dblp: Stefano de Filippis
https://dblp.org/pid/94/10632.html
dblp person page RSS feedMon, 07 Oct 2024 22:08:30 +0200en-USdaily1released under the CC0 1.0 licensedblp@dagstuhl.de (dblp team)dblp@dagstuhl.de (dblp team)Computers/Computer_Science/Publications/Bibliographieshttp://www.rssboard.org/rss-specificationhttps://dblp.org/img/logo.144x51.pngdblp: Stefano de Filippishttps://dblp.org/pid/94/10632.html14451FEM simulation approach to investigate electro-thermal behavior of power transistors in 3-D.https://doi.org/10.1016/j.microrel.2012.09.002Vladimír Kosel, Stefano de Filippis, Liu Chen, Stefan Decker, Andrea Irace: FEM simulation approach to investigate electro-thermal behavior of power transistors in 3-D.Microelectron. Reliab.53(3): 356-362 (2013)]]>https://dblp.org/rec/journals/mr/KoselFCDI13Tue, 01 Jan 2013 00:00:00 +0100Modeling of highly anisotropic microstructures for electro-thermal simulations of power semiconductor devices.https://doi.org/10.1016/j.microrel.2012.06.103Stefano de Filippis, Helmut Köck, Michael Nelhiebel, Vladimír Kosel, Stefan Decker, Michael Glavanovics, Andrea Irace: Modeling of highly anisotropic microstructures for electro-thermal simulations of power semiconductor devices.Microelectron. Reliab.52(9-10): 2374-2379 (2012)]]>https://dblp.org/rec/journals/mr/FilippisKNKDGI12Sun, 01 Jan 2012 00:00:00 +0100Improved thermal management of low voltage power devices with optimized bond wire positions.https://doi.org/10.1016/j.microrel.2011.06.052Helmut Köck, Christian Djelassi, Stefano de Filippis, Robert Illing, Michael Nelhiebel, Markus Ladurner, Michael Glavanovics, Dionyz Pogany: Improved thermal management of low voltage power devices with optimized bond wire positions.Microelectron. Reliab.51(9-11): 1913-1918 (2011)]]>https://dblp.org/rec/journals/mr/KockDFINLGP11Sat, 01 Jan 2011 00:00:00 +0100ANSYS based 3D electro-thermal simulations for the evaluation of power MOSFETs robustness.https://doi.org/10.1016/j.microrel.2011.06.047Stefano de Filippis, Vladimír Kosel, Donald Dibra, Stefan Decker, Helmut Köck, Andrea Irace: ANSYS based 3D electro-thermal simulations for the evaluation of power MOSFETs robustness.Microelectron. Reliab.51(9-11): 1954-1958 (2011)]]>https://dblp.org/rec/journals/mr/FilippisKDDKI11Sat, 01 Jan 2011 00:00:00 +0100