default search action
Google
Google Scholar
Semantic Scholar
Internet Archive Scholar
CiteSeerX
ORCIDKatsuya Kikuchi
Person information
- affiliation: National Institute of Advanced Industrial Science and Technology, Tsukuba, Japan
SPARQL queries 
Refine list
refinements active!
zoomed in on ?? of ?? records
view refined list in
export refined list as
2020 – today
- 2021
[j10]Yuuki Araga, Ryo Kasai, Daisuke Tanaka, Yoshihide Murakami, Kyoshi Mihara, Kazuo Makida, Hiroki Sonoda, Makoto Nagata
, Naoya Watanabe, Haruo Shimamoto, Katsuya Kikuchi:
Landside capacitor efficacy among multi-chip-module using Si-interposer. IEICE Electron. Express 18(9): 20210070 (2021)- [j9]Yuuki Araga, Naoya Watanabe, Haruo Shimamoto, Katsuya Kikuchi:
Analysis and evaluation of noise coupling between through-silicon-vias. IEICE Electron. Express 18(11): 20210139 (2021) - 2020
- [j8]Takuji Miki, Makoto Nagata, Hiroki Sonoda, Noriyuki Miura, Takaaki Okidono, Yuuki Araga, Naoya Watanabe, Haruo Shimamoto, Katsuya Kikuchi:
Si-Backside Protection Circuits Against Physical Security Attacks on Flip-Chip Devices. IEEE J. Solid State Circuits 55(10): 2747-2755 (2020)
2010 – 2019
- 2019
- [c20]Yuuki Araga, Kikuchi Katsuya, Masahiro Aoyagi:
Electrostatic Shield TSVs to Suppress Coupling Among Stacked ICs. 3DIC 2019: 1-3 - [c19]Wei Feng, Naoya Watanabe, Haruo Shimamoto, Masahiro Aoyagi, Katsuya Kikuchi:
Thermal Stress Comparison of Annular-Trench-Isolated (ATI) TSV with Cu and Solder Core. 3DIC 2019: 1-4 - [c18]Takuji Miki, Makoto Nagata, Akihiro Tsukioka, Noriyuki Miura, Takaaki Okidono, Yuuki Araga, Naoya Watanabe, Haruo Shimamoto, Katsuya Kikuchi:
Over-the-top Si Interposer Embedding Backside Buried Metal PDN to Reduce Power Supply Impedance of Large Scale Digital ICs. 3DIC 2019: 1-4 - [c17]Takuji Miki, Makoto Nagata, Hiroki Sonoda, Noriyuki Miura, Takaaki Okidono, Yuuki Araga, Naoya Watanabe, Haruo Shimamoto, Katsuya Kikuchi:
A Si-Backside Protection Circuits Against Physical Security Attacks on Flip-Chip Devices. A-SSCC 2019: 25-28 - 2017
- [j7]Samson Melamed, Naoya Watanabe, Shunsuke Nemoto, Haruo Shimamoto, Katsuya Kikuchi, Masahiro Aoyagi:
Thermal impact of extreme die thinning in bump-bonded three-dimensional integrated circuits. Microelectron. Reliab. 79: 380-386 (2017) - [c16]Takeshi Ohkawa, Kanemitsu Ootsu, Takashi Yokota, Katsuya Kikuchi, Masahiro Aoyagi:
Designing Efficient Parallel Processing in 3D Standard-Chip Stacking System with Standard Bus. MCSoC 2017: 128-135 - 2016
- [j6]Wei Feng, Naoya Watanabe, Haruo Shimamoto, Masahiro Aoyagi, Katsuya Kikuchi:
Validation of TSV thermo-mechanical simulation by stress measurement. Microelectron. Reliab. 59: 95-101 (2016) - [j5]Wei Feng, Tung Thanh Bui, Naoya Watanabe, Haruo Shimamoto, Masahiro Aoyagi, Katsuya Kikuchi:
Fabrication and stress analysis of annular-trench-isolated TSV. Microelectron. Reliab. 63: 142-147 (2016) - [j4]Samson Melamed, Naoya Watanabe, Shunsuke Nemoto, Haruo Shimamoto, Katsuya Kikuchi, Masahiro Aoyagi:
Impact of thinning stacked dies on the thermal resistance of bump-bonded three-dimensional integrated circuits. Microelectron. Reliab. 67: 2-8 (2016) - [c15]Naoya Watanabe, Haruo Shimamoto, Katsuya Kikuchi, Masahiro Aoyagi, Hidekazu Kikuchi, Azusa Yanagisawa, Akio Nakamura:
Wet cleaning process for high-yield via-last TSV formation. 3DIC 2016: 1-4 - 2015
- [j3]Samson Melamed, Fumito Imura, Hiroshi Nakagawa, Katsuya Kikuchi, Michiya Hagimoto, Yukoh Matsumoto, Masahiro Aoyagi:
