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Link to original content: https://dblp.org/rec/journals/tie/DingWSY23.xml
Yi Ding Yalin Wang 0016 Hao Sun Yi Yin High-Temperature Partial Discharge Characteristics of Power Module Packaging Insulation Under Square Pulse With High Dv/Dt Based on Down-Mixing Method. 7334-7342 2023 July 70 IEEE Trans. Ind. Electron. 7 https://doi.org/10.1109/TIE.2022.3201276 db/journals/tie/tie70.html#DingWSY23