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https://dblp.org/rec/conf/3dic/LeeCLIKCO19.nt
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"Chia-Hsuan Lee et al.: Temperature Cycling Reliability of WOW Bumpless Through Silicon Vias. (2019)" .
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_:ID_9ccd39da6041ad71ae886eb94b1192b0 . _:ID_9ccd39da6041ad71ae886eb94b1192b0
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"conf/3dic/LeeCLIKCO19" .
_:ID_b468521f734d0f34c9499794249d7fff . _:ID_b468521f734d0f34c9499794249d7fff
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"10.1109/3DIC48104.2019.9058776" .
"Temperature Cycling Reliability of WOW Bumpless Through Silicon Vias." .
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"7"^^
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_:Sig_835b3521918b5b2d95166a007c5b406c_1 . _:Sig_835b3521918b5b2d95166a007c5b406c_1
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"Chia-Hsuan Lee 0003" . _:Sig_835b3521918b5b2d95166a007c5b406c_1
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"1"^^
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_:Sig_835b3521918b5b2d95166a007c5b406c_2 . _:Sig_835b3521918b5b2d95166a007c5b406c_2
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"Hsin-Chi Chang" . _:Sig_835b3521918b5b2d95166a007c5b406c_2
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"2"^^
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_:Sig_835b3521918b5b2d95166a007c5b406c_3 . _:Sig_835b3521918b5b2d95166a007c5b406c_3
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"Jui-Han Liu" . _:Sig_835b3521918b5b2d95166a007c5b406c_3
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"3"^^
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_:Sig_835b3521918b5b2d95166a007c5b406c_4 . _:Sig_835b3521918b5b2d95166a007c5b406c_4
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"Hiroyuki Ito" . _:Sig_835b3521918b5b2d95166a007c5b406c_4
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"4"^^
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_:Sig_835b3521918b5b2d95166a007c5b406c_5 . _:Sig_835b3521918b5b2d95166a007c5b406c_5
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"Young-Suk Kim" . _:Sig_835b3521918b5b2d95166a007c5b406c_5
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"5"^^
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_:Sig_835b3521918b5b2d95166a007c5b406c_6 . _:Sig_835b3521918b5b2d95166a007c5b406c_6
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"Kuan-Neng Chen" . _:Sig_835b3521918b5b2d95166a007c5b406c_6
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"6"^^
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_:Sig_835b3521918b5b2d95166a007c5b406c_7 . _:Sig_835b3521918b5b2d95166a007c5b406c_7
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"Takayuki Ohba" . _:Sig_835b3521918b5b2d95166a007c5b406c_7
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"7"^^
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"1-4" .
"3DIC" .
"3DIC" .
"2019"^^
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"2019"^^
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"provenance information for RDF data of dblp record 'conf/3dic/LeeCLIKCO19'" .
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"2021-11-03T08:48:34+0100" .