{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,14]],"date-time":"2024-09-14T03:11:14Z","timestamp":1726283474575},"reference-count":19,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"3","license":[{"start":{"date-parts":[[2020,3,1]],"date-time":"2020-03-01T00:00:00Z","timestamp":1583020800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2020,3,1]],"date-time":"2020-03-01T00:00:00Z","timestamp":1583020800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2020,3,1]],"date-time":"2020-03-01T00:00:00Z","timestamp":1583020800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["61674002","61804001"],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100012469","name":"Doctoral Foundation of Fuyang Normal University","doi-asserted-by":"publisher","award":["2019FSKJ05ZD"],"id":[{"id":"10.13039\/501100012469","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. VLSI Syst."],"published-print":{"date-parts":[[2020,3]]},"DOI":"10.1109\/tvlsi.2019.2955865","type":"journal-article","created":{"date-parts":[[2020,1,10]],"date-time":"2020-01-10T21:07:56Z","timestamp":1578690476000},"page":"848-852","source":"Crossref","is-referenced-by-count":44,"title":["Novel Write-Enhanced and Highly Reliable RHPD-12T SRAM Cells for Space Applications"],"prefix":"10.1109","volume":"28","author":[{"given":"Qiang","family":"Zhao","sequence":"first","affiliation":[]},{"ORCID":"http:\/\/orcid.org\/0000-0003-2408-5048","authenticated-orcid":false,"given":"Chunyu","family":"Peng","sequence":"additional","affiliation":[]},{"given":"Junning","family":"Chen","sequence":"additional","affiliation":[]},{"ORCID":"http:\/\/orcid.org\/0000-0002-3314-1606","authenticated-orcid":false,"given":"Zhiting","family":"Lin","sequence":"additional","affiliation":[]},{"ORCID":"http:\/\/orcid.org\/0000-0002-5012-2570","authenticated-orcid":false,"given":"Xiulong","family":"Wu","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/TNS.2017.2728180"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2017.2788439"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/TNS.2006.884788"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TNS.2016.2590426"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TNS.2017.2783935"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2018.2872507"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/TNS.2014.2361514"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/TNS.1982.4336490"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2017.2655079"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/TNS.2016.2637873"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TNS.2003.813129"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2016.2634701"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2016.2645282"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2018.2879341"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TNS.2018.2816583"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/23.556880"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2010.2047907"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/TNS.2003.821593"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TNS.2009.2032090"}],"container-title":["IEEE Transactions on Very Large Scale Integration (VLSI) Systems"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/92\/9011687\/08956093.pdf?arnumber=8956093","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,4,27]],"date-time":"2022-04-27T14:40:05Z","timestamp":1651070405000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/8956093\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2020,3]]},"references-count":19,"journal-issue":{"issue":"3"},"URL":"http:\/\/dx.doi.org\/10.1109\/tvlsi.2019.2955865","relation":{},"ISSN":["1063-8210","1557-9999"],"issn-type":[{"value":"1063-8210","type":"print"},{"value":"1557-9999","type":"electronic"}],"subject":[],"published":{"date-parts":[[2020,3]]}}}
