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https://dblp.org/rec/journals/tcad/ChenTWC22.ttl
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; rdfs:label "Kun-Chih Chen et al.: Thermal Sensor Placement for Multicore Systems Based on Low-Complex Compressive Sensing Theory. (2022)" ; dblp:doi
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; a dblp:AuthorSignature, dblp:Signature ], [ dblp:signatureDblpName "Hsueh-Wen Tang" ; dblp:signatureCreator
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; a dblp:AuthorSignature, dblp:Signature ], [ dblp:signatureDblpName "Chi-Hsun Wu" ; dblp:signatureCreator
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; a dblp:AuthorSignature, dblp:Signature ], [ dblp:signatureDblpName "Chia-Hsin Chen" ; dblp:signatureCreator
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; dblp:pagination "5100-5111" ; dblp:publishedIn "IEEE Trans. Comput. Aided Des. Integr. Circuits Syst." ; dblp:publishedInJournal "IEEE Trans. Comput. Aided Des. Integr. Circuits Syst." ; dblp:publishedInJournalVolume "41" ; dblp:publishedInJournalVolumeIssue "11" ; dblp:yearOfPublication "2022"^^
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