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Link to original content: https://dblp.org/rec/journals/mr/GainCY11.xml
Asit Kumar Gain Y. C. Chan Winco K. C. Yung Microstructure, thermal analysis and hardness of a Sn-Ag-Cu-1 wt% nano-TiO<sub>2</sub> composite solder on flexible ball grid array substrates. 975-984 2011 51 Microelectron. Reliab. 5 https://doi.org/10.1016/j.microrel.2011.01.006 https://www.wikidata.org/entity/Q59192182 db/journals/mr/mr51.html#GainCY11