. The waveform for DACKn is when active low is specified.

Figure 9.17 Basic Timing for Burst Write (Auto-Precharge)

Rev. 3.00 Jan. 18, 2008 Page 365 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

(6) Single Write

A write access ends in one cycle when data is written in non-cacheable region and the data bus
width is larger than or equal to access size.

Figure 9.18 shows the single write basic timing.

Tr Tc1 Trwl Tap

CKIO

A25 to A0

A12/A11*1

CSn

RAS

CAS

RD/WR

DQMxx

D31 to D0

BS

DACKn*2

Notes: 1. Address pin to be connected to the A10 pin of SDRAM.


2. The waveform for DACKn is when active low is specified.

Figure 9.18 Basic Timing for Single Write (Auto-Precharge)

Rev. 3.00 Jan. 18, 2008 Page 366 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

(7) Bank Active

The SDRAM bank function is used to support high-speed accesses to the same row address. When
the BACTV bit in SDCR is 1, accesses are performed using commands without auto-precharge
(READ or WRIT). This function is called bank-active function. This function is valid only for
either the upper or lower bits of area 3. When area 3 is set to bank-active mode, area 2 should be
set to normal space or byte-selection SRAM. When areas 2 and 3 are both set to SDRAM, auto-
precharge mode must be set.

When a bank-active function is used, precharging is not performed when the access ends. When
accessing the same row address in the same bank, it is possible to issue the READ or WRIT
command immediately, without issuing an ACTV command. As SDRAM is internally divided
into several banks, it is possible to activate one row address in each bank. If the next access is to a
different row address, a PRE command is first issued to precharge the relevant bank, then when
precharging is completed, the access is performed by issuing an ACTV command followed by a
READ or WRIT command. If this is followed by an access to a different row address, the access
time will be longer because of the precharging performed after the access request is issued. The
number of cycles between issuance of the PRE command and the ACTV command is determined
by the TRP[1:0] bits in CSnWCR.

In a write, when an auto-precharge is performed, a command cannot be issued to the same bank
for a period of Trwl + Tap cycles after issuance of the WRITA command. When bank active mode
is used, READ or WRIT commands can be issued successively if the row address is the same. The
number of cycles can thus be reduced by Trwl + Tap cycles for each write.

There is a limit on tRAS, the time for placing each bank in the active state. If there is no guarantee
that there will not be a cache hit and another row address will be accessed within the period in
which this value is maintained by program execution, it is necessary to set auto-refresh and set the
refresh cycle to no more than the maximum value of tRAS.

A burst read cycle without auto-precharge is shown in figure 9.19, a burst read cycle for the same
row address in figure 9.20, and a burst read cycle for different row addresses in figure 9.21.
Similarly, a single write cycle without auto-precharge is shown in figure 9.22, a single write cycle
for the same row address in figure 9.23, and a single write cycle for different row addresses in
figure 9.24.

In figure 9.20, a Tnop cycle in which no operation is performed is inserted before the Tc cycle that
issues the READ command. The Tnop cycle is inserted to acquire two cycles of CAS latency for
the DQMxx signal that specifies the read byte in the data read from the SDRAM. If the CAS
latency is specified as two cycles or more, the Tnop cycle is not inserted because the two cycles of
latency can be acquired even if the DQMxx signal is asserted after the Tc cycle.

Rev. 3.00 Jan. 18, 2008 Page 367 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

When bank active mode is set, if only accesses to the respective banks in the area 3 space are
considered, as long as accesses to the same row address continue, the operation starts with the
cycle in figure 9.19 or 9.22, followed by repetition of the cycle in figure 9.20 or 9.23. An access to
a different area during this time has no effect. If there is an access to a different row address in the
bank active state, after this is detected the bus cycle in figure 9.21 or 9.24 is executed instead of
that in figure 9.20 or 9.23. In bank active mode, too, all banks become inactive after a refresh
cycle or after the bus is released as the result of bus arbitration.

Td1 Td2 Td3 Td4


Tr Tc1 Tc2 Tc3 Tc4 Tde

CKIO

A25 to A0

A12/A11*1

CSn

RAS

CAS

RD/WR

DQMxx

D31 to D0

BS

DACKn*2

Notes: 1. Address pin to be connected to the A10 pin of SDRAM.


2. The waveform for DACKn is when active low is specified.

Figure 9.19 Burst Read Timing (No Auto-Precharge)

Rev. 3.00 Jan. 18, 2008 Page 368 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

Td1 Td2 Td3 Td4


Tnop Tc1 Tc2 Tc3 Tc4 Tde

CKIO

A25 to A0

A12/A11*1

CSn

RAS

CAS

RD/WR

DQMxx

D31 to D0

BS

DACKn*2

Notes: 1. Address pin to be connected to the A10 pin of SDRAM.


2. The waveform for DACKn is when active low is specified.

Figure 9.20 Burst Read Timing (Bank Active, Same Row Address)

Rev. 3.00 Jan. 18, 2008 Page 369 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

Td1 Td2 Td3 Td4


Tp Tpw Tr Tc1 Tc2 Tc3 Tc4 Tde

CKIO

A25 to A0

A12/A11*1

CSn

RAS

CAS

RD/WR

DQMxx

D31 to D0

BS

DACKn*2

Notes: 1. Address pin to be connected to the A10 pin of SDRAM.


2. The waveform for DACKn is when active low is specified.

Figure 9.21 Burst Read Timing (Bank Active, Different Row Addresses)

Rev. 3.00 Jan. 18, 2008 Page 370 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

Tr Tc1

CKIO

A25 to A0

A12/A11*1

CSn

RAS

CAS

RD/WR

DQMxx

D31 to D0

BS

DACKn*2

Notes: 1. Address pin to be connected to the A10 pin of SDRAM.


2. The waveform for DACKn is when active low is specified.

Figure 9.22 Single Write Timing (No Auto-Precharge)

Rev. 3.00 Jan. 18, 2008 Page 371 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

Tnop Tc1

CKIO

A25 to A0

A12/A11*1

CSn

RAS

CAS

RD/WR

DQMxx

D31 to D0

BS

DACKn*2

Notes: 1. Address pin to be connected to the A10 pin of SDRAM.


2. The waveform for DACKn is when active low is specified.

Figure 9.23 Single Write Timing (Bank Active, Same Row Address)

Rev. 3.00 Jan. 18, 2008 Page 372 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

Tp Tpw Tr Tc1

CKIO

A25 to A0

A12/A11*1

CSn

RAS

CAS

RD/WR

DQMxx

D31 to D0

BS

DACKn*2

Notes: 1. Address pin to be connected to the A10 pin of SDRAM.


2. The waveform for DACKn is when active low is specified.

Figure 9.24 Single Write Timing (Bank Active, Different Row Addresses)

Rev. 3.00 Jan. 18, 2008 Page 373 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

(8) Refreshing

This LSI has a function for controlling SDRAM refreshing. Auto-refreshing can be performed by
clearing the RMODE bit to 0 and setting the RFSH bit to 1 in SDCR. A continuous refreshing can
be performed by setting the RRC[2:0] bits in RTCSR. If SDRAM is not accessed for a long
period, self-refresh mode, in which the power consumption for data retention is low, can be
activated by setting both the RMODE bit and the RFSH bit to 1.

(a) Auto-refreshing

Refreshing is performed at intervals determined by the input clock selected by bits CKS[2:0] in
RTCSR, and the value set by in RTCOR. The value of bits CKS[2:0] in RTCOR should be set so
as to satisfy the refresh interval stipulation for the SDRAM used. First make the settings for
RTCOR, RTCNT, and the RMODE and RFSH bits in SDCR, then make the CKS[2:0] and
RRC[2:0] settings. When the clock is selected by bits CKS[2:0], RTCNT starts counting up from
the value at that time. The RTCNT value is constantly compared with the RTCOR value, and if
the two values are the same, a refresh request is generated and an auto-refresh is performed for the
number of times specified by the RRC[2:0]. At the same time, RTCNT is cleared to 0 and the
count-up is restarted. Figure 9.25 shows the auto-refresh cycle timing.

After starting, the auto refreshing, PALL command is issued in the Tp cycle to make all the banks
to precharged state from active state when some bank is being precharged. Then REF command is
issued in the Trr cycle after inserting idle cycles of which number is specified by the TRP[1:0]bits
in CSnWCR. A new command is not issued for the duration of the number of cycles specified by
the TRC[1:0] bits in CSnWCR after the Trr cycle. The TRC[1:0] bits must be set so as to satisfy
the SDRAM refreshing cycle time stipulation (tRC). A NOP cycle is inserted between the Tp
cycle and Trr cycle when the setting value of the TRP[1:0] bits in CSnWCR is longer than or
equal to 2 cycles.

Rev. 3.00 Jan. 18, 2008 Page 374 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

Tp Tpw Trr Trc Trc Trc

CKIO

A25 to A0

A12/A11*1

CSn

RAS

CAS

RD/WR

DQMxx

D31 to D0 Hi-z

BS

DACKn*2

Notes: 1. Address pin to be connected to the A10 pin of SDRAM.


2. The waveform for DACKn is when active low is specified.

Figure 9.25 Auto-Refresh Timing

(b) Self-refreshing

Self-refresh mode in which the refresh timing and refresh addresses are generated within the
SDRAM. Self-refreshing is activated by setting both the RMODE bit and the RFSH bit in SDCR
to 1. After starting the self-refreshing, PALL command is issued in Tp cycle after the completion
of the pre-charging bank. A SELF command is then issued after inserting idle cycles of which
number is specified by the TRP[1:0] bits in CSnWSR. SDRAM cannot be accessed while in the
self-refresh state. Self-refresh mode is cleared by clearing the RMODE bit to 0. After self-refresh
mode has been cleared, command issuance is disabled for the number of cycles specified by the
TRC[1:0] bits in CSnWCR.

Self-refresh timing is shown in figure 9.26. Settings must be made so that self-refresh clearing and
data retention are performed correctly, and auto-refreshing is performed at the correct intervals.
When self-refreshing is activated from the state in which auto-refreshing is set, or when exiting
standby mode other than through a power-on reset, auto-refreshing is restarted if the RFSH bit is
set to 1 and the RMODE bit is cleared to 0 when self-refresh mode is cleared. If the transition
from clearing of self-refresh mode to the start of auto-refreshing takes time, this time should be

Rev. 3.00 Jan. 18, 2008 Page 375 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

taken into consideration when setting the initial value of RTCNT. Making the RTCNT value 1 less
than the RTCOR value will enable refreshing to be started immediately.

After self-refreshing has been set, the self-refresh state continues even if the chip standby state is
entered using the LSI standby function, and is maintained even after recovery from standby mode
by an interrupt.

The self-refresh state is not cleared by a manual reset.

In case of a power-on reset, the bus state controller's registers are initialized, and therefore the
self-refresh state is cleared.

Tp Tpw Trr Trc Trc Trc Trc Trc

CKIO

CKE

A25 to A0

A12/A11*1

CSn

RAS

CAS

RD/WR

DQMxx

D31 to D0 Hi-z

BS

DACKn*2

Notes: 1. Address pin to be connected to the A10 pin of SDRAM.


2. The waveform for DACKn is when active low is specified.

Figure 9.26 Self-Refresh Timing

Rev. 3.00 Jan. 18, 2008 Page 376 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

(9) Relationship between Refresh Requests and Bus Cycles

If a refresh request occurs during bus cycle execution, the refresh cycle must wait for the bus cycle
to be completed. If a refresh request occurs while the bus is released by the bus arbitration
function, the refresh will not be executed until the bus mastership is acquired. This LSI supports
requests by the REFOUT pin for the bus mastership while waiting for the refresh request. The
REFOUT pin is asserted low until the bus mastership is acquired.

If a new refresh request occurs while waiting for the previous refresh request, the previous refresh
request is deleted. To refresh correctly, a bus cycle longer than the refresh interval or the bus
mastership occupation must be prevented from occurring.

If a bus mastership is requested during self-refresh, the bus will not be released until the self-
refresh is completed.

Rev. 3.00 Jan. 18, 2008 Page 377 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

(10) Power-Down Mode

If the PDOWN bit in SDCR is set to 1, the SDRAM is placed in the power-down mode by
bringing the CKE signal to the low level in the non-access cycle. This power-down mode can
effectively lower the power consumption in the non-access cycle. However, please note that if an
access occurs in power-down mode, a cycle of overhead occurs because a cycle that asserts the
CKE in order to cancel power-down mode is inserted.

Figure 9.27 shows the access timing in power-down mode.

Power-down Tnop Tr Tc1 Td1 Tde Tap Power-down

CKIO

CKE

A25 to A0

A12/A11*1

CSn

RAS

CAS

RD/WR

DQMxx

D31 to D0

BS

DACKn*2

Notes: 1. Address pin to be connected to the A10 pin of SDRAM.


2. The waveform for DACKn is when active low is specified.

Figure 9.27 Access Timing in Power-Down Mode

Rev. 3.00 Jan. 18, 2008 Page 378 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

(11) Power-On Sequence

In order to use SDRAM, mode setting must first be performed after powering on. To perform
SDRAM initialization correctly, the bus state controller registers must first be set, followed by a
write to the SDRAM mode register. In SDRAM mode register setting, the address signal value at
that time is latched by a combination of the CSn, RAS, CAS, and RD/WR signals. If the value to
be set is X, the bus state controller provides for value X to be written to the SDRAM mode
register by performing a write to address H'A4FD4000 + X for area 2 SDRAM, and to address
H'A4FD5000 + X for area 3 SDRAM. In this operation the data is ignored, but the mode write is
performed as a byte-size access. To set burst read/single write, CAS latency 2 to 3, wrap type =
sequential, and burst length 1 supported by the LSI, arbitrary data is written in a byte-size access
to the addresses shown in table 9.19. In this time 0 is output at the external address pins of A12 or
later.

