A soluble polymer layer can be structured by means of solvent drops etching. The inkjet etching (IJE), innovative technique that consists of ejecting liquid material in controlled manner in terms of both volume amount (10–100 pL) and positioning on the substrate (μm resolution), allows to manufacture suitable shaped microstructures on top of polymer surfaces. In the present work we fabricated IJ etched polymer microstructures whose shape varies from concave to convex by employing a pure solvent or solvent mixtures with suitable mixing ratio of the solvents. The manufactured structure profile has been analyzed and the related geometrical parameters, i.e. depth, diameter and height, have been valuated as function of the drops number. Preliminary tests have been performed in order to employ the IJ etched polymer microstructures with the aim to improve the out‐coupling efficiency of organic light‐emitting diodes.
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2 June 2010
V INTERNATIONAL CONFERENCE ON TIMES OF POLYMERS (TOP) AND COMPOSITES
20–23 June 2010
Ischia (Italy)
Research Article|
June 02 2010
Inkjet Etching of Polymer Surfaces to Manufacture Microstructures for OLED Applications
I. A. Grimaldi;
I. A. Grimaldi
Portici ENEA Research Center, Piazzale E. Fermi I, 80055 Portici (NA), Italy
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A. De Girolamo Del Mauro;
A. De Girolamo Del Mauro
Portici ENEA Research Center, Piazzale E. Fermi I, 80055 Portici (NA), Italy
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G. Nenna;
G. Nenna
Portici ENEA Research Center, Piazzale E. Fermi I, 80055 Portici (NA), Italy
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F. Loffredo;
F. Loffredo
Portici ENEA Research Center, Piazzale E. Fermi I, 80055 Portici (NA), Italy
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C. Minarini;
C. Minarini
Portici ENEA Research Center, Piazzale E. Fermi I, 80055 Portici (NA), Italy
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F. Villani
F. Villani
Portici ENEA Research Center, Piazzale E. Fermi I, 80055 Portici (NA), Italy
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AIP Conf. Proc. 1255, 104–106 (2010)
Citation
I. A. Grimaldi, A. De Girolamo Del Mauro, G. Nenna, F. Loffredo, C. Minarini, F. Villani; Inkjet Etching of Polymer Surfaces to Manufacture Microstructures for OLED Applications. AIP Conf. Proc. 2 June 2010; 1255 (1): 104–106. https://doi.org/10.1063/1.3455544
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