Provider: Schloss Dagstuhl - Leibniz Center for Informatics
Database: dblp computer science bibliography
Content:text/plain; charset="utf-8"
TY - THES
ID - DBLP:phd/ndltd/Chen05a
AU - Chen, Kuan-Neng
TI - Copper wafer bonding in three-dimensional integration.
PY - 2005//
UR - https://hdl.handle.net/1721.1/30156
ER -