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Link to original content: https://dblp.uni-trier.de/rec/journals/candie/KimKLCCP17.ris
Provider: Schloss Dagstuhl - Leibniz Center for Informatics Database: dblp computer science bibliography Content:text/plain; charset="utf-8" TY - JOUR ID - DBLP:journals/candie/KimKLCCP17 AU - Kim, Misuk AU - Kang, Seokho AU - Lee, Jehyuk AU - Cho, Hyunchang AU - Cho, Sungzoon AU - Park, Jee Su TI - Virtual metrology for copper-clad laminate manufacturing. JO - Comput. Ind. Eng. VL - 109 SP - 280 EP - 287 PY - 2017// DO - 10.1016/J.CIE.2017.04.016 UR - https://doi.org/10.1016/j.cie.2017.04.016 ER -