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Link to original content: https://dblp.org/rec/journals/mr/LeeBHW17.ris
Provider: Schloss Dagstuhl - Leibniz Center for Informatics Database: dblp computer science bibliography Content:text/plain; charset="utf-8" TY - JOUR ID - DBLP:journals/mr/LeeBHW17 AU - Lee, Hosung AU - Baeg, Sanghyeon AU - Hua, Nelson AU - Wen, Shi-Jie TI - Temporal and frequency characteristic analysis of margin-related failures caused by an intermittent nano-scale fracture of the solder ball in a BGA package device. JO - Microelectron. Reliab. VL - 69 SP - 88 EP - 99 PY - 2017// DO - 10.1016/J.MICROREL.2016.12.010 UR - https://doi.org/10.1016/j.microrel.2016.12.010 ER -