Ligang Hou et al.: TSV based 3D IC wire length calculation algorithm. (2011)conf/asicon/HouBW1110.1109/ASICON.2011.6157330TSV based 3D IC wire length calculation algorithm.3Ligang Hou1Shu Bai2Jinhui Wang3816-819ASICONASICON20112011provenance information for RDF data of dblp record 'conf/asicon/HouBW11'2017-05-25T00:43:35+0200