Impact of die thinning on the thermal performance of a central TSV bus in a 3D stacked circuit. Microelectron. J. 46(12): 1106-1113 (2015) - [c14]Yuuki Araga, Kikuchi Katsuya, Masahiro Aoyagi:
Guard-ring monitoring system for inspecting defects in TSV-based data buses. 3DIC 2015: TS8.18.1-TS8.18.5 - [c13]Samson Melamed, Katsuya Kikuchi, Masahiro Aoyagi:
Investigation of effects of metalization on heat spreading in bump-bonded 3D systems. 3DIC 2015: TS8.30.1-TS8.30.4 - [c12]Tung Thanh Bui, Naoya Watanabe, Masahiro Aoyagi, Katsuya Kikuchi:
Twice-etched silicon approach for via-last through-silicon-via with a Parylene-HT liner. 3DIC 2015: TS8.6.1-TS8.6.4 - 2014
- [c11]Yuuki Araga, Kikuchi Katsuya, Masahiro Aoyagi:
Substrate monitoring system for inspecting defects in TSV-based data buses. 3DIC 2014: 1-5 - [c10]Wei Feng, Naoya Watanabe, Haruo Shimamoto, Katsuya Kikuchi, Masahiro Aoyagi:
Analysis of thermal stress distribution for TSV with novel structure. 3DIC 2014: 1-4 - [c9]Katsuya Kikuchi, Masahiro Aoyagi, Masaaki Ujiie, Shinya Takayama:
Ultrawideband ultralow PDN impedance of decoupling capacitor embedded interposers using narrow gap chip parts mounting technology for 3-D integrated LSI system. 3DIC 2014: 1-6 - [c8]Bui Thanh Tung, Xiaojin Cheng, Naoya Watanabe, Fumiki Kato, Katsuya Kikuchi, Masahiro Aoyagi:
Copper filled TSV formation with Parylene-HT insulator for low-temperature compatible 3D integration. 3DIC 2014: 1-4 - 2013
- [c7]Masahiro Aoyagi, Naoya Watanabe, Motohiro Suzuki, Katsuya Kikuchi, Shunsuke Nemoto, Noriaki Arima, Misaki Ishizuka, Koji Suzuki, Toshio Shiomi:
New optical three dimensional structure measurement method of cone shape micro bumps used for 3D LSI chip stacking. 3DIC 2013: 1-5 - [c6]Katsuya Kikuchi, Fumiki Kato, Shunsuke Nemoto, Hiroshi Nakagawa, Masahiro Aoyagi, Youtaro Yasu, Kohji Koshiji:
Investigation of optimized high-density flip-chip interconnect design including micro Au bumps for 3-D stacked LSI packaging. 3DIC 2013: 1-4 - 2011
- [c5]Fumiki Kato, Katsuya Kikuchi, Hiroshi Nakagawa, Masahiro Aoyagi:
Hot spots suppression by high thermal conductivity film in thin-sub strate CMOS ICs for 3D integration. 3DIC 2011: 1-4 - [c4]Katsuya Kikuchi, Chihiro Ueda, Fumiaki Fujii, Yutaka Akiyama, Naoya Watanabe, Yasuhiro Kitamura, Toshio Gomyo, Toshikazu Okubo, Tetsuya Koyama, Tadashi Kamada, Masahiro Aoyagi, Kanji Otsuka:
PDN impedance analysis of TSV-decoupling capacitor embedded Silicon interposer for 3D-integrated CMOS image sensor system. 3DIC 2011: 1-4 - [c3]Marco Chacin, Hiroyuki Uchida, Michiya Hagimoto, Takashi Miyazaki, Takeshi Ohkawa, Rimon Ikeno, Yukoh Matsumoto, Fumito Imura, Motohiro Suzuki, Katsuya Kikuchi, Hiroshi Nakagawa, Masahiro Aoyagi:
COOL interconnect low power interconnection technology for scalable 3D LSI design. COOL Chips 2011: 1-3
2000 – 2009
- 2009
- [c2]Katsuya Kikuchi, Koichi Takemura, Chihiro Ueda, Osamu Shimada, Toshio Gomyo, Yukiharu Takeuchi, Toshikazu Okubo, Kazuhiro Baba, Masahiro Aoyagi, Toshio Sudo, Kanji Otsuka:
Ultralow impedance evaluation system of wideband frequency for power distribution network of decoupling capacitor embedded substrates. 3DIC 2009: 1-4 - [c1]Koichi Takemura, Katsuya Kikuchi, Chihiro Ueda, Kazuhiro Baba, Masahiro Aoyagi, Kanji Otsuka:
SrTiO3 thin film decoupling capacitors on Si interposers for 3D system integration. 3DIC 2009: 1-5 - 2008
- [j2]Yasuhiro Yamaji, Tokihiko Yokoshima, Katsuya Kikuchi, Hiroshi Nakagawa, Masahiro Aoyagi:
