iBet uBet web content aggregator. Adding the entire web to your favor.
iBet uBet web content aggregator. Adding the entire web to your favor.



Link to original content: https://dblp.org/rec/conf/3dic/HamaguchiNSSN19.ris
Provider: Schloss Dagstuhl - Leibniz Center for Informatics Database: dblp computer science bibliography Content:text/plain; charset="utf-8" TY - CPAPER ID - DBLP:conf/3dic/HamaguchiNSSN19 AU - Hamaguchi, Koji AU - Nakata, Mitsuki AU - Segawa, Kouta AU - Suzuki, Naoya AU - Nonaka, Toshihisa TI - Investigation of the Influence of Material Properties on Warpage and Solder Joint Reliability of 2.5D & FO Package. BT - 2019 International 3D Systems Integration Conference (3DIC), Sendai, Japan, October 8-10, 2019 SP - 1 EP - 6 PY - 2019// DO - 10.1109/3DIC48104.2019.9058902 UR - https://doi.org/10.1109/3DIC48104.2019.9058902 ER -