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Link to original content: https://dblp.org/rec/journals/mr/GainC14.xml
Asit Kumar Gain Y. C. Chan Growth mechanism of intermetallic compounds and damping properties of Sn-Ag-Cu-1 wt% nano-ZrO<sub>2</sub> composite solders. 945-955 2014 54 Microelectron. Reliab. 5 https://doi.org/10.1016/j.microrel.2014.01.026 db/journals/mr/mr54.html#GainC14