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Link to original content: https://dblp.org/rec/conf/3dic/ChengSUCCC15.rdf
Chuan-An Cheng et al.: Electrical investigation of Cu pumping in through-silicon vias for BEOL reliability in 3D integration. (2015) conf/3dic/ChengSUCCC15 10.1109/3DIC.2015.7334581 Electrical investigation of Cu pumping in through-silicon vias for BEOL reliability in 3D integration. 6 Chuan-An Cheng 1 Ryuichi Sugie 2 Tomoyuki Uchida 3 Kou-Hua Chen 4 Chi-Tsung Chiu 5 Kuan-Neng Chen 6 TS8.12.1-TS8.12.4 3DIC 3DIC 2015 2015 provenance information for RDF data of dblp record 'conf/3dic/ChengSUCCC15' 2019-10-19T20:03:17+0200