Joseph Walters

Using Micro Heat Pipes As Heat Exchanger Unit For Notebook Applications

Application

#6595270 Jul 22, 2003

Filed

Jun 29, 2001

Inventor

Sridhar V. Machiroutu (Santa Clara, CA) · Joseph D. Walters (San Jose, CA)

Appl. No.

09/895308

Assignee

Intel Corporation (Santa Clara, CA)

International Classification

F28D 1500

U.S. Classification

16510426, 16510433, 361700, 174 152

Abstract

A system including a plurality of micro heat pipes is used to transfer heat from a die. A die attach block is coupled with the die. The plurality of micro heat pipes (MHPs) are attached to the die attach block to enable the MHPs to be in close contact with the die to absorb heat generated by the die.

Claim

What is claimed is: 1. A system, comprising: multiple micro heat pipes (MHPs) each having a first end and a second end, a central flexible section having wicking internal surface carrying a liquid, the first end placed in contact with a die to transfer heat generated by the die to a heat exchanger using the liquid; and a thermal attach block coupled to the die, wherein the first end of each of the multiple MHPs is attached to the thermal attach block to enable the first end to be placed in contact with the die. 2. The system of claim 1, wherein the first end is an evaporation end and the second end is a condensation end, both of metallic material. 3. The system of claim 2, wherein the condensation end is attached to the heat exchanger. 4. The system of claim 2, wherein the condensation end is the heat exchanger by applying airflow to the condensation end. 5. A system, comprising: a die; a die attach block coupled to the die; and a plurality of micro heat pipes (MHPs) attached to the die attach block to enable the MHPs to be in close contact with the die to absorb heat generated by the die, each of the MHPs comprising a condensation end and an evaporation end, wherein the evaporation end is attached to the die attach block to be in close contact with the die. 6.

Modular, Scalable Thermal Solution

Application

#7151667 Dec 19, 2006

Filed

Aug 12, 2004

Inventor

Joseph Douglass Walters (San Jose, CA) · Zoran Stefanoski (Menlo Park, CA) · Tommy C. Lee (Danville, CA)

Appl. No.

10/917137

Assignee

NVIDIA Corporation (Santa Clara, CA)

International Classification

H05K 7/20

U.S. Classification

361699, 361689, 361690, 361695, 361696, 361697, 361701, 174 151, 174 163, 165 803, 16510433

Abstract

One embodiment of a modular, scalable cooling system includes a core cooling module configured to be thermally coupled to a heat-generating electronic device and a supplemental cooling module configured to be thermally coupled to the core cooling module. A first interface attached to the core cooling module is configured to thermally couple the core cooling module to the supplemental cooling module. The core cooling module and the supplemental cooling module may be used alone or in combination to dissipate heat from the heat-generating electronic device.

Layered Chair Back And Chair Seat

Application

#7530640 May 12, 2009

Filed

Apr 7, 2006

Inventor

Joseph Lawrence Walters (Goshen, IN) · Jesse Love (Bristol, IN) · James Arlin Riegsecker (White Pigeon, MI)

Appl. No.

11/400624

Assignee

L & P Property Management Company (South Gate, CA)

International Classification

A47C 7/00

U.S. Classification

29744022, 2974402, 29745227

Abstract

A chair having a base, a seat support mounted on the base, and a seat back support coupled with the seat support. The chair further includes a seat support assembly coupled with the seat support and a back support assembly coupled with the back support. The seat support assembly is a multi layered piece having a base layer, an intermediate layer, a gel pad, a tail pad, and a top layer. Once assembled the seat support assembly has a relief area that corresponds to the tail bone region of the user. The back support assembly is multi layered piece having a base layer, an intermediate layer, a support pad assembly, and a top layer. The ordering of the layers and the orientation of the support pad assembly provide support to the user without any direct or focalized pressure being distributed to specific regions of the body.

