iBet uBet web content aggregator. Adding the entire web to your favor.
iBet uBet web content aggregator. Adding the entire web to your favor.



Link to original content: https://api.openalex.org/works/doi:10.1109/NEMS.2017.8017004
{"id":"https://openalex.org/W2751576181","doi":"https://doi.org/10.1109/nems.2017.8017004","title":"A MEMS accelerometer with double-sided symmetrical folded-beams on single wafer","display_name":"A MEMS accelerometer with double-sided symmetrical folded-beams on single wafer","publication_year":2017,"publication_date":"2017-04-01","ids":{"openalex":"https://openalex.org/W2751576181","doi":"https://doi.org/10.1109/nems.2017.8017004","mag":"2751576181"},"language":"en","primary_location":{"is_oa":false,"landing_page_url":"https://doi.org/10.1109/nems.2017.8017004","pdf_url":null,"source":null,"license":null,"license_id":null,"version":null,"is_accepted":false,"is_published":false},"type":"article","type_crossref":"proceedings-article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5057753858","display_name":"Wei Li","orcid":"https://orcid.org/0000-0002-6246-2898"},"institutions":[{"id":"https://openalex.org/I4210147322","display_name":"Shanghai Institute of Microsystem and Information Technology","ror":"https://ror.org/04nytyj38","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210147322"]},{"id":"https://openalex.org/I19820366","display_name":"Chinese Academy of Sciences","ror":"https://ror.org/034t30j35","country_code":"CN","type":"government","lineage":["https://openalex.org/I19820366"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Wei Li","raw_affiliation_strings":["Science and Technology on Micro-system Laboratory, Chinese Academy of Sciences, Shanghai, China"],"affiliations":[{"raw_affiliation_string":"Science and Technology on Micro-system Laboratory, Chinese Academy of Sciences, Shanghai, China","institution_ids":["https://openalex.org/I4210147322","https://openalex.org/I19820366"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5085326586","display_name":"Xiaofeng Zhou","orcid":"https://orcid.org/0000-0002-8528-019X"},"institutions":[{"id":"https://openalex.org/I4210147322","display_name":"Shanghai Institute of Microsystem and Information Technology","ror":"https://ror.org/04nytyj38","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210147322"]},{"id":"https://openalex.org/I19820366","display_name":"Chinese Academy of Sciences","ror":"https://ror.org/034t30j35","country_code":"CN","type":"government","lineage":["https://openalex.org/I19820366"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Xiaofeng Zhou","raw_affiliation_strings":["Science and Technology on Micro-system Laboratory, Chinese Academy of Sciences, Shanghai, China"],"affiliations":[{"raw_affiliation_string":"Science and Technology on Micro-system Laboratory, Chinese Academy of Sciences, Shanghai, China","institution_ids":["https://openalex.org/I4210147322","https://openalex.org/I19820366"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100599435","display_name":"Jian Wu","orcid":"https://orcid.org/0000-0002-3394-1507"},"institutions":[{"id":"https://openalex.org/I4210147322","display_name":"Shanghai Institute of Microsystem and Information Technology","ror":"https://ror.org/04nytyj38","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210147322"]},{"id":"https://openalex.org/I19820366","display_name":"Chinese Academy of Sciences","ror":"https://ror.org/034t30j35","country_code":"CN","type":"government","lineage":["https://openalex.org/I19820366"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Jian Wu","raw_affiliation_strings":["Science and Technology on Micro-system Laboratory, Chinese Academy of Sciences, Shanghai, China"],"affiliations":[{"raw_affiliation_string":"Science and Technology on Micro-system Laboratory, Chinese Academy of Sciences, Shanghai, China","institution_ids":["https://openalex.org/I4210147322","https://openalex.org/I19820366"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5014862182","display_name":"Youling Lin","orcid":null},"institutions":[{"id":"https://openalex.org/I19820366","display_name":"Chinese Academy of Sciences","ror":"https://ror.org/034t30j35","country_code":"CN","type":"government","lineage":["https://openalex.org/I19820366"]},{"id":"https://openalex.org/I4210147322","display_name":"Shanghai