Rev. 3.00 Jan. 18, 2008 Page 379 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

Table 9.19 Access Address in SDRAM Mode Register Write

• Setting for Area 2 (SDMR2)


Burst read/single write (burst length 1):
Data Bus Width CAS Latency Access Address External Address Pin
16 bits 2 H'A4FD4440 H'0000440
3 H'A4FD4460 H'0000460
32 bits 2 H'A4FD4880 H'0000880
3 H'A4FD48C0 H'00008C0

Burst read/burst write (burst length 1):


Data Bus Width CAS Latency Access Address External Address Pin
16 bits 2 H'A4FD4040 H'0000040
3 H'A4FD4060 H'0000060
32 bits 2 H'A4FD4080 H'0000080
3 H'A4FD40C0 H'00000C0

• Setting for Area 3 (SDMR3)


Burst read/single write (burst length 1):
Data Bus Width CAS Latency Access Address External Address Pin
16 bits 2 H'A4FD5440 H'0000440
3 H'A4FD5460 H'0000460
32 bits 2 H'A4FD5880 H'0000880
3 H'A4FD58C0 H'00008C0

Burst read/burst write (burst length 1):


Data Bus Width CAS Latency Access Address External Address Pin
16 bits 2 H'A4FD5040 H'0000040
3 H'A4FD5060 H'0000060
32 bits 2 H'A4FD5080 H'0000080
3 H'A4FD50C0 H'00000C0

Rev. 3.00 Jan. 18, 2008 Page 380 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

Mode register setting timing is shown in figure 9.28. A PALL command (all bank precharge
command) is firstly issued. A REF command (auto-refresh command) is then issued 8 times. An
MRS command (mode register write command) is finally issued. Idle cycles, of which number is
specified by the TRP[1:0] bits in CSnWCR, are inserted between the PALL and the first REF. Idle
cycles, of which number is specified by the TRC[1:0]bits in CSnWCR, are inserted between REF
and REF, and between the 8th REF and MRS. Idle cycles, of which number is one or more, are
inserted between the MRS and a command to be issued next.

It is necessary to keep idle time of certain cycles for SDRAM before issuing PALL command after
power-on. Refer the manual of the SDRAM for the idle time to be needed. When the pulse width
of the reset signal is longer then the idle time, mode register setting can be started immediately
after the reset, but care should be taken when the pulse width of the reset signal is shorter than the
idle time.

Tp Tpw Trr Trc Trc Trr Trc Trc Tmw Tnop


PALL REF REF MRS

CKIO

A25 to A0

A12/A11*1

CSn

RAS

CAS

RD/WR

DQMxx

D31 to D0 Hi-Z

BS

DACKn*2

Notes: 1. Address pin to be connected to the A10 pin of SDRAM.


2. The waveform for DACKn is when active low is specified.

Figure 9.28 Write Timing for SDRAM Mode Register (Based on JEDEC)

Rev. 3.00 Jan. 18, 2008 Page 381 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

(12) Low-Power SDRAM

The low-power SDRAM can be accessed using the same protocol as the normal SDRAM. The
differences between the low-power SDRAM and normal SDRAM are that partial refresh takes
place that puts only a part of the SDRAM in the self-refresh state during the self-refresh function,
and that power consumption is low during refresh under user conditions such as the operating
temperature. The partial refresh is effective in systems in which data in a work area other than the
specific area can be lost without severe repercussions. For details, refer to the data sheet for the
low-power SDRAM to be used.

The low-power SDRAM supports the extension mode register (EMRS) in addition to the mode
registers as the normal SDRAM. This LSI supports issuing of the EMRS command.

The EMRS command is issued according to the conditions specified in table 9.20. For example, if
data H'0YYYYYYY is written to address H'A4FD5XXX in long-word, the commands are issued
to the CS3 space in the following sequence: PALL -> REF × 8 -> MRS -> EMRS. In this case, the
MRS and EMRS issue addresses are H'0000XXX and H'YYYYYYY, respectively. If data
H'1YYYYYYY is written to address H'A4FD5XXX in long-word, the commands are issued to the
CS3 space in the following sequence: PALL -> MRS -> EMRS.

Rev. 3.00 Jan. 18, 2008 Page 382 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

Table 9.20 Output Addresses when EMRS Command is Issued

EMRS
Command to Access Write MRS Command Command Issue
be Issued Address Access Data Access Size Issue Address Address
CS2 MRS H'A4FD4XXX H'******** 16 bits H'0000XXX 
CS3 MRS H'A4FD5XXX H'******** 16 bits H'0000XXX 
CS2MRS H'A4FD4XXX H'0YYYYYYY 32 bits H'0000XXX H'YYYYYYY
+EMRS
(with refresh)
CS3 MRS H'A4FD5XXX H'0YYYYYYY 32 bits H'0000XXX H'YYYYYYY
+EMRS
(with refresh)
CS2 MRS H'A4FD4XXX H'1YYYYYYY 32 bits H'0000XXX H'YYYYYYY
+EMRS
(without
refresh)
CS3 MRS H'A4FD5XXX H'1YYYYYYY 32 bits H'0000XXX H'YYYYYYY
+EMRS
(without
refresh)

Rev. 3.00 Jan. 18, 2008 Page 383 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

Tp Tpw Trr Trc Trc Trr Trc Trc Tmw Tnop Temw Tnop
PALL REF REF MRS EMRS

CKIO

A25 to A0

BA1*1

BA0*2

A12/A11*3

CSn

RAS

CAS

RD/WR

DQMxx

D31 to D0 Hi-Z

BS

DACKn*4

Notes: 1. Address pin to be connected to the BA1 pin of SDRAM.


2. Address pin to be connected to the BA0 pin of SDRAM.
3. Address pin to be connected to the A10 pin of SDRAM.
4. The waveform for DACKn is when active low is specified.

Figure 9.29 EMRS Command Issue Timing

• Deep power-down mode


The low-power SDRAM supports the deep power-down mode as a low-power consumption
mode. In the partial self-refresh function, self-refresh is performed on a specific area. In the
deep power-down mode, self-refresh will not be performed on any memory area. This mode is
effective in systems where all of the system memory areas are used as work areas.

If the RMODE bit of the SDCR is set to 1 while the DEEP and RFSH bits of the SDCR are set to
1, the low-power SDRAM enters the deep power-down mode. If the RMODE bit is cleared to 0,
the CKE signal is pulled high to cancel the deep power-down mode. Before executing an access
after returning from the deep power-down mode, the power-up sequence must be re-executed.

Rev. 3.00 Jan. 18, 2008 Page 384 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

Tp Tpw Tdpd Trc Trc Trc Trc Trc

CKIO

CKE

A25 to A0

A12/A11*1

CSn

RAS

CAS

RD/WR

DQMxx

D31 to D0 Hi-Z

BS

DACKn*2

Notes: 1. Address pin to be connected to the A10 pin of SDRAM.


2. The waveform for DACKn is when active low is specified.

Figure 9.30 Transition Timing in Deep Power-Down Mode

9.5.6 Burst ROM (Clock Asynchronous) Interface

The burst ROM (clock asynchronous) interface is used to access a memory with a high-speed read
function using a method of address switching called the burst mode or page mode. In a burst ROM
(clock asynchronous) interface, basically the same access as the normal space is performed, but
the 2nd and subsequent accesses are performed only by changing the address, without negating the
RD signal at the end of the 1st cycle. In the 2nd and subsequent accesses, addresses are changed at
the falling edge of the CKIO.

For the 1st access cycle, the number of wait cycles specified by the W[3:0] bits in CSnWCR is
inserted. For the 2nd and subsequent access cycles, the number of wait cycles specified by the
BW[1:0] bits in CSnWCR is inserted.

In the access to the burst ROM (clock asynchronous), the BS signal is asserted only to the first
access cycle. An external wait input is valid only to the first access cycle.

In the single access or write access that do not perform the burst operation in the burst ROM
(clock asynchronous) interface, access timing is same as a normal space.

Rev. 3.00 Jan. 18, 2008 Page 385 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

Table 9.21 lists a relationship between bus width, access size, and the number of bursts. Figure
9.31 shows a timing chart.

Table 9.21 Relationship between Bus Width, Access Size, and Number of Bursts

Number of Number of
Bus Width BEN Bit Access Size Bursts Accesses
8 bits Not affected 8 bits 1 1
Not affected 16 bits 2 1
Not affected 32 bits 4 1
0 16 bytes 16 1
1 4 4
16 bits Not affected 8 bits 1 1
Not affected 16 bits 1 1
Not affected 32 bits 2 1
0 16 bytes 8 1
1 2 4
32 bits Not affected 8 bits 1 1
Not affected 16 bits 1 1
Not affected 32 bits 1 1
Not affected 16 bytes 4 1

Rev. 3.00 Jan. 18, 2008 Page 386 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

T1 Tw Tw TB2 Twb TB2 Twb TB2 Twb T2

CKIO

Address

CS

RD/WR

RD

Data

WAIT

BS

DACK

Figure 9.31 Burst ROM (Clock Asynchronous) Access (Bus Width = 32 Bits,
16-byte Transfer (Number of Bursts = 4), Access Wait for First Time = 2,
Access Wait for 2nd Time and after = 1)

9.5.7 Byte-Selection SRAM Interface

The byte-selection SRAM interface is for access to an SRAM which has a byte-selection pin
(WEn (BEn)). This interface has 16-bit data pins and accesses SRAMs having upper and lower
byte selection pins, such as UB and LB.

When the BAS bit in CSnWCR is cleared to 0 (initial value), the write access timing of the byte-
selection SRAM interface is the same as that for the normal space interface. While in read access
of a byte-selection SRAM interface, the byte-selection signal is output from the WEn (BEn) pin,
which is different from that for the normal space interface. The basic access timing is shown in
figure 9.32. In write access, data is written to the memory according to the timing of the byte-
selection pin (WEn (BEn)). For details, refer to the data sheet for the corresponding memory.

If the BAS bit in CSnWCR is set to 1, the WEn (BEn) pin and RD/WR pin timings change. Figure
9.33 shows the basic access timing. In write access, data is written to the memory according to the
timing of the write enable pin (RD/WR). The data hold timing from RD/WR negation to data write
must be acquired by setting the HW[1:0] bits in CSnWCR. Figure 9.34 shows the access timing
when a software wait is specified.

Rev. 3.00 Jan. 18, 2008 Page 387 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

T1 T2

CKIO

A25 to A0

CSn

WEn(BEn)

RD/WR

Read RD

D31 to D0

RD/WR

High
Write RD

D31 to D0

BS

DACKn*

Note: The waveform for DACKn is when active low is specified.

Figure 9.32 Basic Access Timing for Byte-Selection SRAM (BAS = 0)

Rev. 3.00 Jan. 18, 2008 Page 388 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

T1 T2

CKIO

A25 to A0

CSn

WEn(BEn)

RD/WR

Read RD

D31 to D0

RD/WR

High
Write
RD

D31 to D0

BS

DACKn*

Note: The waveform for DACKn is when active low is specified.

Figure 9.33 Basic Access Timing for Byte-Selection SRAM (BAS = 1)

Rev. 3.00 Jan. 18, 2008 Page 389 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

Th T1 Tw T2 Tf

CKIO

A25 to A0

CSn

WEn(BEn)

RD/WR

Read RD

D31 to D0

RD/WR

High
Write RD

D31 to D0

BS

DACKn*

Note: The waveform for DACKn is when active low is specified.

Figure 9.34 Wait Timing for Byte-Selection SRAM (BAS = 1) (Software Wait Only)

Rev. 3.00 Jan. 18, 2008 Page 390 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

64 k x 16 bits
This LSI SRAM

A17 A15

...

...
A2 A0
CSn CS
RD OE
RD/WR WE
D31
... I/O15

...
D16 I/O0
WE3(BE3) UB
WE2(BE2) LB
D15
...

A15

...
D0
WE1(BE1) A0
WE0(BE0) CS
OE
WE
I/O15

...
I/O0
UB
LB

Figure 9.35 Example of Connection with 32-Bit Data-Width Byte-Selection SRAM

64Kx16bit
This LSI SRAM
A16 A15

A1 A0
CSn CS
RD OE
RD/WR WE
D15 I/O 15

D0 I/O 0
WE1(BE1) UB
WE0(BE0) LB

Figure 9.36 Example of Connection with 16-Bit Data-Width Byte-Selection SRAM

Rev. 3.00 Jan. 18, 2008 Page 391 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

9.5.8 PCMCIA Interface

With this LSI, if address map (2) is selected using the MAP bit in CMNCR, the PCMCIA
interface can be specified in areas 5 and 6. Areas 5 and 6 in the physical space can be used for the
IC memory card and I/O card interface defined in the JEIDA specifications version 4.2
(PCMCIA2.1 Rev. 2.1) by specifying the TYPE[3:0] bits of CSnBCR (n = 5B, 6B) to B'0101. In
addition, the SA[1:0] bits of CSnWCR (n = 5B, 6B) assign the upper or lower 32 Mbytes of each
area to an IC memory card or I/O card interface. For example, if the SA1 and SA0 bits of the
CS5BWCR are set to 1 and cleared to 0, respectively, the upper 32 Mbytes and the lower 32
Mbytes of area 5B are used as an IC memory card interface and I/O card interface, respectively.

