{"id":"https://openalex.org/W3014250605","doi":"https://doi.org/10.1109/mce.2019.2959747","title":"VLSI for Next Generation CE","display_name":"VLSI for Next Generation CE","publication_year":2020,"publication_date":"2020-04-02","ids":{"openalex":"https://openalex.org/W3014250605","doi":"https://doi.org/10.1109/mce.2019.2959747","mag":"3014250605"},"language":"en","primary_location":{"is_oa":true,"landing_page_url":"https://doi.org/10.1109/mce.2019.2959747","pdf_url":"https://ieeexplore.ieee.org/ielx7/5962380/9055450/09055481.pdf","source":{"id":"https://openalex.org/S2483040032","display_name":"IEEE Consumer Electronics Magazine","issn_l":"2162-2248","issn":["2162-2248","2162-2256"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true},"type":"article","type_crossref":"journal-article","indexed_in":["crossref"],"open_access":{"is_oa":true,"oa_status":"bronze","oa_url":"https://ieeexplore.ieee.org/ielx7/5962380/9055450/09055481.pdf","any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5048927560","display_name":"Nikolaos Voros","orcid":"https://orcid.org/0000-0003-2410-5205"},"institutions":[{"id":"https://openalex.org/I158716096","display_name":"University of Peloponnese","ror":"https://ror.org/04d4d3c02","country_code":"GR","type":"education","lineage":["https://openalex.org/I158716096"]}],"countries":["GR"],"is_corresponding":false,"raw_author_name":"Nikolaos Voros","raw_affiliation_strings":["University of Peloponnese"],"affiliations":[{"raw_affiliation_string":"University of Peloponnese","institution_ids":["https://openalex.org/I158716096"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5068766978","display_name":"Mircea R. Stan","orcid":"https://orcid.org/0000-0003-0577-9976"},"institutions":[{"id":"https://openalex.org/I51556381","display_name":"University of Virginia","ror":"https://ror.org/0153tk833","country_code":"US","type":"education","lineage":["https://openalex.org/I51556381"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Mircea Stan","raw_affiliation_strings":["University of Virginia"],"affiliations":[{"raw_affiliation_string":"University of Virginia","institution_ids":["https://openalex.org/I51556381"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5114423005","display_name":"Michael Huebner","orcid":null},"institutions":[{"id":"https://openalex.org/I51783024","display_name":"Brandenburg University of Technology Cottbus-Senftenberg","ror":"https://ror.org/02wxx3e24","country_code":"DE","type":"education","lineage":["https://openalex.org/I51783024"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Michael Huebner","raw_affiliation_strings":["Brandenburg University of Technology"],"affiliations":[{"raw_affiliation_string":"Brandenburg University of Technology","institution_ids":["https://openalex.org/I51783024"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5074371053","display_name":"\u0393\u03b5\u03ce\u03c1\u03b3\u03b9\u03bf\u03c2 \u039a\u03b5\u03c1\u03b1\u03bc\u03af\u03b4\u03b1\u03c2","orcid":"https://orcid.org/0000-0003-0460-6061"},"institutions":[{"id":"https://openalex.org/I21370196","display_name":"Aristotle University of Thessaloniki","ror":"https://ror.org/02j61yw88","country_code":"GR","type":"education","lineage":["https://openalex.org/I21370196"]}],"countries":["GR"],"is_corresponding":false,"raw_author_name":"Georgios Keramidas","raw_affiliation_strings":["Aristotle University of Thessaloniki"],"affiliations":[{"raw_affiliation_string":"Aristotle University of Thessaloniki","institution_ids":["https://openalex.org/I21370196"]}]}],"institution_assertions":[],"countries_distinct_count":3,"institutions_distinct_count":4,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.159,"has_fulltext":true,"fulltext_origin":"pdf","cited_by_count":2,"citation_normalized_percentile":{"value":0.471311,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":69,"max":74},"biblio":{"volume":"9","issue":"3","first_page":"88","last_page":"89"},"is_retracted":false,"is_paratext":false,"primary_topic":{"id":"https://openalex.org/T10558","display_name":"Advancements in Semiconductor Devices and Circuit Design","score":0.9945,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10558","display_name":"Advancements in Semiconductor Devices and Circuit