Asit Kumar GainY. C. ChanGrowth mechanism of intermetallic compounds and damping properties of Sn-Ag-Cu-1 wt% nano-ZrO2 composite solders.945-955201454Microelectron. Reliab.5https://doi.org/10.1016/j.microrel.2014.01.026db/journals/mr/mr54.html#GainC14