Abstract
A new timing-driven partitioning-based placement tool for 3D FPGA integration is presented. The circuit is first divided into layers with limited number of inter-layer vias, and then placement is performed on individual layers, while minimizing the delay of critical paths. We use our tool as a platform for exploring potential benefits in terms of delay and wire-length that 3D technologies can offer for FPGA fabrics. We show that 3D integration results in wire-length reduction for FPGA designs. Our empirical analysis shows that wire-length can be reduced by up to 50% using ten layers. Delay reductions are estimated to be more than 30% if multi-segment lengths are employed between layers.
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Ababei, C., Maidee, P., Bazargan, K. (2004). Exploring Potential Benefits of 3D FPGA Integration. In: Becker, J., Platzner, M., Vernalde, S. (eds) Field Programmable Logic and Application. FPL 2004. Lecture Notes in Computer Science, vol 3203. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-540-30117-2_92
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DOI: https://doi.org/10.1007/978-3-540-30117-2_92
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