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Link to original content: https://dblp.org/rec/journals/mr/TangCC12.ris
Provider: Schloss Dagstuhl - Leibniz Center for Informatics Database: dblp computer science bibliography Content:text/plain; charset="utf-8" TY - JOUR ID - DBLP:journals/mr/TangCC12 AU - Tang, Ya-Sheng AU - Chang, Yao-Jen AU - Chen, Kuan-Neng TI - Wafer-level Cu-Cu bonding technology. JO - Microelectron. Reliab. VL - 52 IS - 2 SP - 312 EP - 320 PY - 2012// DO - 10.1016/J.MICROREL.2011.04.016 UR - https://doi.org/10.1016/j.microrel.2011.04.016 ER -