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https://dblp.org/rec/journals/ibmrd/AndryTWSWDM08.ttl
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; rdfs:label "Paul S. Andry et al.: Fabrication and characterization of robust through-silicon vias for silicon-carrier applications. (2008)" ; dblp:doi
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; dblp:pagination "571-581" ; dblp:publishedIn "IBM J. Res. Dev." ; dblp:publishedInJournal "IBM J. Res. Dev." ; dblp:publishedInJournalVolume "52" ; dblp:publishedInJournalVolumeIssue "6" ; dblp:yearOfPublication "2008"^^
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