Provider: Schloss Dagstuhl - Leibniz Center for Informatics
Database: dblp computer science bibliography
Content:text/plain; charset="utf-8"
TY - CPAPER
ID - DBLP:conf/dac/VannaIampikulZEKAGRL23
AU - Vanna-Iampikul, Pruek
AU - Zhu, Lingjun
AU - Erdogan, Serhat
AU - Kathaperumal, Mohanalingam
AU - Agarwal, Ravi
AU - Gupta, Ram
AU - Rinebold, Kevin
AU - Lim, Sung Kyu
TI - Glass Interposer Integration of Logic and Memory Chiplets: PPA and Power/Signal Integrity Benefits.
BT - 60th ACM/IEEE Design Automation Conference, DAC 2023, San Francisco, CA, USA, July 9-13, 2023
SP - 1
EP - 6
PY - 2023//
DO - 10.1109/DAC56929.2023.10247949
UR - https://doi.org/10.1109/DAC56929.2023.10247949
ER -