Institute of Microsystem and Information Technology","ror":"https://ror.org/04nytyj38","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210147322"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Youling Lin","raw_affiliation_strings":["Science and Technology on Micro-system Laboratory, Chinese Academy of Sciences, Shanghai, China"],"affiliations":[{"raw_affiliation_string":"Science and Technology on Micro-system Laboratory, Chinese Academy of Sciences, Shanghai, China","institution_ids":["https://openalex.org/I19820366","https://openalex.org/I4210147322"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100443559","display_name":"Ze Wang","orcid":"https://orcid.org/0000-0003-0849-145X"},"institutions":[{"id":"https://openalex.org/I4210147322","display_name":"Shanghai Institute of Microsystem and Information Technology","ror":"https://ror.org/04nytyj38","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210147322"]},{"id":"https://openalex.org/I19820366","display_name":"Chinese Academy of Sciences","ror":"https://ror.org/034t30j35","country_code":"CN","type":"government","lineage":["https://openalex.org/I19820366"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Ze Wang","raw_affiliation_strings":["Science and Technology on Micro-system Laboratory, Chinese Academy of Sciences, Shanghai, China"],"affiliations":[{"raw_affiliation_string":"Science and Technology on Micro-system Laboratory, Chinese Academy of Sciences, Shanghai, China","institution_ids":["https://openalex.org/I4210147322","https://openalex.org/I19820366"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5110177383","display_name":"Lu Feng","orcid":null},"institutions":[{"id":"https://openalex.org/I76130692","display_name":"Zhejiang University","ror":"https://ror.org/00a2xv884","country_code":"CN","type":"education","lineage":["https://openalex.org/I76130692"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Lu feng Che","raw_affiliation_strings":["College of Biomedical Engineering & Instrument Science, Zhejiang University, Hangzhou, China"],"affiliations":[{"raw_affiliation_string":"College of Biomedical Engineering & Instrument Science, Zhejiang University, Hangzhou, China","institution_ids":["https://openalex.org/I76130692"]}]}],"institution_assertions":[],"countries_distinct_count":1,"institutions_distinct_count":3,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.721,"has_fulltext":true,"fulltext_origin":"ngrams","cited_by_count":4,"citation_normalized_percentile":{"value":0.614147,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":78,"max":80},"biblio":{"volume":null,"issue":null,"first_page":"194","last_page":"197"},"is_retracted":false,"is_paratext":false,"primary_topic":{"id":"https://openalex.org/T10369","display_name":"Microelectromechanical Systems","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10369","display_name":"Microelectromechanical Systems","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11449","display_name":"Cavity Optomechanics and Nanomechanical Systems","score":0.9997,"subfield":{"id":"https://openalex.org/subfields/3107","display_name":"Atomic and Molecular Physics, and Optics"},"field":{"id":"https://openalex.org/fields/31","display_name":"Physics and Astronomy"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11160","display_name":"Acoustic Wave Biosensors and Thin Film Resonators","score":0.9997,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/deep-reactive-ion-etching","display_name":"Deep reactive-ion etching","score":0.89595366},{"id":"https://openalex.org/keywords/mems","display_name":"MEMS","score":0.539622}],"concepts":[{"id":"https://openalex.org/C124634506","wikidata":"https://www.wikidata.org/wiki/Q486936","display_name":"Deep reactive-ion etching","level":5,"score":0.89595366},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.8258503},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7499869},{"id":"https://openalex.org/C37977207","wikidata":"https://www.wikidata.org/wiki/Q175561","display_name":"Microelectromechanical