@article{DBLP:journals/neuroimage/Sobczak-EdmansN16,
author = {M. Sobczak{-}Edmans and
T. H. B. Ng and
Y. C. Chan and
E. Chew and
Kai{-}Hsiang Chuang and
Shen{-}Hsing Annabel Chen},
title = {Temporal dynamics of visual working memory},
journal = {NeuroImage},
volume = {124},
pages = {1021--1030},
year = {2016},
url = {https://doi.org/10.1016/j.neuroimage.2015.09.038},
doi = {10.1016/J.NEUROIMAGE.2015.09.038},
timestamp = {Wed, 14 Nov 2018 00:00:00 +0100},
biburl = {https://dblp.org/rec/journals/neuroimage/Sobczak-EdmansN16.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@article{DBLP:journals/mr/VirkkiBKMSUSC14,
author = {Johanna Virkki and
Toni Bj{\"{o}}rninen and
T. Kellom{\"{a}}ki and
Sari Merilampi and
I. Shafiq and
Leena Ukkonen and
Lauri Syd{\"{a}}nheimo and
Y. C. Chan},
title = {Reliability of washable wearable screen printed {UHF} {RFID} tags},
journal = {Microelectron. Reliab.},
volume = {54},
number = {4},
pages = {840--846},
year = {2014},
url = {https://doi.org/10.1016/j.microrel.2013.12.011},
doi = {10.1016/J.MICROREL.2013.12.011},
timestamp = {Sat, 22 Feb 2020 00:00:00 +0100},
biburl = {https://dblp.org/rec/journals/mr/VirkkiBKMSUSC14.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@article{DBLP:journals/mr/GainC14,
author = {Asit Kumar Gain and
Y. C. Chan},
title = {Growth mechanism of intermetallic compounds and damping properties
of Sn-Ag-Cu-1 wt{\%} nano-ZrO\({}_{\mbox{2}}\) composite solders},
journal = {Microelectron. Reliab.},
volume = {54},
number = {5},
pages = {945--955},
year = {2014},
url = {https://doi.org/10.1016/j.microrel.2014.01.026},
doi = {10.1016/J.MICROREL.2014.01.026},
timestamp = {Sat, 22 Feb 2020 00:00:00 +0100},
biburl = {https://dblp.org/rec/journals/mr/GainC14.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/ipps/UllahJCC12,
author = {Zahid Ullah and
Manish Kumar Jaiswal and
Y. C. Chan and
Ray C. C. Cheung},
title = {{FPGA} Implementation of SRAM-based Ternary Content Addressable Memory},
booktitle = {26th {IEEE} International Parallel and Distributed Processing Symposium
Workshops {\&} PhD Forum, {IPDPS} 2012, Shanghai, China, May 21-25,
2012},
pages = {383--389},
publisher = {{IEEE} Computer Society},
year = {2012},
url = {https://doi.org/10.1109/IPDPSW.2012.47},
doi = {10.1109/IPDPSW.2012.47},
timestamp = {Fri, 24 Mar 2023 00:00:00 +0100},
biburl = {https://dblp.org/rec/conf/ipps/UllahJCC12.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@article{DBLP:journals/mr/GainCY11,
author = {Asit Kumar Gain and
Y. C. Chan and
Winco K. C. Yung},
title = {Microstructure, thermal analysis and hardness of a Sn-Ag-Cu-1 wt{\%}
nano-TiO\({}_{\mbox{2}}\) composite solder on flexible ball grid array
substrates},
journal = {Microelectron. Reliab.},
volume = {51},
number = {5},
pages = {975--984},
year = {2011},
url = {https://doi.org/10.1016/j.microrel.2011.01.006},
doi = {10.1016/J.MICROREL.2011.01.006},
timestamp = {Sat, 22 Feb 2020 00:00:00 +0100},
biburl = {https://dblp.org/rec/journals/mr/GainCY11.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@article{DBLP:journals/mr/GainCY11a,
author = {Asit Kumar Gain and
Y. C. Chan and
Winco K. C. Yung},
title = {Effect of additions of ZrO\({}_{\mbox{2}}\) nano-particles on the
microstructure and shear strength of Sn-Ag-Cu solder on Au/Ni metallized
Cu pads},
journal = {Microelectron. Reliab.},
volume = {51},
number = {12},
pages = {2306--2313},
year = {2011},
url = {https://doi.org/10.1016/j.microrel.2011.03.042},
doi = {10.1016/J.MICROREL.2011.03.042},
timestamp = {Sat, 22 Feb 2020 00:00:00 +0100},
biburl = {https://dblp.org/rec/journals/mr/GainCY11a.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@article{DBLP:journals/mr/AhmedFSGC10,
author = {Mansur Ahmed and
Tama Fouzder and