System For Dynamically Reconfigure Wireless Robot Network

Application

#6266577 Jul 24, 2001

Filed

Jul 13, 1998

Inventor

Robert L. Popp (Norwell, MA) · David J. Montana (Arlington, MA) · Joseph B. Walters (Waltham, MA)

Appl. No.

9/114649

Assignee

GTE Internetworking Incorporated (Cambridge, MA)

International Classification

G06F 1900, G06F 1518, G05B 19418, G06E 100

U.S. Classification

700248

Abstract

Methods and systems consistent with the invention provide a robot network that can optimally reconfigure the control logic on-board each robot of the network on a real-time basis. Each robot of the network performs an assigned task according to a control logic. While performing the assigned task, each robot transmits performance data defining a fitness level of the robot for achieving the assigned task. A set of the plurality of robots is then selected based on the performance data transmitted by each robot, and the control logic of the selected set of robots is then sent to the other robots in the network. The robots that receive the control logic then optimize their control logic by producing a new control logic based on the received control logic.

Heat Sink With An Integrated Vapor Chamber

Application

#2014024 Aug 28, 2014

Filed

Feb 26, 2013

Inventor

Joseph Walters (Campbell, CA) · Dalton Seth O'Connor (Santa Clara, CA)

Appl. No.

13/778053

Assignee

NVIDIA CORPORATION (Santa Clara, CA)

International Classification

G06F 1/20

U.S. Classification

36167947, 16510421, 16510426

Abstract

A cooling subsystem is provided for dissipating heat from processor. The cooling subsystem includes a heat sink comprising an upper portion having a plurality of fins formed therein and a base portion fixed to the upper portion to form a vapor chamber in an enclosed volume between the upper portion and the base portion.

Systems And Methods Of Treating Malfunctioning Cardiac Valves

Application

#2021012 May 6, 2021

Filed

May 25, 2018

Inventor

Kalyna APKARIAN (Minneapolis, MN) · Tom JANCARIC (Maple Grove, MN) · Reggie ROTH (Monticello, MN) · James CAWTHRA (Ramsey, MN) · Dennis WERNER (Big Lake, MN) · Jason KILVINGTON (Shoreview, MN) · Umang ANAND (Plymouth, MN) · George L. COLES (Baltimore, MD) · James Duncan BEATY (Sandy Hook, CT) · Keith BULKIN (New Market, MD) · Joseph A. WALTERS (Aberdeen, MD) · Timothy P. HARRIGAN (Franklin, MA) · Kenton J. ZEHR (Baltimore, MD) · Christopher Todd CRAWFORD (Baltimore, MD)

Appl. No.

16/617044

Assignee

Kalyna APKARIAN (Minneapolis, MN) · Tom JANCARIC (Maple Grove, MN) · Reggie ROTH (Monticello, MN) · James CAWTHRA (Ramsey, MN) · Dennis WERNER (Big Lake, MN) · Jason KILVINGTON (Shoreview, MN) · Umang ANAND (Plymouth, MN) · George L. COLES (Baltimore, MD) · James Duncan BEATY (Sandy Hook, CT) · Keith BULKIN (New Market, MD) · Joseph A. WALTERS (Aberdeen, MD) · Timothy P. HARRIGAN (Franklin, MA) · Kenton J. ZEHR (Baltimore, MD) · Christopher Todd CRAWFORD (Baltimore, MD)

International Classification

A61F 2/24

Abstract

A buoy system for treating cardiac valve regurgitation comprising a movable plug having atrial and ventricular ends, wherein a through-hole passes from the atrial to the ventricular end, wherein during systole, the plug travels toward a cardiac atrium, wherein during diastole, the plug travels into a cardiac ventricle; a tether having atrial and ventricular ends, wherein the tether passes through the through-hole of the moving plug, wherein the atrial end of the tether projects into an atrium, wherein the atrial end of the tether includes a cap to engage a delivery tool; at least one distal anchor located in the ventricle, wherein the distal anchor is coupled to the ventricular end of the tether, and wherein the system is percutaneously delivered and optionally recaptured via catheter and recapture tool at the cap of the tether, respectively.