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Link to original content: https://dblp.org/rec/journals/mr/MelamedWNSKA16.xml
Samson Melamed Naoya Watanabe Shunsuke Nemoto Haruo Shimamoto Katsuya Kikuchi Masahiro Aoyagi Impact of thinning stacked dies on the thermal resistance of bump-bonded three-dimensional integrated circuits. 2-8 2016 67 Microelectron. Reliab. https://doi.org/10.1016/j.microrel.2016.08.015 db/journals/mr/mr67.html#MelamedWNSKA16