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Link to original content: https://dblp.org/rec/conf/3dic/SeoPK19.ris
Provider: Schloss Dagstuhl - Leibniz Center for Informatics Database: dblp computer science bibliography Content:text/plain; charset="utf-8" TY - CPAPER ID - DBLP:conf/3dic/SeoPK19 AU - Seo, Han Kyeol AU - Park, Hae-Sung AU - Kim, Sarah Eunkyung TI - Effects of Argon and Nitrogen ion Bombardments on Sputtered and Electroplated Cu Surfaces for Cu Bonding Application. BT - 2019 International 3D Systems Integration Conference (3DIC), Sendai, Japan, October 8-10, 2019 SP - 1 EP - 4 PY - 2019// DO - 10.1109/3DIC48104.2019.9058789 UR - https://doi.org/10.1109/3DIC48104.2019.9058789 ER -