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Link to original content: https://dblp.org/rec/conf/3dic/KoHCCHFHCTCLC11.rdf
Cheng-Ta Ko et al.: Wafer-level 3D integration with Cu TSV and micro-bump/adhesive hybrid bonding technologies. (2011) conf/3dic/KoHCCHFHCTCLC11 10.1109/3DIC.2012.6262949 Wafer-level 3D integration with Cu TSV and micro-bump/adhesive hybrid bonding technologies. 12 Cheng-Ta Ko 1 Zhi-Cheng Hsiao 2 Y. J. Chang 3 Peng-Shu Chen 4 J. H. Huang 5 Hsin-Chia Fu 6 Y. J. Huang 7 C. W. Chiang 8 W. L. Tsat 9 Y. H. Chen 10 Wei-Chung Lo 11 Kuan-Neng Chen 12 1-4 3DIC 3DIC 2011 2012 provenance information for RDF data of dblp record 'conf/3dic/KoHCCHFHCTCLC11' 2017-09-16T12:09:38+0200