Valeriy Sukharev et al.: An Accurate Assessment of Chip-Package Interaction is a Key Factor for Designing Resilient 3D IC Systems. (2019)conf/3dic/SukharevKC1910.1109/3DIC48104.2019.9058854An Accurate Assessment of Chip-Package Interaction is a Key Factor for Designing Resilient 3D IC Systems.3Valeriy Sukharev1Armen Kteyan2Jun-Ho Choy31-63DIC3DIC20192019provenance information for RDF data of dblp record 'conf/3dic/SukharevKC19'2020-04-19T18:57:24+0200