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Link to original content: https://dblp.org/rec/conf/3dic/MurugesanSSMSFK21.xml
Mariappan Murugesan E. Sone A. Simomura Makoto Motoyoshi M. Sawa K. Fukuda Mitsumasa Koyanagi Takafumi Fukushima Cu-Cu Direct Bonding Through Highly Oriented Cu Grains for 3D-LSI Applications. 1-4 2021 3DIC https://doi.org/10.1109/3DIC52383.2021.9687604 conf/3dic/2021 db/conf/3dic/3dic2021.html#MurugesanSSMSFK21