Chemical flip-chip bonding method for fabricating 10-µm-pad-pitch interconnect. IEICE Electron. Express 5(18): 732-737 (2008) - 2006
- [j1]Junso Pak, Masahiro Aoyagi, Katsuya Kikuchi, Joungho Kim:
Band-Stop Filter Effect of Power/Ground Plane on Through-Hole Signal Via in Multilayer PCB. IEICE Trans. Electron. 89-C(4): 551-559 (2006)
Coauthor Index
manage site settings
To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.
Unpaywalled article links
Add open access links from 
to the list of external document links (if available).
Privacy notice: By enabling the option above, your browser will contact the API of unpaywall.org to load hyperlinks to open access articles. Although we do not have any reason to believe that your call will be tracked, we do not have any control over how the remote server uses your data. So please proceed with care and consider checking the Unpaywall privacy policy.
Archived links via Wayback Machine
For web page which are no longer available, try to retrieve content from the 
of the Internet Archive (if available).
Privacy notice: By enabling the option above, your browser will contact the API of archive.org to check for archived content of web pages that are no longer available. Although we do not have any reason to believe that your call will be tracked, we do not have any control over how the remote server uses your data. So please proceed with care and consider checking the Internet Archive privacy policy.
Reference lists
Add a list of references from 
, 
, and 
to record detail pages.
load references from crossref.org and opencitations.net
Privacy notice: By enabling the option above, your browser will contact the APIs of crossref.org, opencitations.net, and semanticscholar.org to load article reference information. Although we do not have any reason to believe that your call will be tracked, we do not have any control over how the remote server uses your data. So please proceed with care and consider checking the Crossref privacy policy and the OpenCitations privacy policy, as well as the AI2 Privacy Policy covering Semantic Scholar.
Citation data
Add a list of citing articles from and to record detail pages.
load citations from opencitations.net
Privacy notice: By enabling the option above, your browser will contact the API of opencitations.net and semanticscholar.org to load citation information. Although we do not have any reason to believe that your call will be tracked, we do not have any control over how the remote server uses your data. So please proceed with care and consider checking the OpenCitations privacy policy as well as the AI2 Privacy Policy covering Semantic Scholar.
OpenAlex data
Load additional information about publications from 
.
Privacy notice: By enabling the option above, your browser will contact the API of openalex.org to load additional information. Although we do not have any reason to believe that your call will be tracked, we do not have any control over how the remote server uses your data. So please proceed with care and consider checking the information given by OpenAlex.
last updated on 2024-04-25 05:40 CEST by the dblp team
all metadata released as open data under CC0 1.0 license
see also: Terms of Use | Privacy Policy | Imprint
dblp was originally created in 1993 at:
since 2018, dblp has been operated and maintained by:
the dblp computer science bibliography is funded and supported by:
