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Link to original content: https://dblp.org/rec/journals/mr/ChanL02a.xml
Y. C. Chan D. Y. Luk Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects for flip-chip-on-flex packages assembly II. Different bonding pressure. 1195-1204 2002 42 Microelectron. Reliab. 8 https://doi.org/10.1016/S0026-2714(02)00089-6 db/journals/mr/mr42.html#ChanL02a