When the PCMCIA interface is used, the bus size must be specified as 8 bits or 16 bits using the
BSZ[1:0] bits in CS5BBCR or CS6BBCR.

Figure 9.37 shows an example of a connection between this LSI and the PCMCIA card. To enable
insertion and removal of the PCMCIA card during system power-on, a three-state buffer must be
connected between the LSI and the PCMCIA card.

In the JEIDA and PCMCIA standards, operation in the big endian mode is not clearly defined.
Consequently, an original definition is provided for the PCMCIA interface in big endian mode in
this LSI.

Rev. 3.00 Jan. 18, 2008 Page 392 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

PC card
This LSI (memory I/O)

A25 to A0 G
A25 to A0
D7 to D0
D15 to D8 D7 to D0
RD/WR
CE1A G
DIR
CE2A
D15 to D8

G
DIR
CE1
CE2
RD OE
WE WE/PGM
ICIORD IORD
ICIOWR IOWR
I/O Port REG
G

WAIT WAIT
IOIS16 IOIS16

Card
detection CD1,CD2
circuit

Figure 9.37 Example of PCMCIA Interface Connection

Rev. 3.00 Jan. 18, 2008 Page 393 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

(1) Basic Timing for Memory Card Interface

Figure 9.38 shows the basic timing of the PCMCIA IC memory card interface. If areas 5 and 6 in
the physical space are specified as the PCMCIA interface, accessing the common memory areas in
areas 5 and 6 automatically accesses the IC memory card interface. If the external bus frequency
(CKIO) increases, the setup times and hold times for the address pins (A25 to A0) to RD and WE,
card enable signals (CE1A, CE2A, CE1B, CE2B), and write data (D15 to D0) become
insufficient. To prevent this error, the LSI can specify the setup times and hold times for areas 5
and 6 in the physical space independently, using CS5BWCR and CS6BWCR. In the PCMCIA
interface, as in the normal space interface, a software wait or hardware wait can be inserted using
the WAIT pin. Figure 9.39 shows the PCMCIA memory bus wait timing.

Tpcm1 Tpcm1w Tpcm1w Tpcm1w Tpcm2

CKIO

A25 to A0

CExx

RD/WR

RD

Read
D15 to D0

WE

Write

D15 to D0

BS

Figure 9.38 Basic Access Timing for PCMCIA Memory Card Interface

Rev. 3.00 Jan. 18, 2008 Page 394 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

Tpcm0 Tpcm0w Tpcm1 Tpcm1w Tpcm1w Tpcm1w Tpcm1w Tpcm2 Tpcm2w

CKIO

A25 to A0

CExx

RD/WR

RD
Read
D15 to D0

WE
Write
D15 to D0

BS

WAIT

Figure 9.39 Wait Timing for PCMCIA Memory Card Interface


(TED[3:0] = B'0010, TEH[3:0] = B'0001, Software Wait = 1, Hardware Wait = 1)

If all 32 Mbytes of the memory space are used as an IC memory card interface, the REG signal
that switches between the common memory and attribute memory can be generated by an I/O port.
If the memory space used for the IC memory card interface is 16 Mbytes or less, the A24 pin can
be used as the REG signal by using the memory space as a 16-Mbyte common memory space and
a 16-Mbyte attribute memory space.

Rev. 3.00 Jan. 18, 2008 Page 395 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

PCMCIA interface area is 32 Mbytes (An I/O port is used as the REG)

Area 5 : H'14000000
Attribute memory/common memory
Area 5 : H'16000000
I/O space
Area 6 : H'18000000
Attribute memory/common memory
Area 6 : H'1A000000
I/O space

PCMCIA interface area is 16 Mbytes (A24 is used as the REG)

Area 5 : H'14000000
Attribute memory
Area 5 : H'15000000
Common memory
Area 5 : H'16000000
I/O space
H'17000000
Area 6 : H'18000000
Attribute memory
Area 6 : H'19000000
Common memory
Area 6 : H'1A000000
I/O space
H'1B000000

Figure 9.40 Example of PCMCIA Space Assignment (CS5BWCR.SA[1:0] = B'10,


CS6BWCR.SA[1:0] = B'10)

Rev. 3.00 Jan. 18, 2008 Page 396 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

(2) Basic Timing for I/O Card Interface

Figures 9.41 and 9.42 show the basic timings for the PCMCIA I/O card interface.

The I/O card and IC memory card interfaces can be switched using an address to be accessed. If
area 5 of the physical space is specified as the PCMCIA, the I/O card interface can automatically
be accessed by accessing the physical addresses from H'16000000 to H'17FFFFFF. If area 6 of the
physical space is specified as the PCMCIA, the I/O card interface can automatically be accessed
by accessing the physical addresses from H'1A000000 to H'1BFFFFFF.

Note that areas to be accessed as the PCMCIA I/O card must be non-cached if they are virtual
space (space P2 or P3) areas, or a non-cached area specified by the MMU.

If the PCMCIA card is accessed as an I/O card in little endian mode, dynamic bus sizing for the
I/O bus can be achieved using the IOIS16 signal. If the IOIS16 signal is brought high in a word-
size I/O bus cycle while the bus width of area 6 is specified as 16 bits, the bus width is recognized
as 8 bits and data is accessed twice in 8-bit units in the I/O bus cycle to be executed.

The IOIS16 signal is sampled at the falling edge of CKIO in the Tpci0, Tpci0w, and Tpci1 cycles
when the TED[3:0] bits are specified as 1.5 cycles or more, and is reflected in the CE2 signal 1.5
cycles after the CKIO sampling point. The TED[3:0] bits must be specified appropriately to satisfy
the setup time from ICIORD and ICIOWR of the PC card to CEn.

Figure 9.43 shows the dynamic bus sizing basic timing.

Note that the IOIS16 signal is not supported in big endian mode. In the big endian mode, the
IOIS16 signal must be fixed low.

Rev. 3.00 Jan. 18, 2008 Page 397 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

Tpci1 Tpci1w Tpci1w Tpci1w Tpci2

CKIO

A25 to A0

CExx

RD/WR

ICIORD
Read
D15 to D0

ICIOWR
Write

D15 to D0

BS

Figure 9.41 Basic Timing for PCMCIA I/O Card Interface

Rev. 3.00 Jan. 18, 2008 Page 398 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

Tpci0 Tpci0w Tpci1 Tpci1w Tpci1w Tpci1w Tpci1w Tpci2 Tpci2w

CKIO

A25 to A0

CExx

RD/WR

ICIORD
Read
D15 to D0

ICIOWR
Write
D15 to D0

BS

WAIT

IOIS16

Figure 9.42 Wait Timing for PCMCIA I/O Card Interface


(TED[3:0] = B'0010, TEH[3:0] = B'0001, Software Wait = 1, Hardware Wait = 1)

Tpci0 Tpci0w Tpci1 Tpci1w Tpci1w Tpci1w Tpci1w Tpci2 Tpci2w Tpci0 Tpci0w Tpci1 Tpci1w Tpci1w Tpci1w Tpci1w Tpci2 Tpci2w

CKIO

A25 to A0

CE1x

CE2x

RD/WR

ICIORD
Read
D15 to D0

ICIOWR
Write
D15 to D0

BS

WAIT

IOIS16

Figure 9.43 Timing for Dynamic Bus Sizing of PCMCIA I/O Card Interface
(TED[3:0] = B'0010, TEH[3:0] = B'0001, Software Waits = 3)

Rev. 3.00 Jan. 18, 2008 Page 399 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

9.5.9 Burst ROM (Clock Synchronous) Interface

The burst ROM (clock synchronous) interface is supported to access a ROM with a synchronous
burst function at high speed. The burst ROM interface accesses the burst ROM in the same way as
a normal space. This interface is valid only for area 0.

In the first access cycle, wait cycles are inserted. In this case, the number of wait cycles to be
inserted is specified by the W[3:0] bits of the CS0WCR. In the second and subsequent cycles, the
number of wait cycles to be inserted is specified by the BW[1:0] bits of the CS0WCR.

While the burst ROM is accessed (clock synchronous), the BS signal is asserted only for the first
access cycle and an external wait input is also valid for the first access cycle.

If the bus width is 16 bits, the burst length must be specified as 8. If the bus width is 32 bits, the
burst length must be specified as 4. The burst ROM interface does not support the 8-bit bus width
for the burst ROM. The burst ROM interface performs burst operations for all read accesses. For
example, in a longword access over a 16-bit bus, valid 16-bit data is read two times and invalid
16-bit data is read six times.

These invalid data read cycles increase the memory access time and degrade the program
execution speed and DMA transfer speed. To prevent this problem, a 16-byte read by cache fill or
16-byte read by the DMA should be used. The burst ROM interface performs write accesses in the
same way as normal space access.

T1 Tw Tw T2B Twb T2B Twb T2B Twb T2B Twb T2B Twb T2B Twb T2B Twb T2

CKIO

Address

CSn

RD/WR

RD

D15 to D0

WAIT

BS

DACKn*

Note: The waveform for DACKn is when active low is specified.

Figure 9.44 Burst ROM (Clock Synchronous) Access Timing


(Burst Length = 8, Wait Cycles inserted in First Access = 2,
Wait Cycles inserted in Second and Subsequent Accesses = 1)

Rev. 3.00 Jan. 18, 2008 Page 400 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

9.5.10 Wait between Access Cycles

As the operating frequency of LSIs becomes higher, the off-operation of the data buffer often
collides with the next data access when the read operation from devices with slow access speed is
completed. As a result of these collisions, the reliability of the device is low and malfunctions may
occur. This LSI has a function that avoids data collisions by inserting wait cycles between
continuous access cycles.

The number of wait cycles between access cycles can be set by bits IWW[2:0], IWRWD[2:0],
IWRWS[2:0], IWRRD[2:0], and IWRRS[2:0] in CSnBCR, and bits DMAIW[2:0] and DMAIWA
in CMNCR. The conditions for setting the wait cycles between access cycles (idle cycles) are
shown below.

1. Continuous accesses are write-read or write-write


2. Continuous accesses are read-write for different spaces
3. Continuous accesses are read-write for the same space
4. Continuous accesses are read-read for different spaces
5. Continuous accesses are read-read for the same space
6. Data output from an external device caused by DMA single transfer is followed by data output
from another device that includes this LSI (DMAIWA = 0)
7. Data output from an external device caused by DMA single transfer is followed by any type of
access (DMAIWA = 1)

9.5.11 Bus Arbitration

To prevent device malfunction while the bus mastership is transferred between master and slave,
the LSI negates all of the bus control signals before bus release. When the bus mastership is
received, all of the bus control signals are first negated and then driven appropriately. In this case,
output buffer contention can be prevented because the master and slave drive the same signals
with the same values. In addition, to prevent noise while the bus control signal is in the high
impedance state, pull-up resistors must be connected to these control signals.

Bus mastership is transferred at the boundary of bus cycles. Namely, bus mastership is released
immediately after receiving a bus request when a bus cycle is not being performed. The release of
bus mastership is delayed until the bus cycle is complete when a bus cycle is in progress. Even
when from outside the LSI it looks like a bus cycle is not being performed, a bus cycle may be
performing internally, started by inserting wait cycles between access cycles. Therefore, it cannot
be immediately determined whether or not bus mastership has been released by looking at the CSn

Rev. 3.00 Jan. 18, 2008 Page 401 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

signal or other bus control signals. The states that do not allow bus mastership release are shown
below.

1. 16-byte transfer because of a cache miss


2. During copyback operation for the cache
3. Between the read and write cycles of a TAS instruction
4. Multiple bus cycles generated when the data bus width is smaller than the access size (for
example, between bus cycles when longword access is made to a memory with a data bus
width of 8 bits)
5. 16-byte transfer by the DMAC or USBH
6. Setting the BLOCK bit in CMNCR to 1
7. 16 to 128-byte transfer by LCDC
8. Transfer by USBH

Bits DPRTY[1:0] in CMNCR can select whether or not the bus request is received during DMAC
burst transfer.

This LSI has the bus mastership until a bus request is received from another device. Upon
acknowledging the assertion (low level) of the external bus request signal BREQ, the LSI releases
the bus at the completion of the current bus cycle and asserts the BACK signal. After the LSI
acknowledges the negation (high level) of the BREQ signal that indicates the slave has released
the bus, it negates the BACK signal and resumes the bus usage.

The SDRAM issues an all bank precharge command (PALL) when active banks exist and releases
the bus after completion of a PALL command.

The bus sequence is as follows. The address bus and data bus are placed in a high-impedance state
synchronized with the rising edge of CKIO. The bus mastership enable signal is asserted 0.5
cycles after the above timing, synchronized with the falling edge of CKIO. The bus control signals
(BS, CSn, RAS, CAS, DQMxx, WEn (BEn), RD, and RD/WR) are placed in the high-impedance
state at subsequent rising edges of CKIO. Bus request signals are sampled at the falling edge of
CKIO.

The sequence for reclaiming the bus mastership from a slave is described below. 1.5 cycles after
the negation of BREQ is detected at the falling edge of CKIO, the bus control signals are driven
high. The BACK is negated at the next falling edge of the clock. The fastest timing at which actual
bus cycles can be resumed after bus control signal assertion is at the rising edge of the CKIO
where address and data signals are driven. Figure 9.45 shows the bus arbitration timing.