Ahmed Sharif and
Asit Kumar Gain and
Y. C. Chan},
title = {Influence of Ag micro-particle additions on the microstructure, hardness
and tensile properties of Sn-9Zn binary eutectic solder alloy},
journal = {Microelectron. Reliab.},
volume = {50},
number = {8},
pages = {1134--1141},
year = {2010},
url = {https://doi.org/10.1016/j.microrel.2010.03.017},
doi = {10.1016/J.MICROREL.2010.03.017},
timestamp = {Mon, 26 Oct 2020 00:00:00 +0100},
biburl = {https://dblp.org/rec/journals/mr/AhmedFSGC10.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@article{DBLP:journals/mr/FouzderGCSY10,
author = {Tama Fouzder and
Asit Kumar Gain and
Y. C. Chan and
Ahmed Sharif and
Winco K. C. Yung},
title = {Effect of nano Al\({}_{\mbox{2}}\)O\({}_{\mbox{3}}\) additions on
the microstructure, hardness and shear strength of eutectic Sn-9Zn
solder on Au/Ni metallized Cu pads},
journal = {Microelectron. Reliab.},
volume = {50},
number = {12},
pages = {2051--2058},
year = {2010},
url = {https://doi.org/10.1016/j.microrel.2010.06.013},
doi = {10.1016/J.MICROREL.2010.06.013},
timestamp = {Sat, 22 Feb 2020 00:00:00 +0100},
biburl = {https://dblp.org/rec/journals/mr/FouzderGCSY10.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@article{DBLP:journals/tim/ChanJKYC10,
author = {Y. C. Chan and
W. A. Johnson and
S. K. Karuza and
A. M. Young and
J. C. Camparo},
title = {Self-Monitoring and Self-Assessing Atomic Clocks},
journal = {{IEEE} Trans. Instrum. Meas.},
volume = {59},
number = {2},
pages = {330--334},
year = {2010},
url = {https://doi.org/10.1109/TIM.2009.2023817},
doi = {10.1109/TIM.2009.2023817},
timestamp = {Mon, 08 Jun 2020 01:00:00 +0200},
biburl = {https://dblp.org/rec/journals/tim/ChanJKYC10.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@article{DBLP:journals/mr/ShenC09,
author = {Jun Shen and
Y. C. Chan},
title = {Research advances in nano-composite solders},
journal = {Microelectron. Reliab.},
volume = {49},
number = {3},
pages = {223--234},
year = {2009},
url = {https://doi.org/10.1016/j.microrel.2008.10.004},
doi = {10.1016/J.MICROREL.2008.10.004},
timestamp = {Wed, 17 Nov 2021 00:00:00 +0100},
biburl = {https://dblp.org/rec/journals/mr/ShenC09.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@article{DBLP:journals/mr/GainCSWY09,
author = {Asit Kumar Gain and
Y. C. Chan and
Ahmed Sharif and
N. B. Wong and
Winco K. C. Yung},
title = {Interfacial microstructure and shear strength of Ag nano particle
doped Sn-9Zn solder in ball grid array packages},
journal = {Microelectron. Reliab.},
volume = {49},
number = {7},
pages = {746--753},
year = {2009},
url = {https://doi.org/10.1016/j.microrel.2009.05.004},
doi = {10.1016/J.MICROREL.2009.05.004},
timestamp = {Sat, 22 Feb 2020 00:00:00 +0100},
biburl = {https://dblp.org/rec/journals/mr/GainCSWY09.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@article{DBLP:journals/envsoft/SmitBC08,
author = {R. Smit and
A. L. Brown and
Y. C. Chan},
title = {Do air pollution emissions and fuel consumption models for roadways
include the effects of congestion in the roadway traffic flow?},
journal = {Environ. Model. Softw.},
volume = {23},
number = {10-11},
pages = {1262--1270},
year = {2008},
url = {https://doi.org/10.1016/j.envsoft.2008.03.001},
doi = {10.1016/J.ENVSOFT.2008.03.001},
timestamp = {Sun, 06 Oct 2024 01:00:00 +0200},
biburl = {https://dblp.org/rec/journals/envsoft/SmitBC08.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/ijcnn/KumarTCP08,
author = {Sachin Kumar and
Myra Torres and
Y. C. Chan and
Michael G. Pecht},
title = {A hybrid prognostics methodology for electronic products},
booktitle = {Proceedings of the International Joint Conference on Neural Networks,
{IJCNN} 2008, part of the {IEEE} World Congress on Computational Intelligence,
