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Link to original content: https://doi.org/10.1093/ietele/e89-c.4.551
IEICE Trans - Band-Stop Filter Effect of Power/Ground Plane on Through-Hole Signal Via in Multilayer PCB


Band-Stop Filter Effect of Power/Ground Plane on Through-Hole Signal Via in Multilayer PCB

Jun So PAK
Masahiro AOYAGI
Katsuya KIKUCHI
Joungho KIM

Publication
IEICE TRANSACTIONS on Electronics   Vol.E89-C    No.4    pp.551-559
Publication Date: 2006/04/01
Online ISSN: 1745-1353
DOI: 10.1093/ietele/e89-c.4.551
Print ISSN: 0916-8516
Type of Manuscript: PAPER
Category: Electronic Components
Keyword: 
power/ground plane,  signal via,  return current,  signal integrity,  power integrity,  radiated emission,  

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Summary: 
The effect of the power/ground plane on the through-hole signal via is analyzed in a viewpoint of a band-stop filter. When the through-hole signal via passes through the power/ground plane, the return current path discontinuity of the through-hole signal via occurs due to the high impedance of the power/ground plane. Since the high impedance is produced by the power/ground plane resonance, it acts as a band-stop filter, which is connected to the signal trace in series. Therefore, the power/ground plane filters off its resonance frequency component by absorbing and reflecting from the signal on the through-hole signal via, and consequently the signal distortion, the power/ground plane noise voltage, and the consequent radiated emission occur. With S-parameter and TDR-TDT measurements, the band-stop effect of the power/ground plane on the through-hole signal via is confirmed. And then, this analysis is applied to the clock transmission through the through-hole signal via to obtain the clearer confirmation. The measurements of the distorted clock waveforms, the induced power/ground plane noise voltages, and the radiated emissions depending on the power/ground plane impedance around the through-hole signal via are shown.