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https://dblp.org/rec/journals/mr/ChanL02.nt
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"Y. C. Chan and D. Y. Luk: Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects for flip-chip-on-flex packages assembly I. Different bonding temperature. (2002)" .
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_:ID_8f25b99054c959046f1af5a69a75adc3 . _:ID_8f25b99054c959046f1af5a69a75adc3
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"journals/mr/ChanL02" .
_:ID_528cbf3923102c4762c42c57b0fc5546 . _:ID_528cbf3923102c4762c42c57b0fc5546
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"10.1016/S0026-2714(02)00079-3" .
"Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects for flip-chip-on-flex packages assembly I. Different bonding temperature." .
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"2"^^
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_:Sig_2d74e0e078b524c00d6a1cf6be61797f_1 . _:Sig_2d74e0e078b524c00d6a1cf6be61797f_1
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"Y. C. Chan" . _:Sig_2d74e0e078b524c00d6a1cf6be61797f_1
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"1"^^
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_:Sig_2d74e0e078b524c00d6a1cf6be61797f_2 . _:Sig_2d74e0e078b524c00d6a1cf6be61797f_2
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"D. Y. Luk" . _:Sig_2d74e0e078b524c00d6a1cf6be61797f_2
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"2"^^
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"1185-1194" .
"Microelectron. Reliab." .
"Microelectron. Reliab." .
"42" .
"8" .
"2002"^^
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"provenance information for RDF data of dblp record 'journals/mr/ChanL02'" .
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"2020-02-22T19:28:06+0100" .
