Chuan-An Cheng et al.: Electrical investigation of Cu pumping in through-silicon vias for BEOL reliability in 3D integration. (2015)conf/3dic/ChengSUCCC1510.1109/3DIC.2015.7334581Electrical investigation of Cu pumping in through-silicon vias for BEOL reliability in 3D integration.6Chuan-An Cheng1Ryuichi Sugie2Tomoyuki Uchida3Kou-Hua Chen4Chi-Tsung Chiu5Kuan-Neng Chen6TS8.12.1-TS8.12.43DIC3DIC20152015provenance information for RDF data of dblp record 'conf/3dic/ChengSUCCC15'2019-10-19T20:03:17+0200