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2020 – today
- 2023
[c7]Mariappan Murugesan, M. Sawa, E. Sone, Makoto Motoyoshi, Mitsumasa Koyanagi, Takafumi Fukushima
:
Copper Electrode Surface Features and Cu-SiO2Hybrid Bonding. 3DIC 2023: 1-4- 2021
- [c6]Mariappan Murugesan, E. Sone, A. Simomura, Makoto Motoyoshi, M. Sawa, K. Fukuda, Mitsumasa Koyanagi, Takafumi Fukushima:
Cu-Cu Direct Bonding Through Highly Oriented Cu Grains for 3D-LSI Applications. 3DIC 2021: 1-4
2010 – 2019
- 2019
- [c5]Makoto Motoyoshi, Kohki Yanagimura, Taikoh Fushimi, Shunta Endo:
Stacked Pixel Sensor/Detector Technology using Au Micro-Bump Junction. 3DIC 2019: 1-4 - [c4]Miho Yamada, Shun Ono, Yasuo Arai, Ikuo Kurachi, Toru Tsuboyama, Masayuki Ikebe, Makoto Motoyoshi:
3D Integrated Pixel Sensor with Silicon-on-Insulator Technology for the International Linear Collider Experiment. 3DIC 2019: 1-4 - 2016
- [c3]Makoto Motoyoshi, Kohki Yanagimura, Taikoh Fushimi, Junichi Takanohashi, Mariappan Murugesan, Masahiro Aoyagi, Mitsumasa Koyanagi:
3 Dimensional stacked pixel detector and sensor technology using less than 3-μmφ robust bump junctions. 3DIC 2016: 1-4 - [c2]Mariappan Murugesan, Jichel Bea, Takafumi Fukushima, Makoto Motoyoshi, Tetsu Tanaka, Mitsumasa Koyanagi:
Improving the integrity of Ti barrier layer in Cu-TSVs through self-formed TiSix for via-last TSV technology. 3DIC 2016: 1-4 - 2011
- [c1]Makoto Motoyoshi, Junichi Takanohashi, Takafumi Fukushima, Yasuo Arai, Mitsumasa Koyanagi:
Stacked SOI pixel detector using versatile fine pitch μ-bump technology. 3DIC 2011: 1-4
2000 – 2009
- 2009
- [j1]Makoto Motoyoshi:
Through-Silicon Via (TSV). Proc. IEEE 97(1): 43-48 (2009)
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