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https://dblp.org/rec/conf/dac/KimZTSL21.nt
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"Jinwoo Kim et al.: Micro-bumping, Hybrid Bonding, or Monolithic? A PPA Study for Heterogeneous 3D IC Options. (2021)" .
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_:ID_6ffb5be7f3bf10eebda51f1627769c6f . _:ID_6ffb5be7f3bf10eebda51f1627769c6f
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"conf/dac/KimZTSL21" .
_:ID_11df4837d1c03cebe68b144e80b0ea72 . _:ID_11df4837d1c03cebe68b144e80b0ea72
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"10.1109/DAC18074.2021.9586229" .
"Micro-bumping, Hybrid Bonding, or Monolithic? A PPA Study for Heterogeneous 3D IC Options." .
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"5"^^
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_:Sig_866f73a543789632d41936d3773021b3_1 . _:Sig_866f73a543789632d41936d3773021b3_1
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"Jinwoo Kim" . _:Sig_866f73a543789632d41936d3773021b3_1
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"1"^^
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_:Sig_866f73a543789632d41936d3773021b3_2 . _:Sig_866f73a543789632d41936d3773021b3_2
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"Lingjun Zhu" . _:Sig_866f73a543789632d41936d3773021b3_2
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"2"^^
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_:Sig_866f73a543789632d41936d3773021b3_3 . _:Sig_866f73a543789632d41936d3773021b3_3
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"Hakki Mert Torun" . _:Sig_866f73a543789632d41936d3773021b3_3
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"3"^^
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_:Sig_866f73a543789632d41936d3773021b3_4 . _:Sig_866f73a543789632d41936d3773021b3_4
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"Madhavan Swaminathan" . _:Sig_866f73a543789632d41936d3773021b3_4
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"4"^^
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_:Sig_866f73a543789632d41936d3773021b3_5 . _:Sig_866f73a543789632d41936d3773021b3_5
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"Sung Kyu Lim" . _:Sig_866f73a543789632d41936d3773021b3_5
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"5"^^
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"1189-1194" .
"DAC" .
"DAC" .
"2021"^^
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"2021"^^
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"provenance information for RDF data of dblp record 'conf/dac/KimZTSL21'" .
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"2022-10-02T15:58:45+0200" .