In an original slave device designed by the user, multiple bus accesses are generated continuously
to reduce the overhead caused by bus arbitration. In this case, to execute SDRAM refresh

Rev. 3.00 Jan. 18, 2008 Page 402 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

correctly, the slave device must be designed to release the bus mastership within the refresh
interval time. To achieve this, the LSI instructs the REFOUT pin to request the bus mastership
while the SDRAM waits for the refresh. The LSI asserts the REFOUT pin until the bus mastership
is received. If the slave releases the bus, the LSI acquires the bus mastership to execute the
SDRAM refresh.

The bus release by the BREQ and BACK signal handshaking requires some overhead. If the slave
has many tasks, multiple bus cycles should be executed in a bus mastership acquisition. Reducing
the cycles required for master to slave bus mastership transitions streamlines the system design.

CKIO

BREQ

BACK

A25 to A0
D31 to D0
CSn
Other bus
control signals

Figure 9.45 Bus Arbitration Timing

Rev. 3.00 Jan. 18, 2008 Page 403 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

9.6 Usage Notes


(1) Reset

The bus state controller (BSC) can be initialized completely only at power-on reset. At power-on
reset, all signals are negated and output buffers are turned off regardless of the bus cycle state. All
control registers are initialized. In standby, sleep, and manual reset, control registers of the bus
state controller are not initialized. At manual reset, the current bus cycle being executed is
completed and then the access wait state is entered. If a 16-byte transfer is performed by a cache
or if another LSI on-chip bus master module is executed when a manual reset occurs, the current
access is cancelled in longword units because the access request is cancelled by the bus master at
manual reset. If a manual reset is requested during cache fill operations, the contents of the cache
cannot be guaranteed. Since the RTCNT continues counting up during manual reset signal
assertion, a refresh request occurs to initiate the refresh cycle. In addition, a bus arbitration request
by the BREQ signal can be accepted during manual reset signal assertion.

Some flash memories may specify a minimum time from reset release to the first access. To
ensure this minimum time, the bus state controller supports a 5-bit counter (RWTCNT). At power-
on reset, the RWTCNT is cleared to 0. After power-on reset, RWTCNT is counted up
synchronously together with CKIO and an external access will not be generated until RWTCNT is
counted up to H′001F. At manual reset, RWTCNT is not cleared.

(2) Access from the Site of the LSI Internal Bus Master

There are three types of LSI internal buses: a cache bus, internal bus, and peripheral bus. The CPU
and cache memory are connected to the cache bus. Internal bus masters other than the CPU and
bus state controller are connected to the internal bus. Low-speed peripheral modules are connected
to the peripheral bus. Internal memories other than the cache memory and debugging modules
such as a UBC and AUD are connected bidirectionally to the cache bus and internal bus. Access
from the cache bus to the internal bus is enabled but access from the internal bus to the cache bus
is disabled. This gives rise to the following problems.

Internal bus masters such as DMAC other than the CPU can access on-chip memory other than the
cache memory but cannot access the cache memory. If an on-chip bus master other than the CPU
writes data to an external memory other than the cache, the contents of the external memory may
differ from that of the cache memory. To prevent this problem, if the external memory whose
contents is cached is written by an on-chip bus master other than the CPU, the corresponding
cache memory should be purged by software.

If the CPU initiates read access for the cache, the cache is searched. If the cache stores data, the
CPU latches the data and completes the read access. If the cache does not store data, the CPU

Rev. 3.00 Jan. 18, 2008 Page 404 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

performs four contiguous longword read cycles to perform cache fill operations via the internal
bus. If a cache miss occurs in byte or word operand access or at a branch to an odd word boundary
(4n + 2), the CPU performs four contiguous longword accesses to perform a cache fill operation
on the external interface. For a cache-through area, the CPU performs access according to the
actual access addresses. For an instruction fetch to an even word boundary (4n), the CPU performs
longword access. For an instruction fetch to an odd word boundary (4n + 2), the CPU performs
word access.

For a read cycle of a cache-through area or an on-chip peripheral module, the read cycle is first
accepted and then read cycle is initiated. The read data is sent to the CPU via the cache bus.

In a write cycle for the cache area, the write cycle operation differs according to the cache write
methods.

In write-back mode, the cache is first searched. If data is detected at the address corresponding to
the cache, the data is then re-written to the cache. In the actual memory, data will not be re-written
until data in the corresponding address is re-written. If data is not detected at the address
corresponding to the cache, the cache is modified. In this case, data to be modified is first saved to
the internal buffer, 16-byte data including the data corresponding to the address is then read, and
data in the corresponding access of the cache is finally modified. Following these operations, a
write-back cycle for the saved 16-byte data is executed.

In write-through mode, the cache is first searched. If data is detected at the address corresponding
to the cache, the data is re-written to the cache simultaneously with the actual write via the internal
bus. If data is not detected at the address corresponding to the cache, the cache is not modified but
an actual write is performed via the internal bus.

Since the bus state controller (BSC) incorporates a one-stage write buffer, the BSC can execute an
access via the internal bus before the previous external bus cycle is completed in a write cycle. If
the on-chip module is read or written after the external low-speed memory is written, the on-chip
module can be accessed before the completion of the external low-speed memory write cycle.

In read cycles, the CPU is placed in the wait state until read operation has been completed. To
continue the process after the data write to the device has been completed, perform a dummy read
to the same address to check for completion of the write before the next process to be executed.

The write buffer of the BSC functions in the same way for an access by a bus master other than the
CPU such as the DMAC. Accordingly, to perform dual address DMA transfers, the next read cycle
is initiated before the previous write cycle is completed. Note, however, that if both the DMA
source and destination addresses exist in external memory space, the next write cycle will not be
initiated until the previous write cycle is completed.

Rev. 3.00 Jan. 18, 2008 Page 405 of 1458


REJ09B0033-0300
Section 9 Bus State Controller (BSC)

(3) On-Chip Peripheral Module Access

To access an on-chip module register, two or more peripheral module clock (Pφ) cycles are
required. Care must be taken in system design.

(4) External Bus Priority Order

Access via an external bus is performed in the priority order below:

BREQ > Refresh > LCDC > USBH > DMAC > CPU

Note that next transfer is not performed until current transfer (e.g. burst transfer) has completed.

Rev. 3.00 Jan. 18, 2008 Page 406 of 1458


REJ09B0033-0300
Section 10 Direct Memory Access Controller (DMAC)

Section 10 Direct Memory Access Controller (DMAC)


This LSI includes the direct memory access controller (DMAC).

The DMAC can be used in place of the CPU to perform high-speed transfers between external
devices that have DACK (transfer request acknowledge signal), external memory, on-chip
memory, memory-mapped external devices, and on-chip peripheral modules.

10.1 Features
• Six channels (two channels can receive an external request)
• 4-Gbyte physical address space
• Data transfer unit is selectable: Byte, word (2 bytes), longword (4 bytes), and 16 bytes
(longword × 4)
• Maximum transfer count: 16,777,216 transfers
• Address mode: Dual address mode or single address mode can be selected.
• Transfer requests:
External request, on-chip peripheral module request, or auto request can be selected.
The following modules can issue an on-chip peripheral module request.
 SCIF0, SIOF1, MMC, CMT (channels 0 to 4), SIM, USBF, SIOF0, SIOF1, ADC, and
SDHI
• Selectable bus modes:
Cycle steal mode (normal mode and intermittent mode) or burst mode can be selected.
• Selectable channel priority levels:
The channel priority levels are selectable between fixed mode and round-robin mode.
• Interrupt request: An interrupt request can be generated to the CPU after transfers end by the
specified counts.
• External request detection: There are following four types of DREQ input detection.
 Low level detection
 High level detection
 Rising edge detection
 Falling edge detection
• Transfer request acknowledge signal:
Active levels for DACK and TEND can be set independently.

DMAS301A_010020030200 Rev. 3.00 Jan. 18, 2008 Page 407 of 1458


REJ09B0033-0300
Section 10 Direct Memory Access Controller (DMAC)

Figure 10.1 shows the block diagram of the DMAC.

DMAC module

Iteration SARn
On-chip
control
memory

DARn
On-chip peripheral
Register
module
control

Peripheral bus

Internal bus
DMATCRn

Start-up
control CHCRn

DMA transfer
request signal DMAOR
Request
DMA transfer acknowledge signal priority
DEIn control DMARS0 to
Interrupt controller DMARS2

External Bus
ROM interface

External
RAM

External
I/O (memory
mapped) [Legend]
Bus state SARn: DMA source address register
External controller DARn: DMA destination address register
I/O (with DMATCRn: DMA transfer count register
acknowledge- CHCRn: DMA channel control register
ment) DMAOR: DMA operation register
DMARS0 to
DMARS2: DMA extended resource selector 0 to 2
DACK0, DACK1
DEIn: DMA transfer-end interrupt request to the CPU
TEND0, TEND1 n: 0, 1, 2, 3, 4, 5

DREQ0, DREQ1

Figure 10.1 Block Diagram of DMAC

Rev. 3.00 Jan. 18, 2008 Page 408 of 1458


REJ09B0033-0300
Section 10 Direct Memory Access Controller (DMAC)

10.2 Input/Output Pins


The external pins for the DMAC are described below. Table 10.1 lists the configuration of the pins
that are connected to external bus. The DMAC has pins for 2 channels (channels 0 and 1) for
external bus use.

Table 10.1 Pin Configuration

Channel Name Pin Name I/O Function


0 DMA transfer request DREQ0 Input DMA transfer request input from
external device to channel 0
DMA transfer request DACK0 Output DMA transfer request acknowledge
reception output from channel 0 to external
device
DMA transfer end TEND0 Output DMA transfer end of DMAC channel 0
output of
1 DMA transfer request DREQ1 Input DMA transfer request input from
external device to channel 1
DMA transfer request DACK1 Output DMA transfer request acknowledge
reception output from channel 1 to external
device
DMA transfer end TEND1 Output DMA transfer end of DMAC channel 1
output

Rev. 3.00 Jan. 18, 2008 Page 409 of 1458


REJ09B0033-0300
Section 10 Direct Memory Access Controller (DMAC)

10.3 Register Descriptions


The DMAC has the following registers. Refer to section 37, List of Registers, for more details on
the addresses and states of these registers in each operating mode. The SAR for channel 0 is
expressed such as SAR_0.

(1) Channel 0

• DMA source address register_0 (SAR_0)


• DMA destination address register_0 (DAR_0)
• DMA transfer count register_0 (DMATCR_0)
• DMA channel control register_0 (CHCR_0)

(2) Channel 1

• DMA source address register_1 (SAR_1)


• DMA destination address register_1 (DAR_1)
• DMA transfer count register_1 (DMATCR_1)
• DMA channel control register _1 (CHCR_1)

(3) Channel 2

• DMA source address register_2 (SAR_2)


• DMA destination address register_2 (DAR_2)
• DMA transfer count register_2 (DMATCR_2)
• DMA channel control register_2 (CHCR_2)

(4) Channel 3

• DMA source address register_3 (SAR_3)


• DMA destination address register_3 (DAR_3)
• DMA transfer count register_3 (DMATCR_3)
• DMA channel control register_3 (CHCR_3)

(5) Channel 4

• DMA source address register_4 (SAR_4)


• DMA destination address register_4 (DAR_4)
• DMA transfer count register_4 (DMATCR_4)
• DMA channel control register_4 (CHCR_4)

Rev. 3.00 Jan. 18, 2008 Page 410 of 1458


REJ09B0033-0300
Section 10 Direct Memory Access Controller (DMAC)

(6) Channel 5

• DMA source address register_5 (SAR_5)


• DMA destination address register_5 (DAR_5)
• DMA transfer count register_5 (DMATCR_5)
• DMA channel control register_5 (CHCR_5)

(7) Common

• DMA operation register (DMAOR)


• DMA extended resource selector 0 (DMARS0)
• DMA extended resource selector 1 (DMARS1)
• DMA extended resource selector 2 (DMARS2)

10.3.1 DMA Source Address Registers (SAR_0 to SAR_5)

SAR are 32-bit readable/writable registers that specify the source address of a DMA transfer.
During a DMA transfer, these registers indicate the next source address. When the data is
transferred from an external device with the DACK in single address mode, the SAR is ignored.

To transfer data in 16 bits or in 32 bits, specify the address with 16-bit or 32-bit address boundary.
When transferring data in 16-byte units, a 16-byte boundary must be set for the source address
value. The initial value is undefined.

Rev. 3.00 Jan. 18, 2008 Page 411 of 1458


REJ09B0033-0300
Section 10 Direct Memory Access Controller (DMAC)

10.3.2 DMA Destination Address Registers (DAR_0 to DAR_5)

DAR are 32-bit readable/writable registers that specify the destination address of a DMA transfer.
During a DMA transfer, these registers indicate the next destination address. When the data is
transferred from an external device with the DACK in single address mode, the DAR is ignored.

To transfer data in 16 bits or in 32 bits, specify the address with 16-bit or 32-bit address boundary.
When transferring data in 16-byte units, a 16-byte boundary must be set for the destination address
value. The initial value is undefined.

10.3.3 DMA Transfer Count Registers (DMATCR_0 to DMATCR_5)

DMATCR are 32-bit readable/writable registers that specify the DMA transfer count. The number
of transfers is 1 when the setting is H'00000001, 16,777,215 when H'00FFFFFF is set, and
16,777,216 (the maximum) when H'00000000 is set. During a DMA transfer, these registers
indicate the remaining transfer count.

The upper eight bits of DMATCR are always read as 0, and the write value should always be 0. To
transfer data in 16 bytes, one 16-byte transfer (128 bits) counts one. The initial value is undefined.