systems","level":2,"score":0.720283},{"id":"https://openalex.org/C89805583","wikidata":"https://www.wikidata.org/wiki/Q192940","display_name":"Accelerometer","level":2,"score":0.71723336},{"id":"https://openalex.org/C30066665","wikidata":"https://www.wikidata.org/wiki/Q164399","display_name":"Capacitance","level":3,"score":0.6781719},{"id":"https://openalex.org/C206755178","wikidata":"https://www.wikidata.org/wiki/Q1131271","display_name":"Capacitive sensing","level":2,"score":0.6465921},{"id":"https://openalex.org/C100460472","wikidata":"https://www.wikidata.org/wiki/Q2368605","display_name":"Etching (microfabrication)","level":3,"score":0.6080153},{"id":"https://openalex.org/C544956773","wikidata":"https://www.wikidata.org/wiki/Q670","display_name":"Silicon","level":2,"score":0.55950934},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.5482994},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.33010966},{"id":"https://openalex.org/C130472188","wikidata":"https://www.wikidata.org/wiki/Q1640159","display_name":"Reactive-ion etching","level":4,"score":0.26807904},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.19134271},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.15686053},{"id":"https://openalex.org/C17525397","wikidata":"https://www.wikidata.org/wiki/Q176140","display_name":"Electrode","level":2,"score":0.12921932},{"id":"https://openalex.org/C185592680","wikidata":"https://www.wikidata.org/wiki/Q2329","display_name":"Chemistry","level":0,"score":0.08857244},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.07159209},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.064060986},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0},{"id":"https://openalex.org/C147789679","wikidata":"https://www.wikidata.org/wiki/Q11372","display_name":"Physical chemistry","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"is_oa":false,"landing_page_url":"https://doi.org/10.1109/nems.2017.8017004","pdf_url":null,"source":null,"license":null,"license_id":null,"version":null,"is_accepted":false,"is_published":false}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/7","score":0.7,"display_name":"Affordable and clean energy"}],"grants":[],"datasets":[],"versions":[],"referenced_works_count":8,"referenced_works":["https://openalex.org/W1991177310","https://openalex.org/W1991765443","https://openalex.org/W2084389613","https://openalex.org/W2090524419","https://openalex.org/W2090950845","https://openalex.org/W2103982259","https://openalex.org/W2146408065","https://openalex.org/W2164773376"],"related_works":["https://openalex.org/W756886103","https://openalex.org/W3161496874","https://openalex.org/W3094407298","https://openalex.org/W2915680872","https://openalex.org/W2902633157","https://openalex.org/W2502505565","https://openalex.org/W2314946316","https://openalex.org/W2160325238","https://openalex.org/W2026330382","https://openalex.org/W2003963243"],"abstract_inverted_index":{"We":[0],"present":[1],"a":[2],"novel":[3],"MEMS":[4],"capacitance":[5],"accelerometer":[6,47,104],"with":[7,78],"single":[8,20],"wafer":[9,21],"symmetrical":[10,16,61],"double-sided":[11,60],"folded-beams":[12,18,62],"structure.":[13,63],"The":[14,43,54,64,76,98],"highly":[15],"8":[17],"on":[19],"is":[22,48,57,83,89,105],"designed":[23],"and":[24,32,67,73,86],"fabricated":[25,103],"by":[26,50,59],"Deep":[27],"Reactive":[28],"Ion":[29],"Etch":[30],"(DRIE)":[31],"KOH":[33],"wet":[34],"etching":[35],"from":[36],"both":[37],"sides":[38],"of":[39,95,101],"the":[40,87,92,102],"silicon":[41],"wafer.":[42],"sandwich":[44],"differential":[45],"capacitive":[46],"formed":[49],"three-layer":[51],"silicon-silicon":[52],"bonding.":[53],"excellent":[55],"performance":[56],"obtained":[58],"resonance":[65],"frequency":[66],"quality":[68],"factor":[69],"are":[70],"1.3":[71],"kHz":[72],"10,":[74],"respectively.":[75],"sensitivity":[77],"closed":[79],"loop":[80],"interface":[81],"circuit":[82],"1.0":[84],"V/g,":[85],"nonlinearity":[88],"0.05%":[90],"over":[91],"typical":[93],"range":[94],"1":[96],"g.":[97],"bias":[99],"stability":[100],"0.2":[106],"mg.":[107]},"cited_by_api_url":"https://api.openalex.org/works?filter=cites:W2751576181","counts_by_year":[{"year":2023,"cited_by_count":1},{"year":2021,"cited_by_count":1},{"year":2020,"cited_by_count":2}],"updated_date":"2024-10-17T08:41:55.982862","created_date":"2017-09-15"}