BibTeX record conf/iccad/ZhaoWSL13

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@inproceedings{DBLP:conf/iccad/ZhaoWSL13,
  author       = {Xin Zhao and
                  Yang Wan and
                  Michael Scheuermann and
                  Sung Kyu Lim},
  editor       = {J{\"{o}}rg Henkel},
  title        = {Transient modeling of TSV-wire electromigration and lifetime analysis
                  of power distribution network for 3D ICs},
  booktitle    = {The {IEEE/ACM} International Conference on Computer-Aided Design,
                  ICCAD'13, San Jose, CA, USA, November 18-21, 2013},
  pages        = {363--370},
  publisher    = {{IEEE}},
  year         = {2013},
  url          = {https://doi.org/10.1109/ICCAD.2013.6691144},
  doi          = {10.1109/ICCAD.2013.6691144},
  timestamp    = {Sun, 02 Oct 2022 16:03:59 +0200},
  biburl       = {https://dblp.org/rec/conf/iccad/ZhaoWSL13.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}