Rev. 3.00 Jan. 18, 2008 Page 412 of 1458


REJ09B0033-0300
Section 10 Direct Memory Access Controller (DMAC)

10.3.4 DMA Channel Control Registers (CHCR_0 to CHCR_5)

CHCR are 32-bit readable/writable registers that control the DMA transfer mode.

Initial
Bit Bit Name Value R/W Descriptions
31 to 24  All 0 R Reserved
These bits are always read as 0. The write value should
always be 0.
23 DO 0 R/W DMA Overrun
Selects whether DREQ is detected by overrun 0 or by
overrun 1. This bit is valid only in CHCR_0 and
CHCR_1. This bit is always reserved and read as 0 in
CHCR_2 to CHCR_5. The write value should always be
0.
0: Detects DREQ by overrun 0
1: Detects DREQ by overrun 1
22 TL 0 R/W Transfer End Level
Specifies whether the TEND signal output is high active
or low active.
This bit is valid only in CHCR_0 and CHCR_1. This bit
is always reserved and read as 0 in CHCR2 to
CHCR_5. The write value should always be 0.
0: Low-active output of TEND
1: High-active output of TEND
21 to 18  All 0 R Reserved
These bits are always read as 0. The write value should
always be 0.
17 AM 0 R/W Acknowledge Mode
Selects whether DACK is output in data read cycle or in
data write cycle in dual address mode.
In single address mode, DACK is always output
regardless of the specification by this bit.
This bit is valid only in CHCR_0 and CHCR_1. This bit
is always reserved and read as 0 in CHCR_2 to
CHCR_5. The write value should always be 0.
0: DACK output in read cycle (dual address mode)
1: DACK output in write cycle (dual address mode)

Rev. 3.00 Jan. 18, 2008 Page 413 of 1458


REJ09B0033-0300
Section 10 Direct Memory Access Controller (DMAC)

Initial
Bit Bit Name Value R/W Descriptions
16 AL 0 R/W Acknowledge Level
Specifies whether the DACK signal output is high active
or low active.
This bit is valid only in CHCR_0 and CHCR_1. This bit
is always reserved and read as 0 in CHCR_2 to
CHCR_5. The write value should always be 0.
0: Low-active output of DACK
1: High-active output of DACK
15 DM1 0 R/W Destination Address Mode 1, 0
14 DM0 0 R/W Specify whether the DMA destination address is
incremented, decremented, or left fixed. (In single
address mode, the DM1 and DM0 bits are ignored
when data is transferred to an external device with
DACK.)
00: Fixed destination address (setting prohibited in 16-
byte transfer)
01: Destination address is incremented (+1 in byte-unit
transfer, +2 in word-unit transfer, +4 in longword-
unit transfer, +16 in 16-byte transfer)
10: Destination address is decremented (–1 in byte-unit
transfer, –2 in word-unit transfer, –4 in longword-
unit transfer; setting prohibited in 16-byte transfer)
11: Setting prohibited
13 SM1 0 R/W Source Address Mode 1, 0
12 SM0 0 R/W Specify whether the DMA source address is
incremented, decremented, or left fixed. (In single
address mode, SM1 and SM0 bits are ignored when
data is transferred from an external device with DACK.)
00: Fixed source address (setting prohibited in 16-byte
transfer)
01: Source address is incremented (+1 in byte-unit
transfer, +2 in word-unit transfer, +4 in longword-
unit transfer, +16 in 16-byte transfer)
10: Source address is decremented (–1 in byte-unit
transfer, –2 in word-unit transfer, –4 in longword-
unit transfer; setting prohibited in 16-byte transfer)
11: Setting prohibited

Rev. 3.00 Jan. 18, 2008 Page 414 of 1458


REJ09B0033-0300
Section 10 Direct Memory Access Controller (DMAC)

Initial
Bit Bit Name Value R/W Descriptions
11 RS3 0 R/W Resource Select 3 to 0
10 RS2 0 R/W Specify which transfer requests will be sent to the DMAC.
9 RS1 0 R/W The changing of transfer request source should be done
in the state that the DMA enable bit (DE) is set to 0.
8 RS0 0 R/W
0 0 0 0 External request, dual address mode
0 0 0 1 Setting prohibited
0 0 1 0 External request, single address mode
External address space → External device with
DACK
0 0 1 1 External request, single address mode
External device with DACK → External address
space
0 1 0 0 Auto request
0 1 0 1 Setting prohibited
0 1 1 0 Setting prohibited
0 1 1 1 Setting prohibited
1 0 0 0 Selected by DMA extended resource selector
1 0 0 1 Setting prohibited
1 0 1 0 Setting prohibited
1 0 1 1 Setting prohibited
1 1 0 0 Setting prohibited
1 1 0 1 Setting prohibited
1 1 1 0 ADC
1 1 1 1 Setting prohibited
Note: External request specification is valid only in
CHCR_0 and CHCR_1. None of the external
request can be selected in CHCR_2 to CHCR_5.

Rev. 3.00 Jan. 18, 2008 Page 415 of 1458


REJ09B0033-0300
Section 10 Direct Memory Access Controller (DMAC)

Initial
Bit Bit Name Value R/W Descriptions
7 DL 0 R/W DREQ Level and DREQ Edge Select
6 DS 0 R/W Specify the detecting method of the DREQ pin input and
the detecting level.
These bits are valid only in CHCR_0 and CHCR_1.
These bits are always reserved and read as 0 in CHCR_2
to CHCR_5. The write value should always be 0.
In channels 0 and 1, also, if the transfer request source is
specified as an on-chip peripheral module or if an auto-
request is specified, these bits are invalid.
00: DREQ detected in low level
01: DREQ detected at falling edge
10: DREQ detected in high level
11: DREQ detected at rising edge
5 TB 0 R/W Transfer Bus Mode
Specifies the bus mode when DMA transfers data.
0: Cycle steal mode
1: Burst mode
4 TS1 0 R/W Transfer Size 1, 0
3 TS0 0 R/W Specify the size of data to be transferred.
Select the size of data to be transferred when the source
or destination is an on-chip peripheral module register of
which transfer size is specified.
00: Byte size
01: Word size (2 bytes)
10: Longword size (4 bytes)
11: 16-byte unit (four longword transfers)
2 IE 0 R/W Interrupt Enable
Specifies whether or not an interrupt request is generated
to the CPU at the end of the DMA transfer. Setting this bit
to 1 generates an interrupt request (DEI) to the CPU
when the TE bit is set to 1.
0: Interrupt request is disabled.
1: Interrupt request is enabled.

Rev. 3.00 Jan. 18, 2008 Page 416 of 1458


REJ09B0033-0300
Section 10 Direct Memory Access Controller (DMAC)

Initial
Bit Bit Name Value R/W Descriptions
1 TE 0 R/(W)* Transfer End Flag
Shows that DMA transfer ends. The TE bit is set to 1
when data transfer ends when DMATCR becomes to 0.
The TE bit is not set to 1 in the following cases.
• DMA transfer ends due to an NMI interrupt or DMA
address error before DMATCR is cleared to 0.
• DMA transfer is ended by clearing the DE bit and
DME bit in the DMA operation register (DMAOR).
To clear the TE bit, the TE bit should be written to 0 after
reading 1.
Even if the DE bit is set to 1 while this bit is set to 1,
transfer is not enabled.
0: During the DMA transfer or DMA transfer has been
interrupted
[Clearing condition]
Writing 0 after TE = 1 read
1: DMA transfer ends by the specified count (DMATCR =
0)
0 DE 0 R/W DMA Enable
Enables or disables the DMA transfer. In auto request
mode, DMA transfer starts by setting the DE bit and DME
bit in DMAOR to 1. In this time, all of the bits TE, NMIF,
and AE in DMAOR must be 0. In an external request or
peripheral module request, DMA transfer starts if DMA
transfer request is generated by the devices or peripheral
modules after setting the bits DE and DME to 1. In this
case, however, all of the bits TE, NMIF, and AE must be
0, which is the same as in the case of auto request
mode. Clearing the DE bit to 0 can terminate the DMA
transfer.
0: DMA transfer disabled
1: DMA transfer enabled
Note: * Writing 0 is possible to clear the flag.

Rev. 3.00 Jan. 18, 2008 Page 417 of 1458


REJ09B0033-0300
Section 10 Direct Memory Access Controller (DMAC)

10.3.5 DMA Operation Register (DMAOR)

DMAOR is a 16-bit readable/writable register that specifies the priority level of channels at the
DMA transfer. This register shows the DMA transfer status.

Initial
Bit Bit Name Value R/W Description
15, 14  All 0 R Reserved
These bits are always read as 0. The write value should
always be 0.
13 CMS1 0 R/W Cycle Steal Mode Select 1, 0
12 CMS0 0 R/W Select either normal mode or intermittent mode in cycle
steal mode.
It is necessary that all channel's bus modes are set to
cycle steal mode to make valid intermittent mode.
00: Normal mode
01: Setting prohibited
10: Intermittent mode 16
Executes one DMA transfer in each of 16 clocks of an
external bus clock.
11: Intermittent mode 64
Executes one DMA transfer in each of 64 clocks of an
external bus clock.
11, 10  All 0 R Reserved
These bits are always read as 0. The write value should
always be 0.
9 PR1 0 R/W Priority Mode 1, 0
8 PR0 0 R/W Select the priority level between channels when there are
transfer requests for multiple channels simultaneously.
00: CH0 > CH1 > CH2 > CH3 > CH4 > CH5
01: CH0 > CH2 > CH3 > CH1 > CH4 > CH5
10: Setting prohibited
11: Round-robin mode
7 to 3  All 0 R Reserved
These bits are always read as 0. The write value should
always be 0.

Rev. 3.00 Jan. 18, 2008 Page 418 of 1458


REJ09B0033-0300
Section 10 Direct Memory Access Controller (DMAC)

Initial
Bit Bit Name Value R/W Description
2 AE 0 R/(W)* Address Error Flag
Indicates that an address error occurred during DMA
transfer. If this bit is set, DMA transfer is disabled even if
the DE bit in CHCR and the DME bit in DMAOR are set to
1. This bit can only be cleared by writing 0 after reading
1.
0: No DMAC address error
[Clearing condition]
Writing AE = 0 after AE = 1 read
1: DMAC address error occurs
1 NMIF 0 R/(W)* NMI Flag
Indicates that an NMI interrupt occurred. If this bit is set,
DMA transfer is disabled even if the DE bit in CHCR and
the DME bit in DMAOR are set to 1. This bit can only be
cleared by writing 0 after reading 1.
When the NMI is input, the DMA transfer in progress can
be done in one transfer unit. When the DMAC is not in
operational, the NMIF bit is set to 1 even if the NMI
interrupt was input.
0: No NMI interrupt
[Clearing condition]
Writing NMIF = 0 after NMIF = 1 read
1: NMI interrupt occurs
0 DME 0 R/W DMA Master Enable
Enables or disables DMA transfers on all channels. If the
DME bit and the DE bit in CHCR are set to 1, transfer is
enabled. In this time, all of the bits TE in CHCR, NMIF,
and AE in DMAOR must be 0. If this bit is cleared during
transfer, transfers in all channels are terminated.
0: Disables DMA transfers on all channels
1: Enables DMA transfers on all channels
Note: * Writing 0 is possible to clear the flag.

Rev. 3.00 Jan. 18, 2008 Page 419 of 1458


REJ09B0033-0300
Section 10 Direct Memory Access Controller (DMAC)

10.3.6 DMA Extended Resource Selectors 0 to 2 (DMARS0 to DMARS2)

DMARS are 16-bit readable/writable registers that specify the DMA transfer sources from
peripheral modules in each channel. DMARS0 specifies for channels 0 and 1, DMARS1 specifies
for channels 2 and 3, and DMARS2 specifies for channels 4 and 5. This register can set the
transfer request of SCIF0, SIOF1, MMC, CMT (channels 0 to 4), SIM, USBF, SIOF0, SIOF1, and
SDHI.

When MID/RID other than the values listed in table 10.2 is set, the operation of this LSI is not
guaranteed. The transfer request from DMARS is valid only when the resource select bits (RS3 to
RS0) have been set to B'1000 for CHCR_0 to CHCR_5 registers. Otherwise, even if DMARS has
been set, transfer request source is not accepted.

• DMARS0

Initial
Bit Bit Name Value R/W Description
15 C1MID5 0 R/W Transfer request module ID5 to ID0 for DMA channel 1
14 C1MID4 0 R/W (MID)

13 C1MID3 0 R/W See table 10.2.

12 C1MID2 0 R/W
11 C1MID1 0 R/W
10 C1MID0 0 R/W
9 C1RID1 0 R/W Transfer request register ID1 and ID0 for DMA channel 1
8 C1RID0 0 R/W (RID)
See table 10.2.
7 C0MID5 0 R/W Transfer request module ID5 to ID0 for DMA channel 0
6 C0MID4 0 R/W (MID)

5 C0MID3 0 R/W See table 10.2.

4 C0MID2 0 R/W
3 C0MID1 0 R/W
2 C0MID0 0 R/W
1 C0RID1 0 R/W Transfer request register ID1 and ID0 for DMA channel 0
0 C0RID0 0 R/W (RID)
See table 10.2.

