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Link to original content: https://dblp.dagstuhl.de/rec/journals/mr/ChiuHL11.nt
. . . . . "Tz-Cheng Chiu et al.: Warpage evolution of overmolded ball grid array package during post-mold curing thermal process. (2011)" . . _:ID_d43ce94b1717fa0d2dacf872913fd50e . _:ID_d43ce94b1717fa0d2dacf872913fd50e . _:ID_d43ce94b1717fa0d2dacf872913fd50e . _:ID_d43ce94b1717fa0d2dacf872913fd50e . _:ID_d43ce94b1717fa0d2dacf872913fd50e "journals/mr/ChiuHL11" . _:ID_f0401c1cadc8f78a02eaf669d5da5f6c . _:ID_f0401c1cadc8f78a02eaf669d5da5f6c . _:ID_f0401c1cadc8f78a02eaf669d5da5f6c . _:ID_f0401c1cadc8f78a02eaf669d5da5f6c . _:ID_f0401c1cadc8f78a02eaf669d5da5f6c "10.1016/J.MICROREL.2011.06.001" . "Warpage evolution of overmolded ball grid array package during post-mold curing thermal process." . . . . . . . . "3"^^ . _:Sig_f107b9efb9db1d514a77c9173402f852_1 . _:Sig_f107b9efb9db1d514a77c9173402f852_1 . _:Sig_f107b9efb9db1d514a77c9173402f852_1 . _:Sig_f107b9efb9db1d514a77c9173402f852_1 "Tz-Cheng Chiu" . _:Sig_f107b9efb9db1d514a77c9173402f852_1 . _:Sig_f107b9efb9db1d514a77c9173402f852_1 "1"^^ . _:Sig_f107b9efb9db1d514a77c9173402f852_1 . _:Sig_f107b9efb9db1d514a77c9173402f852_2 . _:Sig_f107b9efb9db1d514a77c9173402f852_2 . _:Sig_f107b9efb9db1d514a77c9173402f852_2 . _:Sig_f107b9efb9db1d514a77c9173402f852_2 "Hong-Wei Huang" . _:Sig_f107b9efb9db1d514a77c9173402f852_2 . _:Sig_f107b9efb9db1d514a77c9173402f852_2 "2"^^ . _:Sig_f107b9efb9db1d514a77c9173402f852_2 . _:Sig_f107b9efb9db1d514a77c9173402f852_3 . _:Sig_f107b9efb9db1d514a77c9173402f852_3 . _:Sig_f107b9efb9db1d514a77c9173402f852_3 . _:Sig_f107b9efb9db1d514a77c9173402f852_3 "Yi-Shao Lai" . _:Sig_f107b9efb9db1d514a77c9173402f852_3 . _:Sig_f107b9efb9db1d514a77c9173402f852_3 "3"^^ . _:Sig_f107b9efb9db1d514a77c9173402f852_3 . . . . . "2263-2273" . "Microelectron. Reliab." . "Microelectron. Reliab." . "51" . "12" . "2011"^^ . "provenance information for RDF data of dblp record 'journals/mr/ChiuHL11'" . . . . "2020-02-22T19:29:22+0100" .