Koji Hamaguchi et al.: Investigation of the Influence of Material Properties on Warpage and Solder Joint Reliability of 2.5D & FO Package. (2019)conf/3dic/HamaguchiNSSN1910.1109/3DIC48104.2019.9058902Investigation of the Influence of Material Properties on Warpage and Solder Joint Reliability of 2.5D & FO Package.5Koji Hamaguchi1Mitsuki Nakata2Kouta Segawa3Naoya Suzuki4Toshihisa Nonaka51-63DIC3DIC20192019provenance information for RDF data of dblp record 'conf/3dic/HamaguchiNSSN19'2020-04-19T18:57:24+0200