Rev. 3.00 Jan. 18, 2008 Page 420 of 1458


REJ09B0033-0300
Section 10 Direct Memory Access Controller (DMAC)

• DMARS1

Initial
Bit Bit Name Value R/W Description
15 C3MID5 0 R/W Transfer request module ID5 to ID0 for DMA channel 3
14 C3MID4 0 R/W (MID)

13 C3MID3 0 R/W See table 10.2.

12 C3MID2 0 R/W
11 C3MID1 0 R/W
10 C3MID0 0 R/W
9 C3RID1 0 R/W Transfer request register ID1 and ID0 for DMA channel 3
8 C3RID0 0 R/W (RID)
See table 10.2.
7 C2MID5 0 R/W Transfer request module ID5 to ID0 for DMA channel 2
6 C2MID4 0 R/W (MID)

5 C2MID3 0 R/W See table 10.2.

4 C2MID2 0 R/W
3 C2MID1 0 R/W
2 C2MID0 0 R/W
1 C2RID1 0 R/W Transfer request register ID1 and ID0 for DMA channel 2
0 C2RID0 0 R/W (RID)
See table 10.2.

Rev. 3.00 Jan. 18, 2008 Page 421 of 1458


REJ09B0033-0300
Section 10 Direct Memory Access Controller (DMAC)

• DMARS2

Initial
Bit Bit Name Value R/W Description
15 C5MID5 0 R/W Transfer request module ID5 to ID0 for DMA channel 5
14 C5MID4 0 R/W (MID)

13 C5MID3 0 R/W See table 10.2.

12 C5MID2 0 R/W
11 C5MID1 0 R/W
10 C5MID0 0 R/W
9 C5RID1 0 R/W Transfer request register ID1 and ID0 for DMA channel 5
8 C5RID0 0 R/W (RID)
See table 10.2.
7 C4MID5 0 R/W Transfer request module ID5 to ID0 for DMA channel 4
6 C4MID4 0 R/W (MID)

5 C4MID3 0 R/W See table 10.2.

4 C4MID2 0 R/W
3 C4MID1 0 R/W
2 C4MID0 0 R/W
1 C4RID1 0 R/W Transfer request register ID1 and ID0 for DMA channel 4
0 C4RID0 0 R/W (RID)
See table 10.2.

Rev. 3.00 Jan. 18, 2008 Page 422 of 1458


REJ09B0033-0300
Section 10 Direct Memory Access Controller (DMAC)

Table 10.2 Transfer Request Sources

Peripheral Setting Value for One


Module Channel (MID + RID) MID RID Function
SCIF0 H'21 B'001000 B'01 Transmit
H'22 B'10 Receive
SCIF1 H'29 B'001010 B'01 Transmit
H'2A B'10 Receive
CMT H'03 B'000000 B'11 
(channel 0)
CMT H'07 B'000001 B'11 
(channel 1)
CMT H'0B B'000010 B'11 
(channel 2)
CMT H'0F B'000011 B'11 
(channel 3)
CMT H'13 B'000100 B'11 
(channel 4)
USBF H'83 B'100000 B'11 Transmit
H'80 B'00 Receive
SIM H'A1 B'101000 B'01 Transmit
H'A2 B'10 Receive
MMC H'A8 B'101010 B'00 Transmit/receive
SIOF0 H'B1 B'101100 B'01 Transmit
H'B2 B'10 Receive
SIOF1 H'B5 B'101101 B'01 Transmit
H'B6 B'10 Receive
SDHI H'C1 B'110000 B'01 Transmit
H'C2 B'10 Receive

Rev. 3.00 Jan. 18, 2008 Page 423 of 1458


REJ09B0033-0300
Section 10 Direct Memory Access Controller (DMAC)

10.4 Operation
When there is a DMA transfer request, the DMAC starts the transfer according to the
predetermined channel priority; when the transfer end conditions are satisfied, it ends the transfer.
Transfers can be requested in three modes: auto request, external request, and on-chip peripheral
module request. In bus mode, burst mode or cycle steal mode can be selected.

10.4.1 DMA Transfer Flow

After the DMA source address registers (SAR), DMA destination address registers (DAR), DMA
transfer count registers (DMATCR), DMA channel control registers (CHCR), DMA operation
register (DMAOR), and DMA extended resource selectors (DMARS) are set, the DMAC transfers
data according to the following procedure:

1. Checks to see if transfer is enabled (DE = 1, DME = 1, TE = 0, AE = 0, NMIF = 0)


2. When a transfer request occurs while transfer is enabled, the DMAC transfers one transfer unit
of data (depending on the TS0 and TS1 settings). In auto request mode, the transfer begins
automatically when the DE bit and DME bit are set to 1. The DMATCR value will be
decremented for each transfer. The actual transfer flows vary by address mode and bus mode.
3. When the specified number of transfer have been completed (when DMATCR reaches 0), the
transfer ends normally. If the IE bit in CHCR is set to 1 at this time, a DEI interrupt is sent to
the CPU.
4. When an address error or an NMI interrupt is generated, the transfer is aborted. Transfers are
also aborted when the DE bit in CHCR or the DME bit in DMAOR is changed to 0.

Rev. 3.00 Jan. 18, 2008 Page 424 of 1458


REJ09B0033-0300
Section 10 Direct Memory Access Controller (DMAC)

Figure 10.2 shows a flowchart of this procedure.

Start

Initial settings
(SAR, DAR, DMATCR, CHCR, DMAOR, DMARS)

DE, DME = 1 and No


NMIF, AE, TE = 0?

Yes

Transfer request No *2
occurs?*1
Bus mode,
Yes *3 transfer request mode,
DREQ detection selection
Transfer (1 transfer unit); system
DMATCR – 1 → DMATCR, SAR and DAR
updated

NMIF = 1 No
No
DMATCR = 0? or AE = 1 or DE = 0
or DME = 0?

Yes
Yes
TE = 1 Transfer aborted

DEI interrupt request (when IE = 1)

NMIF = 1 No
or AE = 1 or DE = 0
or DME = 0?

Yes
Transfer end Normal end

Notes: 1. In auto-request mode, transfer begins when the NMIF, AE, and TE bits are all 0 and the DE and
DME bits are set to 1.
2. DREQ = level detection in burst mode (external request) or cycle-steal mode.
3. DREQ = edge detection in burst mode (external request), or auto-request mode in burst mode.

Figure 10.2 DMA Transfer Flowchart

Rev. 3.00 Jan. 18, 2008 Page 425 of 1458


REJ09B0033-0300
Section 10 Direct Memory Access Controller (DMAC)

10.4.2 DMA Transfer Requests

DMA transfer requests are basically generated in either the data transfer source or destination, but
they can also be generated by external devices or on-chip peripheral modules that are neither the
source nor the destination. Transfers can be requested in three modes: auto request, external
request, and on-chip peripheral module request. The request mode is selected in the RS3 to RS0
bits in CHCR0 to CHCR3, and DMARS0 to DMARS2.

(1) Auto-Request Mode

When there is no transfer request signal from an external source, as in a memory-to-memory


transfer or a transfer between memory and an on-chip peripheral module unable to request a
transfer, auto-request mode allows the DMAC to automatically generate a transfer request signal
internally. When the DE bits in CHCR and the DME bit in DMAOR are set to 1, the transfer
begins so long as the AE and NMIF bits in DMAOR are all 0.

(2) External Request Mode

In this mode, a transfer is performed at the request signals (DREQ0 and DREQ1) of an external
device. This mode is valid only in channel 0 and channel 1. Choose one of the modes shown in
table 10.3 according to the application system. When this mode is selected, if the DMA transfer is
enabled (DE = 1, DME = 1, TE = 0, AE = 0, NMIF = 0), a transfer is performed upon a request at
the DREQ input.

Table 10.3 Selecting External Request Modes with RS Bits

RS3 RS2 RS1 RS0 Address Mode Source Destination


0 0 0 0 Dual address Any Any
mode
1 0 Single address External memory, External device with
mode memory-mapped DACK
external device
1 External device with External memory,
DACK memory-mapped
external device

Rev. 3.00 Jan. 18, 2008 Page 426 of 1458


REJ09B0033-0300
Section 10 Direct Memory Access Controller (DMAC)

Choose to detect DREQ by either the edge or level of the signal input with the DL bit and DS bit
in CHCR_0 and CHCR_1 as shown in table 10.4. The source of the transfer request does not have
to be the data transfer source or destination.

Table 10.4 Selecting External Request Detection with DL, DS Bits

CHCR_0 or CHCR_1
DL DS Detection of External Request
0 0 Low level detection
1 Falling edge detection
1 0 High level detection
1 Rising edge detection

When DREQ is accepted, the DREQ pin becomes request accept disabled state. After issuing
acknowledge signal DACK for the accepted DREQ, the DREQ pin again becomes request accept
enabled state.

When DREQ is used by level detection, there are following two cases by the timing to detect the
next DREQ after outputting DACK.

• Overrun 0: Transfer is aborted after the same number of transfer has been performed as
requests.
• Overrun 1: Transfer is aborted after transfers have been performed for (the number of requests
plus 1) times.

The DO bit in CHCR selects this overrun 0 or overrun 1.

Table 10.5 Selecting External Request Detection with DO Bit

CHCR_0 or CHCR_1
DO External Request
0 Overrun 0
1 Overrun 1

Rev. 3.00 Jan. 18, 2008 Page 427 of 1458


REJ09B0033-0300
Section 10 Direct Memory Access Controller (DMAC)

(3) On-Chip Peripheral Module Request Mode

In this mode, a transfer is performed at the transfer request signal of an on-chip peripheral module.
Transfer request signals comprise the transmit data empty transfer request and receive data full
transfer request from the ADC set by CHCR0 to CHCR5 and the SCIF0, SCIF1, MMC, USBF,
SIM, SIOF0, SIOF1, and SDHI set by DMARS0/1/2, and the compare-match timer transfer
request from the CMT (channels 0 to 4).

When this mode is selected, if the DMA transfer is enabled (DE = 1, DME = 1, TE = 0, AE = 0,
NMIF = 0), a transfer is performed upon the input of a transfer request signal.

When a transmit data empty transfer request of the SCIF0 is set as the transfer request, the transfer
destination must be the SCIF0's transmit data register. Likewise, when receive data full transfer
request of the SCIF0 is set as the transfer request, the transfer source must be the SCIF0's receive
data register. These conditions also apply to the SIOF1, MMC, USBF, SIM, SIOF0, SIOF1, and
SDHI. When the ADC is set as the transfer request, the transfer source must be the A/D data
register. Any address can be specified for data source and destination, when transfer request is
generated by the CMT (channels 0 to 4).

The number of the receive FIFO triggers can be set as a transfer request depending on an on-chip
peripheral module. Data needs to be read after the DMA transfer is ended, because data may be
remained in the receive FIFO when the receive FIFO trigger condition is not satisfied.

Rev. 3.00 Jan. 18, 2008 Page 428 of 1458


REJ09B0033-0300
Section 10 Direct Memory Access Controller (DMAC)

Table 10.6 Selecting On-Chip Peripheral Module Request Modes with RS3 to RS0 Bits
CHCR DMARS DMA Transfer
Request DMA Transfer Bus
RS[3:0] MID RID Source Request Signal Source Destination Mode
1000 001000 01 SCIF0 TXI0 (transmit FIFO data Any SCFTDR0 Cycle
transmitter empty interrupt) steal
10 SCIF0 RXI0 (receive FIFO data SCFRDR0 Any Cycle
receiver full interrupt) steal
001010 01 SCIF1transmitt TXI1 (transmit FIFO data Any SITDR Cycle
er empty interrupt) steal
10 SCIF1 RXI1 (receive FIFO data SCFRDR1 Any Cycle
receiver full interrupt) steal
000000 11 CMT Compare-match transfer Any Any Cycle
(channel 0) request steal/
burst
000001 11 CMT Compare-match transfer Any Any Cycle
(channel 1) request steal/
burst
000010 11 CMT Compare-match transfer Any Any Cycle
(channel 2) request steal/
burst
000011 11 CMT Compare-match transfer Any Any Cycle
(channel 3) request steal/
burst
000100 11 CMT Compare-match transfer Any Any Cycle
(channel 4) request steal/
burst

Rev. 3.00 Jan. 18, 2008 Page 429 of 1458


REJ09B0033-0300
Section 10 Direct Memory Access Controller (DMAC)

CHCR DMARS DMA Transfer


Request DMA Transfer Bus
RS[3:0] MID RID Source Request Signal Source Destination Mode
1000 100000 11 USBF Transmit data empty request Any EPDR2 Cycle
transmitter steal
00 USBF receiver Transmit data full request EPDR1 Any Cycle
steal
101000 01 SIM TXI (transmit data empty) Any SCTDR Cycle
transmitter steal
10 SIM receiver RXI (receive data full) SCRDR Any Cycle
steal
101010 00 MMC Receive data empty request Any Data register Cycle
transmitter steal
MMC receiver Receive data full request Data register Any Cycle
steal
101100 01 SIOF0 TXI0 (transmit FIFO data Any SITDR0 Cycle
transmitter empty) steal
10 SIOF0 RXI0 (receive FIFO data full) SIRDR0 Any Cycle
receiver steal
101101 01 SIOF1 TXI1 (transmit FIFO data Any SITDR1 Cycle
transmitter empty) steal
10 SIOF1 RXI1 (receive FIFO data full) SIRDR0 Any Cycle
receiver steal
110000 01 SD transmitter Transmit data empty request Any Data register Cycle
steal
10 SD receiver Receive data full request Data register Any Cycle
steal
1110   ADC ADI (A/D conversion end) ADDR Any Cycle
steal

Rev. 3.00 Jan. 18, 2008 Page 430 of 1458


REJ09B0033-0300
Section 10 Direct Memory Access Controller (DMAC)

10.4.3 Channel Priority

When the DMAC receives simultaneous transfer requests on two or more channels, it transfers
data according to a predetermined priority. Two modes (fixed mode and round-robin mode) are
selected by the PR1 and PR0 bits in DMAOR.

