Xianhu Liang et al.: Enhanced reliability of hexagonal boron nitride dielectric stacks due to high thermal conductivity. (2018)conf/irps/LiangYSHJLP1810.1109/IRPS.2018.8353666Enhanced reliability of hexagonal boron nitride dielectric stacks due to high thermal conductivity.7Xianhu Liang1Bin Yuan2Yuanyuan Shi3Fei Hui4Xu Jing5Mario Lanza6Felix Palumbo76-1IRPSIRPS20182018provenance information for RDF data of dblp record 'conf/irps/LiangYSHJLP18'2019-05-29T09:36:12+0200