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Link to original content: https://dblp.org/rec/conf/3dic/ShigetouYK19.ris
Provider: Schloss Dagstuhl - Leibniz Center for Informatics Database: dblp computer science bibliography Content:text/plain; charset="utf-8" TY - CPAPER ID - DBLP:conf/3dic/ShigetouYK19 AU - Shigetou, Akitsu AU - Yang, Tilo H. AU - Kao, C. Robert TI - Hydrolysis-Tolerant Hybrid Bonding in Ambient Atmosphere for 3D Integration. BT - 2019 International 3D Systems Integration Conference (3DIC), Sendai, Japan, October 8-10, 2019 SP - 1 EP - 3 PY - 2019// DO - 10.1109/3DIC48104.2019.9058786 UR - https://doi.org/10.1109/3DIC48104.2019.9058786 ER -