(1) Fixed Mode

In this mode, the priority levels among the channels remain fixed. There are two kinds of fixed
modes as follows:

• CH0 > CH1 > CH2 > CH3 > CH4 > CH5
• CH0 > CH2 > CH3 > CH1 > CH4 > CH5

These are selected by the PR1 and the PR0 bits in DMAOR.

(2) Round-Robin Mode

In round-robin mode each time data of one transfer unit (word, byte, longword, or 16-byte unit) is
transferred on one channel, the priority is rotated. The channel on which the transfer was just
finished rotates to the bottom of the priority. The round-robin mode operation is shown in figure
10.3. The priority of round-robin mode is CH0 > CH1 > CH2 > CH3 > CH4 > CH5 immediately
after a reset. When round-robin mode is specified, the same bus mode, either cycle steal mode or
burst mode, must be specified for all of the channels.

Rev. 3.00 Jan. 18, 2008 Page 431 of 1458


REJ09B0033-0300
Section 10 Direct Memory Access Controller (DMAC)

(1) When channel 0 transfers

Initial priority order CH0 > CH1 > CH2 > CH3 > CH4 > CH5 Channel 0 becomes bottom
priority

Priority order
CH1 > CH2 > CH3 > CH4 > CH5 > CH0
after transfer

(2) When channel 1 transfers

Channel 1 becomes bottom


Initial priority order CH0 > CH1 > CH2 > CH3 > CH4 > CH5 priority.
The priority of channel 0, which
was higher than channel 1, is also
shifted.
Priority order
CH2 > CH3 > CH4 > CH5 > CH0 > CH1
after transfer

(3) When channel 2 transfers

Channel 2 becomes bottom


Initial priority order CH0 > CH1 > CH2 > CH3 > CH4 > CH5
priority.
The priority of channels 0 and 1,
which were higher than channel 2,
are also shifted. If immediately
Priority order
CH3 > CH4 > CH5 > CH0 > CH1 > CH2 after there is a request to transfer
after transfer channel 5 only, channel 5 becomes
bottom priority and the priority of
channels 3 and 4, which were
Post-transfer priority order higher than channel 5, are also
when there is an CH0 > CH1 > CH2 > CH3 > CH4 > CH5 shifted.
immediate transfer
request to channel 5 only

(4) When channel 5 transfers

Initial priority order CH0 > CH1 > CH2 > CH3 > CH4 > CH5 Priority order does not change.

Priority order
CH0 > CH1 > CH2 > CH3 > CH4 > CH5
after transfer

Figure 10.3 Round-Robin Mode

Rev. 3.00 Jan. 18, 2008 Page 432 of 1458


REJ09B0033-0300
Section 10 Direct Memory Access Controller (DMAC)

Figure 10.4 shows how the priority changes when channel 0 and channel 3 transfers are requested
simultaneously and a channel 1 transfer is requested during the channel 0 transfer. The DMAC
operates as follows:

1. Transfer requests are generated simultaneously to channels 0 and 3.


2. Channel 0 has a higher priority, so the channel 0 transfer begins first (channel 3 waits for
transfer).
3. A channel 1 transfer request occurs during the channel 0 transfer (channels 1 and 3 are both
waiting)
4. When the channel 0 transfer ends, channel 0 becomes lowest priority.
5. At this point, channel 1 has a higher priority than channel 3, so the channel 1 transfer begins
(channel 3 waits for transfer).
6. When the channel 1 transfer ends, channel 1 becomes lowest priority.
7. The channel 3 transfer begins.
8. When the channel 3 transfer ends, channels 3 and 2 shift downward in priority so that channel
3 becomes the lowest priority.

Transfer request Waiting channel(s) DMAC operation Channel priority

(1) Channels 0 and 3


(2) Channel 0 transfer 0>1>2>3>4>5
3 starts
(3) Channel 1
Priority order
(4) Channel 0 transfer changes
1,3 1>2>3>4>5>0
ends

(5) Channel 1 transfer


starts
Priority order
changes
3 (6) Channel 1 transfer 2>3>4>5>0>1
ends

(7) Channel 3 transfer


starts
None Priority order
changes
(8) Channel 3 transfer 4>5>0>1>2>3
ends

Figure 10.4 Changes in Channel Priority in Round-Robin Mode

Rev. 3.00 Jan. 18, 2008 Page 433 of 1458


REJ09B0033-0300
Section 10 Direct Memory Access Controller (DMAC)

10.4.4 DMA Transfer Types

DMA transfer has two types; single address mode transfer and dual address mode transfer. They
depend on the number of bus cycles of access to source and destination. A data transfer timing
depends on the bus mode, which has cycle steal mode and burst mode. The DMAC supports the
transfers shown in table 10.7.

Table 10.7 Supported DMA Transfers

Destination
Memory-
External Mapped On-Chip
Device with External External Peripheral X/Y Memory
Source DACK Memory Device Module U Memory
External device with DACK Not Dual, Dual, Not Not
available single single available available
External memory Dual, single Dual Dual Dual Dual
Memory-mapped external Dual, single Dual Dual Dual Dual
device
On-chip peripheral module Not Dual Dual Dual Dual
available
X/Y memory Not Dual Dual Dual Dual
available
Notes: 1. Dual: Dual address mode
2. Single: Single address mode
3. For on-chip peripheral modules, 16-byte transfer is available only by registers which
can be accessed in longword units.

Rev. 3.00 Jan. 18, 2008 Page 434 of 1458


REJ09B0033-0300
Section 10 Direct Memory Access Controller (DMAC)

(1) Address Modes

(a) Dual Address Mode

In dual address mode, both the transfer source and destination are accessed by an address. The
source and destination can be located externally or internally.

DMA transfer requires two bus cycles because data is read from the transfer source in a data read
cycle and written to the transfer destination in a data write cycle. At this time, transfer data is
temporarily stored in the DMAC. In the transfer between external memories as shown in figure
10.5, data is read to the DMAC from one external memory in a data read cycle, and then that data
is written to the other external memory in a write cycle.

DMAC

SAR Memory
Address bus

DAR
Transfer source
Data bus

module

Transfer destination
Data buffer
module

The SAR value is an address, data is read from the transfer source module,
and the data is temporarily stored in the DMAC.

First bus cycle

DMAC

SAR Memory
Address bus

Data bus

DAR
Transfer source
module

Transfer destination
Data buffer
module

The DAR value is an address and the value stored in the data buffer in the
DMAC is written to the transfer destination module.
Second bus cycle

Figure 10.5 Data Flow of Dual Address Mode

Auto request, external request, and on-chip peripheral module request are available for the transfer
request. DACK can be output in read cycle or write cycle in dual address mode. The channel
control register (CHCR) can specify whether the DACK is output in read cycle or write cycle.

Rev. 3.00 Jan. 18, 2008 Page 435 of 1458


REJ09B0033-0300
Section 10 Direct Memory Access Controller (DMAC)

Figure 10.6 shows an example of DMA transfer timing in dual address mode.

CKIO

A25 to A0 Transfer source Transfer destination


address address

CSn

D31 to D0

RD

WEn

DACKn
(Active-low)

Data read cycle Data write cycle


(1st cycle) (2nd cycle)

Note: In transfer between external memories, with DACK output in the read cycle,
DACK output timing is the same as that of CSn.

Figure 10.6 Example of DMA Transfer Timing in Dual Mode


(Source: Ordinary Memory, Destination: Ordinary Memory)

Rev. 3.00 Jan. 18, 2008 Page 436 of 1458


REJ09B0033-0300
Section 10 Direct Memory Access Controller (DMAC)

(b) Single Address Mode

In single address mode, either the transfer source or transfer destination peripheral device is
accessed (selected) by means of the DACK signal, and the other device is accessed by an address.
In this mode, the DMAC performs one DMA transfer in one bus cycle, accessing one of the
external devices by outputting the DACK transfer request acknowledge signal to it, and at the
same time outputting an address to the other device involved in the transfer. For example, in the
case of transfer between external memory and an external device with DACK shown in figure
10.7, when the external device outputs data to the data bus, that data is written to the external
memory in the same bus cycle.

External address bus External data bus

This LSI
External
DMAC memory

External device
with DACK

DACK

DREQ

Data flow

Figure 10.7 Data Flow in Single Address Mode

Two kinds of transfer are possible in single address mode: (1) transfer between an external device
with DACK and a memory-mapped external device, and (2) transfer between an external device
with DACK and external memory. In both cases, only the external request signal (DREQ) is used
for transfer requests.

Rev. 3.00 Jan. 18, 2008 Page 437 of 1458


REJ09B0033-0300
Section 10 Direct Memory Access Controller (DMAC)

Figure 10.8 shows an example of DMA transfer timing in single address mode.

CKIO

A25 to A0 Address output to external memory space

CSn Select signal to external memory space

WE Write strobe signal to external memory space

D31 to D0 Data output from external device with DACK

DACKn DACK signal (active-low) to external device with DACK

(a) External device with DACK → external memory space (ordinary memory)

CKIO

A25 to A0 Address output to external memory space

CSn Select signal to external memory space

RD Read strobe signal to external memory space

D31 to D0 Data output from external memory space

DACKn DACK signal (active-low) to external device with DACK

(b) External memory space (ordinary memory) → external device with DACK

Figure 10.8 Example of DMA Transfer Timing in Single Address Mode

Rev. 3.00 Jan. 18, 2008 Page 438 of 1458


REJ09B0033-0300
Section 10 Direct Memory Access Controller (DMAC)

(2) Bus Modes

There are two bus modes: cycle steal mode and burst mode. Select the mode in the TB bits in the
channel control register (CHCR).

(a) Cycle-Steal Mode

• Normal mode
In cycle-steal normal mode, the bus mastership is given to another bus master after a one-
transfer-unit (byte, word, longword, or 16-byte unit) DMA transfer. When another transfer
request occurs, the bus mastership is obtained from the other bus master and a transfer is
performed for one transfer unit. When that transfer ends, the bus mastership is passed to the
other bus master. This is repeated until the transfer end conditions are satisfied.
In cycle-steal normal mode, transfer areas are not affected regardless of settings of the transfer
request source, transfer source, and transfer destination.
Figure 10.9 shows an example of DMA transfer timing in cycle-steal normal mode. Transfer
conditions shown in the figure are:
 Dual address mode
 DREQ low level detection

DREQ

Bus mastership returned to CPU once

Bus cycle CPU CPU CPU DMAC DMAC CPU DMAC DMAC CPU
Read/Write Read/Write

Figure 10.9 DMA Transfer Example in Cycle-Steal Normal Mode


(Dual Address, DREQ Low Level Detection)

• Intermittent mode 16 and intermittent mode 64


In intermittent mode of cycle steal, the DMAC returns the bus mastership to other bus master
whenever a unit of transfer (byte, word, longword, or 16-byte unit) is complete. If the next
transfer request occurs after that, the DMAC gets the bus mastership from other bus master
after waiting for 16 or 64 clocks in Bφ count. The DMAC then transfers data of one unit and
returns the bus mastership to other bus master. These operations are repeated until the transfer
end condition is satisfied. It is thus possible to make lower the ratio of bus occupation by DMA
transfer than cycle-steal normal mode.
When the DMAC gets again the bus mastership, DMA transfer can be postponed in case of
entry updating due to cache miss.

Rev. 3.00 Jan. 18, 2008 Page 439 of 1458


REJ09B0033-0300
Section 10 Direct Memory Access Controller (DMAC)

This intermittent mode can be used for all transfer section; transfer request source, transfer
source, and transfer destination. The bus modes, however, must be cycle steal mode in all
channels.
Figure 10.10 shows an example of DMA transfer timing in cycle steal intermittent mode.
Transfer conditions shown in the figure are:
 Dual address mode
 DREQ low level detection

DREQ

More than 16 or 64 Bφ
(change by the CPU, LCDC, and USBH states of using bus)

Bus cycle CPU CPU CPU DMAC DMAC CPU CPU DMAC DMAC CPU
Read/Write Read/Write

Figure 10.10 Example of DMA Transfer in Cycle Steal Intermittent Mode


(Dual Address, DREQ Low Level Detection)

(b) Burst Mode

In burst mode, once the DMAC obtains the bus mastership, the transfer is performed continuously
without releasing the bus mastership until the transfer end condition is satisfied. In external
request mode with level detection of the DREQ pin, however, when the DREQ pin is not active,
the bus mastership passes to the other bus master after the DMAC transfer request that has already
been accepted ends, even if the transfer end conditions have not been satisfied.

Burst mode cannot be used for other than CMT (channels 0 to 4) when the on-chip peripheral
module is the transfer request source.

Figure 10.11 shows DMA transfer timing in burst mode.

DREQ

Bus cycle CPU CPU CPU DMAC DMAC DMAC DMAC DMAC DMAC CPU
Read Write Read Write Read Write

Figure 10.11 DMA Transfer Example in Burst Mode


(Dual Address, DREQ Low Level Detection)

Rev. 3.00 Jan. 18, 2008 Page 440 of 1458


REJ09B0033-0300
Section 10 Direct Memory Access Controller (DMAC)

(3) Relationship between Request Modes and Bus Modes by DMA Transfer Category

Table 10.8 shows the relationship between request modes and bus modes by DMA transfer
category.

