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Link to original content: https://dblp.org/rec/conf/asicon/HouBW11.rdf
Ligang Hou et al.: TSV based 3D IC wire length calculation algorithm. (2011) conf/asicon/HouBW11 10.1109/ASICON.2011.6157330 TSV based 3D IC wire length calculation algorithm. 3 Ligang Hou 1 Shu Bai 2 Jinhui Wang 3 816-819 ASICON ASICON 2011 2011 provenance information for RDF data of dblp record 'conf/asicon/HouBW11' 2017-05-25T00:43:35+0200