Provider: Schloss Dagstuhl - Leibniz Center for Informatics
Database: dblp computer science bibliography
Content:text/plain; charset="utf-8"
TY - JOUR
ID - DBLP:journals/mr/TangCC12
AU - Tang, Ya-Sheng
AU - Chang, Yao-Jen
AU - Chen, Kuan-Neng
TI - Wafer-level Cu-Cu bonding technology.
JO - Microelectron. Reliab.
VL - 52
IS - 2
SP - 312
EP - 320
PY - 2012//
DO - 10.1016/J.MICROREL.2011.04.016
UR - https://doi.org/10.1016/j.microrel.2011.04.016
ER -