{WCCI} 2008, Hong Kong, China, June 1-6, 2008},
pages = {3479--3485},
publisher = {{IEEE}},
year = {2008},
url = {https://doi.org/10.1109/IJCNN.2008.4634294},
doi = {10.1109/IJCNN.2008.4634294},
timestamp = {Fri, 04 Sep 2020 01:00:00 +0200},
biburl = {https://dblp.org/rec/conf/ijcnn/KumarTCP08.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@article{DBLP:journals/mj/IslamCJI06,
author = {Rashed Adnan Islam and
Y. C. Chan and
W. Jillek and
Samia Islam},
title = {Comparative study of wetting behavior and mechanical properties (microhardness)
of Sn-Zn and Sn-Pb solders},
journal = {Microelectron. J.},
volume = {37},
number = {8},
pages = {705--713},
year = {2006},
url = {https://doi.org/10.1016/j.mejo.2005.12.010},
doi = {10.1016/J.MEJO.2005.12.010},
timestamp = {Sun, 02 Oct 2022 01:00:00 +0200},
biburl = {https://dblp.org/rec/journals/mj/IslamCJI06.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/infocom/HoCC06,
author = {C.{-}Y. Ho and
Y.{-}C. Chan and
Y.{-}C. Chen},
title = {An Efficient Mechanism of TCP-Vegas on Mobile {IP} Networks},
booktitle = {{INFOCOM} 2006. 25th {IEEE} International Conference on Computer Communications,
Joint Conference of the {IEEE} Computer and Communications Societies,
23-29 April 2006, Barcelona, Catalunya, Spain},
publisher = {{IEEE}},
year = {2006},
url = {https://doi.org/10.1109/INFOCOM.2006.338},
doi = {10.1109/INFOCOM.2006.338},
timestamp = {Wed, 16 Oct 2019 14:14:51 +0200},
biburl = {https://dblp.org/rec/conf/infocom/HoCC06.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@article{DBLP:journals/mr/RizviCBL05,
author = {M. J. Rizvi and
Y. C. Chan and
Chris Bailey and
Hua Lu},
title = {Study of anisotropic conductive adhesive joint behavior under 3-point
bending},
journal = {Microelectron. Reliab.},
volume = {45},
number = {3-4},
pages = {589--596},
year = {2005},
url = {https://doi.org/10.1016/j.microrel.2004.10.015},
doi = {10.1016/J.MICROREL.2004.10.015},
timestamp = {Sun, 04 Aug 2024 01:00:00 +0200},
biburl = {https://dblp.org/rec/journals/mr/RizviCBL05.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@article{DBLP:journals/mr/TanCCT04,
author = {S. C. Tan and
Y. C. Chan and
Y. W. Chiu and
C. W. Tan},
title = {Thermal stability performance of anisotropic conductive film at different
bonding temperatures},
journal = {Microelectron. Reliab.},
volume = {44},
number = {3},
pages = {495--503},
year = {2004},
url = {https://doi.org/10.1016/S0026-2714(03)00239-7},
doi = {10.1016/S0026-2714(03)00239-7},
timestamp = {Sat, 22 Feb 2020 00:00:00 +0100},
biburl = {https://dblp.org/rec/journals/mr/TanCCT04.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@article{DBLP:journals/mr/YeungLC04,
author = {N. H. Yeung and
Victor Lau and
Y. C. Chan},
title = {Bias-HAST on tape ball grid array {(TBGA)} test pattern},
journal = {Microelectron. Reliab.},
volume = {44},
number = {4},
pages = {595--602},
year = {2004},
url = {https://doi.org/10.1016/j.microrel.2003.08.008},
doi = {10.1016/J.MICROREL.2003.08.008},
timestamp = {Sat, 22 Feb 2020 00:00:00 +0100},
biburl = {https://dblp.org/rec/journals/mr/YeungLC04.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@article{DBLP:journals/mr/IslamC04,
author = {Rashed Adnan Islam and
Y. C. Chan},
title = {Effect of microwave preheating on the bonding performance of flip
chip on flex joint},
journal = {Microelectron. Reliab.},
volume = {44},
number = {5},
pages = {815--821},
year = {2004},
url = {https://doi.org/10.1016/j.microrel.2003.08.014},
doi = {10.1016/J.MICROREL.2003.08.014},
timestamp = {Sun, 02 Oct 2022 01:00:00 +0200},
biburl = {https://dblp.org/rec/journals/mr/IslamC04.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@article{DBLP:journals/mr/TanCCLS04,
