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ORCIDY. C. Chan
This is just a disambiguation page, and is not intended to be the bibliography of an actual person. Any publication listed on this page has not been assigned to an actual author yet. If you know the true author of one of the publications listed below, you are welcome to contact us.
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2010 – 2019
- 2016
[j29]M. Sobczak-Edmans, T. H. B. Ng, Y. C. Chan, E. Chew, Kai-Hsiang Chuang
, Shen-Hsing Annabel Chen:
Temporal dynamics of visual working memory. NeuroImage 124: 1021-1030 (2016)- 2014
- [j28]Johanna Virkki, Toni Björninen, T. Kellomäki, Sari Merilampi, I. Shafiq, Leena Ukkonen, Lauri Sydänheimo, Y. C. Chan:
Reliability of washable wearable screen printed UHF RFID tags. Microelectron. Reliab. 54(4): 840-846 (2014) - [j27]Asit Kumar Gain, Y. C. Chan:
Growth mechanism of intermetallic compounds and damping properties of Sn-Ag-Cu-1 wt% nano-ZrO2 composite solders. Microelectron. Reliab. 54(5): 945-955 (2014) - 2012
- [c4]Zahid Ullah, Manish Kumar Jaiswal, Y. C. Chan, Ray C. C. Cheung:
FPGA Implementation of SRAM-based Ternary Content Addressable Memory. IPDPS Workshops 2012: 383-389 - 2011
- [j26]Asit Kumar Gain, Y. C. Chan, Winco K. C. Yung:
Microstructure, thermal analysis and hardness of a Sn-Ag-Cu-1 wt% nano-TiO2 composite solder on flexible ball grid array substrates. Microelectron. Reliab. 51(5): 975-984 (2011) - [j25]Asit Kumar Gain, Y. C. Chan, Winco K. C. Yung:
Effect of additions of ZrO2 nano-particles on the microstructure and shear strength of Sn-Ag-Cu solder on Au/Ni metallized Cu pads. Microelectron. Reliab. 51(12): 2306-2313 (2011) - 2010
- [j24]Mansur Ahmed, Tama Fouzder, Ahmed Sharif, Asit Kumar Gain, Y. C. Chan:
Influence of Ag micro-particle additions on the microstructure, hardness and tensile properties of Sn-9Zn binary eutectic solder alloy. Microelectron. Reliab. 50(8): 1134-1141 (2010) - [j23]Tama Fouzder, Asit Kumar Gain, Y. C. Chan, Ahmed Sharif, Winco K. C. Yung:
Effect of nano Al2O3 additions on the microstructure, hardness and shear strength of eutectic Sn-9Zn solder on Au/Ni metallized Cu pads. Microelectron. Reliab. 50(12): 2051-2058 (2010) - [j22]Y. C. Chan, W. A. Johnson, S. K. Karuza, A. M. Young, J. C. Camparo:
Self-Monitoring and Self-Assessing Atomic Clocks. IEEE Trans. Instrum. Meas. 59(2): 330-334 (2010)
2000 – 2009
- 2009
- [j21]Jun Shen, Y. C. Chan:
Research advances in nano-composite solders. Microelectron. Reliab. 49(3): 223-234 (2009) - [j20]Asit Kumar Gain, Y. C. Chan, Ahmed Sharif, N. B. Wong, Winco K. C. Yung:
Interfacial microstructure and shear strength of Ag nano particle doped Sn-9Zn solder in ball grid array packages. Microelectron. Reliab. 49(7): 746-753 (2009) - 2008
- [j19]R. Smit, A. L. Brown, Y. C. Chan:
Do air pollution emissions and fuel consumption models for roadways include the effects of congestion in the roadway traffic flow? Environ. Model. Softw. 23(10-11): 1262-1270 (2008) - [c3]Sachin Kumar, Myra Torres, Y. C. Chan, Michael G. Pecht:
A hybrid prognostics methodology for electronic products. IJCNN 2008: 3479-3485 - 2006
- [j18]Rashed Adnan Islam, Y. C. Chan, W. Jillek, Samia Islam:
Comparative study of wetting behavior and mechanical properties (microhardness) of Sn-Zn and Sn-Pb solders. Microelectron. J. 37(8): 705-713 (2006) - [c2]C.-Y. Ho, Y.-C. Chan, Y.-C. Chen:
An Efficient Mechanism of TCP-Vegas on Mobile IP Networks. INFOCOM 2006 - 2005
- [j17]M. J. Rizvi, Y. C. Chan, Chris Bailey, Hua Lu:
Study of anisotropic conductive adhesive joint behavior under 3-point bending. Microelectron. Reliab. 45(3-4): 589-596 (2005) - 2004
- [j16]S. C. Tan, Y. C. Chan, Y. W. Chiu, C. W. Tan:
Thermal stability performance of anisotropic conductive film at different bonding temperatures. Microelectron. Reliab. 44(3): 495-503 (2004) - [j15]N. H. Yeung, Victor Lau, Y. C. Chan:
Bias-HAST on tape ball grid array (TBGA) test pattern. Microelectron. Reliab. 44(4): 595-602 (2004) - [j14]Rashed Adnan Islam, Y. C. Chan:
Effect of microwave preheating on the bonding performance of flip chip on flex joint. Microelectron. Reliab. 44(5): 815-821 (2004) - [j13]C. W. Tan, Y. C. Chan, H. P. Chan, N. W. Leung, C. K. So:
Investigation on bondability and reliability of UV-curable adhesive joints for stable mechanical properties in photonic device packaging. Microelectron. Reliab. 44(5): 823-831 (2004) - 2003
- [j12]C. W. Tan, Y. C. Chan, N. H. Yeung:
Effect of autoclave test on anisotropic conductive joints. Microelectron. Reliab. 43(2): 279-285 (2003) - [j11]C. W. Tan, Y. C. Chan, N. H. Yeung:
Behaviour of anisotropic conductive joints under mechanical loading. Microelectron. Reliab. 43(3): 481-486 (2003) - 2002
- [j10]C. F. Luk, Y. C. Chan, K. C. Hung:
Development of gold to gold interconnection flip chip bonding for chip on suspension assemblies. Microelectron. Reliab. 42(3): 381-389 (2002) - [j9]C. F. Luk, Y. C. Chan, K. C. Hung:
Application of adhesive bonding techniques in hard disk drive head assembly. Microelectron. Reliab. 42(4-5): 767-777 (2002) - [j8]S. H. Fan, Y. C. Chan:
Effect of misalignment on electrical characteristics of ACF joints for flip chip on flex applications. Microelectron. Reliab. 42(7): 1081-1090 (2002) - [j7]Y. C. Chan, D. Y. Luk:
Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects for flip-chip-on-flex packages assembly I. Different bonding temperature. Microelectron. Reliab. 42(8): 1185-1194 (2002) - [j6]Y. C. Chan, D. Y. Luk:
Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects for flip-chip-on-flex packages assembly II. Different bonding pressure. Microelectron. Reliab. 42(8): 1195-1204 (2002) - [j5]Hua Lu, K. C. Hung, Stoyan Stoyanov, Chris Bailey, Y. C. Chan:
No-flow underfill flip chip assembly--an experimental and modeling analysis. Microelectron. Reliab. 42(8): 1205-1212 (2002) - [j4]Y. W. Chiu, Y. C. Chan, S. M. Lui:
Study of short-circuiting between adjacent joints under electric field effects in fine pitch anisotropic conductive adhesive interconnects. Microelectron. Reliab. 42(12): 1945-1951 (2002) - 2001
- [j3]P. L. Tu, Y. C. Chan, K. C. Hung, J. K. L. Lai:
Study of micro-BGA solder joint reliability. Microelectron. Reliab. 41(2): 287-293 (2001) - [j2]Y. C. Chan, P. L. Tu, K. C. Hung:
Study of the self-alignment of no-flow underfill for micro-BGA assembly. Microelectron. Reliab. 41(11): 1867-1875 (2001) - [j1]P. L. Tu, Y. C. Chan, K. C. Hung:
Reliability of microBGA assembly using no-flow underfill. Microelectron. Reliab. 41(12): 1993-2000 (2001)
1980 – 1989
- 1985
- [c1]Y. C. Chan:
FORTLOG = Fortran + Logique. SPLT 1985
Coauthor Index
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