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Link to original content: https://dblp.org/rec/conf/3dic/SukharevKC19.rdf
Valeriy Sukharev et al.: An Accurate Assessment of Chip-Package Interaction is a Key Factor for Designing Resilient 3D IC Systems. (2019) conf/3dic/SukharevKC19 10.1109/3DIC48104.2019.9058854 An Accurate Assessment of Chip-Package Interaction is a Key Factor for Designing Resilient 3D IC Systems. 3 Valeriy Sukharev 1 Armen Kteyan 2 Jun-Ho Choy 3 1-6 3DIC 3DIC 2019 2019 provenance information for RDF data of dblp record 'conf/3dic/SukharevKC19' 2020-04-19T18:57:24+0200