author = {C. W. Tan and
Y. C. Chan and
H. P. Chan and
N. W. Leung and
C. K. So},
title = {Investigation on bondability and reliability of UV-curable adhesive
joints for stable mechanical properties in photonic device packaging},
journal = {Microelectron. Reliab.},
volume = {44},
number = {5},
pages = {823--831},
year = {2004},
url = {https://doi.org/10.1016/j.microrel.2003.10.003},
doi = {10.1016/J.MICROREL.2003.10.003},
timestamp = {Sat, 22 Feb 2020 00:00:00 +0100},
biburl = {https://dblp.org/rec/journals/mr/TanCCLS04.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@article{DBLP:journals/mr/TanCY03,
author = {C. W. Tan and
Y. C. Chan and
N. H. Yeung},
title = {Effect of autoclave test on anisotropic conductive joints},
journal = {Microelectron. Reliab.},
volume = {43},
number = {2},
pages = {279--285},
year = {2003},
url = {https://doi.org/10.1016/S0026-2714(02)00293-7},
doi = {10.1016/S0026-2714(02)00293-7},
timestamp = {Sat, 22 Feb 2020 00:00:00 +0100},
biburl = {https://dblp.org/rec/journals/mr/TanCY03.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@article{DBLP:journals/mr/TanCY03a,
author = {C. W. Tan and
Y. C. Chan and
N. H. Yeung},
title = {Behaviour of anisotropic conductive joints under mechanical loading},
journal = {Microelectron. Reliab.},
volume = {43},
number = {3},
pages = {481--486},
year = {2003},
url = {https://doi.org/10.1016/S0026-2714(02)00318-9},
doi = {10.1016/S0026-2714(02)00318-9},
timestamp = {Sat, 22 Feb 2020 00:00:00 +0100},
biburl = {https://dblp.org/rec/journals/mr/TanCY03a.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@article{DBLP:journals/mr/LukCH02,
author = {C. F. Luk and
Y. C. Chan and
K. C. Hung},
title = {Development of gold to gold interconnection flip chip bonding for
chip on suspension assemblies},
journal = {Microelectron. Reliab.},
volume = {42},
number = {3},
pages = {381--389},
year = {2002},
url = {https://doi.org/10.1016/S0026-2714(01)00256-6},
doi = {10.1016/S0026-2714(01)00256-6},
timestamp = {Sat, 22 Feb 2020 00:00:00 +0100},
biburl = {https://dblp.org/rec/journals/mr/LukCH02.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@article{DBLP:journals/mr/LukCH02a,
author = {C. F. Luk and
Y. C. Chan and
K. C. Hung},
title = {Application of adhesive bonding techniques in hard disk drive head
assembly},
journal = {Microelectron. Reliab.},
volume = {42},
number = {4-5},
pages = {767--777},
year = {2002},
url = {https://doi.org/10.1016/S0026-2714(02)00038-0},
doi = {10.1016/S0026-2714(02)00038-0},
timestamp = {Sat, 22 Feb 2020 00:00:00 +0100},
biburl = {https://dblp.org/rec/journals/mr/LukCH02a.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@article{DBLP:journals/mr/FanC02,
author = {S. H. Fan and
Y. C. Chan},
title = {Effect of misalignment on electrical characteristics of {ACF} joints
for flip chip on flex applications},
journal = {Microelectron. Reliab.},
volume = {42},
number = {7},
pages = {1081--1090},
year = {2002},
url = {https://doi.org/10.1016/S0026-2714(02)00069-0},
doi = {10.1016/S0026-2714(02)00069-0},
timestamp = {Sat, 22 Feb 2020 00:00:00 +0100},
biburl = {https://dblp.org/rec/journals/mr/FanC02.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@article{DBLP:journals/mr/ChanL02,
author = {Y. C. Chan and
D. Y. Luk},
title = {Effects of bonding parameters on the reliability performance of anisotropic
conductive adhesive interconnects for flip-chip-on-flex packages assembly
I. Different bonding temperature},
journal = {Microelectron. Reliab.},
volume = {42},
number = {8},
pages = {1185--1194},
year = {2002},
url = {https://doi.org/10.1016/S0026-2714(02)00079-3},
doi = {10.1016/S0026-2714(02)00079-3},
timestamp = {Sat, 22 Feb 2020 00:00:00 +0100},
