Y. C. ChanD. Y. LukEffects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects for flip-chip-on-flex packages assembly II. Different bonding pressure.1195-1204200242Microelectron. Reliab.8https://doi.org/10.1016/S0026-2714(02)00089-6db/journals/mr/mr42.html#ChanL02a