Provider: Schloss Dagstuhl - Leibniz Center for Informatics
Database: dblp computer science bibliography
Content:text/plain; charset="utf-8"
TY - JOUR
ID - DBLP:journals/ibmrd/AndryTWSWDM08
AU - Andry, Paul S.
AU - Tsang, Cornelia K.
AU - Webb, Bucknell C.
AU - Sprogis, Edmund J.
AU - Wright, Steven L.
AU - Dang, Bing
AU - Manzer, Dennis G.
TI - Fabrication and characterization of robust through-silicon vias for silicon-carrier applications.
JO - IBM J. Res. Dev.
VL - 52
IS - 6
SP - 571
EP - 581
PY - 2008//
DO - 10.1147/JRD.2008.5388558
UR - https://doi.org/10.1147/JRD.2008.5388558
ER -
