{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,12]],"date-time":"2024-09-12T12:37:29Z","timestamp":1726144649061},"reference-count":29,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"7","license":[{"start":{"date-parts":[[2023,7,1]],"date-time":"2023-07-01T00:00:00Z","timestamp":1688169600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2023,7,1]],"date-time":"2023-07-01T00:00:00Z","timestamp":1688169600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2023,7,1]],"date-time":"2023-07-01T00:00:00Z","timestamp":1688169600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["52007114"],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Ind. Electron."],"published-print":{"date-parts":[[2023,7]]},"DOI":"10.1109\/tie.2022.3201276","type":"journal-article","created":{"date-parts":[[2022,8,30]],"date-time":"2022-08-30T19:46:00Z","timestamp":1661888760000},"page":"7334-7342","source":"Crossref","is-referenced-by-count":20,"title":["High-Temperature Partial Discharge Characteristics of Power Module Packaging Insulation Under Square Pulse With High Dv\/Dt Based on Down-Mixing Method"],"prefix":"10.1109","volume":"70","author":[{"ORCID":"http:\/\/orcid.org\/0000-0001-8901-5812","authenticated-orcid":false,"given":"Yi","family":"Ding","sequence":"first","affiliation":[{"name":"Department of Electrical Engineering, School of Electronic Information and Electrical Engineering, Shanghai Jiao Tong University, Shanghai, China"}]},{"ORCID":"http:\/\/orcid.org\/0000-0002-8624-7463","authenticated-orcid":false,"given":"Yalin","family":"Wang","sequence":"additional","affiliation":[{"name":"Department of Electrical Engineering, School of Electronic Information and Electrical Engineering, Shanghai Jiao Tong University, Shanghai, China"}]},{"given":"Hao","family":"Sun","sequence":"additional","affiliation":[{"name":"Department of Electrical Engineering, School of Electronic Information and Electrical Engineering, Shanghai Jiao Tong University, Shanghai, China"}]},{"ORCID":"http:\/\/orcid.org\/0000-0002-9187-1033","authenticated-orcid":false,"given":"Yi","family":"Yin","sequence":"additional","affiliation":[{"name":"Department of Electrical Engineering, School of Electronic Information and Electrical Engineering, Shanghai Jiao Tong University, Shanghai, China"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/APEC42165.2021.9487213"},{"issue":"14","key":"ref2","first-page":"5312","article-title":"Review of packaging insulation reliability for high voltage power module","volume-title":"Proc. CSEE","volume":"42","author":"Li","year":"2022"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2014.2357836"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TDEI.2019.008227"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2020.3014043"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/28.980373"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/IAS.2005.1518425"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TDEI.2017.006865"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1049\/hve.2017.0186"},{"key":"ref10","first-page":"466","article-title":"Research on partial discharge detection technology under square wave","volume-title":"Proc. Int. Symp. Elect. Insul. Mater.","author":"Ding"},{"key":"ref11","article-title":"Partial discharge test method under square wave based on SHF signal acquisition and down-mixing technology","author":"Ding","year":"2021","journal-title":"High Vol. Eng."},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/ICEMPE51623.2021.9509188"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.3403\/30264557"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TDEI.2022.3163812"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2021.3072655"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.3403\/02304418u"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/CEIDP.2006.312007"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/IAS.2003.1257662"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/TDEI.2022.3183677"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.3403\/30113973"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/ICPADM.2018.8401153"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/TDEI.2013.6451364"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/TDEI.2006.1593409"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/94.469970"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/TDEI.2017.006461"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/ICEMPE.2019.8727352"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1088\/0022-3727\/37\/2\/020"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1109\/TDEI.2014.004261"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1109\/TCP.1965.1135088"}],"container-title":["IEEE Transactions on Industrial Electronics"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/41\/10048563\/09870632.pdf?arnumber=9870632","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,2,1]],"date-time":"2024-02-01T12:28:02Z","timestamp":1706790482000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9870632\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,7]]},"references-count":29,"journal-issue":{"issue":"7"},"URL":"http:\/\/dx.doi.org\/10.1109\/tie.2022.3201276","relation":{},"ISSN":["0278-0046","1557-9948"],"issn-type":[{"value":"0278-0046","type":"print"},{"value":"1557-9948","type":"electronic"}],"subject":[],"published":{"date-parts":[[2023,7]]}}}
