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Link to original content: https://dblp.org/rec/conf/asiasim/DingBHCC22.ris
Provider: Schloss Dagstuhl - Leibniz Center for Informatics Database: dblp computer science bibliography Content:text/plain; charset="utf-8" TY - CPAPER ID - DBLP:conf/asiasim/DingBHCC22 AU - Ding, Ling AU - Bai, Jiuyang AU - Hu, Weiye AU - Chang, Hui AU - Chen, Fuwen TI - Simulation of Microstructure Evolution of Ti-3Al-2Fe Alloy as Fabricated by VAR. BT - Methods and Applications for Modeling and Simulation of Complex Systems - 21st Asia Simulation Conference, AsiaSim 2022, Changsha, China, December 9-11, 2022, Proceedings, Part II SP - 288 EP - 300 PY - 2022// DO - 10.1007/978-981-19-9195-0_24 UR - https://doi.org/10.1007/978-981-19-9195-0_24 ER -