Provider: Schloss Dagstuhl - Leibniz Center for Informatics
Database: dblp computer science bibliography
Content:text/plain; charset="utf-8"
TY - JOUR
ID - DBLP:journals/mr/LeeBHW17
AU - Lee, Hosung
AU - Baeg, Sanghyeon
AU - Hua, Nelson
AU - Wen, Shi-Jie
TI - Temporal and frequency characteristic analysis of margin-related failures caused by an intermittent nano-scale fracture of the solder ball in a BGA package device.
JO - Microelectron. Reliab.
VL - 69
SP - 88
EP - 99
PY - 2017//
DO - 10.1016/J.MICROREL.2016.12.010
UR - https://doi.org/10.1016/j.microrel.2016.12.010
ER -