Design","score":0.9945,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.983,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10363","display_name":"Low-power high-performance VLSI design","score":0.9397,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/electronic-design-automation","display_name":"Electronic design automation","score":0.551176}],"concepts":[{"id":"https://openalex.org/C14580979","wikidata":"https://www.wikidata.org/wiki/Q876049","display_name":"Very-large-scale integration","level":2,"score":0.94169676},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.6914324},{"id":"https://openalex.org/C118524514","wikidata":"https://www.wikidata.org/wiki/Q173212","display_name":"Computer architecture","level":1,"score":0.5665221},{"id":"https://openalex.org/C64260653","wikidata":"https://www.wikidata.org/wiki/Q1194864","display_name":"Electronic design automation","level":2,"score":0.551176},{"id":"https://openalex.org/C201995342","wikidata":"https://www.wikidata.org/wiki/Q682496","display_name":"Systems engineering","level":1,"score":0.34525615},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.32265228},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.15629745}],"mesh":[],"locations_count":1,"locations":[{"is_oa":true,"landing_page_url":"https://doi.org/10.1109/mce.2019.2959747","pdf_url":"https://ieeexplore.ieee.org/ielx7/5962380/9055450/09055481.pdf","source":{"id":"https://openalex.org/S2483040032","display_name":"IEEE Consumer Electronics Magazine","issn_l":"2162-2248","issn":["2162-2248","2162-2256"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true}],"best_oa_location":{"is_oa":true,"landing_page_url":"https://doi.org/10.1109/mce.2019.2959747","pdf_url":"https://ieeexplore.ieee.org/ielx7/5962380/9055450/09055481.pdf","source":{"id":"https://openalex.org/S2483040032","display_name":"IEEE Consumer Electronics Magazine","issn_l":"2162-2248","issn":["2162-2248","2162-2256"],"is_oa":false,"is_in_doaj":false,"is_core":true,"host_organization":"https://openalex.org/P4310319808","host_organization_name":"Institute of Electrical and Electronics Engineers","host_organization_lineage":["https://openalex.org/P4310319808"],"host_organization_lineage_names":["Institute of Electrical and Electronics Engineers"],"type":"journal"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true},"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/9","display_name":"Industry, innovation and infrastructure","score":0.63}],"grants":[],"datasets":[],"versions":[],"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W4312076519","https://openalex.org/W4236647084","https://openalex.org/W3027318491","https://openalex.org/W2742852324","https://openalex.org/W2134640991","https://openalex.org/W2117241246","https://openalex.org/W1986774039","https://openalex.org/W1617740971","https://openalex.org/W1607753725","https://openalex.org/W1483017465"],"abstract_inverted_index":{"The":[0,83],"current":[1,95],"research":[2,96],"in":[3,19,99],"VLSI":[4,25,40],"explores":[5],"emerging":[6],"trends":[7],"and":[8,11,28,34,45,50,54,97],"novel":[9],"ideas":[10],"concepts":[12],"covering":[13],"a":[14],"broad":[15],"range":[16],"of":[17,22,64,85],"topics":[18,63],"the":[20],"area":[21],"VLSI:":[23],"from":[24],"circuits,":[26],"systems,":[27],"design":[29,33,58],"methods,":[30],"to":[31,38,42,80,90,102],"system-level":[32],"systemon-":[35],"chip":[36],"issues,":[37],"bringing":[39],"methods":[41],"new":[43,74],"areas":[44],"technologies":[46],"such":[47],"as":[48,71,73],"nano":[49],"molecular":[51],"devices,":[52],"MEMS,":[53],"quantum":[55],"computing.":[56],"Future":[57],"methodologies":[59],"are":[60],"also":[61],"key":[62],"Very":[65],"Large":[66],"Scale":[67],"Integration":[68],"(VLSI)":[69],"research,":[70],"well":[72],"Electronic":[75],"Design":[76],"Automation":[77],"(EDA)":[78],"tools":[79],"support":[81],"them.":[82],"purpose":[84],"this":[86],"special":[87],"section":[88],"is":[89],"provide":[91],"an":[92],"insight":[93],"into":[94],"development":[98],"aspects":[100],"related":[101],"ISVLSI.":[103]},"cited_by_api_url":"https://api.openalex.org/works?filter=cites:W3014250605","counts_by_year":[{"year":2021,"cited_by_count":1},{"year":2020,"cited_by_count":1}],"updated_date":"2024-12-09T11:28:29.052922","created_date":"2020-04-10"}
