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Link to original content: https://dblp.org/rec/conf/irps/LiangYSHJLP18.rdf
Xianhu Liang et al.: Enhanced reliability of hexagonal boron nitride dielectric stacks due to high thermal conductivity. (2018) conf/irps/LiangYSHJLP18 10.1109/IRPS.2018.8353666 Enhanced reliability of hexagonal boron nitride dielectric stacks due to high thermal conductivity. 7 Xianhu Liang 1 Bin Yuan 2 Yuanyuan Shi 3 Fei Hui 4 Xu Jing 5 Mario Lanza 6 Felix Palumbo 7 6-1 IRPS IRPS 2018 2018 provenance information for RDF data of dblp record 'conf/irps/LiangYSHJLP18' 2019-05-29T09:36:12+0200