biburl = {https://dblp.org/rec/journals/mr/ChanL02.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@article{DBLP:journals/mr/ChanL02a,
author = {Y. C. Chan and
D. Y. Luk},
title = {Effects of bonding parameters on the reliability performance of anisotropic
conductive adhesive interconnects for flip-chip-on-flex packages assembly
{II.} Different bonding pressure},
journal = {Microelectron. Reliab.},
volume = {42},
number = {8},
pages = {1195--1204},
year = {2002},
url = {https://doi.org/10.1016/S0026-2714(02)00089-6},
doi = {10.1016/S0026-2714(02)00089-6},
timestamp = {Sat, 22 Feb 2020 00:00:00 +0100},
biburl = {https://dblp.org/rec/journals/mr/ChanL02a.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@article{DBLP:journals/mr/LuHSBC02,
author = {Hua Lu and
K. C. Hung and
Stoyan Stoyanov and
Chris Bailey and
Y. C. Chan},
title = {No-flow underfill flip chip assembly--an experimental and modeling
analysis},
journal = {Microelectron. Reliab.},
volume = {42},
number = {8},
pages = {1205--1212},
year = {2002},
url = {https://doi.org/10.1016/S0026-2714(02)00092-6},
doi = {10.1016/S0026-2714(02)00092-6},
timestamp = {Sat, 22 Feb 2020 00:00:00 +0100},
biburl = {https://dblp.org/rec/journals/mr/LuHSBC02.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@article{DBLP:journals/mr/ChiuCL02,
author = {Y. W. Chiu and
Y. C. Chan and
S. M. Lui},
title = {Study of short-circuiting between adjacent joints under electric field
effects in fine pitch anisotropic conductive adhesive interconnects},
journal = {Microelectron. Reliab.},
volume = {42},
number = {12},
pages = {1945--1951},
year = {2002},
url = {https://doi.org/10.1016/S0026-2714(02)00097-5},
doi = {10.1016/S0026-2714(02)00097-5},
timestamp = {Sat, 22 Feb 2020 00:00:00 +0100},
biburl = {https://dblp.org/rec/journals/mr/ChiuCL02.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@article{DBLP:journals/mr/TuCHL01,
author = {P. L. Tu and
Y. C. Chan and
K. C. Hung and
J. K. L. Lai},
title = {Study of micro-BGA solder joint reliability},
journal = {Microelectron. Reliab.},
volume = {41},
number = {2},
pages = {287--293},
year = {2001},
url = {https://doi.org/10.1016/S0026-2714(00)00217-1},
doi = {10.1016/S0026-2714(00)00217-1},
timestamp = {Sat, 22 Feb 2020 00:00:00 +0100},
biburl = {https://dblp.org/rec/journals/mr/TuCHL01.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@article{DBLP:journals/mr/ChanTH01,
author = {Y. C. Chan and
P. L. Tu and
K. C. Hung},
title = {Study of the self-alignment of no-flow underfill for micro-BGA assembly},
journal = {Microelectron. Reliab.},
volume = {41},
number = {11},
pages = {1867--1875},
year = {2001},
url = {https://doi.org/10.1016/S0026-2714(01)00041-5},
doi = {10.1016/S0026-2714(01)00041-5},
timestamp = {Sat, 22 Feb 2020 00:00:00 +0100},
biburl = {https://dblp.org/rec/journals/mr/ChanTH01.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@article{DBLP:journals/mr/TuCH01,
author = {P. L. Tu and
Y. C. Chan and
K. C. Hung},
title = {Reliability of microBGA assembly using no-flow underfill},
journal = {Microelectron. Reliab.},
volume = {41},
number = {12},
pages = {1993--2000},
year = {2001},
url = {https://doi.org/10.1016/S0026-2714(01)00115-9},
doi = {10.1016/S0026-2714(01)00115-9},
timestamp = {Sat, 22 Feb 2020 00:00:00 +0100},
biburl = {https://dblp.org/rec/journals/mr/TuCH01.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/jfplc/Chan85,
author = {Y. C. Chan},
editor = {Serge Bourgault and
Mehmet Dincbas},
title = {{FORTLOG} = Fortran + Logique},
booktitle = {SPLT'85, S{\'{e}}minaire Programmation en Logique, 29-31 mai 1985,
Tr{\'{e}}gastel, France},
year = {1985},
timestamp = {Mon, 06 Sep 2004 15:35:20 +0200},
biburl = {https://dblp.org/rec/conf/jfplc/Chan85.bib},
bibsource = {dblp computer science bibliography, https://dblp.org}
}
