Provider: Schloss Dagstuhl - Leibniz Center for Informatics
Database: dblp computer science bibliography
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TY - CPAPER
ID - DBLP:conf/3dic/ShigetouYK19
AU - Shigetou, Akitsu
AU - Yang, Tilo H.
AU - Kao, C. Robert
TI - Hydrolysis-Tolerant Hybrid Bonding in Ambient Atmosphere for 3D Integration.
BT - 2019 International 3D Systems Integration Conference (3DIC), Sendai, Japan, October 8-10, 2019
SP - 1
EP - 3
PY - 2019//
DO - 10.1109/3DIC48104.2019.9058786
UR - https://doi.org/10.1109/3DIC48104.2019.9058786
ER -