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Link to original content: https://dblp.org/rec/conf/3dic/MurugesanSSMSFK21.ris
Provider: Schloss Dagstuhl - Leibniz Center for Informatics Database: dblp computer science bibliography Content:text/plain; charset="utf-8" TY - CPAPER ID - DBLP:conf/3dic/MurugesanSSMSFK21 AU - Murugesan, Mariappan AU - Sone, E. AU - Simomura, A. AU - Motoyoshi, Makoto AU - Sawa, M. AU - Fukuda, K. AU - Koyanagi, Mitsumasa AU - Fukushima, Takafumi TI - Cu-Cu Direct Bonding Through Highly Oriented Cu Grains for 3D-LSI Applications. BT - IEEE International 3D Systems Integration Conference, 3DIC 2021, Raleigh, NC, USA, October 26-29, 2021 SP - 1 EP - 4 PY - 2021// DO - 10.1109/3DIC52383.2021.9687604 UR - https://doi.org/10.1109/3DIC52383.2021.9687604 ER -