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Link to original content: https://dblp.org/rec/journals/mr/GainCSWY09.xml
Asit Kumar Gain Y. C. Chan Ahmed Sharif N. B. Wong Winco K. C. Yung Interfacial microstructure and shear strength of Ag nano particle doped Sn-9Zn solder in ball grid array packages. 746-753 2009 49 Microelectron. Reliab. 7 https://doi.org/10.1016/j.microrel.2009.05.004 https://www.wikidata.org/entity/Q57923851 db/journals/mr/mr49.html#GainCSWY09