Asit Kumar GainY. C. ChanWinco K. C. YungMicrostructure, thermal analysis and hardness of a Sn-Ag-Cu-1 wt% nano-TiO2 composite solder on flexible ball grid array substrates.975-984201151Microelectron. Reliab.5https://doi.org/10.1016/j.microrel.2011.01.006https://www.wikidata.org/entity/Q59192182db/journals/mr/mr51.html#GainCY11