Table 10.8 Relationship between Request Modes and Bus Modes by DMA Transfer
Category

Address Request Bus Transfer Usable


Mode Transfer Category Mode Mode Size (Bits) Channels
Dual External device with DACK and external External B/C 8/16/32/128 0,1
memory
External device with DACK and memory- External B/C 8/16/32/128 0, 1
mapped external device
1 5
External memory and external memory All* B/C 8/16/32/128 0 to 5*
1
External memory and memory-mapped All* B/C 8/16/32/128 0 to 5*5
external device
Memory-mapped external device and All*1 B/C 8/16/32/128 0 to 5*5
memory-mapped external device
External memory and on-chip peripheral All*2 B/C*3 8/16/32/128*4 0 to 5*5
module
Memory-mapped external device and All*2 B/C*3 8/16/32/128*4 0 to 5*5
on-chip peripheral module
On-chip peripheral module and on-chip All*2 B/C*3 8/16/32/128*4 0 to 5*5
peripheral module
X/Y memory and X/Y memory All*1 B/C 8/16/32/128 0 to 5*5
X/Y memory and memory-mapped All*1 B/C 8/16/32/128 0 to 5*5
external device
X/Y memory and on-chip peripheral All*2 B/C*3 8/16/32/128*4 0 to 5*5
module
X/Y memory and external memory All*1 B/C 8/16/32/128 0 to 5*5
Single External device with DACK and external External B/C 8/16/32 0, 1
memory
External device with DACK and memory- External B/C 8/16/32 0, 1
mapped external device
B: Burst mode, C: Cycle steal mode

Rev. 3.00 Jan. 18, 2008 Page 441 of 1458


REJ09B0033-0300
Section 10 Direct Memory Access Controller (DMAC)

Notes: 1. External requests, auto requests, and on-chip peripheral module requests are all
available. In the case of on-chip peripheral module requests, however, the CMT
(channels 0 to 4) are only available.
2. External requests, auto requests, and on-chip peripheral module requests are all
available. However, with the exception of the CMT (channels 0 to 4) as the transfer
request source, the request source register must be designated as the transfer source
or the transfer destination.
3. Only cycle steal except for the CMT (channels 0 to 4) as the transfer request source.
4. Access size permitted for the on-chip peripheral module register functioning as the
transfer source or transfer destination.
5. If the transfer request is an external request, channels 0 and 1 are only available.

Rev. 3.00 Jan. 18, 2008 Page 442 of 1458


REJ09B0033-0300
Section 10 Direct Memory Access Controller (DMAC)

(4) Bus Mode and Channel Priority

When the priority is set in fixed mode (CH0 > CH1), even though channel 1 is transferring in burst
mode, if there is a transfer request to channel 0 which has a higher priority, the transfer of channel
0 will begin immediately.

At this time, if channel 0 is also operating in burst mode, the channel 1 transfer will continue when
the channel 0 transfer with a higher priority has completely finished.

If channel 0 is operating in cycle steal mode, immediately after channel 0 with a higher priority
completes the transfer of one transfer unit, the channel 1 transfer will begin again without
releasing the bus mastership. Transfer will then switch between the two in the order of channel 0,
channel 1, channel 0, and channel 1. For the bus state, the CPU cycle after cycle steal mode
transfer finishes is replaced with a burst mode transfer cycle (hereafter referred to as burst mode
high-priority execution).

This example is illustrated in figure 10.12. If there are channels with conflicting burst transfers,
transfer for the channel with the highest priority is performed first.

In DMA transfer for more than one channel, the DMAC does not give the bus mastership to the
bus master until all conflicting burst transfers have finished.

DMA DMA DMA DMA DMA DMA DMA


CPU CPU
CH1 CH1 CH0 CH1 CH0 CH1 CH1

CH0 CH1 CH0

CPU DMAC CH1 DMAC CH0 and CH1 DMAC CH1 CPU
Burst mode Cycle-steal mode Burst mode

Priority: CH0 > CH1


CH0: Cycle-steal mode
CH1: Burst mode

Figure 10.12 Bus State when Multiple Channels are Operating

In round-robin mode, the priority changes according to the specifications shown in figure 10.3.
Note that a channel operating in cycle steal mode cannot be handled together with a channel
operating in burst mode.

Rev. 3.00 Jan. 18, 2008 Page 443 of 1458


REJ09B0033-0300
Section 10 Direct Memory Access Controller (DMAC)

10.4.5 Number of Bus Cycle States and DREQ Pin Sampling Timing

(1) Number of Bus Cycle States

When the DMAC is the bus master, the number of bus cycle states is controlled by the bus state
controller (BSC) in the same way as when the CPU is the bus master. For details, see section 9,
Bus State Controller (BSC).

(2) DREQ Pin Sampling Timing

Figures 10.13, 10.14, 10.15, and 10.16 show the sample timing of the DREQ input in each bus
mode, respectively.

CKIO

Bus cycle CPU CPU DMAC CPU


1st acceptance 2nd acceptance
DREQ Non-sensitive period
(Rising edge)

DACK
(High-active) Acceptance started

Figure 10.13 Example of DREQ Input Detection in Cycle Steal Mode Edge Detection

Rev. 3.00 Jan. 18, 2008 Page 444 of 1458


REJ09B0033-0300
Section 10 Direct Memory Access Controller (DMAC)

CKIO

Bus cycle CPU CPU DMAC CPU


1st acceptance 2nd acceptance
DREQ
(Overrun 0, Non-sensitive period
high-level)
DACK
(High-active) Acceptance started

CKIO

Bus cycle CPU CPU DMAC CPU


1st acceptance 2nd acceptance
DREQ
Non-sensitive period Non-sensitive period
(Overrun 1,
high-level)
DACKn
(High-active) Acceptance started

Figure 10.14 Example of DREQ Input Detection in Cycle Steal Mode Level Detection

CKIO

Bus cycle CPU CPU DMAC DMAC


Burst acceptance
DREQ Non-sensitive period
(Rising edge)

DACK
(High-active)

Figure 10.15 Example of DREQ Input Detection in Burst Mode Edge Detection

Rev. 3.00 Jan. 18, 2008 Page 445 of 1458


REJ09B0033-0300
Section 10 Direct Memory Access Controller (DMAC)

CKIO

Bus cycle CPU CPU DMAC


1st acceptance 2nd acceptance
DREQ
(Overrun 0, Non-sensitive period
high-level)
DACK
(High-active) Acceptance
started

CKIO

Bus cycle CPU CPU DMAC DMAC


1st acceptance 2nd acceptance 3rd acceptance
DREQ
(Overrun 1, Non-sensitive period
high-level)
DACK
(High-active)
Acceptance Acceptance
started started

Figure 10.16 Example of DREQ Input Detection in Burst Mode Level Detection

CKIO

Last DMA transfer


Bus cycle DMAC CPU DMAC CPU CPU

DREQ

DACK

TEND

Figure 10.17 Example of DMA Transfer End in Cycle Steal Mode Level Detection

Rev. 3.00 Jan. 18, 2008 Page 446 of 1458


REJ09B0033-0300
Section 10 Direct Memory Access Controller (DMAC)

When an 8-bit or 16-bit external device is accessed in longword units, or when an 8-bit external
device is accessed in word units, the DACK output is divided because of the data alignment. This
example is illustrated in figure 10.18.

T1 T2 Taw T1 T2

CKIO

Address

CSn

RD

Data

WEn

DACKn
(Active-low)

WAIT

Note: The DACK is asserted for the last transfer unit


of the DMA transfer. When the transfer unit is
divided into several bus cycles and the CSn is
negated between bus cycles, the DACK is also
divided.

Figure 10.18 Example of BSC Ordinary Memory Access


(No Wait, Idle Cycle 1, Longword Access to 16-Bit Device)

Rev. 3.00 Jan. 18, 2008 Page 447 of 1458


REJ09B0033-0300
Section 10 Direct Memory Access Controller (DMAC)

10.5 Usage Notes


Pay attentions to the following notes when the DMAC is used.

10.5.1 Notes on DACK Pin Output

When burst mode and cycle steal mode are simultaneously set in two or more channels, an
additional DACK may be asserted at the end of burst transfer. This phenomenon will occur when
all of the conditions described below are satisfied.
1. When the DMA transfer is simultaneously performed in two or more channels support both
burst mode and cycle steal mode
2. When the channel to be used in burst mode is set to dual address mode, and DACK is output in
data write cycle
3. When the DMAC cannot obtain the bus mastership consecutively even though a transfer
demand of cycle steal has been received after the completion of burst transfer

This phenomenon is avoided by taking either of three measures shown below.

• Measure 1
After confirming the completion of burst transfer (TE bit = 1), perform the DMA transfer of
other cycle steal mode
• Measure 2
The channel to be used in burst mode should not be set to output DACK in data write cycle
• Measure 3
When the DMA transfer is simultaneously performed in two or more channels, set all of the
channels to burst mode or cycle steal mode

10.5.2 Notes on the Cases When DACK is Divided

(1) Overview

When DACK is divided for output while the DMAC is accessing an external device, sampling of
DREQ may be accepted once more during the access.

(2) Conditions and Phenomena

Conditions: In the cases when DACK is divided for output during external access, specifically, the
following cases:

Rev. 3.00 Jan. 18, 2008 Page 448 of 1458


REJ09B0033-0300
Section 10 Direct Memory Access Controller (DMAC)

• 16-byte access
• 32-bit access in an 8-bit space
• 16-bit access in an 8-bit space
• 32-bit access in a 16-bit space,

Any one of the following inter-access idle cycle specifications has been made for that space:

• Idle between write cycles (IWW = 001 or more)


• Idle between read cycles in the same space (IWRRS = 001 or more)
• External wait masking (WM = 0)

Phenomena: For the access patterns above, the DREQ pin signal is detected with the timing shown
in figures 10.19 and 10.21. For other access patterns, DREQ is detected normally as shown in
figures 10.20 and 10.22.

(3) How to Avoid the Problem

For the external accesses under the conditions of 2 above, the problems can be avoided in the
following way:
1. Detection of DREQ edges: During the bus cycle, input a DREQ edge (rising edge) only once at
most.
2. When overrun-0 in DREQ level detection is specified: During the bus cycle, negate the DREQ
input after detection of the first DACK output negation but before the second DACK output
negation takes place.
3. When overrun-1 in DREQ level detection is specified: During the bus cycle, negate the DREQ
input after detection of the first DACK output assertion but before the second DACK output
assertion takes place.

Rev. 3.00 Jan. 18, 2008 Page 449 of 1458


REJ09B0033-0300
Section 10 Direct Memory Access Controller (DMAC)

(4) DREQ Pin Detection Timing Charts

CKIO

Bus cycle CPU DMAC write or read

First acceptance Second acceptance Third acceptance (possible)


DREQ
(rising edge)
Dead zone Dead zone Dead zone
DACK
(active-high)
Acceptance started Acceptance started

Figure 10.19 Timing of DREQ Input Detection by Edge Detection in Cycle Stealing Mode
(DACK is Divided into Four due to Idle Cycle Insertion between Access Cycles and So
DREQ Sampling is Accepted One Extra Time)

CKIO

Bus cycle CPU DMAC write or read

Third
First acceptance Second acceptance acceptance
DREQ
(rising edge)
Dead zone Dead zone Dead zone
DACK
(active-high)
Acceptance Acceptance
started started

Figure 10.20 Timing of DREQ Input Detection by Edge Detection in Cycle Stealing Mode
(DACK is Not Divided By Idle Cycle Insertion between Access Cycles and So DREQ
Sampling is Accepted Normally)

Rev. 3.00 Jan. 18, 2008 Page 450 of 1458


REJ09B0033-0300
Section 10 Direct Memory Access Controller (DMAC)

CKIO

Bus cycle CPU DMAC write or read

Second
DREQ First acceptance acceptance Third acceptance (possible)
(overrun 0,
high level)
Dead zone Dead zone
DACK
(active-high)
Acceptance started

CKIO

Bus cycle CPU DMAC write or read


Second
DREQ First acceptance acceptance Third acceptance (possible)
(overrun 1,
high level)
Dead zone Dead zone
DACK
(active-high)
Acceptance
started

Figure 10.21 Timing of DREQ Input Detection by Level Detection in Cycle Stealing Mode
(DACK is Divided into Four due to Idle Cycle Insertion between Access Cycles and So
DREQ Sampling is Accepted One Extra Time)

Rev. 3.00 Jan. 18, 2008 Page 451 of 1458


REJ09B0033-0300
Section 10 Direct Memory Access Controller (DMAC)

CKIO

Bus cycle CPU DMAC write or read

DREQ First acceptance Second acceptance Third acceptance


(overrun 0,
high level)
Dead zone Dead zone Dead zone
DACK
(high active)
Acceptance Acceptance
started started
CKIO

Bus cycle CPU DMAC write or read

DREQ First acceptance Second acceptance Third acceptance


(overrun 1,
high level)
Dead zone Dead zone Dead zone
DACK
(active-high)
Acceptance started Acceptance started

Figure 10.22 Timing of DREQ Input Detection by Edge Detection in Cycle Stealing Mode
(DACK is Not Divided By Idle Cycle Insertion between Access Cycles and So DREQ
Sampling is Accepted Normally)

10.5.3 Other Notes

1. Before making a transition to standby mode, either wait until DMA transfer finishes or
suspend DMA transfer.
2. If an on-chip peripheral module whose clock supply is to be stopped by the module standby
functio