Provider: Schloss Dagstuhl - Leibniz Center for Informatics
Database: dblp computer science bibliography
Content:text/plain; charset="utf-8"
TY - CPAPER
ID - DBLP:conf/aimech/LiuLZTT17
AU - Liu, Dong
AU - Liang, Wenyu
AU - Zhu, Haiyue
AU - Teo, Chek Sing
AU - Tan, Kok Kiong
TI - Development of a distributed Bernoulli gripper for ultra-thin wafer handling.
BT - IEEE International Conference on Advanced Intelligent Mechatronics, AIM 2017, Munich, Germany, July 3-7, 2017
SP - 265
EP - 270
PY - 2017//
DO - 10.1109/AIM.2017.8014028
UR - https://doi.org/10.1109/AIM.2017.8014028
ER -
