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ORCIDJeffery Hicks
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2020 – today
- 2023
[c8]Rahim Kasim, Cheyun Lin, Christopher Perini, James Palmer, N. Gilda, S. Imam, Justin R. Weber, C. Wallace, Jeffery Hicks:
Reliability Modeling of Middle-Of-Line Interconnect Dielectrics in Advanced process nodes. IRPS 2023: 1-8- [c7]Walid M. Hafez, P. Agnihotri, M. Asoro, M. Aykol, B. Bains, R. Bambery, M. Bapna, A. Barik, A. Chatterjee, P. C. Chiu, T. Chu, C. Firby
, K. Fischer, M. Fradkin, Hannes Greve, A. Gupta, E. Haralson, M. Haran, Jeffery Hicks, A. Illa, M. Jang, S. Klopcic, M. Kobrinsky, B. Kuns, H.-h. Lai, G. Lanni, S.-H. Lee, N. Lindert, C.-l. Lo, Y. Luo, G. Malyavanatham, B. Marinkovic, Y. Maymon, M. Nabors, J. Neirynck, P. Packan, A. Paliwal, L. Pantisano, Leif Paulson, Padma Penmatsa, Chetan Prasad, Conor Puls, T. Rahman, R. Ramaswamy, S. Samant, Bernhard Sell, K. Sethi, F. Shah, M. Shamanna, K. Shang, Q. Li, M. Sibakoti, J. Stoeger, Nathan Strutt, R. Thirugnanasambandam, C. Tsai, X. Wang, A. Wang, S.-j. Wu, Q. Xu, X.-h. Zhong, S. Natarajan:
Intel PowerVia Technology: Backside Power Delivery for High Density and High-Performance Computing. VLSI Technology and Circuits 2023: 1-2 - [c6]Mauro J. Kobrinsky, J. D. Silva, E. Mannebach, S. Mills, M. Abd El Qader, O. Adebayo, N. Arkali Radhakrishna, M. Beasley, J. Chawla, S. Chugh, A. Dasgupta, U. Desai, E. De Re, G. Dewey, T. Edwards, C. Engel, V. Gudmundsson, Jeffery Hicks, B. Krist, R. Mehandru, Inanc Meric, Patrick Morrow, D. Nandi, P. Patel, R. Ramamurthy, D. Samanta, L. Shoer, A. St Amour, L. H. Tan, Sukru Yemenicioglu, X. Wang, T. Ghani:
Novel Cell Architectures with Back-side Transistor Contacts for Scaling and Performance. VLSI Technology and Circuits 2023: 1-2 - [c5]M. Shamanna, E. Abuayob, G. Aenuganti, C. Alvares, J. Antony, A. Bahudhanam, A. Chandran, P. Chew, A. Chatterjee, B. Chauhan, N. Dandeti, J. Desai, M. Doyle, T. Dmukauskas, P. Farache, E. Fetzer, K. Fischer, P. Hack, Y. Greenzweig, John Giacobbe, Walid M. Hafez, E. Haralson, A. Hegde, A. Illa, M. Islam, S. Jain, M. Jang, J. Nguyen, T. Tong, L. Jiang, Eric Karl, P. Kalangi, G. Khoo, A. Krishnamoorthy, B. Kuns, W. Li, R. Livengood, T. Malik, R. Priyanka, H. Faraby, Y. Maymon, K. Mistry, K. Morgan, S. Natarajan, O. Nevo, M. Oh, P. Pardy, J. Park, P. Penmatsa, Boyd Phelps, C. Peterson, S. Rajappa, A. Raveh, A Rezaie, T. Ravishankar, R. Ramaswamy, S. Reddy, R. Saha, S. Sen, R. Sanchez, R. Sanaga, B. Simkhovich, Bernhard Sell, M. Senger, B. Schnarch, M. Seshadri, O. Sidorov, S. Subramanian, K. Subramanian, B. Truong, S. Bangalore, Jeffery Hicks, S. Venkatesh, D. Christensen, K. Bhargav, M. Von Haartman, P. Joshi, S. Zickel, C.-H. Lin, J. Huening, T.-H. Wu, N. Bakken, A. Afzal, A. Raman, Sj. Rao, V. Kawar, J. Neirynck, D. Bradley, M. Duwe, S. Wu, V. Patil, M. Bayoumy:
E-Core Implementation in Intel 4 with PowerVia (Backside Power) Technology. VLSI Technology and Circuits 2023: 1-2 - 2020
- [c4]Cheyun Lin, Uygar E. Avci, M. A. Blount, Rohit Grover, Jeffery Hicks, R. Kasim, A. Kundu, C. M. Pelto, C. Ryder, Anthony Schmitz, K. Sethi, D. Seghete, D. J. Towner, A. J. Welsh, J. Weber, C. Auth:
Reliability Characteristics of a High Density Metal- Insulator-Metal Capacitor on Intel's 10+ Process. IRPS 2020: 1-4 - [c3]Ketul B. Sutaria, Jihan Standfest, Inanc Meric, Amirhossein H. Davoody, Swaroop Kumar Namalapuri, Trinadh Mutyala, Supriya P., Balkaran Gill, Stephen Ramey, Jeffery Hicks:
Novel Re-configurable Circuits For Aging Characterization: Connecting Devices to Circuits. IRPS 2020: 1-5
2010 – 2019
- 2018
- [c2]F. Griggio, James Palmer, F. Pan, N. Toledo, Anthony Schmitz, Ilan Tsameret, R. Kasim, Gerald S. Leatherman, Jeffery Hicks, A. Madhavan, J. Shin, J. Steigerwald, A. Yeoh, C. Auth:
Reliability of dual-damascene local interconnects featuring cobalt on 10 nm logic technology. IRPS 2018: 6 - 2015
- [c1]Stephen Ramey, M. Chahal, P. Nayak, Steven R. Novak, Chetan Prasad, Jeffery Hicks:
Transistor reliability variation correlation to threshold voltage. IRPS 2015: 3
Coauthor Index
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